ASMPT secures orders for more than 50 chip-to-substrate bonding tools
ASMPT announced in late July bulk orders for more than 50 of its Chip-to-Substrate Thermo-Compression Bonding tools from OSAT customers, for use in advanced AI computing chip packaging.
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Forge Nano breaks ground on battery gigafactory in North Carolina
Forge Nano has broken ground on a major expansion of its lithium-ion battery manufacturing facility in Morrisville, North Carolina, in the United States. The project, backed by up to USD 100 million from the US Department of Energy, will expand the site to nearly 315,000 square feet and establish up to 3 GWh of annual battery cell manufacturing capacity.
NEOTech acquires Virtex, expanding to eleven US defence manufacturing facilities
US EMS provider NEOTech has completed the acquisition of Virtex, a provider of high-reliability electronics manufacturing services focused on the defence market.
Sony Semiconductor returns to full operations at Kumamoto facility after earthquake
Sony Semiconductor Solutions' Kumamoto Technology Center, which was halted following an earthquake in the Kumamoto region on July 28, began staged resumption of operations on August 4. The company expects to return to pre-earthquake operating levels by mid-August, according to updates published by Sony Semiconductor Solutions.
Marvell and Google expand custom silicon partnership
Marvell Technology has entered into an expanded commercial agreement with Google to develop custom semiconductor products across a range of programmes attached to Google's TPU ecosystem.
PCB material shortage spreads to standard FR-4 as structural shift deepens
The PCB industry's material shortage is no longer confined to advanced laminates. According to a market update from Norwegian PCB supplier Confidee, the shortage has now spread to standard FR-4 and thicker copper-clad laminates – and conditions are not expected to ease through 2026 or into 2027.
CACI opens defence electronics manufacturing facility in Rochester, New York
CACI International has opened a 61,000-square-foot Manufacturing Centre of Excellence for Defence Electronics in the Greater Rochester area in New York, in the United States. The facility increases CACI's manufacturing space by more than 300% and will serve as the primary production hub for the company's electronic warfare technologies.
Airbus Helicopters and Terma deepen partnership on Danish defence
Danish defence technology company Terma and Airbus Helicopters have signed a memorandum of understanding to expand their industrial partnership. The agreement covers advanced manufacturing, electronic warfare system integration, research and development, and maintenance, repair and overhaul services.
Incap Germany adds new selective soldering system in Karlsfeld
Incap Germany has commissioned a new SEHO SelectLine-C 500 selective soldering system at its Karlsfeld facility, expanding production capacity and automation capabilities for through-hole technology components.
Qualcomm appoints Wassim Chourbaji as President of EMEA
Qualcomm has appointed Wassim Chourbaji as Senior Vice President and President of Qualcomm EMEA, effective immediately. He succeeds Enrico Salvatori, who will retire from Qualcomm in June 2027 after 25 years with the company.
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