Siemens taps Jabil to operate new switchgear facility in Virginia
Siemens and Jabil have announced plans for a new 300,000-square-foot manufacturing facility in Prince George County, Virginia, where Jabil will produce medium-voltage switchgear and integrated power distribution solutions on Siemens' behalf. Production is scheduled to begin in autumn 2026.
Nexperia secures US manufacturing partner for power MOSFETs
Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.
Amkor acquires additional land in Arizona to expand advanced packaging campus
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.
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COMPACT PHOTOELECTRIC SENSORS OF THE PANASONIC BRAND
Panasonic offers a wide range of components designed for industrial automation applications. Among them, miniature photoelectric sensors are particularly popular, valued for their compact dimensions, high precision of operation, and reliability in demanding applications. Let’s check what functions these solutions offer and what distinguishes them in terms of technical parameters.
Zirconn launches SMT division in China
Zirconn is expanding its manufacturing capabilities in China. The company has launched a new SMT assembly division aimed at increasing its capacity to deliver advanced electronic projects for customers in Europe and international markets.
BluJ Aerospace unveils its next prototype eVTOL aircraft
The Indian startup's fully battery-powered Gen #2 prototype aircraft can carry an active payload target of above 200 kg, operates under a 500 kg maximum take-off weight, and uses a lift plus cruise configuration.
Global PCB material supply tightening: What the market is experiencing today
The global raw material supply continues to pressure the electronic industry and not least the PCB manufacturing sector. What initially affected a narrow range of high-frequency materials has now evolved into a broader scope, impacting both advanced laminates and standard FR-4 materials.
Huawei proposes Tau Scaling Law as successor to Moore's Law
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.
Quectel expands EMEA reach with Future Electronics deal
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.
Indian startup Anscer Robotics secures $4.7 million in Series A
The company’s architecture is designed to support real-time analytics, contextual decision-making, and seamless interoperability with customer-owned Artificial Intelligence models and digital systems.
IBM announces US quantum chip foundry with $1B CHIPS support
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.
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