MT Systems has been acquired by Kamet
Kamet Precision Machining & Assembly has acquired MT Systems, Inc., a California-based manufacturer of chemical platforms for substrates and wafer processing systems serving the semiconductor and electronics industries.
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Tokyo Electron invest $167 million in new production building
Japanese chipmaking-equipment maker Tokyo Electron says it will invest JPY 22 billion (USD 167 million) to build a new production facility located in the Iwate Prefecture in order to meet the recent rise in demand from the semiconductor market.
Magnachip to cut workforce by 5%
South Korean Magnachip Semiconductor, a designer and manufacturer of f analog and mixed-signal semiconductor platform solutions, is reportedly planning to reduce its workforce by 5% in response to last year's poor performance and the general decline of the global semiconductor market.
Aehr receives volume production order from major SiC customer
Aehr Test Systems has received an order from its second major SiC semiconductor customer for production quantities of WaferPak full wafer contactors to be used with previously ordered FOX-XP systems for test and burn-in of SiC semiconductor wafers in their production facility.
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Infineon and Delta extends partnership to automotive applications
German semiconductor manufacturer Infineon is expanding its cooperation Taiwanese power management specialist Delta Electronics from industrial to automotive applications.
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Renesas extend connectivity portfolio via Panthronics acquisition
Renesas Electronics has, via a subsidiary, entered into a definitive agreement to acquire Panthronics AG, a fabless semiconductor company specialising in high-performance wireless products.
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Omni Design opens design centre in India
Omni Design Technologies, a provider of high-performance, low-power mixed-signal IP products, is opening a new design centre in Hyderabad, India.
Nano Dimension inaugurates European HQ
Nano Dimension has inaugurated its new European headquarters in Munich, Germany to further its commercial and R&D efforts.
Murata to set up JV to produce MLCC raw materials
Murata Manufacturing plans to set up a joint venture agreement with Ishihara Sangyo Kaisha, Ltd. and Fuji Titanium Industry, a subsidiary of Ishihara Sangyo.
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The U.S. CHIPS Act is already making an impact - Evertiq Expo Malmö, Krakow & Berlin
While the EU equivalent still hasn’t officially been launched, the U.S. CHIPS Act has already sparked USD 200 billion in private investments across the country. But where are all of these new fabs going to be built?
Microchip USA moves to new location
As the business has continued to grow and evolve, Microchip USA found itself in need of a bigger and better space in order to continue to facilitate its operations.
Samsung’s Texas plant could be more pricey than initially thought
Samsung Electronics' future chip plant in Taylor, Texas, will cost the company over USD 25 billion, up more than USD 8 billion from initial forecasts, undisclosed sources told Reuters.
Semtech's president and CEO to retire
Semtech Corporation's president and chief executive officer, Mohan Maheswaran, will retire from his role after having served in such capacity for 17 years.
Amtech receives large order for advanced packaging reflow systems
Amtech Systems has received a multi-unit order for high-volume reflow systems used in advanced packaging applications.
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Mycronic receives order for an SLX mask writer
Mycronic has received an order for an SLX mask writer from an existing customer, for delivery to the United States.
Tageos to set up two new major manufacturing sites
Tageos, a designer and manufacturer of RFID inlays and tags, says that the company has o soon be opening two new manufacturing sites in the USA and China.
Nexperia responds to news that its chips have been found in Russian military equipment
News has circulated that Nexperia chips have been found in Russian military equipment. Nexperia says that it has never been involved in projects of military nature and that it has no intention of doing so in the future.
Mitsubishi Electric looking to boost its SiC power semiconductor business
The Japanese company says that it will double a previously announced investment plan to approximately JPY 260 billion (EUR 1.8 billion), mainly for the construction of a new wafer plant to increase production of SiC power semiconductors.
Improved sales sentiment from December 2022 continued in 1Q23
February 2023 electronic components sales sentiment powers past expectations, momentum carries into March outlook.
RS Group appoints Simon Pryce as CEO
RS Group plc announces that Simon Pryce will step into the role of CEO and Executive Director of RS with effect from 3 April 2023. David Egan, currently Acting CEO, will work alongside Simon in his role as CFO.
Infineon and Continental team up on vehicle architectures
Continental will be collaborating with Infineon Technologies AG in the development of server-based vehicle architectures.
onsemi relocates its headquarters – looking to add employees
onsemi recently announced the move of its headquarters from Phoenix to Scottsdale, Arizona. The new office is located on the Salt River Pima Maricopa Indian Community (SRPMIC).
Nexperia expands cleanroom space in Germany
Caverion has recently handed over an ISO4-certified cleanroom to semiconductor manufacturer Nexperia Germany GmbH for its Hamburg production facility.
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