Envision partners with Pulse on 310 MWh BESS project in UK
Leveraging its expertise in AI-powered Future Energy Systems, Chinese green tech company Envision Energy will deliver a system-level storage solution integrating its Gen 7 BESS platform, advanced battery technologies and grid-forming capabilities.
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Sumitomo Chemical to establish JV with Samsung Electro-Mechanics
The joint venture company will engage in the business of glass core substrates for advanced semiconductor packages. Glass core substrates are known for features like excellent rigidity, dimensional stability, low warpage and low thermal expansion.
QUDORA partners with QAI to advance ion-trap quantum computing
By combining German firm QUDORA’s quantum computing platform with Korean company QAI’s AI infrastructure and application expertise, the collaboration aims to demonstrate practical hybrid AI-quantum services in a real operational environment.
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Connector Technology at the Core of Ground Vehicle Modernization
Ground combat vehicles are rapidly evolving from fixed-function platforms into modular, software-defined systems. This shift demands interconnect solutions that support continuous upgrades without requiring redesigns of wiring infrastructure. Scalable, high-reliability connectors, particularly those based on MIL-DTL-38999, are central to enabling this transformation.
LTSCT, Azuremoto to advance SiC, power semiconductor solutions
The MoU establishes a structured framework for cross-border business cooperation across SiC power semiconductor products for the AI data centre market, and rectifiers and MOS-based power semiconductor products targeting LTSCT’s key business verticals.
Mitsubishi Electric wholly acquires GSaaS provider Infostellar
Tokyo-based Infostellar provides ground segment as a service (GSaaS) offerings for orbiting satellites. The two companies aim to accelerate the global expansion of ground station networks and establish a high-quality space communications infrastructure.
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US import ban on Innoscience's GaN products confirmed after presidential review
The US International Trade Commission's final determination against Innoscience has been upheld following the conclusion of the presidential review period. The ruling confirms that Innoscience infringes an Infineon patent covering GaN technology, resulting in import and sales bans on the infringing products in the United States.
Micron breaks ground on new cleanroom at Hiroshima facility
Micron Technology has broken ground on a new cleanroom at its manufacturing facility in Higashi-Hiroshima, Japan. The first phase covers approximately 300,000 square feet and is intended to strengthen Micron's advanced memory manufacturing capacity to meet growing AI demand. Equipment move-in is scheduled for the second half of 2028.
Silex acquires Onsemi fab in Pennsylvania for $40 million
Swedish MEMS foundry Silex Microsystems has entered into a binding agreement to acquire a 200mm semiconductor fab in Mountain Top, Pennsylvania, in the United States, from Onsemi. The purchase price is USD 40 million.
FOXTRON, MediaTek to advance intelligent vehicle experiences
The MediaTek Dimensity AX C-X1 platform, which incorporates NVIDIA’s leading-edge GPU and advanced AI technologies, will be integrated into premium automotive solutions across the partners’ ecosystems.
Micron partners with Ford to strengthen long-term memory supply
Micron is increasing output of key automotive memory solutions with capacity expansions designed to support long product lifecycles and ensure sustained supply for critical production programs.
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