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Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure

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The collaboration is expected to add significant wind power, solar, and energy storage capacity and help create an AI-powered energy infrastructure that integrates energy systems with intelligent systems.

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The two companies will explore opportunities to accelerate the delivery of critical capabilities and innovation by combining Lockheed Martin’s defense production expertise with General Motors’ advanced industrial capabilities in commercial manufacturing and engineering.

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As a core partner in physical AI, Viam will work with Tech Mahindra to provide their global enterprise clients with direct access to the Viam platform for managing and maintaining robotic fleets at scale.

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The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.

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The agreement creates a foundation for the companies to jointly identify high-impact industrial use cases and explore quantum and hybrid quantum-classical approaches for next-generation engineering workflows.

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Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.

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Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.

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Under the MoU, the two companies will deploy Airbus Flexrotor UAVs across international markets, leveraging Extensee’s end-to-end operational capabilities with Garuda Aerospace’s drone technology expertise.

The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

The 10-year agreement brings together Cellula Robotics’commercial off-the-shelf (COTS) long-endurance autonomous underwater vehicle (AUV) platforms with Metron’s adaptive mission autonomy and undersea warfare and maritime domain expertise.

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Through the strategic alliance, Hitachi will establish and globally deploy Hitachi’s Forward Deployed Engineers (FDEs) model that leverages its strengths in IT, OT, and products cultivated through Lumada, together with Google Cloud’s advanced AI.

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The three parties will work together to build an electric two-wheeler ecosystem that includes Battery Swapping Stations in central Hanoi, battery standards, safety management systems, and new platform-based business models for electric two-wheelers.

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The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.

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The companies plan to combine Hitachi’s IT expertise, operational technology and product manufacturing knowledge with Intel’s computing capabilities and silicon-based platforms to develop next-gen compute capabilities and industry solutions.

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Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

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The partners will use the platform to conduct research on the application of near-term quantum and hybrid quantum-classical computing including areas such as portfolio optimization and expanding explorations around quantum machine learning.

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Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

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ICEYE has completed its Series F financing round, raising more than EUR 1 billion in total. The company secured EUR 450 million in new capital, while the overall transaction value – including share sales by existing shareholders – exceeded EUR 1 billion. Following the round, ICEYE's valuation has risen to more than EUR 10 billion.

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STMicroelectronics has raised its data centre revenue ambition for 2026 to approximately USD 1 billion, up from previous guidance of "nicely above USD 500 million."

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Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

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The collaboration will bring together Nvidia’s full-stack accelerated computing platforms with Doosan Group’s capabilities in industrial automation, power generation and advanced electronics materials to support next-generation AI infrastructure.

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TVS SCS and ALA will jointly provide integrated supply chain services across production and aftermarket lifecycles, spanning production support, spare parts distribution, inventory optimisation, defence-grade logistics solutions and aftermarket and MRO support services.

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The proposed agreement aims at the timely supply of electronic fuzes as per stipulated specifications and quality standards to undertake proof firing and evaluation or trials of weapons and ammunition being procured by the Indian Army.

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The collaboration brings together Nvidia’s full-stack, end-to-end AI factory platform with LG Group’s global expertise in consumer electronics, robotics, mobility components, smart spaces and data center technologies.

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Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.

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As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.

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Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.

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The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.

Robotics

The agreement establishes a cooperative framework to layer Integer Technologies’ DIGIT COMMAND operator software with Cellula Robotics’ mission control software for its advanced unmanned underwater vehicle (UUV) platforms.

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