Air Liquide invests over $170M to back SK hynix’s US fab
Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.
Sicona gets $45M grant to open battery materials production facility
The ARENA grant will be delivered under the Australian government’s Battery Breakthrough Initiative, which supports the growth of domestic battery manufacturing capability and strengthens Australia’s position in the global battery supply chain.
Micron and General Motors sign long-term memory supply agreement
Micron Technology and General Motors have signed a Strategic Customer Agreement to secure a long-term, reliable supply of memory and storage products for GM's vehicle production. The agreement covers LPDRAM, NOR and UFS NAND products, according to a press release from Micron.
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How developers choose the right solution between LCD, OLED and e-paper
Today, displays are a central element of electronic systems – far beyond their traditional role as output devices. They directly influence user interaction, power consumption, thermal behavior and ultimately the overall system architecture. Whether in embedded systems, medical devices, test equipment or mobile applications, developers must define the display technology early in the design phase. This decision has a direct impact on hardware, software and mechanical integration – and is difficult and costly to change later.
JetZero breaks ground on aircraft factory in North Carolina
The project, supported by a state-level incentive package, will be home to production of JetZero’s next-generation aircraft and is expected to create 14,500 jobs over the next 10 years.
Coherent receives $50 million CHIPS funding to expand InP fab in Texas
Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.
Fort Robotics acquires Mapless AI to advance Trust Platform
The acquisition transitions the Fort platform into an intelligent, proactive system where autonomous machines can not only communicate safely but also actively read their environments, anticipate potential hazards, and execute real-time operational decisions on the fly.
MediaTek, Samsung achieve 3Tx 5-layer uplink breakthrough
Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.
Infineon opens €5 billion Smart Power Fab in Dresden
Infineon Technologies has opened its Smart Power Fab in Dresden, Germany – described as the world's largest fab for power semiconductors and analog/mixed-signal technologies.
AT&S expands Kulim with up to €2 billion investment
Austrian PCB and IC substrate manufacturer AT&S is expanding its Kulim manufacturing site in Malaysia, backed by agreements with AMD and another unnamed technology company.
TSMC and Sony sign MOU for next-generation image sensor JV
TSMC and Sony Semiconductor Solutions have signed a non-binding memorandum of understanding to form a strategic partnership for the development and manufacturing of next-generation image sensors.
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