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Sponsored content by Kerafol Keramische Folien
Good contact between surfaces as a key to successful thermal management
21st Century brings number of new challenges for engineers. The race to design efficient energy storage systems for renewable resources, miniaturization of power electronic components with simultaneous increase of energy density or pursuit of a lighter, more efficient electric vehicles force inventors to find a way to solve variety of problems. One of it relates to the thermal management of devices being created. In theory whenever heat is generated as side effect of powered component, it needs to be dissipated. There are different methods or cooling systems but most of them require a proper connection between the hot electronic component, like semiconductors, and the cooling plate which is responsible for cooling down the device. This is the space where thermal interface materials (TIMs) are used, which are responsible for filling the gap, levelling irregular spots on the area and conducting or spreading the heat to the coolant. Only well chilled device can work in long-term.
Sponsored content by Cogiscan
AI-powered tools positioned to revolutionize electronics manufacturing –
providing unparalleled improvements to factory efficiency and throughput. As we welcome in a new year, there’s a feeling of optimism and eagerness amongst electronics manufacturers to implement factory digitalization strategies to improve and optimize their operations. With access to factory-ready tools to properly convert data into tangible and actionable insights, factories around the globe are looking at 2023 as the year to turn smart factory dreams into reality.
