Horiba to set up new production base in Malaysia
The Horiba Group is set to significantly expand its operations in Malaysia with plans to establish its first manufacturing facility in the state of Kedah.
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VECV partners with Statiq to boost EV adoption in India
Statiq will extend access to its expanding network of over 8,000 charging points from leading CPOs on its aggregated platform across India, making charging simpler, faster and more efficient for Eicher customers.
Swedish giants to build AI factory with Nvidia
A group of leading Swedish companies – AstraZeneca, Ericsson, Saab and SEB – together with Wallenberg Investments and Nvidia, plans to build Sweden’s largest AI supercomputer. The new system will be based on Nvidia’s latest generation of accelerated computing and operated by a jointly owned company to provide sovereign, secure access to AI compute capacity.
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TSMC to launch European chip design centre in Munich
Taiwanese semiconductor giant TSMC is preparing to strengthen its European presence with the opening of a new design centre in Munich, Germany.
Mario Merino takes the helm at Avnet Abacus
Mario Merino will be appointed as president of Avnet Abacus, effective 1 July 2025. He will succeed Rudy Van Parijs, who is set to retire at the end of Avnet's 2025 fiscal year after more than three decades with the company.
Kandi partners with CBAK to launch US lithium battery facilities
Each facility will be operated as a separate joint venture between the two Chinese companies, with differing ownership structures tailored to the specific nature and scope of each project.
ST expands "Lab-in-Fab" initiative in Singapore
STMicroelectronics says that it is partnering with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, to expand its “Lab-in-Fab” (LiF) in Singapore. The focus of the collaboration is to advance piezoelectric MEMS for applications in personal electronics, medical devices, and other applications.
Dubai’s du announces $540M hyperscale data center deal with Microsoft
The hyperscale data center will have Microsoft as the main tenant and its capacity will be delivered in tranches.
ClassOne, IBM Research team up to develop non-NMP solvent processing
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
KLA opens $138M R&D and manufacturing facility in Wales
KLA Corporation has inaugurated a new USD 138 million R&D and manufacturing facility in Newport, Wales, expanding its footprint in the UK. It will serve as the new home for KLA's SPTS division, which specialises in advanced wafer processing technologies.
L&T-Cloudfiniti partners with QpiAI to drive quantum computing workloads
The two companies will initiate and execute joint R&D programmes focussed on next-generation solutions at the intersection of AI and quantum computing, in India.
Prophesee, Tobii partner to develop event-based eye tracking solution
The companies aim to develop an ultra-fast and power-efficient eye-tracking solution, specifically designed to meet the stringent power and form factor requirements of compact and battery-constrained smart eyewear.
Trump: iPhones must be made in the U.S. — or face 25% tariff
President of the United States Donald Trump has once again publicly addressed Apple.
Trensor break ground on automotive sensor facility in Penang
China-based Trensor Co. Ltd. has broken ground on its first overseas manufacturing facility in Penang, Malaysia, with an investment valued at MYR 100 million (USD 23.39 million). The plant is expected to begin operations in 2026 and create 200 high-skilled jobs.
Fujitsu to supply components for Lockheed Martin’s SPY-7 radar
Lockheed Martin and Fujitsu have signed an MOU establishing Fujitsu as a source for the SPY-7 Subarray Suite Power Supply Line Replaceable Unit (PS LRU).
GCT, G+D partner to launch eSIM solution for IoT devices
This collaboration for eSIMs, or SIM cards directly embedded into a device, brings intelligent, location-aware connectivity to headless 4G and 5G IoT devices.
MHI, Yamaha test flight hybrid-type medium-sized UAV
Mitsubishi Heavy Industries (MHI) and Yamaha Motor have conducted a flight test of a medium-sized UAV equipped with a compact, lightweight power generating unit, capable of carrying a payload of 200 kg.
ENGIE teams up with CBRE for 2.4 GW battery storage portfolio in US
This transaction is one of ENGIE’s largest operating portfolio partnerships in the US. ENGIE will retain a controlling share in the portfolio and will continue to operate and manage the assets.
IBM and Deca to launch advanced chip packaging in Quebec
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
Rotakorn sees a bright future – with sustainability in focus
As the market begins to reawaken after a quiet 2024, Rotakorn Electronics is looking ahead with both confidence and a clear focus on sustainability. In the midst of the bustling Evertiq Expo in Tampere, we caught up with Sebastian Blom, newly appointed Sales Manager at Rotakorn, for a quick chat about the current market situation and future outlook.
Ukrainian drone strike targets Russian semiconductor plant
Ukraine’s military claims it successfully struck a Russian semiconductor facility in the Oryol region during a drone operation.
UST partners with T-Works to advance automotive, chip product development
UST will serve as the systems integrator, offering end-to-end solutions and providing a launch pad for T-Works startups to scale up, specifically in areas such as Automotive AI platforms, Semiconductor ATE frameworks, and Smart Factory integration, in India.
Wolfspeed reportedly preparing for bankruptcy
Wolfspeed is said to be preparing a Chapter 11 bankruptcy filing within weeks, according to reports from The Wall Street Journal and Reuters. The move comes after failed restructuring talks and growing financial pressure from falling demand and aggressive Chinese competition.
Infineon to supply power modules for Rivian's EVs
Germany's Infineon Technologies will supply Rivian’s R2 platform with power modules for traction inverters. The R2 platform will use SiC and Si modules from Infineon’s HybridPACK Drive G2 family.
GlobalWafers opens Texas wafer plant, announces major expansion
Taiwanese semiconductor company GlobalWafers has officially inaugurated its new, USD 3.5 billion, silicon wafer facility in Sherman, Texas, marking a significant step in efforts to boost US semiconductor manufacturing capacity. The company also announced plans to further expand the site, increasing its total investment in the region to USD 7.5 billion.
Nearfield, A*STAR IME to partner on chip metrology tech research
By leveraging Nearfield’s expertise in high-precision metrology and A*STAR’s cutting-edge semiconductor research, the partnership will accelerate the development of advanced metrology solutions that enable efficient AI chip production.
NY Creates and Fraunhofer team up on 300mm memory R&D
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.
Joonas Mikkilä predicts strong growth for Finland’s tech sector
At this year’s Evertiq Expo Tampere 2025, Joonas Mikkilä, Senior Advisor at Technology Industries of Finland, shared insights on the country's semiconductor sector and the national strategy known as “Chips from the North,” which aims to accelerate growth in the years ahead.
Zeon partners with SiAT to advance next-gen battery manufacturing
Zeon will lead SiAT's USD 20 million USD Series C fundraising round to support the expansion of its production capacity for single-walled carbon nanotube (SWCNT) conductive paste, a critical nanomaterial for next-generation battery technologies.
C-DOT teams up with Synergy to develop drone-based QKD tech
The MoU aims to formalize cooperation between C-DOT, a telecom R&D institution under the Indian government’s Department of Telecommunications, and Synergy Quantum in the development of drone-based Quantum Key Distribution (QKD) systems.
Report: Apple partners with Anthropic to build AI coding platform
The system is a new version of Apple’s programming software Xcode, which will integrate Anthropic’s Claude Sonnet model, according to a report by Bloomberg.
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