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AI-powered computer vision company RealSense has hit two major milestones: its spinout from Intel, fueled with a USD 50 million Series A funding round, and a strategic collaboration with Nvidia to accelerate the adoption of physical AI across humanoids and autonomous mobile robots (AMRs).

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Vector Atomic’s sensing and timing portfolio will be integrated into IonQ’s commercial and government offerings, with particular impact on defense and space industries.

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Following the companies’ announcement of Canada’s first commercial virtualized and O-RAN network in February 2024, the RIC implementation will enable TELUS to harness AI throughout network operations and management.

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During Evertiq Expo Gothenburg on September 4, 2025, Mareike Haass from in4ma and Christoph Solka from the Global Electronics Association presented the latest half-year analysis of the European EMS market — offering a sobering snapshot of the industry’s performance.

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This collaboration combines ChemVolt Global’s expertise in project development, engineering, procurement, and construction (EPC) and local market execution, with ElevenEs’ experience in LFP cell technology and large-scale European manufacturing.

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The partnership brings together Smartports’ scalable carport architecture and integrated charging with Rebaba’s circular storage technology, enabling sites to generate, store and deliver clean power directly where it is used.

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Isuzu is working to commercialize the next-generation fuel cell (FC) route bus as a new technology. Toyota is advancing various initiatives in producing, transporting, storing and using hydrogen in collaboration with a wide range of partners across industries.

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The new capital will expand production capacity for the Nova vehicle and complete activation of Launch Complex 14 at Cape Canaveral. The US company will also invest in supply chain, its Boltline product, and infrastructure to prepare for high-cadence launch operations.

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Nidec Motor Corporation is expanding its existing facility in Mena, Arkansas, with an investment of more than USD 19 million. With the expansion, Nidec aims to create 35 new jobs over five years.

Marco Pieters will take on the role as Executive Vice President and Chief Technology Officer of ASML, reporting to President and Chief Executive Officer, Christophe Fouquet.

Mercedes-Benz has announced a collaboration with semiconductor company Athos Silicon to accelerate the development of advanced chiplet architectures for autonomous computing.

Global spending on 300mm semiconductor fabrication equipment is projected to reach USD 374 billion from 2026 and 2028, driven by rising demand for AI chips and efforts to strengthen regional semiconductor self-sufficiency, according to SEMI’s latest 300mm Fab Outlook.

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Evertiq AB has been named one of Sweden’s Gazelle Companies 2025 by Dagens industri. The award recognises some of the country’s fastest-growing and best-managed companies – businesses that demonstrate strong growth, sound finances, and sustainable business models.

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Imec has launched a new 300mm gallium nitride (GaN) program aimed at advancing power electronics technology and reducing manufacturing costs.

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The new funds would be used to build and test the company’s first chip, expand its engineering team and launch pilot projects with data center clients. Commercial deployments are planned in India, Europe and the US.

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VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

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EMS provider Federal Electronics has installed a new Pillarhouse Jade S-200 MKII selective solder system at its Hermosillo, Mexico, facility, strengthening its ability to support high-mix, high-complexity assemblies.

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Swedish EMS provider Note has signed an agreement to build new, larger production facilities for its operations in Finland.

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A major question in physics is the maximum size of a system that can demonstrate quantum mechanical effects. This year’s Nobel Prize laureates conducted experiments with an electrical circuit in which they demonstrated both quantum mechanical tunnelling and quantised energy levels in a system big enough to be held in the hand.

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Qualcomm Technologies has agreed to acquire open-source hardware and software company Arduino, integrating one of the world’s largest developer ecosystems into its edge computing and AI portfolio.

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ABB has signed an agreement to sell its Robotics division to Japan’s SoftBank Group for an enterprise value of USD 5.375 billion, ending its earlier plan to spin off the business into a separate listed company.

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The amount will be invested over five years, starting with a refrigerator manufacturing plant of 1.2 million units annual capacity, with commercial production targeted by December 2026.

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Fujitsu has an expanded collaboration with Nvidia aimed at developing a full-stack AI infrastructure that integrates AI agents and high-performance computing systems. The companies said the initiative is intended to accelerate industrial transformation and AI adoption across sectors such as healthcare, manufacturing, and robotics.

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ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, and NewPhotonics, a designer of photonic integrated circuit (PIC) chips for data centre optical interconnect, have entered into a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.

Jaguar Land Rover (JLR) has begun a phased restart of its manufacturing operations following a cyber incident that disrupted production in early September. The company has also introduced a new short-term financing programme to support the cashflow of qualifying suppliers during the recovery phase.

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The Electronic System Design (ESD) industry revenue increased 8.6% to USD 5,089.4 million in the second quarter of 2025 from the USD 4,685.5 million registered in the second quarter of 2024, according to the ESD Alliance, a SEMI Technology Community. The four-quarter moving average rose 10.4%, based on a comparison of the most recent four quarters to the prior four.

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C-Hawk Technology, a manufacturer of components, assemblies, systems and surface treatment processes for the semiconductor and health imaging industries, has opened its new manufacturing facility in Vietnam.

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Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its planned investment to USD 7 billion.

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TLT Manufacturing has been making headlines in recent months with its expansion strategy. In September, the Lithuanian electronics group inaugurated a EUR 320 million expansion in Vilnius, which included four new factories, highlighting its ambition to build a vertically integrated manufacturing park in Europe.

Through this alliance, LTTS will utilize the digital technology portfolio of Siemens to deliver simulation-driven automation and IIoT-enabled solutions for diverse sectors including automotive & transportation, industrial products, and process & plant engineering.

AMD and OpenAI have announced a strategic multi-year agreement to deploy up to 6 gigawatts of AMD GPUs to support OpenAI’s next-generation AI infrastructure.

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Funded through the US Defense Advanced Research Projects Agency (DARPA)’s Next-Generation Microelectronics Manufacturing (NGMM) program, the work at Penn State is part of a USD 840 million multi-institutional effort.

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