Evertiq - First In Electronics News & Expo

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Japanese electronics company TDK has established a new Asia-Pacific regional headquarters (APAC RHQ) in Bengaluru, India, effective 1 April 2026. The move marks the company’s fifth regional headquarters, alongside Japan, Europe, the Americas and China.

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The ongoing war between the United States, Israel and Iran could disrupt supplies of key semiconductor manufacturing materials, raising concerns within the global chip industry. The warning was issued by a South Korean ruling party lawmaker after discussions with semiconductor companies and industry groups, according to a report by Reuters.

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Siemens plans to invest more than EUR 200 million to build a new digitalised and automated factory at its manufacturing and development site in Amberg, Germany. The facility is intended to support the company’s Smart Infrastructure business and is scheduled to be completed by 2030.

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Turnover in Finland’s electronics and electrotechnical industry increased by approximately 6% in 2025 compared with 2024, reaching around EUR 23 billion. The figures are based on preliminary estimates published by Technology Industries of Finland.

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Semtech Corporation, a provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions, has acquired HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data centre interconnects (DCI) and intra-data centre interconnects.

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A significant portion of the investment will focus on new businesses based on these technologies, contributing to the development of South Korea’s future industrial competitiveness.

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The funds will be used for product research and development focused on next-generation electronic warfare and communication payloads across platforms, including drones, ground systems, naval vessels and satellites.

EMS provider Neways Electronics has signed a long-term partnership agreement with Thales covering the supply of electronics for advanced radar and sensing systems. The agreement has an initial term of 10 years, according to a press release.

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The global shortage of glass fiber cloth is continuing to drive significant constraints in PCB laminate availability.

Nvidia has entered a multiyear strategic partnership with Lumentum to accelerate the development of advanced optics technologies for next-generation AI infrastructure.

EMS provider Flex has expanded its strategic collaboration with Advanced Micro Devices (AMD) to manufacture AMD Instinct GPU platforms in the United States, as demand for AI infrastructure continues to accelerate, according to a press release.

The global NAND Flash market extended its recovery in the fourth quarter of 2025, supported by accelerating AI infrastructure deployments, according to new figures from TrendForce. Combined revenue for the top five NAND Flash suppliers rose 23.8% QoQ to USD 21.17 billion in 4Q25.

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The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.

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Hitachi will provide project development support for KS Energy’s development of the project and jointly promote the development and operation of this BESS.

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The project adds 8,000 km of new fiber routes. This expansion is expected to reach a total of 26,000 km across 23 Brazilian states by the end of 2026. Eletronet is investing USD 30.4 million in this initiative.

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Nvidia has entered a multiyear strategic agreement with Coherent to develop advanced optics technologies for next-generation AI infrastructure. The agreement includes a USD 2 billion investment by Nvidia in Coherent, alongside a multibillion-dollar purchase commitment for optical networking and laser products.

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OMR Italia SpA, a PCB manufacturer based in Concorezzo, Italy, has signed an agreement on a collective redundancy procedure affecting 27 employees following its decision to permanently cease production.

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Sensor and photonics company ams OSRAM has completed the sale of its Entertainment and Industry Lamps business to Japan-based Ushio Inc. for EUR 114 million. The transaction was closed on 2 March 2026.

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Austrian IC substrates and PCB manufacturer AT&S will invest more than EUR 30 million in its Fehring plant by March 2027. The programme covers new production technologies, sustainability measures and the creation of around 50 jobs.

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Keenfinity EMS has obtained ISO 13485:2016 certification for its electronics manufacturing plant in Ovar, Portugal. The certification, announced on 2 March 2026, covers the design and manufacture of electronic systems for medical devices, including control units, power supply units and human–machine interfaces.

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In collaboration with Hexagon, a long‑standing, established partner of the BMW Group in the field of sensor technology and software, the first pilot project in Europe is now underway.

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Rohm is considering the outsourcing of back-end processes for power devices and IC products to Suchi Semicon and has begun technical evaluations toward potential mass production shipments starting in 2026.

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This collaboration has reached a milestone with InterQo, an EUR 4 million project that includes a bilateral industrial partnership between Pasqal and Welinq, alongside a dedicated research collaboration.

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By reducing radio power consumption and thermal management requirements while meeting spectral emissions targets with margin, Sierra enables a smaller and lighter radio design that simplifies installation and lowers total cost of ownership.

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AST is engaged in maintenance, inspection and field services for rotating equipment such as compressors and steam turbines that drive compressors, used in resource and energy development sites, including in the oil and gas sectors.

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So far, GA-ASI has performed all the performance analytics and is confident in MQ-9 B’s ability to carry long-range weapons over long distances, while providing a measure of persistence and endurance.

Following last year’s validation milestone, both companies will introduce the successful results of multi-cell testing conducted at Samsung’s R&D Lab, enabling scalable deployments and greater processor flexibility within software-based network environments.

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Siemens’ platform-independent and AI-enabled Simatic WinCC Open Architecture SCADA will connect eight renewable energy generation and storage assets in New South Wales, Victoria, Western Australia, and the Australian Capital Territory.

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The GEK1500 is a 1,500-lb thrust jet engine that could potentially power unmanned aerial systems (UAS), collaborative combat aircraft (CCAs) and missiles.

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Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.

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Having officially closed its acquisition of Lacon Group, EMS provider Incap Group has appointed Dr Ralf Hasler as the Director of Operations, Germany and Romania, and member of Incap Group’s Management Team.

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US memory manufacturer Micron Technology has officially opened its semiconductor assembly and test facility in Sanand, Gujarat, India.

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