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AT&S expands AI substrate capacity in Chongqing
Austrian PCB and IC substrate manufacturer AT&S is expanding capacity at its Chongqing facility in China to meet growing demand for high-end IC substrates from a key customer in the AI segment.
The investment, described as being in the high double-digit million range, will be fully financed through long-term customer agreements.
AT&S expects a positive EBIT effect also in the high double-digit million range from the expansion in financial year 2026/27, according to a company disclosure.
The company doesn't name any customers in the disclosure. The decision to expand was driven by what AT&S describes as growing demand for high-end IC substrates as AI applications require increasing levels of computing power.
