Infineon wins two more patent cases against Innoscience in Germany
A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.
TTM Technologies opens Ultra-HDI PCB facility in Syracuse
TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.
Bosch to pay $36 million penalty for unlicensed shipments to Huawei
Robert Bosch GmbH has agreed to pay a USD 36 million penalty to the US Bureau of Industry and Security after shipping MEMS sensor products and software to Huawei and its affiliates without the required export licence. The shipments took place between September 2020 and September 2024.
OPmobility, ProLogium sign MoU to develop solid‑state battery packs
France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.
Adam Ryder appointed Managing Director of Incap UK
EMS provider Incap has appointed Adam Ryder as Managing Director of Incap Electronics UK, effective June 17. He joins the company's extended management team.
Viasat selected by US Space Force to deliver dual-band satellite system
Under this multi-year development award, Viasat’s Space and Mission Systems (SMS) team will produce and deliver a dual-band X/Ka-band mini-GEO, maneuverable satellite, and provide ground stations and operations support.
Nokia announces $30M semiconductor investment in Pennsylvania
The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.
QS partners with Honda to advance solid-state battery tech
The joint program includes a multi-year plan focused on solid-state battery development and associated manufacturing processes. The agreement follows Honda’s successful completion of a technology evaluation agreement with QuantumScape Corporation (QS).
Evertiq Expo Berlin 2026 wraps up the first half of the year
Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.
US medical tech firm Channel Robotics raises $4.6 million
Channel Robotics is developing a patented handheld AI-enabled endoscopic robotic platform designed to deliver robotic-level dexterity through existing flexible endoscopes.
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