IQM, Telefónica to install quantum computers in Spain
The deployment will expand the Galician Supercomputing Center’s (CESGA) advanced computing capabilities and strengthen its role as a key national and European research infrastructure.
Aegis Aerospace and United Semiconductors partner on in-space materials manufacturing
Aegis Aerospace has entered into a partnership with United Semiconductors to develop an in-space manufacturing platform for advanced materials, including semiconductor-related applications, in low Earth orbit.
Micron to break ground on New York megafab
Micron Technology will officially break ground on its planned semiconductor megafab in Onondaga County, New York, on January 16, 2026, marking the start of construction on what the company describes as the largest semiconductor manufacturing facility in US history.
Pixelworks completes sale of Shanghai semiconductor subsidiary
Pixelworks has completed the previously announced sale of its Shanghai-based semiconductor subsidiary, Pixelworks Semiconductor Technology (Shanghai), to a special purpose entity led by VeriSilicon Microelectronics (Shanghai).
Hanwha signs $4 billion deal to produce missiles in Poland
The CGR-080 is a 239mm caliber precision-guided missile featuring a range of 80 km and a CEP (Circular Error Probability) of 15 meters. These missiles will serve as the core ammunition for Poland’s Homar-K (Polish variant of the Chunmoo Multiple Rocket Launcher System).
IOL partners with Safran to manufacture advanced systems
Under the partnership, India Optel Limited (IOL) will be responsible for manufacturing, final assembly, testing, quality control and full life-cycle support, ensuring the systems meet the operational needs of the Indian Army.
Global semiconductor supply chain remains concentrated, exposing bottlenecks
A new analysis of the global semiconductor supply chain highlights how critical stages of chip production remain concentrated among a handful of economies, underscoring the industry’s vulnerability to geopolitical and supply disruptions.
Mouser signs global distribution agreement with Telit Cinterion
Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.
Kaynes partners with Mitsui, AOI to boost chip manufacturing
The collaboration with AOI Electronics positions Kaynes Semicon to deliver turnkey backend semiconductor solutions to global customers. Through the partnership with Mitsui, Kaynes expects to gain access to critical raw materials.
Rohm partners with Tata Electronics to boost chip manufacturing
As the first step in this collaboration, Tata Electronics will assemble and test Rohm’s India-designed automotive-grade Nch 100V, 300A Si MOSFET in a TOLL package, targeting mass production shipments by next year.
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