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The Effects of pH: Cleaning Agent Properties and Performance in Production
As cleaning agents evolve to meet customer and supplier environmental challenges, we take a closer look at the effect of pH cleaning agent properties and performance including material compatibility and rinsing behavior all while answering questions with SIR data.
Exyte acquires Kinetics Group
Exyte says it plans to acquire Kinetics Group, a global provider of installation services, equipment, as well as technical facility management.
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ERS and Geringer to strengthen R&D and production capabilities
ERS electronic, a thermal management solutions specialist for semiconductor manufacturing, has finalised an agreement with Geringer Halbleitertechnik GmbH & Co. KG, a move poised to bolster its R&D and production capabilities.
JDI completes the sale of Higashiura fab to Sony
Back in March last year, Japan Display Inc (JDI) announced that it was going to sell its Higashiura fab facilities. The company has now completed the sale of the former Higashiura fab facilities to Sony Semiconductor Manufacturing Corporation (SCK).
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Intelligent power modules with new optocoupler from CT Micro
CT Micro offers the CTS480, an interface optocoupler for intelligent power modules (IPM) with a high CMR (Common Mode Rejection) value. It contains an AlGaAs LED and a photodetector with integrated Schmitt trigger to provide logic-compatible waveforms so that no additional waveform design is required. The highly integrated, compact power coupler is designed to drive motors in applications such as household appliances, fans, pumps and general drives.
Microchip acquires VSI
Microchip Technology has completed the acquisition of Seoul, Korea-based VSI Co. Ltd., a specialist in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for In-Vehicle Networking (IVN).
Arena team up with AMD
AMD and Arena are looking to scale the deployment of the first AI test solution to enhance next-generation GPU performance optimisations.
CSA Catapult opens new advanced packaging facility
A new GBP 1.6 million facility to help accelerate electrification across the UK has officially opened at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales.
Global semiconductor equipment billings slip in 2023
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to USD 106.3 billion in 2023 from an all-time record of USD 107.6 billion in 2022, SEMI reports.
Infineon and Amkor looks to strengthen European supply chain
Infineon Technologies says that it is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology.
Nvidia to build $200m AI centre in Indonesia
The world's largest chip design firm Nvidia is teaming up with Indonesian telco PT Indosat Ooredoo Hutchison to build an AI hub in Java.
System-on-chip startup SiMa.ai raises $70m
Silicon Valley-based startup SiMa.ai has secured a $70m round of extension funding and will use the cash to bring its second-generation chipset to market.
Rapidus to receive $3.9bn in government subsidies
The Japanese government has pledged up to $3.9bn to help domestic chip maker Rapidus to better compete in the advanced semiconductor space.
Its official: SK hynix to invest $3.87 billion in US plant
South Korean memory specialist SK hynix says that it will invest an estimated USD 3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
ASML cautions investors regarding Tutanota “mini-tender”
ASML says that it recently became aware of an unsolicited “mini-tender” offer by Tutanota LLC to purchase up to 250,000 of ASML’s ordinary shares, less than 0.1% of its ordinary stock, at an offer price of USD 1,075 net per share.
Intel foundry unit sees increased losses, turning the ship around
Intel Corporation has outlined a new financial reporting structure, aligned with the company’s previously announced foundry operating model for 2024 and beyond.
SemiQ expands with a new office in Taiwan
SemiQ, a designer, developer and supplier of SiC solutions, has expanded its global footprint with the opening its newest office in Taiwan.
Infineon signs MoU with Korean shipbuilding firm
Germany's semiconductor group Infineon has agreed a partnership with HD Korea Shipbuilding & Offshore Engineering Co to develop energy-efficient semiconductor tech for electric-powered shipping.
Sony Semiconductor starts production at new Thai fab
Sony Semiconductor Solutions Corporation has formally opened 'Building 4' at its Thai plant. The new facility will assemble image sensors and laser diodes for data centre applications.
SEALSQ Corp will open an OSAT in the US next year
Post-quantum tech firm SEALSQ has revelled plans to create an Open Semiconductors Assembly and Test (OSAT) plant in the US, which will be operational by end of 2025.
Micron breaks ground on Xi'an expansion project
Micron Technology has officially broken ground on its new packaging and testing plant in Xi'an, China
Rogers plans to expand with a new factory in Mexico
Rogers Corporation has signed a lease on a factory in Monterrey, Mexico for advanced busbar manufacturing and engineering services.
Pragmatic opens the UK's first 300mm wafer manufacturing fab
Pragmatic Semiconductor has officially opened the UK's first 300mm semiconductor wafer fabrication line at Pragmatic Park in Durham.
Coherent expands capacity in US and Europe
Compound semiconductor specialist Coherent Corp. has established the world’s first capability for 6-inch indium phosphide (InP) wafer fabrication, at the company’s Sherman, Texas, and Järfälla, Sweden, wafer fabs.
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