Tata enters partnership with Tokyo Electron Limited
Tata Electronics and Tokyo Electron Limited (TEL) have signed a memorandum of understanding to speed up the development of semiconductor equipment in India. This partnership will support Tata Electronics’ new semiconductor fab in Dholera, Gujarat, and its assembly and test facility in Jagiroad, Assam.
Ad
Infineon first with 300 mm power GaN technology
Infineon Technologies says it has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.
Mycronic receives an order for an SLX mask writer
Swedish developer and manufacturer of production equipment, Mycronic, says it has received an order for an SLX mask writer from an existing customer in Asia, for delivery to Europe.
Sponsored content by PEI-Genesis
Amphenol Heavy|Mate® Connectors
Amphenol Heavy|Mate® Connectors are robust and versatile connectivity solutions designed for harsh and demanding environments. Engineered to provide secure and reliable connections in industrial and transportation applications, these connectors are built to withstand extreme conditions, including high vibration, shock, dust, and moisture.
NXP to invest over $1 billion in India
Kurt Sievers, CEO of Dutch semiconductor company NXP, said on Wednesday that the company is planning to double its R&D efforts in India – investing over USD 1 billion in the country.
Skeleton appoints industry veteran to lead curved graphene scale-up
Skeleton Technologies has appointed Timo Koljonen as Vice President of Curved Graphene Scale-Up.
Ad
Soitec kicks off European Indium Phosphide project
A European research and industry consortium led by Soitec has begun work to develop a future generation of high-frequency semiconductors based on Indium Phosphide (InP).
Tata and ASMPT team up to boost India's semiconductor ecosystem
Tata Electronics is partnering with ASMPT Singapore workforce training, advancing service engineering infrastructure, automation, spare supports and boosting R&D initiatives in India.
Ad
Mobileye ends internal lidar development
Intel company Mobileye has chosen to end the internal development of next-generation frequency-modulated continuous wave (FMCW) lidars for use in autonomous and highly automated driving systems.
Teledyne e2v HiRel enters partnership with Flip Electronics
High-reliability semiconductor solutions provider, Teledyne e2v HiRel Electronics, has entered into a new partnership with Flip Electronics, a distributor based in Alpharetta, Georgia.
A*STAR and Applied Materials to open joint lab
The Agency for Science, Technology and Research (A*STAR) has partnered with Applied Materials to establish a joint lab aimed at developing innovative, cost-effective solutions for semiconductor equipment and strengthening the local chip ecosystem.
Würth Elektronik eiSos appoints Thomas Garz EVP
Thomas Garz has been appointed Executive Vice President for the Würth Elektronik eiSos Group.
Tower and Adani plan $10 billion semiconductor facility in India
Tower Semiconductor and India's Adani Group are planning to invest USD 10 billion in a semiconductor manufacturing facility in the Indian state of Maharashtra, according to a statement made by the state’s Deputy Chief Minister.
Sponsored content by Rogers Corporation
Rogers is Leading the Way with Advanced Material Solutions for Automotive Radar in ADAS
In the ever-evolving world of automotive technology, radar systems pave the way for safer, more comfortable autonomous driving experiences in electric and hybrid electric vehicles' sustainable future.
VIS and NXP to build a new 300mm JV fab
Vanguard International Semiconductor (VIS) and NXP Semiconductors have secured the necessary approvals and injected capital to establish their joint venture VisionPower Semiconductor Manufacturing Company (VSMC). The new company will now proceed with the planned construction its first 300mm wafer manufacturing facility.
BAE Systems has acquired Kirintec
Founded in 1999, the British defence and aerospace concern acquired an innovative UK cyber and electromagnetic activities (CEMA) company, which specialises in counter-Improvised Explosive Devices (IED), counter-Uncrewed Air Systems (UAS) and electronic warfare products and solutions.
STMicroelectronics joins Quintauris as sixth shareholder
Semiconductor manufacturer STMicroelectronics has joined Quintauris GmbH as its sixth shareholder, to collaborate on exploring the potential of RISC-V architecture.
