Toppan and IBM to advance development of EUV photomasks
Toppan Photomask has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. The agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.
Samsung to start production at second US chip fab in July 2024
Samsung is reportedly expecting to have its chip fab in Tyler, Texas operational by July, 2024.
Calumet and Schmid Group to build US substrate facility
“The partnership between Calumet and Schmid signals a significant leap forward in advanced packaging and substrate technology, further enhancing the United States’ competitive position in the global market”, says Stephen Vairo, President, and CEO of Calumet Electronics.
Plan Optik expands production in Hungary
The Plan Optik Group continues to expand its production capacities and has now rented a new production hall in Hungary.
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Microsoft commits $3.5bn to German AI projects
Microsoft will invest 3.3 billion euros ($3.5 billion) in new and existing German facilities to expand the AI capabilities of its data centres.
Fabless startup Sapeon to develop on-device AI chip
South Korea's Sapeon, a spin off from telco SK Group, has announced it is working on a new semiconductor optimised for on-device artificial intelligence.
OpenTitan launches world's first open-source silicon project
After five years of development, the OpenTitan coalition and lowRISC and have unveiled the first open-source silicon project to reach commercial availability.
Arm creates group to define chiplet standards
Arm has formed an alliance of more than 20 partners to develop the Arm Chiplet System Architecture (CSA), which will define optimal partitioning choices for chiplet-based systems.
Nvidia discloses investment in Arm
Nvidia tried, and failed, to acquire Arm back in 2022 – however, in a regulatory filling, the company disclosed a USD 147.3 million investment in Arm Holdings.
Renesas to acquire PCB design software company Altium
Japanese semiconductor company Renesas has entered into an agreement to acquire Australian electronics design systems specialist Altium Limited.
Murata to start building new R&D hub
Murata says that it will establish the Moriyama Innovation Center as a new R&D hub located in front of Moriyama Station in Shiga Prefecture. Construction will begin in February 2024 and is expected to be completed in May 2026.
Global silicon wafer shipments and revenue fall in 2023
Worldwide silicon wafer shipments in 2023 decreased 14.3% to 12,602 million square inches while wafer revenue contracted 10.9% to USD 12.3 billion over the same period, reports SEMI.
Nvidia CEO: “countries must build sovereign AI infrastructure”
Nvidia’s CEO Jensen Huang says that every country needs to have its own artificial intelligence infrastructure to safeguard its own culture and capitalise on the technology's economic potential.
Cisco to cut thousands of jobs
American multinational digital communications technology conglomerate Cisco is reportedly planning to restructure its business – something that will include a reduction of its workforce. According to Reuters, the company is considering laying off thousands of workers in order to concentrate on high-growth areas.
Tower to build $8bn fab in India?
Online reports say Tower Semiconductor has submitted a proposal to create a major new facility, with the Indian government paying half of the cost.
SK hynix reveals new sustainability programme
Memory specialist SK hynix has established a fresh roadmap to boost its use of recycled and renewable materials.
CG Power leads effort to create Indian OSAT plant
Indian industrial giant CG Power and Industrial Solutions is leading a JV with US's Renesas and Thailand's Stars to establish a new Outsourced Semiconductor Assembly and Test (OSAT) facility.
YorChip and Digitho team up to secure chiplet supply chain
Two specialists have joined forces to tackle supply chain, security and Known Good Die (KGD) problems in the manufacture of chiplets.
Toppan partners with IBM on 2nm logic semiconductor node
Toppan Photomask has confirmed a five year agreement with IBM to develop a 2 nanometer logic semiconductor node using extreme ultraviolet (EUV) lithography.
SMIC's revenue fell by nearly $1bn in 2023
China’s biggest chip firm, SMIC, endured a tough 2023 with sales down to $6.32 billion from $7.27 billion a year earlier.
Faraday is developing a 64-core SoC with Arm and Intel
Faraday Technology Corporation is working on a 64-core System-on-Chip (SoC) utilising Intel 18A technology and Arm Neoverse Compute Subsystems.
Will SMIC bring 5nm fabrication to China this year?
China is a long way behind in advance chip manufacturing, but fresh reports say the country could be on the verge of a 5nm node breakthrough.
TSMC to open its second Japanese plant in 2027
Taiwanese chipmaker TSMC will start construction of a new $13bn fab in Kumamoto, Japan, as it continues to off-shore its manufacturing base.
Indian scientists make high temperature chip breakthrough
Researchers at the Indian Institute of Technology have developed a semiconductor material that can withstand very high temperatures, and therefore be used in high-pressure automotive applications.
Nordic Semiconductor signs multi-year deal to use Arm IP
Nordic Semiconductor and Arm have extended their long-term partnership with a new agreement to share IP, tools, support and training for current and future products.
proteanTecs and Alphawave team up on SoC monitoring
Analytics specialist proteanTecs has agreed a partnership with Alphawave Semi to improve the health and performance monitoring of its custom silicon and chiplet-enabled system-on-chips (SoCs).
Applied Materials up fund MIT's nanoscale lab enhancements
MIT, Applied Materials and the Northeast Microelectronics Coalition (NEMC) Hub have committed more than USD 40 million to add advanced nano-fabrication equipment and capabilities to the MIT.nano lab.
Imec to build overseas R&D lab in Malaga
Belgium's Interuniversity Microelectronics Centre (IMEC) is to open a new research centre in Malaga Spain with the creation of 450 jobs.
Japan earmarks $307m for optical chip R&D centre
The Japanese government is making available USD 307 million in subsidies for a new unit to research optical technology semiconductors. The project is backed by NTT, Intel, and SK Hynix.
Indian government invites bids to revamp state-owned factory
Nine companies including Tata and Texas Instruments are competing for a USD 1 billion contract to modernise a 180nm chip manufacturing plant in India.
SK Hynix confirms new packaging plant in Indiana
South Korean chipmaker SK Hynix is to open a new US facility, which will produce high-bandwidth memory chips for integration with Nvidia’s GPUs.
350+ new Chinese semiconductor industry projects in 2023
In a time where we're seeing more and more investments being made to secure technological sovereignty concerning semiconductors – both in terms of innovation and manufacturing – China is making a push strategically fortify itself.
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