Evertiq - First In Electronics News & Expo

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PCB-EU-Haas

Some conference presentations end with the applause. Others begin there. They continue over coffee, in conversations between exhibition stands, and in the photographs people take before the final slide disappears from the screen. That was certainly the case during Evertiq Expo Berlin, where one presentation continued to resonate long after the audience had left the conference hall.

Industries_FiberPrinting

The financing supports the Norwegian deep-tech company’s expanding manufacturing capacity, development of its product portfolio and international growth as demand accelerates for compact, high-performance electric motors.

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Instruments_India

The two Indian companies will leverage their combined expertise in advanced manufacturing, defence engineering and innovation to build next-gen indigenous defence solutions, including loitering munitions, payload-enabled UAVs and advanced unmanned systems.

BESS_Oregon

Shutler Energy Storage will be located near two existing Avangrid facilities, and a third under construction one. The project will function as a large power bank, capable of discharging 41 MW for two hours.

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Ground combat vehicles are rapidly evolving from fixed-function platforms into modular, software-defined systems. This shift demands interconnect solutions that support continuous upgrades without requiring redesigns of wiring infrastructure. Scalable, high-reliability connectors, particularly those based on MIL-DTL-38999, are central to enabling this transformation.

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The US Space Force contract award for Mobile User Objective System Service Life Extension (MUOS SLE) includes two narrowband communications satellites that prioritize reliable voice and essential data.

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Through this collaboration, the Fujitsu Group aims to enhance its global customer offerings by combining 1Finity’s expertise in developing, manufacturing, and selling optical transmission and wireless base station equipment with Accton’s advanced network technologies.

Aeponyx_PIC_Centre

Supported by the Canadian government, the initiative brings together Aeponyx, HOP Technologies and Phantom Photonics to strengthen Canada’s domestic capabilities in advanced photonics and quantum technologies.

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The proceeds will support the Swiss company’s ambitious technical roadmap towards an industrialized production line, unlocking additional manufacturing capacity to serve key Tier-1 customers.

FPT_agreement

As Gremsy’s global Strategic Partner and Certified Distributor, FPT will leverage its Japan market presence, regional delivery network and clientele to support Gremsy’s expansion in Japan and broader global distribution strategy.

The round co-led by Blackstone, Noteus, Airbus and Advent supports Quantum Systems’ industrial scale-up as a leading deep-tech prime for interoperable, multi-domain autonomous capabilities in Europe.

Micron Technology and General Motors have signed a Strategic Customer Agreement to secure a long-term, reliable supply of memory and storage products for GM's vehicle production. The agreement covers LPDRAM, NOR and UFS NAND products, according to a press release from Micron.

Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.

Battery_Technologies_team

The ARENA grant will be delivered under the Australian government’s Battery Breakthrough Initiative, which supports the growth of domestic battery manufacturing capability and strengthens Australia’s position in the global battery supply chain.

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The project, supported by a state-level incentive package, will be home to production of JetZero’s next-generation aircraft and is expected to create 14,500 jobs over the next 10 years.

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Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.

PCB-India_3

India Semiconductor Mission 2.0 will be geared towards strengthening the entire semiconductor value chain, including chip design, fabrication and packaging.

radar_technology

The American OEM will be able to customize the hardware configuration – without increasing hardware complexity – to offer driving and parking functions from entry level to Level 3 of autonomy.

Robotics

The acquisition transitions the Fort platform into an intelligent, proactive system where autonomous machines can not only communicate safely but also actively read their environments, anticipate potential hazards, and execute real-time operational decisions on the fly.

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Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.

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Infineon Technologies has opened its Smart Power Fab in Dresden, Germany – described as the world's largest fab for power semiconductors and analog/mixed-signal technologies.

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Austrian PCB and IC substrate manufacturer AT&S is expanding its Kulim manufacturing site in Malaysia, backed by agreements with AMD and another unnamed technology company.

TSMC and Sony Semiconductor Solutions have signed a non-binding memorandum of understanding to form a strategic partnership for the development and manufacturing of next-generation image sensors.

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US electronics manufacturer Kimball Electronics has acquired Helvoet Polymer Technologies B.V., a Dutch contract development and manufacturing organisation specialising in micro-molding and precision injection molding for medical applications. The purchase price is EUR 90 million, or approximately USD 103 million.

Erfurt-Main-entrance

X-FAB MEMS Foundry has received a grant notification of EUR 127.4 million from the German federal government and the Free State of Thuringia for the construction of a new cleanroom at its Erfurt site. The Fab4Micro project will expand capacity for MEMS, microsystems and photonics, with initial production targeted for the end of 2028.

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ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.

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The Joint Laboratory in Shenzhen will serve as a hub for technical exchange, collaborative R&D, project incubation and pilot exploration with a focus on areas such as ultra-fast charging, cloud-charger synergistic scheduling and megawatt charging.

PCB-India_2

Japan’s Kurita Industries provides a range of water treatment solutions for the electronics industry, including semiconductors, in Japan, East Asia, North America and Europe, which is essential for their manufacturing processes.

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PCB manufacturer Somacis Group has completed the acquisition of Group ACB, a PCB manufacturer with two sites in France and one in Belgium.

Kingboard-Laminate

Kingboard Holdings has sold a 4.92% stake in its laminates subsidiary, Kingboard Laminates Holdings, raising net proceeds of approximately HKD 11.8 billion – roughly EUR 1.4 billion. The capital is earmarked for PCB capacity expansion and multi-layer and HDI capabilities.

tesla-5

Tesla has announced plans to hire 1,000 employees at its Gigafactory in Grünheide, near Berlin, as the company prepares to increase production. From October, the plant is expected to raise output to 7,500 vehicles per week, marking the next phase in the expansion of Tesla's European manufacturing hub.

saic-volkswagen-shanghai

Volkswagen is reportedly planning to end its partnership with Bosch on the development of advanced driver assistance systems (ADAS) and autonomous driving technology. According to German newspaper Bild, which cited anonymous sources, the project failed to meet expectations despite investments of around EUR 1.5 billion.

MLRS

US defence contractor Lockheed Martin and Finnish technology company Insta are establishing Europe's first maintenance and support centre for the Common Fire Control System (CFCS) used in M270A2 and HIMARS rocket launchers. The facility will be located in Tampere, Finland.

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