STV to deploy Post-Quantum’s secure communications platform
The partnership combines Czech company STV’s defence innovation track record with UK-based cybersecurity firm Post-Quantum’s expertise to deliver communications and data protection systems that go beyond current industry standards.
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Critical Nexperia chip supply from China to be reinstated
The Dutch government has announced that China will enable the resumption of shipments from Nexperia’s facilities in China, restoring the supply of critical semiconductors.
NEC teams up with Siemens to boost smart factory innovation
Through this agreement, the two companies will jointly develop a robot teaching automation solution that combines the “NEC Robot Task Planning” digital twin service with Siemens’s “Process Simulate” software for 3D robot simulations.
Sponsored content by FlexLink
FlexLink for PCB Management: Simple Solutions for Complex Requirements
In the world of electronics, where precision is essential and complexity is constant, FlexLink introduces a new approach: modular, autonomous, and intelligent systems that transform motion into efficiency.
Nokia, Rohde & Schwarz collaborate on AI-powered 6G receiver
Nokia Bell Labs developed the receiver and validated it using 6G test equipment and methodologies from Munich-based test and measurement company Rohde & Schwarz.
SkyWater partners with QuamCore to advance quantum computing
Under the agreement, SkyWater will fabricate and jointly optimize the superconducting process modules required to produce QuamCore’s SFQ digital controller, the ultra-low-power chip that interfaces directly with the qubits inside the cryostat.
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Sivers Semiconductors partners With POET Technologies
Swedish photonics and wireless technologies specialist, Sivers Semiconductors, has released additional details on the strategic partnership with POET Technologies Inc., a specialist the design and implementation of highly integrated optical engines and light sources for artificial intelligence networks. The collaboration will combine Sivers’ lasers with POET’s optical interposer to deliver scalable, energy-efficient light sources.
GF and Silicon Labs expand US chip manufacturing
GlobalFoundries and Silicon Labs are expanding their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale US-based semiconductor manufacturing.
Sensirion breaks ground on new production building
Swiss sensor specialist Sensirion has officially broken ground on its new production building in Stäfa
onsemi completes acquisition of Vcore Power Technology
onsemi has completed the acquisition of rights to Vcore power technologies, including associated IP licenses, from Aura Semiconductor.
Skyworks and Qorvo to merge, creating a $22b company
Skyworks Solutions and Qorvo have entered into a definitive agreement to merge in a cash-and-stock transaction that values the combined enterprise at approximately USD 22 billion.
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Easily track every PCB
Complete traceability solution from BRADY can connect every circuit board in production to your Smart Factory set up. A fully automated printed circuit board labelling solution can enable traceability and manufacturing data analysis without human interference.
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Amphenol Socapex
PowerSafe: High-Power Connectors for Harsh Environments Amphenol Socapex’s PowerSafe series stems from the MIL-DTL-38999 Series III architecture and is purpose-built for high-power supply applications up to 500 V in demanding conditions. These connectors integrate highest levels of user safety, shielding effectiveness and environmental performance to meet the European standard for power equipment, DIN EN 61984 (formerly VDE 0627).
Sponsored content by Koh Young
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
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