Apogee partners with Arrow to boost space-grade tech network
The partnership will expand the distribution network for Apogee’s high-reliability ICs and radiation-tolerant solutions, bringing their technologies to a broader market across aerospace and defense.
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SEALSQ and IC’ALPS team up to enhance automotive ASIC safety
Through this partnership, SEALSQ’s post-quantum secure technology will be integrated into IC’ALPS’ automotive ASIC designs, providing robust cryptographic resistance against quantum-era threats.
SOTI partners with Urovo to boost battery monitoring
SOTI XSight now supports Urovo’s advanced smart batteries, giving organisations real-time insights into battery health, performance and location, thereby reducing mobile-device-related downtime, in the transportation and logistics (T&L) industry.
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Prototyping of electronic devices: Major Barriers and Strategies to Overcome Them
Prototyping electronic devices is one of the most important stages of the design process – the point at which an idea begins to take shape. It is not just about testing technical assumptions, but also a strategic exercise requiring precise planning, optimisation and functional analysis. It is at this stage that potential errors are identified, individual components are refined and the readiness of the product for series production is assessed. However, successful prototyping is not without its challenges – from selecting the right components to iterative testing and system integration. At Comarch, with many years of experience in IoT development, we have a deep understanding of the complexity of the electronic device prototyping process and the difficulties that engineers have to face. We also know how to remedy them.
NEO to leverage Elementium’s advanced electrolyte tech
Under the terms of the Agreement, NEO will apply Elementium’s advanced electrolytes to its silicon battery platform for use in specialty commercial applications.
Samsung’s AI robot Ballie paired with Google Cloud’s Gemini
Ballie, a home AI companion robot from Samsung, will use Google Cloud’s generative AI tech Gemini’s multimodal capabilities along with proprietary Samsung language models to process and understand a variety of inputs.
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Farnell inks new global distribution agreement with MCC
Farnell has entered into a global distribution agreement with Micro Commercial Components (MCC), expanding its range of discrete semiconductor solutions available to customers in sectors such as automotive, industrial, consumer electronics, and computing.
STMicroelectronics targets edge AI leadership with STM32N6
As the edge AI landscape continues to expand, STMicroelectronics is positioning itself at the forefront of this transformation. At the recent Evertiq Expo in Sophia Antipolis, Edwin Hilkens from STMicroelectronics spoke with Evertiq about the company’s new product with which ST is looking to become the leader in the domain.
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ST to cut up to 2,800 jobs in major manufacturing overhaul
Semiconductor manufacturer STMicroelectronics will see up to 2,800 employees leave the company globally over the next three years as part of an overhaul of its manufacturing operations and cost structure.
STMicroelectronics responds to insider trading allegations
On Thursday, STMicroelectronics' supervisory board firmly refuted allegations of insider trading involving two members of the European semiconductor manufacturer's management board. The statement follows accusations made the day before by Italy’s Economy Minister, Giancarlo Giorgetti, who claimed that members of STMicro’s management sold shares just prior to releasing disappointing financial results.
IQE and X-FAB to develop European-based GaN Power device platform
IQE plc, a supplier of compound semiconductor wafer products and advanced material solutions, and X-FAB Silicon Foundries have entered into a Joint Development Agreement (JDA) to create a European-based GaN Power device platform solution.
Magnachip to exit display business – shifts focus to power semiconductors
Magnachip Semiconductor says that it will shut down its Display business by the end of the second quarter of 2025, transitioning into a pure-play power semiconductor company focused on Power IC and Power discrete solutions.
Horiba acquires EtaMaX in South Korea
Japanese semiconductor metrology company Horiba has acquired EtaMax, a South Korean developer and manufacturer of wafer inspection systems, in a move aimed at expanding its capabilities in the compound semiconductor market.
Bosch and Element Six set up JV to commercialise quantum sensing
Bosch is intensifying its push into quantum technology by establishing a new joint venture with Element Six, a leading provider of synthetic diamond solutions. The new company, Bosch Quantum Sensing, aims to accelerate the commercialisation of quantum sensors, building on a collaboration between the two firms that began in 2023.
