Drive TLV partners with NXP to advance smart mobility solutions
Drive TLV will facilitate collaborations between NXP and participating companies, identifying startups with the necessary capabilities and technologies to tackle industry challenges and bring market-ready solutions to fruition.
Lucid, KAUST team up to advance EV tech, autonomous driving
Lucid will have access to KAUST’s supercomputing capabilities. Joint efforts will also focus on the design and prototyping of next-generation components and systems, integrating disciplines such as mechanical, electrical, thermal and chemical engineering.
DENSO, ROHM to establish semiconductor partnership
Going forward, both companies will integrate DENSO’s advanced system construction capabilities in the automotive sector with ROHM’s cutting-edge semiconductor technology, cultivated in the consumer market.
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Mitsubishi Motors and Foxtron sign MOU for OEM supply of EV
The EV model to be supplied to Mitsubishi Motors as an OEM model will be developed by Foxtron, manufactured in Taiwan by Yulon Motor, and introduced in the Oceania region (Australia and New Zealand) in the second half of 2026.
Cyient wins Norway hydrogen project contract with GreenH, Luxcara
The hydrogen facility will supply green hydrogen fuel under a long-term agreement with Torghatten Nord AS, fuelling the Vestfjorden ferries — a key project in Norway’s green energy transformation for the maritime sector.
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ABS partners with SCAG to power next-gen commercial mowers
The partnership is set up to run through 2027 with deliveries of Alliance Intelligent Battery Series systems already underway from ABS’ Springboro, Ohio manufacturing facility.
Partstat, WIN team up to enhance chip storage solutions
The partnership between US-based Partstat and Taiwan’s WIN Semiconductors combines Partstat’s expertise in inventory management and storage with WIN’s advanced semiconductor manufacturing capabilities.
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V-GREEN signs MOU to deploy 63,000 VinFast EV charging ports
Under the agreement, V-GREEN and its four partners — Chargecore, Chargepoint, Amarta Group and CVS — will jointly invest a total of USD 300 million to develop EV charging infrastructure throughout Indonesia.
BAM, HZB, HU Berlin plan to establish Berlin Battery Lab
The lab will pool the expertise of the three institutions to advance the development of sustainable battery technologies. The joint research infrastructure will also be open to industry for pioneering projects in this field.
Allego partners with KREISEL to deploy battery-integrated chargers
Allego will install KREISEL’s CHIMERO high-power chargers across its network of en-route and destination sites. The KREISEL CHIMERO enables locations where a separate battery system is not feasible.
IBM, Oracle expand partnership to advance agentic AI, hybrid cloud
To give customers a consistent way to build and manage agents across multi-agent, multi-system business processes, spanning both Oracle and non-Oracle applications and data sources, IBM is making its watsonx Orchestrate AI agent offerings available on Oracle Cloud Infrastructure.
SEMI: EU must quadruple semiconductor funding
The EU should quadruple its semiconductor investment and establish a dedicated budget to support the sector, industry association SEMI says, according to a Reuters report.
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Veeco taps into AI-driven demand with $35M AP300 lithography orders
Veeco Instruments says it has received over USD 35 million of orders for its AP300 Lithography systems in recent quarters from a range of IDM and OSAT customers.
imec spin-off eyeo raises €15 million to give cameras perfect eyesight
eyeo, a new imec spin-off, has raised EUR 15 million in seed funding, co-led by imec.xpand, Invest-NL, joined by QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM). The spin-off aims to revolutionise the imaging market for consumer, industrial, XR and security applications by drastically increasing the light sensitivity of image sensors.
Germany greenlights €1B in support for Infineon's massive Dresden fab
Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
Azad Engineering signs $54 million deal with GE Vernova
Under this contract, Indian company Azad Engineering will manufacture and supply highly engineered and complex rotating and stationary airfoils for advanced nuclear, industrial and thermal power industries.
Ferrotec breaks ground on second manufacturing facility in Kulim
Ferrotec Holdings Corporation has officially broken ground on its second high-technology manufacturing facility in Kulim, Kedah, Malaysia, marking a MYR 1 billion (USD 226 million) investment aimed at strengthening its precision manufacturing capacity for semiconductor components.
Smart Photonics speed up production set up with Aixtron
Aixtron supplies the Netherlands-based Indium Phosphide (InP) foundry Smart Photonics with its new G10-AsP system. The MOCVD solution for high-volume production of GaAs/InP materials will enable the foundry to increase its capacity and capabilities.
Tariff uncertainty and weakening demand threaten MLCC market stability
The global MLCC market is facing heightened risks amid persistent economic uncertainty, driven by unresolved US tariff policy and weakening downstream demand, according to a new report from market intelligence firm TrendForce.
Jenoptik opens the doors to its new fab in Dresden
After around two and a half years of construction, Jenoptik has completed its largest single investment in recent history and officially inaugurated its new fab in Dresden, Germany.
Siemens and Intel expand collaboration on IC and packaging solutions
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
CODICO and Cavli Wireless form partnership
Distributor Codico has entered into a strategic partnership with Cavli Wireless, a provider of cellular IoT connectivity solutions. Through the collaboration, Codico becomes the official distribution partner for Cavli’s advanced IoT modules throughout the European market.
Sustio completes €68.5M expansion, doubling HDI capacity in Penang
Sustio Sdn. Bhd., a subsidiary of South Korea's Simmtech Group, has completed its second manufacturing facility in Batu Kawan, Penang, following an investment of MYR 326 million (EUR 68.5 million). The expansion effectively doubles Sustio’s high-density interconnect (HDI) manufacturing capacity.
IBM, TCS team up to deploy India’s largest quantum computer
IBM and the Andhra Pradesh government have entered into discussions that aim for the Quantum Valley Tech Park to be anchored by an IBM Quantum System Two installation, with a 156-qubit Heron quantum processor.
AT&S starts high-volume manufacturing at new Kulim plant
IC substrate and PCB manufacturer AT&S is commencing high-volume manufacturing at its new facility in Kulim, Malaysia. AT&S Malaysia will deliver high-end IC substrates for AMD’s data centre processors, as well as for other customers.
METLEN, Glenfarne clinch deal for solar and BESS project in Chile
The transaction involves operational solar projects with total capacity of 588 MW, combined with co-located BESS facilities of 1,610 MWh. The total value of the acquisition is about USD 815 million.
TSMC breaks ground on third Arizona fab
TSMC has broken ground on its third fabrication facility in Phoenix, Arizona, marking a major expansion of the company's US-based manufacturing.
QuantumScape, Murata announce framework for ceramics collaboration
US firm QuantumScape (QS) and Japan’s Murata Manufacturing have entered into the first phase of an agreement to explore a partnership for high-volume manufacturing of ceramic film for QS’s solid-state battery tech.
Chinese skyscraper-cleaning robot deal with U.S. suspended
Chinese robotics company Lindu Intelligent Technology has suspended a $1.6 million deal with a U.S. client due to the impact of tariffs.
NEXT partners with BAE to develop next-gen space-qualified chips
NEXT’s latest APU, the NX450, is the world’s first 200 GS/s antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively.
ABS batteries will now power TICO’s EV terminal tractors
Under the initial partnership, valued at more than USD 132 million, TICO is integrating ABS’ high-voltage, off-the-shelf Proliance battery packs into its fleet of EV terminal tractors.
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