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Infineon CEO Jochen Hanebeck becomes new ESIA President

Jochen Hanebeck, CEO of Infineon Technologies, was named the new ESIA President for a two-year mandate at the General Assembly of the European Semiconductor Industry Association (ESIA). Hanebeck is succeeding NXP Semiconductors’ President and CEO Kurt Sievers.

Mycronic receives another order for an SLX mask writer

Swedish production equipment manufacturer Mycronic has received another order for an SLX mask writer, this time from a new customer in Asia.
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Rohm and Toshiba team up to boost manufacturing

Japanese electronics companies Rohm and Toshiba Electronic Devices & Storage Corporation are teaming up to boost Japan's supply of power devices.

AMD takes on Nvidia with new AI chip products

Advanced Micro Devices is predicting a huge boom in the market for AI processors after launching a new chip series to challenge Nvidia's dominance in the space.
 

Toshiba and Rohm to manufacture power management chips

The Japanese government says it will support this joint project between domestic companies with up to 120 billion yen (USD 830 million) in subsidies.

Lattice team up with Nvidia to accelerate edge AI

Lattice Semiconductor has teamed up with Nvidia and introduced a new reference sensor-bridging design to accelerate the development of edge AI applications using the Nvidia Jetson Orin and IGX Orin platforms.
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Coherent ready to accelerate SiC business expansion

Coherent has closed the USD 1 billion aggregate investment by Denso and Mitsubishi Electric Corporation in the company's silicon carbide semiconductor business.

Applied Materials and CEA-Leti unveil joint lab

Applied Materials and CEA-Leti have expanded their longstanding collaboration to focus on developing differentiated materials engineering solutions for several speciality semiconductor applications.
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Toppan to acquire JOLED's Nomi Site

Toppan Inc. has entered into a sale and purchase agreement with OLED developer and manufacturer JOLED Inc. for the land and buildings at the JOLED Nomi Site in Nomi, Ishikawa Prefecture, Japan.

Kontron signs a contract worth over €30 million

Kontron has signed a contract exceeding EUR 30 million for fiber optic solutions. While the new client remains unnamed it is described as a "significant player in the telecommunications sector in Germany."

ASM launches €300M expansion in the US

ASM International N.V. plans to invest EUR 300 million in a new US site in Scottsdale, Arizona. The company says that the investment will focus on technology development, research, design and engineering capabilities, as well as pilot manufacturing capacities

Pragmatic Semiconductor secures $231m in investments

Pragmatic Semiconductor has raised GBP 162 million (USD 206 million) in a first close of its Series D funding round. The company says that it's planning a limited second close for key investors, of which GBP 20 million (USD 25 million) additional investment is already allocated.

Axcelis officially opens its new logistics centre

Axcelis Technologies has officially opened the company's new logistics centre in Beverly, Massachusetts.

Siemens and Intel to team up to advance factory efficiency

Siemens and Intel have signed a memorandum of understanding (MoU) to collaborate on driving digitalisation and sustainability of microelectronics manufacturing.

Skeleton hires industry veteran to drive growth

Skeleton Technologies has attracted former Northvolt Senior Director of Manufacturing Tobias Hüppe. He joins Skeleton as the company's new Chief Operations Officer (COO) and will utilise his experience in the battery industry as he steers the company's manufacturing expansion.

Imec plans 1950 new hires for its research centre

By 2035, Imec is planning to have hired 1,950 new employees at its research centre in Leuven, Flemish Brabant. That is if the current growth trends persist.
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December 07 2023 11:13 pm V22.1.2-1
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