Mouser adds over 60 manufacturers in 2024
Mouser Electronics says that it added more than 60 new manufacturers to its line card during 2024.
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Faulhaber expands its presence in the Nordics
German drive systems specialist Faulhaber is fortifying its market presence in the Nordic region. As the company entered the new year, the German company will operate under the name Faulhaber Nordic ApS in Norway, Sweden, and Finland.
Chipmetrics set up Dresden-based subsidiary
Chipmetrics has officially launched its new Dresden-based German subsidiary, Chipmetrics GmbH. Originally hailing from Joensuu in Finland, 2025 is set to be an important year for the company as it aims to aggressively scale both sales and marketing of its 3D semiconductor metrology products.
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New Bluetooth 5.3 Low Energy (LE) module from Panasonic with LE audio
Panasonic's PAN1783 is a Bluetooth 5.3 Low Energy (LE) module. At its core is the Nordic nRF5340 single-chip controller. The module is available with either an on-board chip antenna or an RF bottom pad. The module uses the functions of Bluetooth 5.3, including isochronous channels and LE audio, and supports a high throughput of 2 Mbps, advertising extensions and long-range communication. It integrates the extensive functions of the nRF52 series and improves performance and memory while maintaining low power consumption.
Altium acquires Part Analytics
Electronics design systems specialist Altium has completed the acquisition of Milwaukee-based Part Analytics.
NAND flash manufacturers to cut production in 2025
The NAND Flash industry will continue to struggle with weak demand and oversupply in 2025, according to TrendForce. To address this, manufacturers like Micron, Kioxia/SanDisk, Samsung, and SK hynix/Solidigm plan to cut production, which could lead to further industry consolidation over time.
Micross acquires OSAT provider Integra
Micross Components has closed its acquisition of Wichita, Kansas-based Outsourced Semiconductor Assembly and Test (OSAT) post-processing provider Integra Technologies.
GF to set up New York advanced packaging and photonics centre
Semiconductor manufacturer GlobalFoundries says it plans to create a new centre for advanced packaging and testing of US-made essential chips within its New York manufacturing facility.
New Chief Sales Officer joins Soitec
Soitec has appointed Ruth Hernandez as Chief Sales Officer.
GM signs agreement with Vianode
Automotive giant General Motors has signed a multi-billion-dollar agreement with Norwegian company Vianode for the supply of synthetic graphite anode materials for electric vehicle (EV) batteries, Reuters reported.
PGZ and Raytheon launch Expert Cable Center in Poland
Polska Grupa Zbrojeniowa (PGZ) has announced a major milestone in Poland’s defense industry. Wojskowe Zakłady Uzbrojenia S.A. (WZU), a PGZ subsidiary, has signed an agreement with Raytheon Polska to launch the Expert Cable Center in Grudziądz. This state-of-the-art facility will produce over 80 types of cables for the Patriot air and missile defense system, further enhancing Poland’s national defense capabilities.
Infineon launches SURF unit to drive sensor and RF growth
Infineon Technologies has launched a new business unit, SURF (Sensor Units & Radio Frequency), effective January 1, 2025. The unit combines Infineon’s Sensor and Radio Frequency businesses under the Power & Sensor Systems (PSS) division to enhance innovation and profitability in these markets.
Farnell expands line card with the new Vishay microBRICK regulator
Farnell is now stocking the band new microBRICK regulator module from Vishay Intertechnology, expanding its power portfolio with the smallest DC/DC regulator module on the market.
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Join the PEDC – Pan-European Electronics Design Conference on 29–30 January 2025 in Vienna!
The Pan-European Electronics Design Conference (PEDC) will take place on 29–30 January 2025 in Vienna. This event is jointly organised by IPC and the German Electronics Design and Manufacturing Association (FED). It promises to be an outstanding forum for the exchange of knowledge and innovation in electronics design. The aim of the PEDC is to foster dialogue between industry, academia, and research at the European level while showcasing the latest developments, technologies, and best practices in the electronics sector. In short: Design Meets AI: Innovating Electronics.
Panasonic Industry Europe inks distribution deal with Özdisan Elektronik
The manufacturer of industrial components and solutions has signed a distribution deal with Özdisan Elektronik, a Turkish electronic components distributor to intensify its business activities in the region.