The memory market is still challenging
During Evertiq Expo in Berlin earlier this June, Evertiq took the opportunity to speak to Mark Baumgärtner, Vice President of Sales EMEA at memory specialist memory distributor Memphis Electronic, to see how the memory market is moving and how the company is doing in the current market climate.
YES signs MoU with Tamil Nadu Government
Yield Engineering Systems (YES), a manufacturer of process equipment for AI and HPC semiconductor solutions, has signed a Memorandum of Understanding (MoU) with the Government of Tamil Nadu to set up a manufacturing and new product development facility in Coimbatore, India.
Sponsored content by Kyzen
The Effects of pH: Cleaning Agent Properties and Performance in Production
As cleaning agents evolve to meet customer and supplier environmental challenges, we take a closer look at the effect of pH cleaning agent properties and performance including material compatibility and rinsing behavior all while answering questions with SIR data.
Nokia to open its largest fixed networks lab in India
The USD 54 million Chennai centre will focus on fixed wireless access and multi-dwelling unit solutions along with access networks and home controllers.
Delta acquires Alps Alpine's power inductor business
Power management specialist Delta has signed an agreement to acquire the power inductor and powder materials business and assets, including production and R&D equipment, patents, and intellectual property of Japanese company Alps Alpine and its subsidiary, Alps Electric Korea, for approximately USD 71 million.
HP to receive $50 million boost for semiconductor project
The US Department of Commerce says it will provide up to USD 50 million to HP Inc. to support the company's expansion and modernisation of its existing facility in Corvallis, Oregon.
LEM expands R&D capabilities in Europe and Asia
To meet the growing demand for current and voltage sensing, driven by the push towards decarbonisation and greater electrification, electrical measurement technology specialist LEM has opened new R&D facilities in Munich and Shanghai.
Qualcomm acuires Sequans' 4G IoT Technology
Qualcomm and Sequans Communications, a supplier of 4G and 5G semiconductor solutions for the IoT, have entered into a definitive agreement for Qualcomm to acquire Sequans' 4G IoT technologies.
Sponsored content by endrich GmbH
High-precision and reliable current sensors for energy systems from endrich group
In the fields of electromobility, renewable energies and industrial control systems, the demand for precise and reliable current sensors is constantly increasing The complex requirements of modern energy systems demand sensors that offer both high accuracy and fast response times to ensure safe and efficient operating conditions
Graco Inc. completes acquisition of PCT Systems
Graco Inc. has acquired the megasonic and ultrasonic wet cleaning systems business of PCT Systems (PCT), a California-based manufacturer of high-purity fluid handling solutions.
TSMC gets $1.96 billion subsidy boost from Japan and China
These funds are mainly for real estate, equipment and plant purchases, and to offset building and operational costs.
Wolfspeed to close its Durham plant
In its fourth quarter and full fiscal year 2024 report, semiconductor company Wolfspeed says it plans to accelerate the shift of device fabrication to its 200mm Mohawk Valley Fab, while assessing the timing of the closure of its 150mm device fab in Durham.
Microchip hit by cyberattack
On August 17, 2024, Microchip Technology detected potentially suspicious activity involving its IT systems.
ESMC officially breaks ground on Dresden fab
Ground has been broken and the land preparation for ESMC's first semiconductor fab in Dresden, Germany has officially started.
EU approves €5 billion subsidy to support TSMC's German fab
The European Commission has approved, under EU State aid rules, a EUR 5 billion German measure to support European Semiconductor Manufacturing Company (ESMC) in the construction and operation of a microchip manufacturing plant in Dresden.
AMD to acquire hyperscale solutions provider ZT Systems
AMD has signed a definitive agreement to acquire ZT Systems, a provider of AI infrastructure for some of the world’s largest hyperscale computing companies, for USD 4.9 billion.
Mouser names Tom Busher as senior VP of global sales and service
Mouser Electronics announces that it is promoting Tom Busher to Senior Vice President of Global Sales and Service.
Intel sells its stake in Arm
As previously reported, Intel has announced a 15% reduction in its workforce affecting approximately 15,000 employees. The company wants to deliver USD 10 billion in cost savings in 2025. Now the US company has sold its 1.18 million share stake in Arm Holdings.
Load more news
