Veeco acquires NXG XII 600 From Nikon SLM Solutions
October 15, 2024
Manufacturer of semiconductor process equipment, Veeco, has acquired the NXG XII 600 system from Nikon SLM Solutions.
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Secret semiconductor company places multi-system order with Veeco
May 14, 2024
Veeco Instruments says that a leading-edge semiconductor company has placed an order for multiple laser annealing systems to accelerate the design and manufacturing of 2-nanometer gate-all-around logic semiconductor chips.
The battle for SiC – the market landscape continues to change
June 29, 2023
With increased demand from booming markets such as EVs and renewable energy, the compound semiconductor business has been thriving in recent years. As businesses fight to cement their place in the sector, M&A activity has increased.
Veeco receives multiple orders from secret semiconductor manufacturer
May 09, 2023
Veeco Instruments says it has received multiple orders for Laser Spike Annealing (LSA) systems from an unnamed memory device manufacturer.
Axcelis Technologies announces CEO succession
March 28, 2023
The Board of Directors of Axcelis Technologies has named Russell J. Low, Ph.D. to succeed Mary G. Puma as President and Chief Executive Officer effective May 11, 2023.
Veeco acquires Epiluvac AB
February 02, 2023
Veeco Instruments has acquired Epiluvac AB, a privately held manufacturer of chemical vapor deposition (CVD) epitaxy systems that enable advanced silicon carbide (SiC) applications in the electric vehicle market.
Boston Semi Equipment adds industry veteran to the team
June 08, 2022
Scott Kroeger is joining Boston Semi Equipment (BSE) as the company's new senior vice president, Sales and Marketing.
Semiconductor company places order for multiple Veeco systems
March 17, 2022
Veeco Instruments says that an unnamed semiconductor manufacturer has ordered multiple Veeco WaferStorm Wet Processing Systems for advanced packaging applications.
Veeco ships first system from new manufacturing facility
November 23, 2021
Veeco Instruments says that the company has shipped the first LSA101 Laser Spike Annealing System from its new San Jose, California facility to an unnamed semiconductor manufacturer.
Transphorm choses Veeco system for GaN-based power and 5G devices
December 03, 2020
Veeco Instruments says that Transphorm, a supplier of gallium nitride (GaN) products for high voltage power conversion applications, has selected its Propel HVM MOCVD System for high-volume production of GaN-based RF (DoD and Commercial/5G) and power electronics Epiwafers.
UAT picks Veeco to bolster fan-out wafer-level packaging portfolio
February 14, 2019
Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s single-wafer solvent wet process tool, WaferStorm, and its AP300 lithography system to support the growth of UAT’s outsourced assembly and test business.
Fraunhofer Institute goes with Veeco's ion beam sputtering technology
February 13, 2019
Veeco Instruments has shipped its SPECTOR Ion Beam Sputtering (IBS) system and the Sirius Optical Monitor System (OMS) to Fraunhofer Institute for Telecommunications.
Veeco sells multiple AP300 lithography systems
July 13, 2018
Veeco Instruments has received an order for multiple AP300 lithography systems to support the fast growing demand for DRAM with copper (Cu) pillars.
Delft university orders Veeco ALD system
July 04, 2018
The Materials for Energy Conversion and Storage Group (MECS) at Delft University of Technology has ordered its Fiji F200 Plasma-Enhanced Atomic Layer Deposition (PE-ALD) system from Veeco Instruments.
Osram orders multiple Veeco MOCVD systems
January 10, 2018
The lighting manufacturer has placed an order for multi-reactor propel and K475i MOCVD systems for high volume photonics and advanced LED applications.
Veeco's MOCVD system shipped to China for LED production
December 07, 2017
Veeco Instruments has received an order for multiple TurboDisc EPIK 868 Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems from Focus Lightings Tech.
Veeco completes acquisition of Ultratech
May 29, 2017
Veeco Instruments Inc. completed the acquisition of Ultratech, Inc., a supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs.
Veeco to acquire Ultratech for $815 million
February 07, 2017
The companies have signed a definitive agreement under which Veeco Instruments Inc. will acquire Ultratech, Inc. Both companies boards of directors have unanimously approved the transaction.
Veeco to provide systems for new LED production facility in Malaysia
December 20, 2016
Osram Opto Semiconductors GmbH has completed an agreement naming Veeco as the supplier for Metal Organic Chemical Vapor Deposition (MOCVD) and Precision Surface Processing (PSP) systems needed for high-volume LED production in Kulim, Malaysia.
A*STAR IME’s consortium to deepen capabilities in MEMS
June 09, 2016
A*STAR’s Institute of Microelectronics (IME) has launched its third consortium to develop "cutting-edge" micro-electro-mechanical systems (MEMS) technologies.
88 Million dollar in financing Kateeva
May 20, 2016
Kateeva today announced that it has closed its Series E funding round with $88 million in new financing.
Aixtron looking for a buyer?
April 01, 2016
German equipment supplier, Aixtron SE, is reportedly holding – informal – talks with potential buyers as the company is trying to cope with losing major customers.
Veeco wraps up acquisition of Solid State Equipment Holdings
December 05, 2014
Veeco Instruments has acquired privately held Solid State Equipment Holdings LLC (SSEC), based in Horsham, Pennsylvania, USA.
IPG Photonics invests in MBE System
March 10, 2014
IPG Photonics Corporation (IPG), purchased an additional GEN2000 Production Molecular Beam Epitaxy (MBE) System from Veeco Instruments.
Veeco to purchase Synos Technology
September 19, 2013
Veeco Instruments has signed an agreement to acquire privately held Synos Technology (Synos).
On Track to a Major Industry Progress with printed and thin film electronics.
February 14, 2007
Nowadays, the term printed electronics is taken to include thin film electronics that will become printable.
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