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Rigetti and India’s Centre for Development of Advanced Computing (C-DAC) will explore the co-development of hybrid quantum computing systems to support government laboratories and academics pursuing quantum computing R&D.

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Unlike traditional solutions that struggle to scale beyond a few hundred units, GreyMatter DeepNav will effortlessly handle significantly larger robot operations with ease and precision.

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Under this agreement, SiMa.ai will deliver industry-leading AI hardware and software solutions by leveraging L&T Technology Services’ core engineering capabilities and human capital investments across areas such as mobility, healthcare, industrial automation and robotics.

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The collaboration will combine Stereolabs’ stereoscopic cameras, which use a vision-based AI perception system to measure the dimensions of products with Honeywell’s SwiftDecoder software — which captures barcode data and other written information — in one innovative mobile solution.

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AMD and IBM are exploring how to integrate AMD CPUs, GPUs, and FPGAs with IBM quantum computers to efficiently accelerate a new class of emerging algorithms, which are outside the current reach of either paradigm working independently.

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This alliance will provide regular commercial launch services and flexible, rapid response capabilities from the European mainland. It will also offer Tactical Responsive Launch (TacRL) capabilities, ensuring secure and resilient operation of satellites with expedited reaction times.

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The integration of ChargePoint’s Express chargers with Eaton’s end-to-end electrical solutions delivers a powerful solution to overcome grid constraints, addressing the challenge of how to cost-effectively scale charging for the growing number of EVs entering service.

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CG Semi, a subsidiary of CG Power and Industrial Solutions and part of the Murugappa Group, has launched its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.

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The GMARS launcher, based on the Rheinmetall HX vehicle series, offers a high degree of interoperability and interchangeability with fielded M270A2 and HIMARS launchers, making it an ideal solution for military forces operating in Europe.

Together, Argonne National Laboratory and The University of Texas at Dallas will work toward an abundant supply of domestic critical materials to strengthen the future of battery manufacturing and energy security in the US.

The agreement aims to develop proprietary SAR (Synthetic Aperture Radar) satellites and jointly target opportunities with commercial and governmental customers.

The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.

Nikon Corporation announced on August 21, 2025, that it will close its Yokohama Plant in Kanagawa Prefecture on September 30, 2025. The decision is part of a plan to consolidate development and production functions across the company.

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Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

Amkor Technology says that the City of Peoria, Arizona, has successfully acquired 834.5 acres of state land for future development, including a 104-acre parcel designated for the company’s new semiconductor packaging and test facility.

Kontron has entered into a strategic distribution agreement with Spirit Electronics. Under the agreement, Spirit Electronics will serve as an authorised distributor for Kontron’s line of rugged, mission-critical embedded computing products for the defence aerospace market.

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The “battery-as-a-service” model allows customers to purchase Joy e-bike vehicles without the battery, reducing the upfront cost of the vehicle by an estimated 20% to 30%.

Japanese foundry Rapidus has entered into a strategic collaboration with Keysight Technologies Japan K.K. The companies have signed a Memorandum of Cooperation to develop a high-precision Process Design Kit (PDK) for Rapidus’ 2nm gate-all-around (GAA) semiconductors

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US President Donald Trump says he wants to make more government investments in American companies, similar to the recently announced deal with chipmaker Intel, Reuters reports.

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US-based Rocket Lab Corporation plans to expand its domestic investments to increase semiconductor manufacturing capacity and secure the supply chain for space-grade solar cells and electro-optical sensors used in national security space missions.

The battery will have a connection capacity of 50 MW and an energy storage capacity of 200 MWh, enabling it to supply electricity for four hours. This will provide more flexibility for the Dutch electricity system when the battery is put into operation in 2027.

Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact.

It's official, Intel and the US government have reached an agreement that makes the federal government a shareholder in the semiconductor company. The government will invest USD 8.9 billion in Intel, acquiring a 9.9% stake.

For the tests, the power system at Mazda’s headquarters campus and Toyota’s system that utilizes batteries from electrified vehicles will be connected through their respective energy management systems.

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By adopting Polarion software from the Siemens Xcelerator portfolio, Indian space tech firm Skyroot Aerospace is able to unify its software and systems development processes, improve traceability and compliance, enhance collaboration, and streamline lifecycle management.

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The launch of the satellite culminates a decade-long partnership between Texas Instruments (TI) and the Indian Space Research Organization (ISRO) to optimize the performance of the electronic systems responsible for this Earth-observation mission.

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Adopting high-volume, scalable manufacturing strategies, these products provide cost-effective solutions for both consumer and industrial market demands.

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Haylo Labs has completed its acquisition of UK-based developer of microLED display technology, Plessey Semiconductors, in a move set to strengthen the UK's position in immersive computing and optical computing.

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The US government is examining whether to take ownership stakes in major semiconductor companies in exchange for federal CHIPS Act grants, Reuters reports, citing two sources familiar with the talks.

GlobalFoundries has completed its acquisition of AI and processor IP supplier MIPS.

Altera, a provider of programmable logic solutions, has announced plans to lay off 82 employees at its San Jose headquarters, effective October 8, 2025. This decision follows Intel's sale of a 51% majority stake in Altera to private equity firm Silver Lake for USD 4.46 billion earlier this year.

Japanese SoftBank Group and US chip manufacturer Intel Corporation have entered into a definitive securities purchase agreement under which SoftBank will invest USD 2 billion in Intel common stock.

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