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By combining Quantinuum’s full-stack quantum computing capabilities with GE Vernova’s expertise in material science and engineering simulation applied to industrial applications, the collaboration will bring an industry perspective to a promising area of quantum research.

CEO-Jensen-Huang-2022

Jensen Huang has resigned as president and CEO of Nvidia, effective immediately. CFO Colette Kress takes over as interim CEO while the board searches for a permanent successor.

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Powell Electronics Europe, which supplies connectors and components for high-reliability applications, has added new support teams in Germany and Poland. The company expects to grow by about 40% this year compared with 2025.

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US photonics company Aeluma has bought an Aixtron G10-AsP system to expand production of photodetectors and lasers on its non-indium phosphide (non-InP) platform. The tool supports 150 mm and 200 mm wafers and has been configured for Aeluma’s own processes.

Sponsored content by TME Transfer Multisort Elektronik

Various types of displays remain the most user-friendly elements of human-machine interfaces (HMIs) – they are intuitive, provide programmers with a way to convey clear messages, and are easy to connect to microcontroller-controlled devices.

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German software company Luminovo is opening its platform for electronics quoting and procurement to AI assistants such as ChatGPT, Claude and Microsoft Copilot. EMS providers and electronics manufacturers will be able to query their own supply chain data in plain language, and build their own tools on top of it.

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Arrow Electronics has launched Capstone, a new global business dedicated to interconnect, passive and electromechanical (IP&E) components. The launch is part of a wider realignment of Arrow’s components business, which is moving from a geographic to a technology-based operating model.

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Ferrotec has opened its second manufacturing plant in Kulim, Malaysia, which will create more than 1,000 new jobs. The new plant brings the company’s total investment in its two Kulim sites to about MYR 1.9 billion.

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With a 15% global market share, WT Microelectronics will serve as a strong global distribution partner for Sivers’ InP (Indium Phosphide) lasers and wireless beamformer products and solutions, connecting its product portfolio and availability at scale with customers globally.

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Indie

The collaboration seeks to boost the companies’ competitive position in India’s market. By leveraging their resources and capabilities, Sanken Electric and Kaynes aim to mitigate risks associated with fluctuations in demand while maximizing investment efficiency.

French electronics distributor Steliau Technology has completed its acquisition of the UK-based Acal BFi Group, which includes Impulse Embedded and Arcobel Embedded Solutions. The combined group will have revenue approaching EUR 1 billion.

Amkor has broken ground on an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The new building will add capacity at a site that has been part of Amkor’s Korean operations since the 1990s.

Infineon expects revenue of about EUR 20 billion in fiscal 2027, which runs from October 2026 to September 2027. That would be an increase of more than 20%, driven by data centres, power infrastructure and software-defined vehicles. Revenue from power supplies for data centres alone is projected to reach close to EUR 4 billion.

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German equipment maker SCHMID Group has received an order for wet-process equipment for a new glass core substrate plant in South Asia. The customer is a US company specialising in glass-based advanced packaging, which is now moving its technology from pilot production to industrial scale.

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The solution establishes a unified digital thread by connecting people, processes and data across the semiconductor lifecycle, from IP management, new product introduction and supplier collaboration to quality and regulatory compliance.

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Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility, which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility.

US company Diamond Foundry says it has grown the first single-crystal diamond with a diameter of 200 mm, the same size as a standard semiconductor wafer. The company sees it as a step towards using diamond as a substrate material in chip manufacturing.

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Infineon has processed 300 mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, using existing silicon manufacturing equipment. The company says it’s the first to do so in a full-scale semiconductor fab.

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The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.

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Combining MPS’s technology with GF’s manufacturing expertise will support the next phase of growth for both companies while providing customers with greater capacity, supply assurance and global scale.

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Supported by Korea’s Ministry of Science and ICT (MSIT), the collaboration aims to support AI services tailored to Korea’s language, industries and priorities, connecting Korean semiconductor development with the systems and operational capabilities needed to deliver AI at scale

CEO-Jensen-Huang-2022

Nvidia’s board of directors has launched an independent investigation following reports that CEO Jensen Huang has been the target of a foreign intelligence effort. The board says it has no reason to believe national security or the company’s secrets have been compromised, and that it has confidence in Huang.

onsemi will not go ahead with the planned expansion of its site in Rožnov pod Radhoštěm, which would have added end-to-end silicon carbide (SiC) production in the Czech Republic. The company and the Czech Ministry of Industry and Trade have agreed to conclude the project, which was announced in June 2024 as an investment of up to USD 2 billion.

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This achievement marks the first time a leading service provider, leading network infrastructure provider and a leading chipset vendor have come together to demonstrate pre-6G technology with 400MHz channel bandwidth under realistic conditions in the field.

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The target business encompasses low-voltage circuit breakers, electromagnetic switches, measurement and control equipment, and UPS for general industrial use of 5kVA or less, and other products.

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Nexperia has taken legal action in the Netherlands against its Chinese parent Wingtech, Nexperia China and its former CEO, Zhang Xuezheng, seeking damages it currently estimates at USD 2 billion. At the same time, a Dutch court has granted Nexperia an injunction protecting its intellectual property rights in the EU.

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Nordson has completed its acquisition of Contrinex, a Swiss maker of sensors for factory automation. The deal adds inductive and photoelectric position sensors to Nordson’s test and inspection business.

The two companies plan to deploy 3 GWh of CATL’s TENER energy storage systems across Germany, Switzerland, Austria and other markets over the next five years, serving both utility-scale and commercial and industrial (C&I) applications.

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WATS has added German distributor S-EV Electronic Distribution to its partner network. The partnership is meant to give WATS a stronger presence among German electronics manufacturers.

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Axcelis Technologies and Veeco Instruments now expect their all-stock merger to close by the end of the first quarter of 2027. The deal is still waiting for approval from China’s competition authority, SAMR, and the companies must also refile with US regulators.

India

NSIL, the commercial arm of India’s space program, has signed an agreement with Australian Earth observation satellite company LatConnect 60 to provide telemetry, tracking and command services for the company’s SWIRSAT-1 and SWIRSAT-2 spacecraft.

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Bosch will move its semiconductor business into a dedicated division from January 2028. The company aims to reach semiconductor sales of around EUR 5 billion by 2030, and plans to open up more of its manufacturing capacity to external customers.

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The companies intend to combine D-Wave’s annealing quantum computing technologies with LG CNS’s industry expertise, mathematical optimization capabilities and systems integration experience to develop applications for customers in manufacturing, telecommunications, finance and retail.

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