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The collaboration brings together Amazon’s comprehensive, secure and price-performant AI infrastructure with Qualcomm Technologies’ expertise in power-efficient processing, silicon design and system-level integration.

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India’s Hindustan Aeronautics Limited (HAL) and Safran Helicopter Engines have signed a contract with SAFHAL Helicopter Engines Pvt. Ltd. (SAFHAL) for the design, development, manufacture, supply and lifecycle support of a new-generation high-power helicopter engine.

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The collaboration builds directly on SolarEdge's SST platform with Infineon SiC components, first announced in November 2025. The SST is designed to enable direct medium-voltage (13.8-34.5 kV) to 800-1500 VDC conversion at over 99 percent efficiency.

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By pairing SiMa.ai’s platform with ARK Electronics’ technology drones and robotics expertise, the partnership aims to deliver a uniquely complete Physical AI foundation, priced for mass-market commercial, industrial, agriculture, and defense deployment at scale.

Sponsored content by TME Transfer Multisort Elektronik

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Automatic quality control was once associated with costly smart cameras and elaborate vision systems. Today, the development of artificial intelligence and compact embedded platforms means that many AI Vision Inspection applications can be implemented much more simply. How does modern quality control using AI work and where is it best to start your own project?

Under the agreement, Samsung will integrate Mistral’s AI services and solutions — including its flagship large language model, Mistral Large — across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure.

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Following ongoing collaboration across energy, next-generation batteries and related industrial fields, Kyushu Electric Power is now moving forward with a strategic investment in ProLogium, extending the relationship from industrial collaboration to strategic capital participation.

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The partnership brings together Sure-Seal Connections’ proven sealed connector technology with Wesgarde’s market expertise and established customer relationships.

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Under the MoU, Arianespace and EnduroSat intend to build a long-term partnership offering an integrated European value chain spanning launch services, satellite deployment and in-orbit operations.

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The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.

Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures.

SMIC posted the strongest growth among the top three foundries in Q2 2026, with revenue surging 20% QoQ to more than USD 3 billion and market share edging up to 5.4% – closing in on Samsung Foundry's 5.9%. Combined revenue for the world's top ten foundries rose 11.5% to nearly USD 53.49 billion, a new record, according to TrendForce.

GlobalFoundries has finalised a definitive agreement with the US Department of Commerce for a USD 375 million research and development award to advance its Quantum Technology Solutions business. The funding is tied to milestone achievements over a five-year period.

German automotive semiconductor manufacturer Elmos Semiconductor and South Korean foundry SK keyfoundry have signed an agreement expanding their collaboration to include 130nm technology, securing long-term wafer capacity through 2037. The two companies have worked together on 350nm technology for 18 years.

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Analog Devices has announced a definitive agreement to acquire Alif Semiconductor in an all-cash transaction valued at USD 1.35 billion, with potential additional contingent consideration of up to USD 200 million. The deal is expected to close before the end of 2026.

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India’s Juniper Green Energy Limited, through its subsidiary Juniper Nirjara Energy Private Limited, has signed a 25-year Power Purchase Agreement (PPA) with SJVN Limited. With this addition, Juniper’s portfolio stands at 11,216 MWp of renewable energy capacity.

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The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

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Labour unions representing nearly two-thirds of Micron Technology's Taiwan workforce are threatening to strike unless the US memory chip maker changes how it distributes profits to employees, Reuters reports. More than 80% of union members who took part in an internal survey in August backed strike action.

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Amkor Technology has announced a Phase 2 expansion of its Arizona advanced packaging and test campus, increasing the total planned investment to approximately USD 12 billion. The expansion adds 60,000 square metres of cleanroom space, bringing the campus to approximately 93,000 square metres in total.

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Under the agreement, the companies will launch a multi-year initiative to establish a Quantum Center of Excellence (Quantum CoE) and support the practical use of quantum computing technologies across the KOBELCO Group.

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ASML has marked the start of construction of a second major industrial campus in the Brainport region of the Netherlands. The new campus at Brainport Industries Campus North in Eindhoven will eventually span approximately 350,000 square metres and provide potential capacity for up to 20,000 workplaces.

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Silicon Labs has opened a new research and development laboratory at its headquarters in Austin, Texas, expanding its capabilities for advanced chip design, testing and validation.

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Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.

Intel Foundry and ASML have reported continued progress in High NA EUV lithography production, including more than one million wafers processed to date across early tool certification and testing, research and development, and volume production on select layers of Intel's Panther Lake processors — part of the Core Ultra Series 3 family.

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The signed agreements are designed to accelerate the development and deployment of advanced physical AI automation across US Navy shipbuilding programs, including aircraft carriers, submarines, destroyers, amphibious ships, future frigates and unmanned surface vessels.

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Manz Asia contributes inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem. German manufacturer SUSS brings semiconductor process expertise and global customer reach.

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The agreements cover two battery projects: the Ruby BESS project near Aberdeen, a 40MW / 80MWh facility scheduled to become operational in October 2026 and the Chatterley BESS project in Gloucestershire, a 49.9MW / 99.8MWh asset expected to reach commercial operation in March 2027.

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The investment includes rights to distribute Hong Kong-based Cornerstone Robotics’ Sentire surgical system in select markets outside the US. Medtronic will distribute Sentire alongside its own Hugo robotic-assisted surgery (RAS) system.

Semiconductor

NanoBridge Semiconductor will provide its customers with a version of Precision FPGA Synthesis tuned for its NBS6503H and NBS1201 FPGA device families, helping designers achieve high-quality synthesis results while supporting efficient implementation workflows.

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GCT Semiconductor and the infrastructure provider for utilities and IoT have a long history of cooperation in the utility sector. The collaboration combines GCT’s cellular and NTN expertise with the provider’s industrial-grade wireless innovation.

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Nvidia has announced an agreement to acquire Hugging Face, the AI model hub and open-source platform, for USD 12.93 billion.

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US interconnect solutions provider PEI-Genesis has opened a new production facility in Pune, India, its sixth globally and second in the Asia-Pacific region. The facility commenced operations on July 1, 2026, and has already shipped its first customer order.

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Swedish company Sivers Semiconductors is investing USD 30 million to expand its indium phosphide manufacturing facility in Glasgow, Scotland.

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