PGZ and Raytheon launch Expert Cable Center in Poland
Polska Grupa Zbrojeniowa (PGZ) has announced a major milestone in Poland’s defense industry. Wojskowe Zakłady Uzbrojenia S.A. (WZU), a PGZ subsidiary, has signed an agreement with Raytheon Polska to launch the Expert Cable Center in Grudziądz. This state-of-the-art facility will produce over 80 types of cables for the Patriot air and missile defense system, further enhancing Poland’s national defense capabilities.
Infineon launches SURF unit to drive sensor and RF growth
Infineon Technologies has launched a new business unit, SURF (Sensor Units & Radio Frequency), effective January 1, 2025. The unit combines Infineon’s Sensor and Radio Frequency businesses under the Power & Sensor Systems (PSS) division to enhance innovation and profitability in these markets.
Farnell expands line card with the new Vishay microBRICK regulator
Farnell is now stocking the band new microBRICK regulator module from Vishay Intertechnology, expanding its power portfolio with the smallest DC/DC regulator module on the market.
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Join the PEDC – Pan-European Electronics Design Conference on 29–30 January 2025 in Vienna!
The Pan-European Electronics Design Conference (PEDC) will take place on 29–30 January 2025 in Vienna. This event is jointly organised by IPC and the German Electronics Design and Manufacturing Association (FED). It promises to be an outstanding forum for the exchange of knowledge and innovation in electronics design. The aim of the PEDC is to foster dialogue between industry, academia, and research at the European level while showcasing the latest developments, technologies, and best practices in the electronics sector. In short: Design Meets AI: Innovating Electronics.
Panasonic Industry Europe inks distribution deal with Özdisan Elektronik
The manufacturer of industrial components and solutions has signed a distribution deal with Özdisan Elektronik, a Turkish electronic components distributor to intensify its business activities in the region.
NXP secures €1B EIB loan to advance semiconductor innovation
NXP Semiconductors has secured a EUR 1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions.
US tightens export controls on advanced AI technologies
The US Department of Commerce's Bureau of Industry and Security (BIS) has issued an interim final rule, effective January 13, 2025, enhancing export controls on advanced computing ICs and certain artificial intelligence (AI) model weights.
onsemi completes acquisition of Qorvo's SiC JFET business
onsemi has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for USD 115 million in cash.
imec spin-off, Vertical Compute raises €20 million
Vertical Compute, founded by CEO Sylvain Dubois (ex-Google) and CTO Sebastien Couet (ex-imec), has closed a seed investment round of EUR 20 million.
MACOM invests $345 to upgrade fabs
MACOM's Massachusetts and North Carolina fabs are set for modernisation and expansion with federal and state backing.
Infineon expands footprint with new backend fab in Thailand
German semiconductor manufacturer Infineon Technologies has broken ground on a new semiconductor backend production site in Samut Prakan, south of Bangkok, in Thailand.
David Heinzmann retires as CEO of Littelfuse
After a 40-year career, David Heinzmann will retire and step down as president and CEO of Littelfuse, Inc.
SK Telecom, SK hynix, Penguin ink AI data centre deal
Penguin Solutions is teaming up with SK Telecom (SKT) and SK hynix to pursue the development and delivery of comprehensive AI data centre (AIDC) solutions. The agreement follows SKT’s USD 200 million strategic investment in Penguin Solutions in December 2024.
NXP deepens partnership with Honeywell
Honeywell and NXP Semiconductors will expand their partnership to accelerate aviation product development and chart the path for autonomous flight.
Nova Metrion selected by unnamed memory manufacturer
Nova’s Metrion platform has been selected by an unnamed memory manufacturer for its most advanced DRAM R&D as well as DRAM and NAND high-volume manufacturing lines.
Park Systems buys Swiss optical metrology business
Korea's Park Systems has acquired Lyncée Tec SA, a Lausanne-based specialist in digital holographic microscope (DHM) technology.
Sivers Semiconductors secures important deal to revolutionize telecom chips
Sivers Semiconductors has entered into a new chip development agreement with a leading Tier-1 telecom infrastructure provider. The collaboration, announced in a recent press release, will see Sivers develop advanced semiconductor solutions designed to meet the growing needs of 5G networks and future telecom technologies.
Nvidia criticizes U.S. plan to tighten AI chip export controls
The Biden administration is reportedly considering new export restrictions that could target advanced artificial intelligence (AI) chips produced by U.S. companies. According to Reuters, Nvidia has expressed concerns about the potential impact of these measures on the tech industry’s growth and the competitiveness of the United States in the global market.
YES receives multiple orders of VertaCure PLP systems
Manufacturer of process equipment for AI and HPC semiconductor solutions, Yield Engineering Systems (YES), says it has received multiple orders of its VertaCure PLP systems for advanced packaging from a an unnamed semiconductor manufacturer in Japan.
Hemlock bags $325M in CHIPS Act funding for polysilicon plant
The U.S. Department of Commerce has awarded Hemlock Semiconductor (HSC) up to USD 325 million in funding under the CHIPS Incentives Program, to support the construction of a new manufacturing facility in Hemlock, Michigan.
NXP acquires TTTech Auto for $625 million
NXP is strengthening its automotive business by acquiring TTEch Auto, a software solution provider specialised in the systems, safety and security required for SDVs, in an all-cash transaction valued at USD 625 million.
"China for China" gains momentum among European tech companies
Geopolitical dynamics are accelerating the formation of the “China for China” supply chain, driven by China’s vast domestic market. This trend is particularly evident in the automotive sector, says TrendForce pointing to its latest research.
Riber secures a repeat order for an MBE 412 cluster system
Molecular Beam Epitaxy (MBE) equipment supplier Riber has secured a repeat order from Teledyne Imaging Sensors (TIS) for an MBE 412 cluster research system from Teledyne Imaging Sensors (TIS) in the US.
Honda and Renesas sign agreement to develop high-performance SoC
Honda Motor and Renesas have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs).
Micron breaks ground on new $7B HBM advanced packaging facility
Micron Technology has started construction on a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, near its existing operations.
Hanmi Semiconductor breaks ground on seventh plant
On January 6, 2025, Hanmi Semiconductor broke ground on its seventh plant, which will focus on High Bandwidth Memory (HBM) TC Bonder.
XIVER takes over Philips' MEMS foundry
The MEMS foundry at the High Tech Campus Eindhoven, will remain in Dutch hands. The former Philips unit will continue as an independent company and will be named XIVER, following a divestment to a consortium of private investors.
Cohu completes acquisition of Tignis
Cohu, a company supplying equipment and services optimising semiconductor manufacturing yield and productivity, has completed acquisition of Tignis, Inc.
Inventec laboratory for developing UWB solutions is powered by NXP
Investec has launched a lab at its facility in Taoyuan, Taiwan. The laboratory aims to design and develop Ultra-Wideband (UWB) based systems for the automotive industry by leveraging NXP’s solution offering including the NXP Trimension UWB portfolio.
GlobalFoundries and IBM settle ongoing lawsuits
GlobalFoundries and IBM have settled their ongoing lawsuits, resolving all litigation matters, including breach of contract, trade secrets and intellectual property claims between the two companies.
Zinitix expands into notebook touchpad module market
Zinitix, a South Korean provider of interface solutions, has expanded into the notebook touchpad module market.
Wistron and NXP launches joint lab
Taiwanese electronics manufacturer Wistron is launching a joint laboratory with NXP Semiconductors to speed up automotive innovations.
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