The challenge of connecting data across electronics manufacturing
Electronics manufacturers have more access to production data than ever before. Yet despite growing investments in digitalisation, many companies still struggle to achieve complete visibility across their production environments.
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Celestica to build one million square foot campus in Fort Worth
Canadian EMS provider Celestica has provided an update on its planned expansion in Fort Worth, Texas, where the company intends to establish a new campus exceeding one million square feet of advanced manufacturing and engineering space. The project is expected to create approximately 1,700 full-time jobs.
Spiro raises $215 million to boost EV mobility in Africa
This investment will support the expansion of Spiro’s battery-swapping network, strengthen its industrial and assembly footprint, accelerate technology development and support the company’s entry into new high-growth African markets.
Sponsored content by Shanghai Yongming Electronic Co.,Ltd
Cold Start & Vibration in Auto Water Pumps: YMIN Hybrid Caps Enable Pin-to-Pin Replacement
YMIN VHT/VHU/VHR solid-liquid hybrid capacitors for automotive electronic water pumps solve cold-start noise and high-vibration challenges. They enable pin-to-pin replacement of Japanese brands with equivalent performance and stable supply.
North American EMS demand remained strong in April
Total North American EMS shipments in April 2026 were up 3.1% compared to the same month last year, reports the Global Electronics Association.
Liftlogic boosts SMT production with new Yamaha solder printer and AOI
Swedish electronics manufacturer Liftlogic has, via Danish equipment supplier CORE-emt, invested in a new Yamaha YCP10 solder printer and Yamaha YSi-V AOI solution, extending an existing Yamaha platform and strengthening quality and flexibility in its SMT production.
Adani Green Energy commissions 3.37 GWh BESS in Gujarat
The Indian renewable energy company plans to add over 10 GWh of battery storage capacity in FY27 and scale this to 50 GWh over the next five years.
Intel, 3DGS to set up $3.3 billion substrate plant in Odisha
The facility in the Indian state of Odisha will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies, with Intel supporting technology know-how and process expertise.
Global EMS grew in 2025 – Europe watched from the sidelines
Following his keynote at Evertiq Expo Zürich, in4ma founder and analyst Dieter Weiss had an interview with Evertiq to discuss the numbers behind global EMS growth in 2025 – and what they reveal about where the European industry stands.
Samsung Electronics begins shipment of HBM4E samples
Samsung’s HBM4E delivers a stable pin speed of 14 gigabits-per-second (Gbps), with performance scalable up to 16Gbps to support increasingly intensive data processing requirements. This represents more than a 20% increase over its HBM4.
LGES secures $1.6 billion US energy supply deal with DTE
The agreement will support eight projects with battery systems delivered over a two-year period. The energy storage projects will deliver 1.5 gigawatts of battery storage or 6 gigawatts hours in Michigan.
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