Apple to invest $1.5 billion in Globalstar to boost satellite coverage
The new arrangement represents a significant expansion of an earlier 2022 deal, which first gave iPhone 14 users access to Globalstar’s 31 L-band satellites for emergency text services.
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CCI Eurolam relocates production facility to Düren
The new, state-of-the-art production facility in the Industrial Area Rurbenden in Germany's Düren is double in size, will increase production capacity by 80% and improve logistics, the company said.
Kimball reports 70% drop in Q1 profit, Tampa plant to be shut
Kimball Electronics’ net income dropped from USD 10.8 million to USD 3.2 million. The Jasper, Indiana-based company posted a Q1 revenue of USD 374.3 million.
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Laser sensor with ultra-high range from Brightlaser
Brightlaser, a supplier of laser sensors, offers a range of laser measurement systems for distances from a few metres to tens of kilometres. The LiDAR laser sensor series is suitable for DTOF (Direct Time Of Flight) measurements. This involves measuring the time between sending an optical pulse and the arrival of the reflected light pulse. High-performance VCSELs (vertical-cavity surface-emitting lasers) are used when short switching times and a narrow optical spectrum are required. They are therefore ideal for time-off-light (ToF) applications with high pulse power.
Nexperia, KOSTAL partner to produce wide bandgap devices
Dutch-headquartered Nexperia will supply, develop and manufacture WBG power electronics devices which will be designed-in and validated by automotive supplier KOSTAL.
Strategy 2028: Cicor aims to become leading electronics designer
A stronger focus on high-growth verticals and the accelerated expansion of R&D services is expected to lead to above market growth organically, the company said.
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US startup Tenstorrent to help train Japanese chip designers
The partnership between Tenstorrent and Japan’s Leading-edge Semiconductor Technology Center (LSTC) is part of Japan’s efforts to boost its semiconductor industry.
SpaceX asks Taiwanese suppliers to move manufacturing abroad
With China increasing military drills around Taiwan, some Taiwanese semiconductor and satellite firms are taking steps to decrease their dependence on domestic manufacturing.
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Silver Lake, Bain prepare to bid for stake in Intel’s Altera
Intel has started the process for the stake sale in its programmable chips unit Altera, which it acquired for nearly USD 17 billion in 2015. The deal could provide Intel with a much-needed cash boost.
L&F to mass produce cathodes with 95% nickel content
This is the highest nickel content for such a battery type. L&F will start supplying these ultra-high-nickel cathodes to Korean battery cell makers and US EV manufacturers from December.
Purdue expands India ties with education, semiconductor centres
Through the US-India Center of Excellence in Semiconductors, Purdue will launch the India-US Collaborative on High-impact Innovation and Partnerships in Semiconductors (INDUS-CHIPS) alliance.
Asahi Kasei, Honda form JV for lithium-ion battery separators
Honda Motor will invest a total of approximately USD 300 million combining the subscription of new shares and other investment in this joint venture.
Oppo invests $4.2 million in HK PolyU’s AI imaging center
The Hong Kong Polytechnic University-Oppo Joint Innovation Lab will be upgraded to the Joint Innovation Research Centre.
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EMC: Applied Physics for Optimal Application Design
In our highly connected world, the smooth operation and communication of electronic devices is of critical importance: They must neither be susceptible to electromagnetic interference, nor become a source of interference themselves. Würth Elektronik supports you in EMC optimization.
Schneider ousts CEO after differences over strategy
Peter Herweck was CEO of French multinational Schneider Electric for 18 months. He is being replaced by company veteran Olivier Blum, the chief of its key energy management business.
Australia scraps $5 billion military satellite project
The project to deliver Australia’s first sovereign-controlled satellite communication system was awarded to Lockheed Martin in 2023. The government says it will prioritize a multi-orbit capability.
Midsummer, Saab sign pact for 200 MW solar plant in Thailand
The two Swedish companies have jointly identified possible opportunities for the establishment of a 200 MW ‘mega factory’ for the production of thin film solar cells in Thailand.
