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India-2026

March 11, 2026
ABB plans to invest approximately USD 75 million in India during 2026 to expand its manufacturing capacity and research and development activities across several locations in the country.

EPIC-Semiconductor-Centre

March 10, 2026
Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.

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building_logo

March 10, 2026
By licensing TSMC GaN technology, Rohm will strengthen its supply capability to meet growing demand for GaN in applications such as AI servers and electric vehicles.

solar

March 09, 2026
The purpose of the joint venture is the development, construction and operation of a portfolio of BESS projects of up to 1,500 MW / 3,000 MWh in Romania, Bulgaria and Italy, of which 1,000 MW are expected to be implemented within the next 12 months.

DeltaCapacity

March 06, 2026
The agreement supports Delta Capacity’s strategy to build a diversified, pan-European portfolio of high-quality BESS assets designed for long-term ownership and operation.

battery_automation

March 06, 2026
The battery manufacturing automation platform is designed to optimize operations by improving cell yields and expediting facility startups for battery manufacturers at any scale.

PCB-India_1

March 06, 2026
C2i Semiconductors is redesigning how electricity flows inside a server from the incoming power source to the processor chip using a grid-to-core approach.

businessman-hand-touching-virtual-screen

March 05, 2026
Semtech Corporation, a provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions, has acquired HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data centre interconnects (DCI) and intra-data centre interconnects.

new-technologies_1

March 05, 2026
A significant portion of the investment will focus on new businesses based on these technologies, contributing to the development of South Korea’s future industrial competitiveness.

PCB-India_3

March 04, 2026
The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.

windmills-pexels

March 04, 2026
Hitachi will provide project development support for KS Energy’s development of the project and jointly promote the development and operation of this BESS.

Ovar-Portugal

March 03, 2026
Keenfinity EMS has obtained ISO 13485:2016 certification for its electronics manufacturing plant in Ovar, Portugal. The certification, announced on 2 March 2026, covers the design and manufacture of electronic systems for medical devices, including control units, power supply units and human–machine interfaces.

Suchi_Semicon

March 03, 2026
Rohm is considering the outsourcing of back-end processes for power devices and IC products to Suchi Semicon and has begun technical evaluations toward potential mass production shipments starting in 2026.

axonite_chip

March 02, 2026
By reducing radio power consumption and thermal management requirements while meeting spectral emissions targets with margin, Sierra enables a smaller and lighter radio design that simplifies installation and lowers total cost of ownership.

farm_GPGA_Siemens

March 02, 2026
Siemens’ platform-independent and AI-enabled Simatic WinCC Open Architecture SCADA will connect eight renewable energy generation and storage assets in New South Wales, Victoria, Western Australia, and the Australian Capital Territory.

GEK_engine

March 02, 2026
The GEK1500 is a 1,500-lb thrust jet engine that could potentially power unmanned aerial systems (UAS), collaborative combat aircraft (CCAs) and missiles.

PCB-Japan_2

March 02, 2026
Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.

Kevin-OBuckley-EVP-Global-Operations-Supply-Chain

February 27, 2026
Qualcomm Incorporated has appointed Kevin O’Buckley as executive vice president of Global Operations and Supply Chain, effective 2 March 2026.

advanced-semiconductor-manufacturing-facility

February 27, 2026
Hitachi Energy and Pakal Technologies have announced a collaboration to develop next-generation high-voltage silicon power semiconductor modules rated at ≥3.3 kV.

February 26, 2026
SK hynix and Sandisk have announced the start of a global standardisation initiative for next-generation memory solution, High Bandwidth Flash (HBF) aimed at the AI inference era.

DRAM5-products

February 26, 2026
A sharp upswing in DRAM contract prices drove global industry revenue to USD 53.58 billion in the fourth quarter of 2025, up 29.4% sequentially, according to the latest analysis from TrendForce.

Yongin-Semiconductor-cluster-expansion

February 25, 2026
SK hynix has announced an additional investment of KRW 21.6 trillion (USD 15 billion) to expand facilities for its first semiconductor fab and construct five cleanrooms for Phases 2 to 6 of the Yongin Semiconductor Cluster.

AMD-Logos-AI

February 25, 2026
AMD and Meta have entered a definitive multi-year agreement under which Meta will deploy up to 6 gigawatts of AMD Instinct GPUs to power its next generation AI infrastructure.

EUV-system

February 24, 2026
ASML has developed an upgraded extreme ultraviolet (EUV) light source for its lithography machines, which the company says could increase chip production by up to 50% by the end of the decade, Reuters reports.

product

February 24, 2026
SEALSQ Corp and its parent WISeKey International Holding, are planning to move their Geneva headquarters to the Pont-Rouge district in August 2026. The relocation coincides with the launch of the Geneva Quantum Centre of Excellence, intended to consolidate the group’s research and industrial deployment of quantum computing, post-quantum cybersecurity, and secure semiconductor technologies.

di_Piave-2025

February 24, 2026
RECOM Power and Bürklin Elektronik are expanding their long-standing distribution partnership, with a focus on product availability, technical expertise and streamlined delivery processes.

February 23, 2026
SoftBank's subsidiary SAIMEMORY has signed a collaboration agreement with Intel Corporation to advance the development and commercialisation of Z‑Angle Memory (ZAM), a next-generation memory technology designed for high capacity, high bandwidth and low power consumption.

February 23, 2026
Denmark-based power cable manufacturer NKT has renewed its long-term copper supply agreement with Polish mining and smelting group KGHM Polska Miedź, securing European-produced copper for the period 2028–2036 in a deal valued at an estimated EUR 6 billion.

chip

February 20, 2026
SemiFive has secured a design win from US‑based Niobium for a fully homomorphic encryption (FHE) hardware accelerator.

researchers-working

February 19, 2026
Austria-based AT&S is funding the establishment of a new microelectronics research group at Graz University of Technology (TU Graz), with a focus on IC substrates and advanced packaging technologies.

Blackwell

February 18, 2026
US chip designer Nvidia has entered a multiyear, multigenerational strategic partnership with Meta Platforms that will include the deployment of millions of Nvidia GPUs.

GaN-300-millimeter-Technology

February 18, 2026
German semiconductor manufacturer Infineon Technologies expects the gallium nitride (GaN) power semiconductor market to reach nearly USD 3 billion by 2030, according to the 2026 edition of its annual “GaN Insights” report.

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