ASE breaks ground on new Renwu facility to expand testing cluster in Kaohsiung
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.
Ad
Molex to acquire Teramount to accelerate Co-Packaged Optics push
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).
From selective soldering to inspection: how THT processes are evolving
Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.
Sponsored content by TME Transfer Multisort Elektronik
PUSH-X IN THE TME OFFER – TOOL-FREE WIRING OF THE NEW GENERATION
XT series connectors with Push-X technology from Phoenix Contact set a new standard for quick and convenient wiring in industrial installations. The solution available at TME significantly reduces assembly time, increases the reliability of connections, and simplifies work during both installation and subsequent service.
Meiko Electronics to set up PCB plant in Vietnam
Japanese PCB manufacturer Meiko Electronics has decided to establish a new wholly owned subsidiary in Vietnam, aimed at expanding its PCB manufacturing capacity in the ASEAN region.
Eurofins to divest electronics testing unit for €575 million
Eurofins Scientific SE has signed an agreement to sell its Electrical & Electronic Testing business, MET Labs, to UL Solutions Inc. for an enterprise value of EUR 575 million on a cash- and debt-free basis.
Ad
Ad
Extended lead times for key components weigh on server growth
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.
First Evertiq Expo Zurich just around the corner – industry experts to take the stage
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.
Sivers and Jabil team up on 1.6T optical transceivers for AI data centres
Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.
How chips competence centres could change semiconductor hiring in Europe
Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?
A+B Electronic expands SMD capacity with second Fuji line
Assmy & Böttger Electronic GmbH has completed a comprehensive modernisation of its SMD production, adding a second placement line from Fuji Europe Corporation GmbH to increase capacity and introduce redundancy.
Load more news