Siemens partners with Samsung Foundry to advance silicon design
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.
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Onsemi reportedly plans up to 300 job cuts at Czech facility
US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.
Nvidia partners with SK hynix to advance memory for AI factories
As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.
Infineon to transfer backend production out of Tijuana over coming years
Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.
NTT, Mbryonics advance next-gen optical communication modules
The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.
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Foxconn and Intel announce strategic collaboration on AI infrastructure
Foxconn and Intel are teaming up to jointly develop and deploy next-generation AI infrastructure and intelligent computing platforms, combining Intel's processor and silicon capabilities with Foxconn's manufacturing scale and system integration expertise.
Cadence, Samsung Foundry deepen 2nm and 3D‑IC collaboration
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.
Murata partners with Xona to advance satellite PNT technologies
The companies will explore the potential to provide optimal products and solutions by combining Murata’s expertise in high-frequency and wireless communications, sensors, timing devices and module design with Xona’s LEO-based positioning and timing synchronization technologies.
Nebius, Bloom Energy partner to power AI infrastructure build-out
US power company Bloom Energy’s fuel cell systems will provide behind-the-meter electricity for Dutch AI cloud company Nebius and help meet demand for the compute capacity underpinning its full-stack AI cloud platform.
EU proposes Chips Act 2.0 and Cloud and AI Act
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.
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