China urges France to find common ground on EV tariff row
Commerce minister Wang Wentao told French junior trade minister Sophie Primas that the EU’s probe into China’s EVs has “seriously hindered” cooperation between the China and EU auto industries.
US fines GlobalFoundries for shipping chips to blacklisted firm
The Commerce Department said contract chipmaker GlobalFoundries sent 74 shipments worth USD 17.1 million to SJ Semiconductor, an affiliate of sanctioned Chinese firm SMIC, without seeking a license.
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Hybrid Connectors: Powering the Next Frontier in IoT and Machine Learning
Explore the transformative role of hybrid connectors in the burgeoning realms of IoT and machine learning. These technological marvels are revolutionizing data transmission, fostering seamless integration, and catalyzing advancements in hyperspectral surveillance and artificial intelligence.
Nissan, Mitsubishi form JV in EV, autonomous push
The joint venture aims to provide robotaxi services using Level 4 autonomous driving technology and at-home EV battery storage, among other services.
Livium bags $560,000 grant for battery recycling plant
The grant was awarded to Livium’s subsidiary Envirostream Australia as part of the Western Australian Government’s electronic waste infrastructure funding program.
Merck completes acquisition of French firm Unity-SC
Unity-SC develops measurement and inspection equipment for heterogeneous integrated semiconductor systems used in AI, high-performance computing and high-bandwidth memory chips.
Irish chip firm Trasna’s office inaugurated in Kerala
Transa will closely work with India Semiconductor Mission, an initiative of the central government to develop the semiconductor ecosystem in the country.
Chiplet market set to reach $411 billion by 2035
Chiplets break down complex chips into smaller, specialized components, giving greater flexibility and customization, resulting in faster time to market and shorter upgrade cycles.
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Koh Young Technology Showcasing its Inspection Solutions at electronica and SEMICON Europa in Munich
Alzenau, Germany – Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024. At electronica Booth A3.358, our team of experts will be on hand to discuss how our AOI, SPI and DPI solutions boost your quality and increase your yield. At the parallel event SEMICON Europa Booth C2.549, our application engineering team will be showcasing our superior quality semiconductor inspection solutions for advanced and wafer-level packaging.
‘Nvidia’s CEO asked SK Hynix to bring forward supply of HBM4’
Nvidia’s CEO Jensen Huang’s request for faster delivery shows the robust demand for new iterations of Nvidia’s GPUs, which are crucial for AI and will have next-generation HBM chips.
Chinese carmakers may pause investment in some EU countries
Chinese automakers were told by the Ministry of Commerce that they should put the brakes on big investment plans in EU countries that back extra tariffs on Chinese-built EVs, sources told Reuters.
Toyota to get Suzuki’s first-ever electric vehicle
The new model is scheduled to be manufactured at Suzuki Motor Gujarat in India from the spring of 2025. This new development marks the first BEV in the OEM relationship between the two companies.
Samsung’s Q3 profit rises but chips remain sluggish
The South Korean company reported net income of 9.78 trillion won (USD 7.1 billion) in the September quarter, compared with analysts’ average estimate of 9.14 trillion won.
Fujitsu, AMD partner to develop sustainable computing infrastructure
The partnership seeks to facilitate the creation of open source and energy efficient platforms comprised of advanced processors with superior power performance and highly flexible AI/HPC software.
US to invest $825 million in New York chip facility
The site in Albany, New York, will focus on extreme ultraviolet (EUV) lithography, which is used to make the most advanced nodes for the next generation of chips and processors.
AQ completes its acquisition of TechROi Engineering
AQ Group AB has completed the transaction of acquiring TechROi Engineering and TechROi Scandinavia, which develop and construct components and systems for customers within vehicle, aerospace and gas turbine industry.
Amphenol opens new facility in Penang
Amphenol DC Electronics Malaysia Sdn. Bhd. (Amphenol), held a grand opening of its new 70,000-square-foot facility in Penang on 26 October 2024. The new facility offers the potential to add an additional 60,000 square feet in Phase 2.
Schmid Group expands in Asia
Germany's Schmid Group is expanding with the opening of SCHMID Asia Pacific Sdn. Bhd., in Malaysia.
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