Evertiq - First In Electronics News & Expo

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The funding will primarily go toward deploying OG-1, Origin’s flagship robot, and building out its fleet. It will also support large-scale pilots with customers in the U.S. and Europe and extend the platform to new interior trades.

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BAE Systems expects to hire more than 200 new employees to support production at the new Weld County facility over the next 12 to 24 months. At full capacity, the company estimates that the new facility could feature approximately 600 employees.

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Taiwanese PCB maker Unimicron plans to dissolve Unimicron Germany, its PCB plant in Geldern, to reduce operating costs. The group is injecting up to EUR 35 million into the company to complete existing orders, cover severance payments and pay for the liquidation.

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SK hynix expects demand for memory to outstrip supply through 2030. The Korean memory maker has already secured long-term agreements covering more than half of its production capacity for 2027 and 2028, and reported record revenue of KRW 104.6 trillion (about EUR 70.2 billion) in the third quarter.

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Power electronics has entered a new phase—one defined not by incremental improvements, but by the ability to turn semiconductor performance into real, scalable system value. Efficiency, power density, and reliability are no longer isolated metrics; they are interconnected outcomes shaped by device physics, packaging, thermal design, and manufacturing execution. In this evolving landscape, StarPower is positioning itself as more than a component supplier—it is becoming an engineering partner in electrification.

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ADS-TEC Energy expects to receive a building permit shortly for a planned battery storage facility at the Pulverdingen substation in Baden-Württemberg, Germany. With a planned output of around 1 GW and a storage capacity of 4 GWh, it would be one of the largest battery storage systems in Europe.

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EMS provider Incap’s third-quarter revenue reached a record EUR 80.7 million, up 56% YoY. The increase was driven by the acquisition of Lacon Group and growing demand from defence customers, and revenue also grew 18% organically.

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ESCATEC has completed a new controlled production room at its ESCATEC Mechatronics Ltd (EUK) site in Lutterworth, UK. The investment is meant to strengthen the plant’s ability to take on manufacturing for medical devices, healthcare and other highly regulated programmes.

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For the first time, the defence industry has become Aspocomp’s largest customer segment, accounting for 40% of the Finnish PCB manufacturer’s net sales in the third quarter. Orders received rose 169% to EUR 15.3 million.

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Mercedes-Benz will once again offer its voluntary severance programme for indirect functions in Germany, starting in December. The move is part of stepped-up productivity measures, as the carmaker cuts its profitability outlook for the year.

The fresh funds will be used to build and launch a four-qubit quantum computer in the near term, with the Bengaluru-based company targeting a larger prototype featuring around 100 qubits by 2029.

Taihan has executed a material supply agreement valued at approximately USD 90 million with its U.S. subsidiary, T.E.USA, which will oversee the entire project, including local engineering and construction.

GlobalFoundries has opened an Advanced Facilities Control Centre (AFCC) at its site in Singapore, developed together with Siemens. In the first phase, the control centres for five fabs on the Singapore campus will be merged into a single, AI-supported command centre.

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On 22 October, the electronics industry gathered once again in Poland's modern and vibrant capital, bringing another Evertiq Expo season to a close.

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Power electronics systems must not only efficiently control the flow of energy but also handle phenomena that may threaten their components. In converters, inverters, power supplies, or drive systems, semiconductors frequently switch large currents and operate at high voltages. At the same time, they may be exposed to overvoltages originating both from the power grid and generated within the device itself.

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The United States has decided to establish a European maintenance centre in Poland for PAC-3 MSE missiles used by Patriot air defence systems. The investment is expected to shorten missile maintenance times and reduce costs. Poland, however, aims to go further and eventually launch missile production on its territory, as these interceptors are in short supply among both European allies and Ukraine.

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Foxconn Slovakia has started recruiting at its plant in Nitra, focusing on electrical engineering roles. The company says the hiring is a response to growing demand for AI infrastructure and new business opportunities in that area.

