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ASMPT said it has secured new orders for 19 chip-to-substrate (C2S) thermo-compression bonding (TCB) tools from an unnamed outsourced semiconductor assembly and test (OSAT) provider supplying a leading foundry focused on AI chips.

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Texas Instruments has officially started production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas.

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Avnet Silica has entered into a new franchise agreement with DeepX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful AI semiconductor technology.

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Nvidia says it has acquired SchedMD, the developer of Slurm, an open-source workload management system widely used in high-performance computing (HPC) and AI, in a move the company said is aimed at strengthening the open-source software ecosystem and supporting AI research and development.

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The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.

Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

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Headquartered in Karnataka, Rangsons specialises in addressing critical aerospace and defence system requirements through a diversified product portfolio with a fully integrated ecosystem of design, manufacturing, special processes, testing and qualification.

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Qualcomm Technologies, Inc. has acquired Ventana Micro Systems Inc., a move aimed at strengthening the company’s capabilities in RISC-V CPU development and advancing its custom Oryon CPU technology.

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The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,

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The partnership brings together ideaForge’s FLYGHT platform, a ready-to-deploy, on-demand drone network delivered through a Drone-as-a-Service (DaaS) model, with C-DAC’s Emergency Response Support System (ERSS–Dial 112).

Under the agreement, FET will lead the commercialization, manufacturing and distribution of Nauticus’ Olympic Arm electric manipulator system, while Nauticus continues to advance the robotics, autonomy and intelligent control technologies that underpin next-generation subsea manipulation.

Wise will supply its GaN power devices, digital-control expertise and technical support; Powernet will lead the development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC will manage backend manufacturing.

The companies aim to deploy a sovereign, space-based intelligence, surveillance, and targeting (IST) constellation with an interconnected comms layer for Europe by 2029.

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The AI-RAN optimization technology verified by the two companies automatically applies optimal configurations for each user — rather than for the network as a whole — based on real-time wireless conditions.

Sponsored content by NORDES EMS

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Modern electronics manufacturing is developing faster than ever. Shorter product life cycles, ever-increasing quality requirements, advancing miniaturization and the need for rapid prototyping means, that companies require partners who can work in highly variable and precise conditions. Against this backdrop, the EMS (electronics manufacturing services) model has become one of the key elements of the modern supply chain.

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Together, the companies aim to advance next-generation nanofabrication processes that improve qubit performance, reliability and scalability, paving the way for practical quantum systems that bridge scientific research and real-world application.

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Empower Semiconductor, a provider of power solutions for AI-class processors, opened a new headquarters in Milpitas, California, and established a research and development center in Munich, Germany.

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For years, the Polish company MediSensonic has been known primarily for its medical microwave technologies – including its work on non-invasive glucose monitoring. Today, the company is expanding its presence into dual-use and defence markets, developing microwave anti-drone systems, passive detection platforms and a noise-based radar shield.

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Imec has presented the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography.

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Nvidia is piloting a new software feature that can verify the physical location of its AI chips, aiming to make illicit GPU diversion and smuggling significantly harder. The initiative, described in detail by Reuters, uses telemetry already present in data-centre deployments to estimate where a device is operating — without modifying the chip itself or embedding direct GPS-style hardware tracking.

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Leveraging its engineering expertise in system-on-chip (SoC) architecture, design and development, India’s HCLTech will embed French company Dolphin Semiconductor’s specialized low-power IP into its silicon design workflows.

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In a post on Truth Social, US President Donald Trump announced that the United States will allow exports of Nvidia’s H200 AI chips to China under a 25% government fee.

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Global semiconductor equipment billings rose 11% year-on-year to 33.66 billion US dollars in the third quarter of 2025, according to the latest Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report from SEMI. Compared with the previous quarter, billings increased by 2%.

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Quobly says that it has reached a key milestone in its roadmap toward industrial-scale quantum processors, with the first custom 28Si FD-SOI wafers from Soitec now cycling in STMicroelectronics’ 300 mm manufacturing facility in Crolles.

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Navitas Semiconductor and Cyient Semiconductors have entered into a strategic partnership aimed at accelerating the adoption of gallium nitride (GaN) technology across India’s AI, mobility, industrial, and energy sectors.

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Swedish Sivers Semiconductors has entered into a strategic partnership with distributor DigiKey aimed at broadening global access to Sivers’ millimetre-wave wireless products and evaluation kits.

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As part of the MoU, Intel and India’s Tata Group intend to explore manufacturing and packaging of Intel products for local markets at Tata Electronics’ upcoming Fab and OSAT facilities, as well as a collaboration for advanced packaging in India.

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Together, the companies will co-develop next-generation electrification solutions for high-performance and commercial vehicles, marine platforms, and energy storage systems, with a strong focus on the European market.

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In addition, based on this platform, Japanese imaging solutions leader CIS Corporation has announced the first A-PHY camera module for machine vision.

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Leveraging cobots from Universal Robots, Viam has developed an AI-powered robotic surfacing system that helps accelerate key manufacturing processes, reduce delays and ensure consistency.

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ICEYE will deliver a state-of-the-art SAR satellite to the Portuguese Air Force. ICEYE’s SAR technology provides unique advantages, including all-weather, day-and- night imaging and rapid revisit rates, ensuring persistent and reliable monitoring regardless of environmental conditions.

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On November 25, Japanese SoftBank Group completed the acquisition of all equity interests in Ampere Computing, a US-based semiconductor design company.

The collaboration brings together onsemi’s expertise in integrated systems and packaging with Innoscience’s GaN technology and high-volume manufacturing to enable delivery of GaN products for industrial, automotive, telecom infrastructure, consumer and AI data center markets.

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While the Hyderabad-based Azad Engineering did not disclose the size of the contract, it confirmed that there is no shareholding involved between the parties and that the deal does not fall under related-party transactions.

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