DigiKey India celebrates official launch in Bengaluru
Electronic components distributor DigiKey has officially launched its Indian subsidiary, Digi-Key Electronics & Automation Trading Private Limited, which will operate a Global Capability Centre (GCC) in Bengaluru.
Powering the world – How microchips are made
The semiconductor industry is back in the mainstream spotlight. Unfortunately, that usually happens during times of volatility, shortage, and turmoil.
EU member states push for stronger Chips Act 2.0
All 27 EU Member States have called for a reinforced “Chips Act 2.0” to secure Europe’s position in the global semiconductor industry, issuing a joint declaration urging stronger action to reduce vulnerabilities and strengthen technological leadership.
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Extending component lifecycles crucial for greener electronics
The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.
Siemens and Intel expand collaboration on IC and packaging solutions
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
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Obsolescence: a question of when, not if
“It’s inevitable; you just have to accept it. The first step is to be aware that it will happen, whether you want it to or not.” That’s what Ronny Nietzsche, regional sales manager Nordic-Baltic region at Rochester Electronics, says about component obsolescence.
Memphis Electronic adds Ramxeed to its linecard
Specialist memory distributor Memphis Electronic has entered into a strategic collaboration with Ramxeed, formerly Fujitsu Semiconductor Memory Solution.
DigiKey enters global distribution agreement with Qorvo
DigiKey and Qorvo, a provider of connectivity and power solutions, have entered into a worldwide distribution agreement.
U-M awarded up to $7.5M to develop heat-tolerant chips
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Innoscience launches lawsuits against Infineon
Innoscience filed lawsuits against Infineon Technologies in China and two affiliates in the Suzhou Intermediate People's Court of Jiangsu Province, alleging patent infringement.
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PowerSafe: High-Power Connectors for Harsh Environments Amphenol Socapex’s PowerSafe series stems from the MIL-DTL-38999 Series III architecture and is purpose-built for high-power supply applications up to 500 V in demanding conditions. These connectors integrate highest levels of user safety, shielding effectiveness and environmental performance to meet the European standard for power equipment, DIN EN 61984 (formerly VDE 0627).
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