NXP secures €1B EIB loan to advance semiconductor innovation
NXP Semiconductors has secured a EUR 1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions.
US tightens export controls on advanced AI technologies
The US Department of Commerce's Bureau of Industry and Security (BIS) has issued an interim final rule, effective January 13, 2025, enhancing export controls on advanced computing ICs and certain artificial intelligence (AI) model weights.
onsemi completes acquisition of Qorvo's SiC JFET business
onsemi has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for USD 115 million in cash.
imec spin-off, Vertical Compute raises €20 million
Vertical Compute, founded by CEO Sylvain Dubois (ex-Google) and CTO Sebastien Couet (ex-imec), has closed a seed investment round of EUR 20 million.
MACOM invests $345 to upgrade fabs
MACOM's Massachusetts and North Carolina fabs are set for modernisation and expansion with federal and state backing.
Infineon expands footprint with new backend fab in Thailand
German semiconductor manufacturer Infineon Technologies has broken ground on a new semiconductor backend production site in Samut Prakan, south of Bangkok, in Thailand.
David Heinzmann retires as CEO of Littelfuse
After a 40-year career, David Heinzmann will retire and step down as president and CEO of Littelfuse, Inc.
SK Telecom, SK hynix, Penguin ink AI data centre deal
Penguin Solutions is teaming up with SK Telecom (SKT) and SK hynix to pursue the development and delivery of comprehensive AI data centre (AIDC) solutions. The agreement follows SKT’s USD 200 million strategic investment in Penguin Solutions in December 2024.
NXP deepens partnership with Honeywell
Honeywell and NXP Semiconductors will expand their partnership to accelerate aviation product development and chart the path for autonomous flight.
Nova Metrion selected by unnamed memory manufacturer
Nova’s Metrion platform has been selected by an unnamed memory manufacturer for its most advanced DRAM R&D as well as DRAM and NAND high-volume manufacturing lines.
Park Systems buys Swiss optical metrology business
Korea's Park Systems has acquired Lyncée Tec SA, a Lausanne-based specialist in digital holographic microscope (DHM) technology.
Sivers Semiconductors secures important deal to revolutionize telecom chips
Sivers Semiconductors has entered into a new chip development agreement with a leading Tier-1 telecom infrastructure provider. The collaboration, announced in a recent press release, will see Sivers develop advanced semiconductor solutions designed to meet the growing needs of 5G networks and future telecom technologies.
Nvidia criticizes U.S. plan to tighten AI chip export controls
The Biden administration is reportedly considering new export restrictions that could target advanced artificial intelligence (AI) chips produced by U.S. companies. According to Reuters, Nvidia has expressed concerns about the potential impact of these measures on the tech industry’s growth and the competitiveness of the United States in the global market.
YES receives multiple orders of VertaCure PLP systems
Manufacturer of process equipment for AI and HPC semiconductor solutions, Yield Engineering Systems (YES), says it has received multiple orders of its VertaCure PLP systems for advanced packaging from a an unnamed semiconductor manufacturer in Japan.
Hemlock bags $325M in CHIPS Act funding for polysilicon plant
The U.S. Department of Commerce has awarded Hemlock Semiconductor (HSC) up to USD 325 million in funding under the CHIPS Incentives Program, to support the construction of a new manufacturing facility in Hemlock, Michigan.
NXP acquires TTTech Auto for $625 million
NXP is strengthening its automotive business by acquiring TTEch Auto, a software solution provider specialised in the systems, safety and security required for SDVs, in an all-cash transaction valued at USD 625 million.
"China for China" gains momentum among European tech companies
Geopolitical dynamics are accelerating the formation of the “China for China” supply chain, driven by China’s vast domestic market. This trend is particularly evident in the automotive sector, says TrendForce pointing to its latest research.
Riber secures a repeat order for an MBE 412 cluster system
Molecular Beam Epitaxy (MBE) equipment supplier Riber has secured a repeat order from Teledyne Imaging Sensors (TIS) for an MBE 412 cluster research system from Teledyne Imaging Sensors (TIS) in the US.
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