Nauticus partners with FET to expand subsea autonomy
Under the agreement, FET will lead the commercialization, manufacturing and distribution of Nauticus’ Olympic Arm electric manipulator system, while Nauticus continues to advance the robotics, autonomy and intelligent control technologies that underpin next-generation subsea manipulation.
Wise, Powernet, KEC to co-develop advanced SMPS solutions
Wise will supply its GaN power devices, digital-control expertise and technical support; Powernet will lead the development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC will manage backend manufacturing.
Kongsberg teams up with Helsing to boost European space capability
The companies aim to deploy a sovereign, space-based intelligence, surveillance, and targeting (IST) constellation with an interconnected comms layer for Europe by 2029.
Sponsored content by NORDES EMS
What competencies are really important when choosing an EMS partner?
Modern electronics manufacturing is developing faster than ever. Shorter product life cycles, ever-increasing quality requirements, advancing miniaturization and the need for rapid prototyping means, that companies require partners who can work in highly variable and precise conditions. Against this backdrop, the EMS (electronics manufacturing services) model has become one of the key elements of the modern supply chain.
Samsung, KT Corporation validate AI-RAN on commercial networks
The AI-RAN optimization technology verified by the two companies automatically applies optimal configurations for each user — rather than for the network as a whole — based on real-time wireless conditions.
Qolab secures strategic investment from Western Digital
Together, the companies aim to advance next-generation nanofabrication processes that improve qubit performance, reliability and scalability, paving the way for practical quantum systems that bridge scientific research and real-world application.
Imec achieves wafer-scale solid-state nanopores using EUV lithography
Imec has presented the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography.
Nvidia pilots chip-tracking software amid rising smuggling concerns
Nvidia is piloting a new software feature that can verify the physical location of its AI chips, aiming to make illicit GPU diversion and smuggling significantly harder. The initiative, described in detail by Reuters, uses telemetry already present in data-centre deployments to estimate where a device is operating — without modifying the chip itself or embedding direct GPS-style hardware tracking.
HCLTech partners with Dolphin to develop energy-efficient chips
Leveraging its engineering expertise in system-on-chip (SoC) architecture, design and development, India’s HCLTech will embed French company Dolphin Semiconductor’s specialized low-power IP into its silicon design workflows.
Trump approves limited Nvidia H200 AI chip exports to China
In a post on Truth Social, US President Donald Trump announced that the United States will allow exports of Nvidia’s H200 AI chips to China under a 25% government fee.
Semiconductor equipment billings increased 11% YoY in 3Q25
Global semiconductor equipment billings rose 11% year-on-year to 33.66 billion US dollars in the third quarter of 2025, according to the latest Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report from SEMI. Compared with the previous quarter, billings increased by 2%.
Sponsored content by PEDC
Join the 2nd PEDC – Pan-European Electronics Design Conference on 21–22 January 2026 in Prague!
The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.
Load more news

