Imec inaugurates its Baden-Württemberg office
Just months after unveiling plans for a new automotive chiplet innovation hub in Baden-Württemberg (Germany), imec has inaugurated its office at the IPAI campus in Heilbronn.
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LTSCT partners with CP PLUS for next-gen IP cameras
Under this agreement CP PLUS will manufacture nine million CCTV IP cameras over the next three years, powered by Indian fabless firm L&T Semiconductor’s indigenously designed Vision System-on-Chip (SoC) technology.
Micron: "China remains an important market"
US semiconductor company Micron has responded to recent reports suggesting it may leave the Chinese data center market.
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Amphenol Socapex D38999 Style Connectors & Derivatives
PEI-Genesis carries one of the largest inventories of Amphenol MIL-DTL-38999 circular connectors (formerly MIL-C-38999), including the Amphenol Socapex D38999 Series III extended range. This portfolio features both fully qualified connectors and derivative variants designed for demanding applications.
Rigaku opens technology centre in Taiwan
Rigaku Holdings Corporation has opened a new facility in Taiwan as part of its strategy to strengthen research, development, and customer support in East Asia. The Rigaku Technology Center Taiwan (RTC-TW), operated by the newly established Rigaku Technology Taiwan (RTTW), began full-scale operations in October 2025.
Embraer partners with Mahindra to introduce C-390 Millennium to India
The agreement builds upon the MOU signed in February 2024, deepening the scope of cooperation to include joint marketing, industrialization and developing India as a hub for the military transport aircraft C-390 Millennium.
ICEYE, IHI sign agreement to build Earth observation satellites
IHI has placed an initial order for four satellites and associated image acquisition system, with the option to procure a further 20 satellites at a later stage. The first satellites are expected to begin phased commissioning and data delivery from around April 2026.
Pixelworks to sell Shanghai subsidiary to VeriSilicon
Pixelworks has entered into a definitive agreement to sell its shares in Pixelworks Semiconductor Technology (Shanghai) Co., Ltd. to a special purpose entity led by VeriSilicon Microelectronics (Shanghai) Co., Ltd.
Sumitomo partners with Toyota to mass produce cathode materials
Since around 2021, the two Japanese companies have been conducting joint research on cathode materials for all-solid-state batteries, to be installed in battery electric vehicles (BEVs).
GlobalWafers opens new 300mm wafer plant in Italy
Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.
ams OSRAM extends with CFO until 2030
ams-OSRAM extends its contract with Chief Financial Officer Rainer Irle, effective immediately and running until October 15, 2030. The current contract would have expired on June 30, 2026.
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Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
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Cinch ModICE Connector Solutions for Heavy Equipment
What commonalities do hydraulic shovels, bulldozers, and threshing machines share? Each example of the above equipment operates in challenging environments where establishing reliable connections is highly difficult. The likelihood of disrupted operations from a single loose connection can be greatly minimized by selecting the appropriate connectivity solution.
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