Sponsored content by Mycronic

 

Turn up the volume. The MYPro A40: Agility accelerated

The MYPro MY300 set the benchmark for productivity in high-mix PCB assembly. Now its successor, the MYPro A40, is raising the bar even further with 48% faster placement speeds and an ability to mount six times larger components with the MX7 high-speed mounthead. All so you can master any product mix. And pump up production volumes to levels never seen before.

Sponsored content by Mycronic

 

MYPro™ I51 3D AOI — when ease of use and high performance go hand in hand

In today’s high-paced, high-mix, just-in-time production environment, electronics producers have to find the right production setup to handle flexibility, high-reliability, and scalability, all while maintaining a high level of usability for their production staff. Now combining a ground-breaking user-friendliness for program creation with one of the most advanced 3D AOI vision technologies on the market, the MYPro I51 might very well be a game-changer for high-reliability high-mix EMSs and OEMs looking to increase their capacity. Compared with previous generation, the MYPro I51 is up to 30% faster to program, and offers an up to 30% faster cycle time.

Sponsored content by Mycronic

Solder paste perfection at jet speed  — how jet printing is gaining momentum and versatility

Since its introduction over a decade ago, solder paste jet printing has continued to improve the quality and versatility of electronics manufacturers worldwide. This is especially true in the world of high-mix electronics, where the high accuracy and high flexibility of software-driven assembly processes are crucial to competitiveness. Now, with faster jetting speeds, a wider range of compatible solder pastes and tightly integrated Solder Paste Inspection (SPI) capabilities, jet printing has matured into a powerful platform for increased production efficiency and improved first-pass yield.