Evertiq - First In Electronics News & Expo

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A new analysis of the global semiconductor supply chain highlights how critical stages of chip production remain concentrated among a handful of economies, underscoring the industry’s vulnerability to geopolitical and supply disruptions.

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Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.

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The collaboration with AOI Electronics positions Kaynes Semicon to deliver turnkey backend semiconductor solutions to global customers. Through the partnership with Mitsui, Kaynes expects to gain access to critical raw materials.

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As the first step in this collaboration, Tata Electronics will assemble and test Rohm’s India-designed automotive-grade Nch 100V, 300A Si MOSFET in a TOLL package, targeting mass production shipments by next year.

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This collaboration combines Chang Robotics’ expertise in deploying large-scale, complex robotic systems with OTTO’s AMR technology to deliver integrated solutions that enhance productivity, flexibility, and efficiency across North American production lines and warehouses.

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To deliver this capability, Rheinmetall has partnered with ICEYE to establish Rheinmetall ICEYE Space Solutions. Based in Neuss, the joint venture will provide a high volume of SAR images via its exclusive constellation.

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The direct recycling methodology, developed by experts from the BMW Group, eliminates the conventional, energy-intensive chemical or thermal processing previously required.

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Under the multi-year agreement, Panasonic Energy will deliver its latest 2170 battery cells beginning in early 2026 to support Zoox’s growing robotaxi service and operations.

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Qualcomm Incorporated has completed its acquisition of Alphawave IP Group, also known as Alphawave Semi, approximately one quarter ahead of the originally planned schedule. The move is aimed at strengthening Qualcomm’s expansion into the data centre market.

Over the past decade, the collaboration between STMicroelectronics and SpaceX has produced billions of co-designed products – used in millions of Starlink user terminals in addition to over 10,000 Starlink satellites.

ASMPT said it has secured new orders for 19 chip-to-substrate (C2S) thermo-compression bonding (TCB) tools from an unnamed outsourced semiconductor assembly and test (OSAT) provider supplying a leading foundry focused on AI chips.

Texas Instruments has officially started production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas.

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Avnet Silica has entered into a new franchise agreement with DeepX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful AI semiconductor technology.

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Nvidia says it has acquired SchedMD, the developer of Slurm, an open-source workload management system widely used in high-performance computing (HPC) and AI, in a move the company said is aimed at strengthening the open-source software ecosystem and supporting AI research and development.

Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

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Headquartered in Karnataka, Rangsons specialises in addressing critical aerospace and defence system requirements through a diversified product portfolio with a fully integrated ecosystem of design, manufacturing, special processes, testing and qualification.

Qualcomm Technologies, Inc. has acquired Ventana Micro Systems Inc., a move aimed at strengthening the company’s capabilities in RISC-V CPU development and advancing its custom Oryon CPU technology.

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The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,

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The partnership brings together ideaForge’s FLYGHT platform, a ready-to-deploy, on-demand drone network delivered through a Drone-as-a-Service (DaaS) model, with C-DAC’s Emergency Response Support System (ERSS–Dial 112).

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Under the agreement, FET will lead the commercialization, manufacturing and distribution of Nauticus’ Olympic Arm electric manipulator system, while Nauticus continues to advance the robotics, autonomy and intelligent control technologies that underpin next-generation subsea manipulation.

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Wise will supply its GaN power devices, digital-control expertise and technical support; Powernet will lead the development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC will manage backend manufacturing.

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The companies aim to deploy a sovereign, space-based intelligence, surveillance, and targeting (IST) constellation with an interconnected comms layer for Europe by 2029.

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The AI-RAN optimization technology verified by the two companies automatically applies optimal configurations for each user — rather than for the network as a whole — based on real-time wireless conditions.

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Together, the companies aim to advance next-generation nanofabrication processes that improve qubit performance, reliability and scalability, paving the way for practical quantum systems that bridge scientific research and real-world application.

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Empower Semiconductor, a provider of power solutions for AI-class processors, opened a new headquarters in Milpitas, California, and established a research and development center in Munich, Germany.

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For years, the Polish company MediSensonic has been known primarily for its medical microwave technologies – including its work on non-invasive glucose monitoring. Today, the company is expanding its presence into dual-use and defence markets, developing microwave anti-drone systems, passive detection platforms and a noise-based radar shield.

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Imec has presented the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography.

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Nvidia is piloting a new software feature that can verify the physical location of its AI chips, aiming to make illicit GPU diversion and smuggling significantly harder. The initiative, described in detail by Reuters, uses telemetry already present in data-centre deployments to estimate where a device is operating — without modifying the chip itself or embedding direct GPS-style hardware tracking.

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Leveraging its engineering expertise in system-on-chip (SoC) architecture, design and development, India’s HCLTech will embed French company Dolphin Semiconductor’s specialized low-power IP into its silicon design workflows.

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In a post on Truth Social, US President Donald Trump announced that the United States will allow exports of Nvidia’s H200 AI chips to China under a 25% government fee.

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Global semiconductor equipment billings rose 11% year-on-year to 33.66 billion US dollars in the third quarter of 2025, according to the latest Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report from SEMI. Compared with the previous quarter, billings increased by 2%.

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Quobly says that it has reached a key milestone in its roadmap toward industrial-scale quantum processors, with the first custom 28Si FD-SOI wafers from Soitec now cycling in STMicroelectronics’ 300 mm manufacturing facility in Crolles.

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