Spirox opens semiconductor verification lab in Taiwan
Semiconductor equipment provider, Spirox Corporation, plans to build the first power semiconductor dynamic reliability verification laboratory in the Asia-Pacific region.
TEL expands with new production building in Miyagi
Tokyo Electron is expanding its Miyagi plant in Japan by adding a new production building to meet the rapidly growing demand for semiconductors in recent years.
SanDisk's new era: independent and live on Nasdaq
SanDisk Corporation has officially completed its separation from Western Digital and will begin trading as an independent public company on the Nasdaq Stock Market.
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Allegro MicroSystems names Mike Doogue as president and CEO
Allegro MicroSystems has appointed Mike Doogue as President and Chief Executive Officer and a member of the company's board.
ams OSRAM secures €227M EU support for Austrian chip facility
ams OSRAM has received approval from the European Commission for up to EUR 227 million in funding under the European Chips Act to expand its semiconductor manufacturing in Premstätten, Austria.
Samsung Display partners with Intel with eye on AI PC market
Through this MoU, Samsung Display plans to develop display solutions optimized for Intel’s cutting-edge processor chips that enable enhanced artificial intelligence (AI) capabilities.
BYD, Saudi partner on ‘world’s largest’ BESS projects
This cooperation is a major step towards advancing Saudi Arabia's renewable energy industry and aligning with the ambitious goals set forth in Saudi Arabia's Vision 2030 initiative.
Yuma Energy acquires Grinntech to boost battery solutions
Integrating Grinntech’s expertise in battery technologies, R&D and manufacturing will enable Yuma Energy to build a vertically integrated BaaS ecosystem, Yuma said.
U-M awarded up to $7.5M to develop heat-tolerant chips
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
CATL, Volkswagen to partner on EV batteries
Volkswagen said the collaboration with CATL will help provide better battery solutions for its customers, support its supply chain and help in meeting the increasing requirements of the EV market.
Toyota backs LG’s Michigan battery plant with $1.5B order
LG Energy Solution was looking for new customers after General Motors reached a non-binding agreement with LG to sell its stake in the Lansing, Michigan, plant.
Silicon Labs secures $23M Texas CHIPS Act grant to boost R&D
Silicon Labs has received a USD 23 million grant from the Texas Semiconductor Innovation Fund (TSIF) under the Texas CHIPS Act to enhance research and development in Austin.
Everspin, Lattice partner to bring MRAM solutions to FPGA platforms
Enabled through the Lattice Radiant software suite, this validation highlights MRAM’s role as a robust and reliable configuration memory device for a wide range of applications.
Murata inks deal to lease factory in India
Murata Electronics (India), a subsidiary of Murata Manufacturing, has signed an agreement to lease a factory in Tamil Nadu, India.
Infineon secures EU Chips Act funding for smart power fab in Dresden
Infineon Technologies has secured European Commission approval for funding under the EU Chips Act. This investment will advance its Smart Power Fab in Dresden, strengthening Europe's semiconductor industry.
SUMCO to end wafer production at Miyazaki plant amid market shifts
Japanese silicon wafer manufacturer SUMCO says it will stop 200mm wafer production at the Miyazaki plant by 2026
Cambridge GaN Devices secures $32M to drive growth
Cambridge GaN Devices (CGD) has successfully raised $32 million in a Series C funding round, led by a strategic investor with contributions from British Patient Capital and existing backers. This funding will allow the company to expand its operations in Cambridge, North America, Taiwan and Europe.
GA-ASI, CAE sign agreement to develop next-gen Mission Trainer
The agreement will enhance the training capabilities for operators of MQ-9B and builds on the long-standing business relationship between GA-ASI and CAE, according to a media release.
EU funding strengthens semiconductor innovation in Finland
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.
ASE expands its chip packaging and testing capacity
ASE has officially launched its fifth plant in Penang, adding to the company’s packaging and testing capabilities in the Bayan Lepas Free Industrial Zone.
Blueshift Memory start £2.77M project with AP Memory & Syntronix
Blueshift Memory, designer of a novel high-speed memory architecture, has secured a UK-Taiwan Bilateral R&D grant from Innovate UK for a project worth GBP 1.2 million in the UK.
General Atomics, EDGE partner to produce electromechanical systems
A key milestone in the project will be the certification of EPI's facility as a Part 145 repair centre. EPI is an entity of the EDGE Group.
Western Digital to complete separation from SanDisk
Western Digital Corporation (WDC) is set to finalise the long-planned separation of its flash business from its hard disk drive (HDD) operations, forming two independent, publicly traded companies.
Cybersecurity: A growing challenge and regulatory shift
For many years, cybersecurity was primarily a concern for the enterprise computing market. Corporate PCs and datacenters were the main targets for malware attacks, while embedded and IoT devices largely flew under the radar of malicious actors.
Ardian completes acquisition of chip firm Synergie
Synergie Cad specializes in development of advanced test interface solutions enabling leading semiconductor companies to optimize testing and validation of their complex chip designs.
Mitsubishi Electric, HD Renewable Energy sign JV
As part of their collaboration, the companies will establish an aggregation business joint venture and Mitsubishi Electric will acquire a stake in HD Renewable Energy, according to a media release.
SkyLab partners with Esnet, expands XR Cloud into South Korea
This move will accelerate AI-driven innovation by providing enterprises, research institutions and startups instant access to high-performance GPU computing.
Infineon reaches next milestone on 200 mm SiC roadmap
Germany's Infineon Technologies says that it has made significant progress on its 200 mm silicon carbide (SiC) roadmap. The company plans to launch its first products based on the advanced 200 mm SiC technology in the first quarter of 2025.
Macom Europe receives multi-year contract
MACOM says that its France-based European Semiconductor Center (MESC) has been awarded a multi-year contract from Banque Publique d'Investissement (BPI) to lead the development and manufacturing of advanced semiconductor products in collaboration with public and private sector partners.
ams Osram: "Our turnaround is in full swing"
Austrian semiconductor manufacturer ams Osram delivers cost savings ahead of plan, Q4 revenues and profitability above mid-point of guided range.
Black Semiconductor launches new HQ – FabONE
Black Semiconductor GmbH has officially opened its new headquarters and production facility, FabONE, in Aachen, Germany, marking a major step toward developing graphene-based optical chip technology.
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