Boreo acquires Elfa Distrelec sales activities in Finland and the Baltics
Boreo has signed an agreement to acquire the sales activities of Elfa Distrelec in Finland, Latvia, Estonia and Lithuania from RS Group.
Sensirion opens new production building in Hungary
Swiss manufacturer of environmental and flow sensors Sensirion has completed the expansion of its production facility in Debrecen, Hungary.
GA-ASI teams up with Hanwha to bolster UAS business
Hanwha Aerospace plans to invest over USD 203 million in the development and production facilities for GE STOL and UAS engines, expand R&D, and provide infrastructure in both South Korea and with GA-ASI in the US.
Intelligent Memory eyes growth despite harket headwinds
The memory market has faced significant headwinds over the past two years, according to Nicolas Rossetto of Intelligent Memory. Speaking to Evertiq during the Evertiq Expo in Sophia Antipolis, Rossetto acknowledged the ongoing difficulties in the industry, noting that both large and small memory makers have been impacted by declining prices and weak consumer demand.
Infineon to acquire Marvell’s Automotive Ethernet business
Germany’s Infineon has entered into an agreement to acquire Marvell Technology’s Automotive Ethernet business for USD 2.5 billion – accelerating the build-up of its system capabilities for software-defined vehicles by complementing and expanding its own microcontroller business.
Mobileye selects Valens’ chipsets for hi-tech driving projects
Mobileye selected the VA7000 for this application following extensive testing of the chipset, where the Valens chip was found superior across a variety of parameters, with significant performance benefits.
Sinopec teams up with CATL to build 10,000 battery swap stations
This year, the collaboration targets construction of at least 500 battery swap stations, with a long-term goal of 10,000 stations, creating a seamless “swap-as-fast-as-refueling” experience for EV owners in China.
Intel, TSMC agree to form chipmaking joint venture
TSMC had recently pitched Nvidia, AMD and Broadcom to take stakes in a JV that would operate Intel’s factories after the US administration requested the Taiwanese chipmaker to help turn around the struggling US company.
German memory innovators aim to revive domestic memory chip manufacturing
Neumonda and Ferroelectric Memory Company (FMC) are joining forces to advance the development and commercialisation of FMC’s nonvolatile DRAM+ technology. This collaboration aims nothing less than to bring semiconductor DRAM memory design and manufacturing back to Germany.
Tokyo Electron, IBM renew partnership for advanced chip tech
The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
BelGaN’s facility to be repurposed for photonic chip production
As previously reported by Evertiq, the production site in Oudenaarde, Belgium — formerly operated by the bankrupt BelGaN — attracted interest from several potential buyers. Now, the site has reportedly found its new owner.
Robert Feurle takes the helm at Wolfspeed
Wolfspeed, US silicon carbide (SiC) specialist, has appointed Robert Feurle as Chief Executive Officer (CEO), effective May 1, 2025. The appointment follows a comprehensive internal and external search, the company revealed.
COGD calls for stronger risk analysis and proactive obsolescence management
The newly re-elected board of the Component Obsolescence Group Deutschland (COGD) is urging German industrial companies to enhance risk analysis and adopt proactive obsolescence management strategies amid growing supply chain challenges.
Metavisio, BKB team up to build data center in South Korea
The project, a partnership between French firm Metavisio Thomson and South Korea’s BKB Energy, will leverage a 260MW power supply validated by Korea Electric Power Corporation (KEPCO).
Aixtron delivers G10-AsP system to Nokia
Aixtron will supply its G10-AsP system to Nokia, facilitating the production of 6-inch Indium Phosphide (InP) wafers for Photonic Integrated Circuits (PICs).
Hitachi opens new semiconductor equipment plant
Hitachi High-Tech Corporation has completed its new production facility for semiconductor manufacturing equipment in Kudamatsu City, Yamaguchi Prefecture, Japan. Construction of the facility started back in December 2023, and the facility commenced operations on March 17, 2025.
UMC opens new fab expansion in Singapore
Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
AKTANTIS strengthens deep-tech innovation and international collaboration
At the Evertiq Expo 2025 in Sophia Antipolis, representatives from AKTANTIS, a deep-tech technology cluster, highlighted the organisation's role in fostering innovation, supporting startups, and facilitating international collaboration.
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