LG Electronics accelerates robotics collaboration with Nvidia
Data collected across various environments such as LG’s Data Factory and LG CNS’s logistics automation solutions will be linked with Nvidia’s robotics stack, where it is augmented and synthesized into high-quality data for robot learning.
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ASMPT secures orders for more than 50 chip-to-substrate bonding tools
ASMPT announced in late July bulk orders for more than 50 of its Chip-to-Substrate Thermo-Compression Bonding tools from OSAT customers, for use in advanced AI computing chip packaging.
Sony Semiconductor returns to full operations at Kumamoto facility after earthquake
Sony Semiconductor Solutions' Kumamoto Technology Center, which was halted following an earthquake in the Kumamoto region on July 28, began staged resumption of operations on August 4. The company expects to return to pre-earthquake operating levels by mid-August, according to updates published by Sony Semiconductor Solutions.
Marvell and Google expand custom silicon partnership
Marvell Technology has entered into an expanded commercial agreement with Google to develop custom semiconductor products across a range of programmes attached to Google's TPU ecosystem.
Qualcomm appoints Wassim Chourbaji as President of EMEA
Qualcomm has appointed Wassim Chourbaji as Senior Vice President and President of Qualcomm EMEA, effective immediately. He succeeds Enrico Salvatori, who will retire from Qualcomm in June 2027 after 25 years with the company.
TTM Technologies acquires Epiq Solutions for $1.1 billion
TTM Technologies has entered into a definitive agreement to acquire Epiq Design Solutions, a provider of software-defined radios, high-performance RF products and space compute solutions for defence and signals intelligence applications. The all-cash purchase price is USD 1.1 billion.
Molex breaks ground on headquarters expansion in Illinois
Molex has held a groundbreaking ceremony marking the start of an expansion and renovation of its global headquarters campus in Lisle, Illinois, in the United States. The project is expected to be completed in December 2027.
Nelco partners with Elveo on next-gen D2D, IoT connectivity
Under the agreement, Nelco will bring reliable, next-generation connectivity and compute solutions directly from Elveo’s satellites in space to varied sectors, including automotive, maritime, energy and government in India and South Asian markets.
Docomo, Samsung validate user-level AI-RAN technology
This validation represents an important step toward realizing predictive network operations, especially as AI-driven network optimization becomes increasingly prevalent in the 6G network.
Fluence Energy, LEAG start construction of BESS in Germany
The Heinersbrück GridBattery, scheduled for completion in 2027, is the second joint project for Fluence and LEAG Clean Power. The companies are already deploying the 1GW / 4 GWh GigaBattery Jänschwalde 1000 system in the same part of the country, in eastern Germany.
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