onsemi and VW in strategic collaboration on SiC technology
onsemi has signed a strategic agreement with Volkswagen to provide modules and semiconductors that enable a complete electric vehicle (EV) traction inverter solution for VW’s next-generation platform family.
Rochester receives certification for automotive production Rochester Electronics are now IATF 16949:2016 certified for the manufacture of semiconductor components at our US-based facilities.
Semtech completes its acquisition of Sierra Wireless Semtech has completed its acquisition of Sierra Wireless in an all-cash transaction representing a total enterprise value of approximately USD 1.2 billion.
North America to strengthen economic ties On Tuesday, the three countries — the US, Mexico, and Canada — promised to strengthen their economic relations, increase regional production, and increase semiconductor output.
Sponsored content by Kerafol Keramische FolienGood contact between surfaces as a key to successful thermal management 21st Century brings number of new challenges for engineers. The race to design efficient energy storage systems for renewable resources, miniaturization of power electronic components with simultaneous increase of energy density or pursuit of a lighter, more efficient electric vehicles force inventors to find a way to solve variety of problems. One of it relates to the thermal management of devices being created. In theory whenever heat is generated as side effect of powered component, it needs to be dissipated. There are different methods or cooling systems but most of them require a proper connection between the hot electronic component, like semiconductors, and the cooling plate which is responsible for cooling down the device. This is the space where thermal interface materials (TIMs) are used, which are responsible for filling the gap, levelling irregular spots on the area and conducting or spreading the heat to the coolant. Only well chilled device can work in long-term.
Infineon sells HiRel DC-DC converter business to Micross Micross Components, Inc. has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.
Taiwan passes own Chips Act Taiwan has passed it's own version of the Chips Act. Companies can now apply for tax credits on 25% of their annual R&D costs.
AEM opens new manufacturing plant in Malaysia AEM has opened a new manufacturing plant in Penang. The new plant comes with a 365,000-square-foot area for assembly, quality assurance (QA), a warehouse and an R&D lab.
Mercedes-Benz turns to Wolfspeed to power its EV platforms Wolfspeed will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms.
Sponsored content by CogiscanAI-powered tools positioned to revolutionize electronics manufacturing – providing unparalleled improvements to factory efficiency and throughput. As we welcome in a new year, there’s a feeling of optimism and eagerness amongst electronics manufacturers to implement factory digitalization strategies to improve and optimize their operations. With access to factory-ready tools to properly convert data into tangible and actionable insights, factories around the globe are looking at 2023 as the year to turn smart factory dreams into reality.
X-fab setting expansion course “We see very strong demand for automotive so we are permanently searching for further expansion", said Rudi de Winter, CEO of European foundry X-Fab in an interview with eeNews Europe.
Silicon Products invests in the production of silicon carbide The Bitterfeld company Silicon Products used to produce solar silicon (polysilicon). The end came when the solar industry went into a tailspin. The company is now venturing into a new production process and intends to produce high-purity silicon carbide for the semiconductor industry in the future. The company is investing a lot of money to this end.
TSMC kickstarts 3nm volume production TSMC has held a 3 nanometer (3nm) volume production and capacity expansion ceremony at its Fab 18 new construction site in the Southern Taiwan Science Park (STSP).
TSMC looks at Dresden for possible European plant TSMC is said to be in advanced talks with suppliers about setting up its first European plant in Dresden (Germany).
YoY growth of NAND Flash demand bits will stay under 30% Client SSDs constituted a major driver of demand bit growth in the NAND Flash market for the past two years as the effects of the COVID-19 pandemic were spurring procurement activities related to working and studying from home.
Infineon grows in Dresden; plans to open innovation centre The Prinovis print shop building in Dresden has been given a new lease on life. It has been sold to chip manufacturer Infineon who plans to establish an innovation and training centre at the new location.
Micron to cut 10% of jobs in 2023 due to 'supply-demand mismatch' Chipmaker Micron Technology is taking significant steps to reduce costs and operating expenses. This will include select product program reductions and job cuts.
Samsung to start mass production of 12nm-Class DDR5 DRAM in 2023 Samsung Electronics has developed its 16-Gb DDR5 DRAM built using the industry’s first 12nam-class process technology, as well as completed product evaluation for compatibility with AMD.
Sony looks at Japan for new sensor factory Sony is said to invest USD 5.8 billion in a new smartphone sensor factory.
Clay Paky sold to ARRI AG ams OSRAM has entered into a definitive agreement to sell its Clay Paky entertainment lighting business to Germany based ARRI AG. The transaction is subject to customary closing conditions.
Magdeburg's Mayor on Intel: "Our schedule has not changed" "We will not alter the preparation schedule for the planned investment by the chip company Intel", says Magdeburg's Lord Mayor Simone Borris in a statement.
Intel delaying German factory start? Intel is said to have pushed back on its original opening date for a new chip factory in the eastern German city of Magdeburg, local media reports.
Bosch wants a bigger slice of the cake; readies itself for rising chip demand Growth in the global market for semiconductors shows no signs of stopping – and Bosch is growing right along with it.
TSMC vows to bring 4,500 direct jobs to Arizona Arizona won't see just one new TSMC fab, but two. The semiconductor giant's two fabs in Arizona are expected to create an additional 10,000 high-paying high-tech jobs, including 4,500 direct TSMC jobs.
Ixana raises $3M with wearable silicon chip Ixana, a wearable hardware company developing high-speed human-computer interfaces, has raised USD 3 million in funding backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC.
STMicro and Soitec cooperate on SiC substrate manufacturing technology STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Managing obsolescence: FED and COGD agree on cooperation The German Electronics Design and Manufacturing Association (FED) and the Component Obsolescence Group Deutschland (COGD) signed a cooperation agreement at Electronica in Munich.
Trading platform aims to alleviate chip shortage Precogs has launched CHIPSMARKET, an online marketplace for OEM-EMS-ODM businesses to trade chips directly between each other, with brokers, and with distributors.
A perfect storm slams the memory markets Early in 2022, the near-term prospects for the memory markets, including both DRAM and NAND, were decidedly bright, despite the backdrop of tenuous geopolitical dynamics with the conflict in Ukraine and worsening China/US relations.
Memphis Electronics discuss the past and current unpredictable market Evertiq met up with Marco Mezger, COO of Neumonda and the Global Head of Memphis Electronics, to talk about what's happened since the Management Buyout of Memphis, and also what's on the horizon for the company.Load more news