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Infineon-1

MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.

Under the agreements, Samsung will receive access to US firm Netlist’s complete patent portfolio, including its server DIMM and High Bandwidth Memory technologies. Samsung will supply Netlist DRAM and NAND products, and the parties agree to settle and mutually release all pending legal actions.

EV_charging_Pixaline

Under the collaboration, Indofast Energy will deploy its Quick Interchange Stations (QIS) at Zeon’s charging sites spanning premium malls, metro parking areas, and commercial hubs across Bengaluru, Hyderabad, Chennai, and other key markets.

axonite_chip

Under the partnership, the two companies will design, build and industrialise the key fabrication equipment behind the metalens value chain, from research and development through to high-volume manufacturing.

Esri_MOU

The two companies seek to leverage opportunities in the defence sector by combining BEL’s domain expertise in defence electronics and systems integration with Esri’s geographic information system (GIS), location intelligence and GeoAI capabilities.

Airbus_deal

Under the contract, Syensqo will continue to supply a broad range of advanced materials from its portfolio including prepregs, RTM resins, adhesives, and primers to support Airbus programs across commercial aircraft, space & defense, and helicopter platforms.

MercedesBenz_charging

The partnership provides Mercedes-Benz business customers in the UK and Germany with a fully integrated charging solution, from initial site planning through to installation, operation and ongoing service.

Kawasaki-main-office

Through this MOU, Chunghwa Telecom, Fujitsu and 1Finity will further advance their existing All-Photonics Network (APN) initiatives and accelerate their collaboration to expand next-generation communication infrastructure in Taiwan.

CATL_partnership

This initiative enables Alfen to diversify its battery material portfolio, optimise the cost structure of its energy storage products and strengthen resilience against lithium price volatility.

The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.

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Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.

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Under the MOU, US-based company Factorial Energy and South Korea’s SK On will jointly evaluate the technical feasibility and manufacturing considerations for Factorial’s FEST solid-state battery technologies.

Indie

The collaboration brings together Eros Innovation’s expertise in sovereign AI, multimodal foundation models, cultural intelligence, healthcare AI and digital platforms with Thakers’ expertise in chip design, embedded systems, aerospace and space technologies.

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The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.

Systems_Openchip_partnership

Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.

Technology_building

The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.

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Together, Silvaco’s physics-based simulation portfolio and Nvidia accelerated computing and AI will help customers design, simulate and optimize increasingly complex semiconductor technologies.

signing-the-contract_2

The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.

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Under the agreement, Energy In Motion (EIM) will deploy charging and battery swapping infrastructure at Hindustan Petroleum Corporation Limited (HPCL) retail outlets across India in a phased rollout.

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On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Playground_Global_MOU

The collaboration aims to strengthen the pathway from laboratory innovation to global commercial impact by combining Playground’s expertise in building and scaling frontier technology companies with the CEA’s scientific research and technology-transfer capabilities.

Ersa_Wisconsin

The partnership is intended to strengthen local support for electronics manufacturers by combining German company Kurtz Ersa’s equipment portfolio with E-tronix’s applications experience and regional presence.

Kineco_partnership

The components will be produced in India, comprising several thousand parts per year, with serial production scheduled to start by the end of 2027.

RSO_KDDI

During peak hours, Samsung’s RAN Speed Optimizer (RSO) delivered an average increase of 31% in 5G downlink throughput across the overall trial area, with gains reaching a maximum increase of 52% in dense urban areas, on KDDI’s commercial 5G SA network in Japan.

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Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.

geralt_AI

The two parties will draw on their respective strengths in global energy, power optimization, capital deployment, and AI data center technology to pursue in-depth cooperation in global AI infrastructure development.

Energy_HVDC

The awarding of the contract by Terna and Steg to Hitachi Energy marks the completion of the procurement process for the first HVDC submarine link between Europe and North Africa, which will have a capacity of 600 MW and extend for about 220 km.

AMD has also pledged to invest up to $5 billion in the AI company. In addition, AMD and Anthropic are launching a multi-year engineering collaboration to use Claude to accelerate AMD software development.

chip

Farnell will offer Hailo’s AI products via their global distribution network, e-commerce platforms, and engineering community, enabling engineers, developers and enterprises to integrate advanced edge AI capabilities into their edge designs more efficiently and at scale.

Electronics_Rayfast

Rayfast is a stocking distributor of interconnect solutions and harness components and electro-mechanical products. Their key markets include aerospace, defence, energy, industrial, rail and motorsport.

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