TXR, iRAPLE partner to advance robot automation technology
TXR Robotics will combine its robot control (FMS) and SLAM-based autonomous driving technology with iRAPLE’s high-precision machine vision to implement ‘intelligent robot automation solutions’ optimized for industrial sites through technical cooperation and localization.
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Nozomi, Schneider deliver security sensor embedded in RTUs
With Nozomi Arc Embedded in Schneider SCADAPack 47xi Smart remote terminal units (RTUs), security and operations teams gain previously unavailable visibility at the control device layer of their industrial automation equipment and field assets.
PTC, Kineco to co-develop aerospace components and structures
The collaboration between the two Indian companies brings together PTC’s expertise in high-integrity castings and materials like titanium and superalloys and Kineco’s capabilities in lightweight composite structures for aerospace and defence applications.
Xanadu partners with DISCO to develop advanced wafer processing
This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.
Infineon completes acquisition of Marvell's Automotive Ethernet business
Infineon Technologies has completed the acquisition of Marvell Technology's Automotive Ethernet business.
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GF expands partnership with Apple
GlobalFoundries has entered into an agreement with Apple for a deeper collaboration aiming to advance semiconductor technologies and strengthen US manufacturing.
Coherent sells aerospace & defence unit to Advent for $400M
Photonics specialist Coherent has entered into a definitive agreement to sell its Aerospace and Defence business to Advent, a private equity investor, for USD 400 million.
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Magnachip CEO steps down as company weighs potential sale
Magnachip Semiconductor's CEO YJ Kim will step down from his role and the company's board of directors, effective immediately, as the board considers “all strategic alternatives,” including a potential sale. Board Chairman Camillo Martino has been appointed interim CEO.
Applied Materials to build $200M components plant in Arizona
Applied Materials says it will invest more than USD 200 million to build an advanced manufacturing facility in Chandler, Arizona, dedicated to producing components for semiconductor equipment.
US uses hidden trackers to monitor AI Chip shipments bound for China
US authorities have reportedly embedded concealed tracking devices in certain shipments of advanced AI chips to detect possible violations of export restrictions targeting China, according to sources cited by Reuters.
Eutelsat, Tata’s Nelco to offer LEO connectivity across India
Under the agreement, OneWeb India Communications, Eutelsat’s local operating entity, will partner with Nelco to deliver secure, low-latency Low Earth Orbit (LEO) connectivity for customers on land, at sea, and in the air.
TSMC to phase out 6-inch wafer production
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.
SuperSiC breaks ground on new manufacturing facility in Penang
SuperSiC, a subsidiary of Zhejiang Jingsheng Mechanical & Electrical (JSG), has broken ground on its new manufacturing facility in Penang, Malaysia. The facility is part of JSG’s global expansion plans and reflects the growing role of Chinese semiconductor companies in the international supply chain.
indie Semiconductor to acquire emotion3D in $20 million deal
indie Semiconductor has agreed to acquire emotion3D GmbH, an Austrian developer of perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS), and automated driving, the companies announced.
Kandi subsidiary to provide battery swapping equipment to CATL
China Battery Exchange will provide standardized, high-performance battery swapping station equipment and comprehensive support solutions, including main station structures, advanced robotic arm systems, and precision battery compartment temperature control modules.
Baidu partners with Uber to accelerate autonomous vehicle deployment
The first deployments are expected in Asia and the Middle East later this year. After launch, if a rider requests a qualifying Uber trip, they may be presented with the option to have their trip fulfilled by a fully driverless Apollo Go autonomous vehicle.
Trump softens criticism of Intel CEO Lip-Bu Tan
From demands for resignation to praise in less than a week – Donald Trump has made a complete turnaround in his view of Intel CEO Lip-Bu Tan.
EnSilica opens mixed-signal design centre in Budapest
UK-based chipmaker EnSilica has opened a new mixed-signal ASIC design centre in Budapest, Hungary, expanding its presence in the EU.
Northrop Grumman to offer advanced ground-based radars to Romania
The radar will deliver advanced capabilities and performance against today’s most sophisticated threats while also providing interoperability with command-and-control systems employed by NATO countries, including the United States.
Thales Alenia Space, ASI to develop first human outpost on Moon
Planned for launch from NASA’s Kennedy Space Center in 2033, the Multi-Purpose Habitation (MPH) module will safely host astronauts during their missions, support surface operations, enable scientific research experiments both with and without the presence of a human crew, and have the capability to move on the surface.
Monolith teams up with CamMotive to boost EV battery testing with AI
Bringing together London-based startup Monolith’s AI platform and CamMotive’s real-world battery data, the collaboration will enhance test data validation, helping engineers detect complex failure characteristics during electric vehicle battery development.
Cyient enters into strategic channel agreement with GlobalFoundries
As a channel partner, India’s Cyient Semiconductors will provide companies with fabrication access, technical consultation, design enablement, assembly, testing, and other value-added services to accelerate innovation and reduce time-to-market.
IQM partners with Toyo to drive quantum adoption in Japan
Toyo Corporation will market and sell IQM Spark, a 5-qubit system, and IQM Radiance, which ranges from 20-qubit to 150-qubit on-premises superconducting quantum computers.
Trump calls for Intel CEO's resignation over China ties
US President Donald Trump has called for the resignation of Intel CEO Lip-Bu Tan, citing what he described as “highly conflicted” ties to Chinese firms, Reuters reports.
DNP to open first overseas R&D centre in the Netherlands
Dai Nippon Printing will open its first overseas R&D centre in the Netherlands in September 2025. The new R&D centre will be located at the High Tech Campus Eindhoven (HTCE), and aims to promote global R&D, and accelerate innovation.
onsemi to set up research centre for wide bandgap materials
onsemi plans to invest USD 8 million with Stony Brook University to establish a wide band gap research centre that will advance innovation in power semiconductors and foster the next generation of professionals in this field.
Boreo completes acquisition of Elfa Distrelec sales operations in Finland and the Baltics
Boreo Plc has completed its acquisition of Elfa Distrelec's sales operations in Finland, Estonia, Latvia, and Lithuania. The transaction was originally announced back in April earlier this year.
Trump proposes 100% tariff on imported chips – with exemptions
President Donald Trump announced plans to impose a 100% tariff on imported semiconductors, while exempting companies that manufacture chips within the United States or have committed to doing so.
CATL, BASF sign framework agreement for cathode active materials
This agreement builds on the collaborative foundation laid in 2021, when the two companies entered into a partnership on battery materials solutions with the shared goal of developing a sustainable battery value chain.
Coherent opens first datacom R&D centre in Penang
US-based photonics manufacturer Coherent has opened its first Datacom R&D centre in Malaysia, expanding its global footprint to advance optical transceiver technologies for AI and cloud computing.
Tata AutoComp, Ichikoh form JV to acquire Valeo’s lighting business
Tata and Ichikoh are in talks to finalise an agreement to acquire Valeo Lighting Systems (VLS), a business unit of Valeo India Private Limited.
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