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chip

The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.

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US firm Blaize and South Korean company SPHERE AX plan to develop a next-generation physical AI solution targeted at the global market by combining Blaize’s AI semiconductor technology, optimized for physical AI, with SPHERE AX’s core software expertise.

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Systems_TUALCOM_MOU

The agreement between BAE Systems and TUALCOM establishes a strategic framework for both organisations to investigate opportunities to integrate advanced communications, resilient navigation and electronic warfare technologies into future autonomous platforms.

cosmos-3

The investment round was anchored by Mitsubishi Electric Corporation. Array Labs and Mitsubishi Electric have also entered into a partnership to develop and bring to market satellite-based maritime and aircraft tracking services for customers in Asia-Pacific.

LS_Electric_MOU

The collaboration will focus on key DC infrastructure areas, including power conversion systems for energy storage systems, solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs).

Headquarters_Redwood_Shores

With Quantinuum’s Helios on OCI, customers can expect to gain managed, secure access to cloud-hosted quantum computing without having to procure, install, or operate dedicated hardware or specialized facilities.

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Kyushu

Tokyo Electron (TEL) is collaborating with Nvidia, utilizing Nvidia Agent Toolkit including Nvidia NeMo, Nvidia NIM, Nvidia NemoClaw blueprints and the open robot development platform Nvidia Isaac within TEL’s “Epsira” concept for digital transformation (DX) solutions.

Solarpro_BESS

Leveraging the technology’s unique advantages in low-temperature performance and long cycle life, CATL and Solarpro will explore sodium-ion storage solutions tailored to diverse application scenarios across Central and Eastern Europe.

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ZeroAvia_MoU

Together, the two companies will seek to integrate scalable, mission-ready hydrogen-electric power and propulsion solutions for defence customers across both new and existing aircraft platforms.

ArianeGroup is currently increasing the Ariane 6 production rate. To support this industrialization phase, Air Liquide’s Engineering & Technologies will provide critical cryogenic equipment necessary for the manufacturing and propulsion of the rockets up to the 42nd flight of Ariane 6.

For plug-in hybrid applications, BorgWarner will supply an updated high-voltage inverter design featuring the company’s proprietary Application-Specific Integrated Circuit (ASIC) technology, which is fully compatible with the customer’s new vehicle operating system.

Under the partnership, Eiffel Investment Group will provide long-term infrastructure investment expertise, while Ergy will originate, develop, arrange financing, construct and manage battery storage projects, drawing on its experience in the Polish renewable energy market.

Energy_Blykalla_MOU

By integrating Swedish firm Blykalla´s power generation with Hitachi Energy´s solutions for electrical infrastructure, the collaboration aims to accelerate the commercialization and deployment of advanced nuclear solutions across Europe and the US.

alenia_prisma

The industrial consortium will be led by OHB Italia, which will be responsible for the mission and end-to-end system activities. Thales Alenia Space will be responsible for developing the satellite and delivering the PRIMA-S platform.

Kasei_HighChem

This marks the first license agreement for Asahi Kasei’s novel electrolyte technology in China, and grants HighChem Shanghai a non-exclusive license to produce and sell the electrolyte for the local market.

Infineon-1

MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.

Under the agreements, Samsung will receive access to US firm Netlist’s complete patent portfolio, including its server DIMM and High Bandwidth Memory technologies. Samsung will supply Netlist DRAM and NAND products, and the parties agree to settle and mutually release all pending legal actions.

EV_charging_Pixaline

Under the collaboration, Indofast Energy will deploy its Quick Interchange Stations (QIS) at Zeon’s charging sites spanning premium malls, metro parking areas, and commercial hubs across Bengaluru, Hyderabad, Chennai, and other key markets.

axonite_chip

Under the partnership, the two companies will design, build and industrialise the key fabrication equipment behind the metalens value chain, from research and development through to high-volume manufacturing.

Esri_MOU

The two companies seek to leverage opportunities in the defence sector by combining BEL’s domain expertise in defence electronics and systems integration with Esri’s geographic information system (GIS), location intelligence and GeoAI capabilities.

Airbus_deal

Under the contract, Syensqo will continue to supply a broad range of advanced materials from its portfolio including prepregs, RTM resins, adhesives, and primers to support Airbus programs across commercial aircraft, space & defense, and helicopter platforms.

MercedesBenz_charging

The partnership provides Mercedes-Benz business customers in the UK and Germany with a fully integrated charging solution, from initial site planning through to installation, operation and ongoing service.

Kawasaki-main-office

Through this MOU, Chunghwa Telecom, Fujitsu and 1Finity will further advance their existing All-Photonics Network (APN) initiatives and accelerate their collaboration to expand next-generation communication infrastructure in Taiwan.

CATL_partnership

This initiative enables Alfen to diversify its battery material portfolio, optimise the cost structure of its energy storage products and strengthen resilience against lithium price volatility.

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The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

glass_substrate

Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

nvidia_agenticAI

The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.

cosmos-3

Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.

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Under the MOU, US-based company Factorial Energy and South Korea’s SK On will jointly evaluate the technical feasibility and manufacturing considerations for Factorial’s FEST solid-state battery technologies.

Indie

The collaboration brings together Eros Innovation’s expertise in sovereign AI, multimodal foundation models, cultural intelligence, healthcare AI and digital platforms with Thakers’ expertise in chip design, embedded systems, aerospace and space technologies.

tes_logo

The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.

Systems_Openchip_partnership

Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.

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