Evertiq - First In Electronics News & Expo

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April 08, 2026
OKI has introduced a new electronics manufacturing services (EMS) offering targeting AI server equipment.

axonite_chip

April 08, 2026
BITSILICA’s diverse service portfolio will complement Quest Global’s existing strengths as an engineering solutions provider by expanding its capabilities in semiconductors and embedded systems.

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PCB-Spain_2

April 07, 2026
The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.

fab-equipment-spending-2026

April 07, 2026
Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.

April 07, 2026
SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.

HBM4

April 06, 2026
HBM4 36GB 12H in high-volume production is designed for Nvidia Vera Rubin — with greater than 2.8 TB/s and 20% better power efficiency.

AI_infrastructure

April 06, 2026
With USD 650 million raised in the past six months, the South Korean AI chip startup is entering a new phase of growth focused on US market expansion, scaled production of its Rebel100 platform, and preparation for a future IPO.

Germany_Dresden

April 03, 2026
The state of Saxony, where Dresden is located, is known as one of Europe’s leading hubs for the semiconductor and other advanced technology industries, and it has attracted numerous global companies from these sectors.

windmills-pexels

April 03, 2026
Located in Rajasthan, these BESS are connected with existing operational Inter-State Transmission System and will run on merchant basis, generating additional revenue stream through price differential between peak and non-peak demand hours.

PCB-world_2

April 02, 2026
The semiconductor market has been sending mixed signals for some time now. Headline numbers suggest a return to growth, and in some segments even a strong rebound. At the same time, when looking more closely at how this growth is distributed, it becomes increasingly difficult to describe it as broad-based or evenly shared across the industry.

windmills-pexels

April 02, 2026
Following receipt of the final construction approval and financing, the company intends to commence the construction of the project. Once completed, the project in Buffalo, New York, will be operated as a community solar project.

April 01, 2026
Optical and photonic solutions provider Lumentum plans to establish a new US manufacturing facility in Greensboro, North Carolina.

sign

April 01, 2026
TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.

Grumman_SEWIP_Block3

April 01, 2026
SEWIP Block 3 is a US Navy program that uses advanced electronic attack to protect surface ships from missiles, improving ship survivability.

Shipyard_HBL_MOU

March 31, 2026
The collaboration will focus on the development of advanced marine batteries, battery management systems, electric motors, power electronics and charging infrastructure. The JV aims to cater to both Indian and international markets.

Molten_MOU

March 31, 2026
Under the arrangement, Molten will produce graphite via methane pyrolysis, which Posco Future M will then process into spherical graphite through its subsidiary FutureGraph before producing natural graphite anode material at its Sejong plant.

March 30, 2026
Electronics manufacturing services provider Flex has entered into a definitive agreement to acquire US-based Electrical Power Products (EP2), a supplier of engineered-to-order electrical power control and protection systems. The transaction is valued at approximately USD 1.1 billion, including anticipated tax benefits of around USD 0.1 billion.

power_modules

March 30, 2026
The UCC34141-Q1 and UCC33420 isolated power modules leverage Texas Instruments’s IsoShield technology, a multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs.

March 30, 2026
Aechelon’s technology is used by the US military and allies to train pilots and test advanced aircraft and autonomous systems before live flight, and supports a range of critical national security platforms.

Inova_PhysicalAI

March 30, 2026
The advanced robotic arm reference platform combines the expertise of Inova, MIPS and GlobalFoundries to build an advanced Physical AI building block that aggregates data interfaces and enables multiple network topologies.

BESS

March 27, 2026
The new energy range will be supplied throughout the EU from Kinell facilities in France and Germany and is designed to meet the evolving needs of rental companies, live events, construction sites and other users of temporary and off-grid energy.

Liquide_semiconductors

March 27, 2026
In December, Claus Aasholm, an analyst at Semiconductor Business Intelligence, raised an uncomfortable question in Evertiq: does the traditional semiconductor cycle still exist? His argument was straightforward — AI-driven growth is pulling the market into parallel trajectories that are increasingly difficult to reconcile within a single top-line number.

Herzogenrath-2

March 27, 2026
The German company plans to manufacture some of its 100/150/200 mm products in the new plant in the Penang region, mostly to address customers in Asia. The facility will include assembly and test, engineering support and local purchasing capabilities.

axonite_chip

March 27, 2026
The US-based company builds AI for the semiconductor industry and is developing a new class of computing hardware, using its software to design its own hardware IP.

RRP_MOU

March 26, 2026
The MoU brings together BEL’s experience in developing advanced electronics and mission-critical systems for defence applications, RRP Electronics’s semiconductor manufacturing expertise, and RRP Defense’s capabilities in EO systems & UAV platforms.

building_logo

March 26, 2026
Japanese company NCT’s expertise in materials and processing technologies for iron-based amorphous alloys will help it achieve early realization of motor generators’ product competitiveness using this next-generation material.

Liquide_plant_Taiwan

March 26, 2026
The French company’s new advanced materials manufacturing facility in Taichung City, Taiwan, will produce highly-engineered molecules designed for nano-scale processes, such as Atomic Layer Deposition (ALD).

axonite_chip

March 26, 2026
Headquartered South Carolina, United Electronics Company (UEC) manufactures a suite of RF, circuit card assembly, and power and connectivity solutions that generate, amplify, transmit and receive power and signals for a diverse set of systems.

March 25, 2026
The South Korean tech giant is ramping up investment 22% in 2026 to retake the lead in AI semiconductors from SK Hynix, which has become the main provider of high-bandwidth memory to Nvidia.

University_battery_project

March 25, 2026
Since its launch in 2024, the Energy Storage Engine in Upstate New York has received USD 15 million from the National Science Foundation (NSF). The initiative may receive up to USD 160 million over 10 years.

Akiem_locomotive

March 25, 2026
The locomotives can operate both under overhead line power and on non-electrified sections using traction batteries. Siemens Mobility will deliver the first locomotives from 2029/2030.

Expo-TMP-2025-003

March 24, 2026
Evertiq Expo Tampere returns on 26 March 2026, bringing together Finland’s electronics community for a day focused on semiconductor reliability, advanced manufacturing, automation strategies, and the evolving business landscape of the European EMS industry.

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