Is Honda planning $2.5B investment in Ohio hybrid vehicle plant?
Honda plans to invest about USD 1.90 billion to USD 2.53 billion in the new facility, which is slated to start production in 2030, Nikkei reports.
Synopsys, TSMC partner to accelerate AI systems innovation
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.
Finnish startup Verda raises €163M to scale full-stack AI cloud
The funding allows the Helsinki-based company to accelerate product development across all layers of its AI cloud, from compute capacity to platform services for frontier AI teams in the agentic era.
Sponsored content by Elemaster Group
In rail safety, the AI bottleneck isn't the algorithm: it's the evidence
Railway electronics are becoming more complex and software-defined, and suppliers are exploring where AI can help. But rail certification runs on determinism and verifiability, while AI is statistical by nature. At InnoTrans 2026, international group Elemaster argues the real gap isn't the algorithm, it's the testing infrastructure needed to prove AI actually works. And that is why owning the physical chain of verification is critical.
Tata Electronics, Kelington to advance development of Dholera Fab
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.
TransPak brings semiconductor packaging expertise to Thailand
Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter facility offers packaging, final assembly, pack-on-site services and in-lane logistics for customers in Thailand and throughout Southeast Asia.
Siemens, TSMC advance AI-powered chip design automation
As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.
China in possession of F-35 stealth jet parts diverted to Hong Kong
An intermediary was transporting the parts on behalf of F-35 manufacturer Lockheed Martin. It wasn’t immediately clear why the shipment was rerouted or how it ended up in Hong Kong. The F-35 is one of the world’s most advanced fighter jets.
Qualcomm to acquire PickNik to advance open robotics ecosystem
The acquisition is intended to foster an open robotics ecosystem, providing developers with the tools, software and frameworks needed to move more efficiently from research and experimentation to prototyping, deployment and production at scale.
Semiconductor supply chain on the edge?
The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.
Tata Electronics, Enomoto sign MoU to boost chip packaging in India
As part of the collaboration, Japanese precision semiconductor component manufacturer Enomoto will leverage its R&D capabilities, technical know-how and next-gen solutions to accelerate semiconductor packaging readiness for the Jagiroad facility.
Sponsored content by Koh Young Europe
Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart. The new industry event will bring together experts, manufacturers, and suppliers to explore innovations, exchange ideas, and build partnerships across the electronics manufacturing process chain.
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