GlobalWafers increases its offer for Siltronic
GlobalWafers says it has increased its all-cash takeover offer of Siltronic, by its subsidiary GlobalWafers GmbH, to EUR 140 per Siltronic share.
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CML recertified according to ISO 9001:2015
CML announces that CML Europe and CML Automotive GmbH have successfully passed the ISO 9001 recertification audit and have renewed the certification.
Custom Interconnect Ltd installs a second Takaya Flying probe tester
UK-based Custom Interconnect has invested in another TAKAYA APT-1400F Flying Probe Test machine from Accelonix Ltd to compliment the first TAKAYA APT-1400F that they installed in late 2018.
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The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Filtronic wins UK defence contract worth over £1 million
The designer and manufacturer of antennas, filters and mmWave products, announces a significant contract win from a new major UK defence customer for the supply of battlefield radio communications hardware valued at over GBP 1 million.
NI and Konrad ink agreement to accelerate autonomous vehicle test
NI and Konrad Technologies (KT) have entered into a strategic agreement to develop test systems and solutions for autonomous driving software and hardware validation.
PCB Connect and Accent PCB join forces in the Netherlands
PCB Connect’s Dutch entity is taking another big step on the Dutch market with the signing of a Business Integration partnership with Accent PCB Nederland BV.
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Intel expands in Poland
The US chipmaker is preparing to expand its operations in the Polish city of Gdańsk. The company will be constructing its sixth building at its campus in the city.
Murata completes new Okayama production building
The Japanese company’s production subsidiary, Okayama Murata Manufacturing, initiated an expansion of its operations in Setouchi City with a new production building in December 2019. Now the building stands complete.
Osram signs supply and commercial agreement with LeddarTech
ADAS and AD sensing specialist, LeddarTech, and automotive lighting and laser systems supplier Osram, have entered into a long-term agreement.
ITW to acquire MTS Test & Simulation business From Amphenol
Illinois Tool Works Inc., a global multi-industrial manufacturing company, and the provider interconnect, antenna and sensor solutions, Amphenol Corporation, have entered into an agreement under which ITW will acquire MTS Systems Corporation’s Test & Simulation business, following the closing of Amphenol’s acquisition of MTS.
Tobey Gonnerman named Fusion Worldwide's new President
The global sourcing distributor announces that Tobey Gonnerman has been appointed as the company’s new President.
NOTE grows further within medtech
The Swedish EMS provider says it has started a cooperation in electronics manufacturing with a, unnamed, well-established large international medtech company.
Industry R&D spending to rise 4% after 2020 record
Intel stays on top of research and development ranking, but its share of total industry R&D expenditures dipped after its spending decreased 4% in 2020. AMD moved into the R&D top 10, says new report.
GE Healthcare invests to start R&D development in Hungary
The company is investing HUF 3.3 billion (EUR 9.24 million) to expand their healthcare development centres in Szeged and Budapest.
Solving the Cable TV Infrastructure Downstream Transmitter Challenge
Driven by demand for faster internet connectivity, the cable TV industry has developed new network architectures for the delivery of multigigabit services to subscribers. This fiber deep approach, using a remote PHY device (RPD), moves critical hardware closer to the users by using digital fiber.
Boyd expands its footprint with new facility in Mexico
Thermal management and engineered material solutions specialist Boyd Corporation, has expanded its presence in North America with a newly built facility strategically located in Juarez, Mexico.
Farnell becomes a global distribution partner NI
the distributor of electronic components, products and solutions has been appointed as an NI Authorized Distributor, expanding its product portfolio to include NI software-connected test and measurement solutions for customers of all sizes.
Foxconn and Winbond invest in chipmaker Kneron
Foxconn and Winbond joins companies such as Qualcomm, Horizons, Sequoia and Weltrend as high profile investors in Kneron
EV Group sets up customer training facility at HQ
EV Group (EVG) has established the EVG Academy, a training facility for customers that provides technical training on all classes of the company's equipment as well as on its CIM Framework software platform in an optimised environment.
Denso team up with Aeva to develop sensing and perception systems
Mobility supplier Denso says that it is partnering with U.S. LiDAR and perception systems company, Aeva, to develop next-generation sensing and perception systems.
Fire hit Taiwanese MLCC manufacturer in China
On January 13 a fire broke out at Taiwanese passive component maker Walsin Technology’s Dongguan, China site.
Thin Film Products joins SERMA Microelectronics
SERMA Microelectronics, a subsidiary of the French electronics specialist SERMA Group, has finalised the purchase of TFP (Thin Film Products), a French manufacturer of thin-film microwave circuits for space, military and civil applications.
New Korean Zestron Technical Center opens for customers
The provider of high precision cleaning products has expanded its operations by opening a new Technical Center, located in Anyang, Korea.
A2 Global Electronics names new executives
Electronic component distribution and supply chain service provider, A2 Global Electronics, has appointed Anthony Andriano as its new Chief Financial Officer and promoted Jesper Romell as its new President.
ROHM expands production capacity of SiC power devices
ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant, which the company started building back in February 2019, to enhance the production capacity of SiC power devices.
TDDI IC shipments poised for growth due to strong end-demand
Given the forecasted recovery of the smartphone market and the corresponding rise in TDDI IC demand throughout this year, total smartphone TDDI IC shipment for 2021 is expected to reach 760 million units, according to TrendForce’s latest investigations.
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