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Malaysian customs has seized AI servers worth around MYR 49.5 million (USD 12.1 million) at Kuala Lumpur International Airport. The authorities believe the shipment is linked to a syndicate that has been smuggling high-performance chips through the country.

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Essemtec, the SMT equipment business of Nano Dimension, has moved its US headquarters to a new facility in Woburn, Massachusetts. The new site will give North American customers access to equipment demonstrations, application development and process evaluation.

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India’s Tata Power brings extensive experience across power generation, transmission, distribution and renewable energy, while Imperial College London contributes research capabilities spanning energy systems, engineering, digital technologies, economics and decarbonization.

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Arrow Electronics will bring several application-led technology demonstrations to electronica 2026, showing how AI, robotics, edge computing and electronic components are being applied across different vertical market segments.

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This 150 MW/300 MWh Hazelwood BESS expansion will feature 66 units of Sungrow’s ST5015-UX BESS, part of the PowerTitan 2.0 series, alongside 33 units of SC6900UD-MV PCS inverters and Sungrow’s smart controller EMS3000.

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US component distributor A2 Global Electronics + Solutions has achieved AS9100 certification. The certification expands the quality management framework supporting the company's value-added services, including BGA reballing, for customers in aviation, space and defence.

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Volkswagen Group has chosen NXP as a strategic technology partner for its future zonal vehicle architecture. NXP’s S32K5 family of microcontrollers will serve as a common building block across all the group’s brands and vehicle segments, and the first vehicle using the new architecture is planned for 2027.

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Microsoft is launching a voluntary buyout program that could be available to as many as 60,000 employees, Reuters reported. The company aims to reduce costs while planning to invest $175 billion, primarily in artificial intelligence infrastructure.

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Audi plans to build its first manufacturing plant in the United States. The investment in Georgia is expected to total around $4 billion, with the factory capable of producing up to 200,000 vehicles annually. Construction is scheduled to begin in 2027, with production expected to start in the early 2030s. The announcement has sparked major controversy because Audi CEO Gernot Döllner unveiled the company's plans during an election rally for Donald Trump in Georgia.

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Intel has agreed to acquire Classiq, an Israeli developer of quantum computing software. The deal would combine Classiq’s software with Intel’s own silicon spin qubits and manufacturing, turning Intel’s quantum computing group into a full-stack business.

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Nexperia’s third-quarter revenue rose 9.3% from the previous quarter to USD 389 million. The Dutch chipmaker is rebuilding its business without its Chinese subsidiaries, which it no longer controls.

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Scanfil grew its third-quarter revenue by 32% to EUR 252.2 million. Acquisitions accounted for 21% of the increase, while organic growth accelerated to 8.5%. Aerospace and defence was the fastest-growing customer segment, with revenue more than tripling to EUR 30.9 million.

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Infineon will invest around EUR 1.1 billion by 2034 to set up high-volume production of gallium nitride (GaN) power semiconductors on 300mm wafers at its site in Villach, Austria. According to the company, it will be the first high-volume GaN fab of its kind in the world, with production scheduled to start by the end of 2027.

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Engineers are increasingly choosing memory components based on what they can actually get, rather than on performance or price. In a survey by Memphis Electronic, 95% of respondents said they had changed their sourcing strategy, their product designs, or both, over the past year.

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The development centers in India will leverage HCLTech’s expertise in core engineering to offer Rapidus a range of semiconductor engineering capabilities, including mask design, design infrastructure, process design kit development, design technology co-optimization and layout design.

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Together, the companies intend to develop integrated power generation and electrification solutions capable of serving both 60 Hz and 50 Hz markets, including deployment in data centers.

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As part of the agreement, Rambus is adopting the ChipAgents platform companywide, including deployment across its chip and silicon IP design and verification workflows to accelerate the pace of development.

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PCB materials supplier Ventec International Group has officially opened its new manufacturing facility in Thailand, its first production site in Southeast Asia. At the same time, the company is investing USD 50 million in expanding its operations in Kunshan, eastern China.

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