Molex to acquire Smiths Interconnect
Molex has signed an agreement to acquire Smiths Interconnect. Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, is a provider of high-reliability connectivity products and solutions serving the aerospace and defence, medical, semiconductor test and industrial markets.
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Keysight completes acquisition of Spirent Communications
The aggregate transaction consideration totaled approximately USD 1.46 billion on a fully diluted basis. UK firm Spirent’s shares will be delisted from the London Stock Exchange effective October 17.
Chara raises $6M to boost rare-earth-free motor manufacturing
The Indian company is planning to establish a new factory in Bengaluru along with a dedicated testing and validation facility. The expansion is expected to increase Chara’s annual production capacity from 20,000 to 100,000 units.
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Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
ICEYE, IHI sign agreement to build Earth observation satellites
IHI has placed an initial order for four satellites and associated image acquisition system, with the option to procure a further 20 satellites at a later stage. The first satellites are expected to begin phased commissioning and data delivery from around April 2026.
Vertical secures $11M to advance development of GaN transistors
Built on a decade of research at MIT’s Palacios Group, Vertical’s breakthrough transistors use GaN. Vertical has demonstrated the technology on 8-inch wafers using standard silicon CMOS semiconductor manufacturing methods.
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Sumitomo partners with Toyota to mass produce cathode materials
Since around 2021, the two Japanese companies have been conducting joint research on cathode materials for all-solid-state batteries, to be installed in battery electric vehicles (BEVs).
Whirlpool invests $300M in US operations
Whirlpool plans a USD 300 million investment in its US laundry manufacturing facilities, in order to grow its American manufacturing footprint.
GlobalWafers opens new 300mm wafer plant in Italy
Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.
Murata opens advanced EMC test lab in Nuremberg
Murata Manufacturing says it is enhances its support for customers in the EMEA region and globally with its advanced electromagnetic compatibility (EMC) test laboratory in Nuremberg, Germany.
Foundry utilisation exceeds expectations in 2H25
According to TrendForce, wafer foundry utilisation during the second half of 2025 has remained more resilient than anticipated. Several factors are contributing to this, including the postponed US semiconductor tariffs, low inventory at IC vendors, the peak smartphone season, and ongoing high demand for AI.
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