Honeywell, Stereolabs develop solution for supply chain logistics
The collaboration will combine Stereolabs’ stereoscopic cameras, which use a vision-based AI perception system to measure the dimensions of products with Honeywell’s SwiftDecoder software — which captures barcode data and other written information — in one innovative mobile solution.
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IBM, AMD join forces to advance quantum-centric supercomputing
AMD and IBM are exploring how to integrate AMD CPUs, GPUs, and FPGAs with IBM quantum computers to efficiently accelerate a new class of emerging algorithms, which are outside the current reach of either paradigm working independently.
Andøya teams up with Rheinmetall to enhance European space capabilities
This alliance will provide regular commercial launch services and flexible, rapid response capabilities from the European mainland. It will also offer Tactical Responsive Launch (TacRL) capabilities, ensuring secure and resilient operation of satellites with expedited reaction times.
ChargePoint, Eaton launch ultrafast DC V2G chargers
The integration of ChargePoint’s Express chargers with Eaton’s end-to-end electrical solutions delivers a powerful solution to overcome grid constraints, addressing the challenge of how to cost-effectively scale charging for the growing number of EVs entering service.
CG Semi unveils one of India’s first end-to-end OSAT facilities
CG Semi, a subsidiary of CG Power and Industrial Solutions and part of the Murugappa Group, has launched its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.
MetaSensing partners with CONTEC to advance SAR technology
The agreement aims to develop proprietary SAR (Synthetic Aperture Radar) satellites and jointly target opportunities with commercial and governmental customers.
Nikon to close Yokohama plant as part of production consolidation
Nikon Corporation announced on August 21, 2025, that it will close its Yokohama Plant in Kanagawa Prefecture on September 30, 2025. The decision is part of a plan to consolidate development and production functions across the company.
Toshiba and SICC team up on SiC power semiconductor wafers
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.
Amkor moves one step closer to packaging facility in Peoria
Amkor Technology says that the City of Peoria, Arizona, has successfully acquired 834.5 acres of state land for future development, including a 104-acre parcel designated for the company’s new semiconductor packaging and test facility.
Wardwizard, Battery Smart boost battery swapping network in India
The “battery-as-a-service” model allows customers to purchase Joy e-bike vehicles without the battery, reducing the upfront cost of the vehicle by an estimated 20% to 30%.
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