Siemens secures service contract for 61 battery-powered trains June 26, 2026 The aim is to achieve particularly reliable, efficient and sustainable operations on Germany’s Network North Westphalia, where the state-of-the-art battery-powered Mireo Plus B trains will enter service from December 2029.
Incap Slovakia adds cleanroom capability in Námestovo June 26, 2026 Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility in Slovakia to support customers with contamination-sensitive assembly requirements, particularly in semiconductor-related applications.
Quantum tech firm Aegiq opens new headquarters in Sheffield June 26, 2026 The UK startup’s goal is to deliver quantum computers at scale based on photonics, leveraging chip manufacturing supply chains, working with industry leaders to deliver real-world impact in advanced manufacturing, defence, clean energy and healthcare.
AMD partners with Rackspace to deploy 30 MW of AMD AI compute June 26, 2026 At full deployment, 30 MW of dedicated AMD compute across Rackspace’s footprint will represent meaningful capacity to serve regulated enterprise workloads, including healthcare providers who have expressed early interest in accelerated compute.
Joynext opens new production hall in Poland June 25, 2026 Chinese automotive electronics manufacturer Joynext opened a new 13,300 square-metre production hall at its site in Oborniki Śląskie near Wrocław in Poland in April, bringing the site's total production area to approximately 26,000 square metres.
NCAB acquires Board Shark PCB in the United States June 25, 2026 NCAB has acquired PCB solutions provider Board Shark LLC, based in Florida in the United States. The company generated USD 17 million in net sales during 2025, with profitability exceeding NCAB's own margins.
Hitachi Energy expands power semiconductor production at Swiss site June 25, 2026 The expansion is part of Hitachi Energy’s USD 9 billion USD global investment program to increase capacity and add 15,000 people to scale manufacturing, R&D, and digitalization, including boosting efficiency through AI-enabled processes.
C-DOT, IIT Hyderabad to advance next-gen communication tech June 25, 2026 As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.
EU clears €76 million German state aid for QuantumDiamonds June 24, 2026 The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.
Nearfield Instruments raises $380 million in largest ever Dutch deep-tech round June 24, 2026 Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.
QCi acquires NHanced in deal valued at up to $145 million June 24, 2026 By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.
NLCIL partners with IOCL to boost renewable energy in Tamil Nadu June 24, 2026 NLC India Ltd (NLCIL), which has a presence in mining and power generation, has been diversifying into large-scale renewable and green energy initiatives, including solar, wind, pumped hydro storage and BESS.
Ubotica raises $11M to scale real-time maritime intelligence June 24, 2026 The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.
TSMC partners with Amkor to accelerate advanced packaging in US June 24, 2026 The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
Infineon wins two more patent cases against Innoscience in Germany June 23, 2026 A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.
OPmobility, ProLogium sign MoU to develop solid‑state battery packs June 23, 2026 France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.
Nokia announces $30M semiconductor investment in Pennsylvania June 22, 2026 The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.
Evertiq Expo Berlin 2026 wraps up the first half of the year June 22, 2026 Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.
Fideltronik secures USD 30 million contract in the renewable energy sector June 22, 2026 Polish electronics manufacturer Fideltronik has signed an agreement with one of the leading companies operating in the renewable energy industry. The contract, valued at USD 30 million, covers comprehensive printed circuit board (PCB) assembly services.
Renesas acquires Pictorus to accelerate embedded system development June 19, 2026 With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.
Tech Mahindra partners with Viam to scale advanced robotics June 19, 2026 As a core partner in physical AI, Viam will work with Tech Mahindra to provide their global enterprise clients with direct access to the Viam platform for managing and maintaining robotic fleets at scale.
Brewer to acquire Heraeus Epurio’s semiconductor chemical business June 19, 2026 The acquisition expands Brewer Science’s advanced materials portfolio and strengthens its ability to support semiconductor customers with highly specialized, ultrapure chemical solutions critical to advanced lithography and microdevice fabrication.
Edge, Safran sign deal to deepen aerospace, defense cooperation June 19, 2026 The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.
Rohm partners with Aixtron to scale GaN power device production June 18, 2026 The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.
Siemens, HighByte partner on industrial data operations June 18, 2026 Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.
Garuda partners with Extensee SAS to deploy Flexrotor UAVs June 17, 2026 Under the MoU, the two companies will deploy Airbus Flexrotor UAVs across international markets, leveraging Extensee’s end-to-end operational capabilities with Garuda Aerospace’s drone technology expertise.
QBit Semiconductor acquires 60% stake in Singapore’s SinChip June 17, 2026 This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.
GE Aerospace, Wolfspeed to accelerate high-voltage SiC adoption June 17, 2026 The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.
Rapidus, Fondazione Chips-IT sign MoU to boost chip manufacturing June 17, 2026 The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.
Europe lags behind globally – but who leads its EMS industry? June 16, 2026 Europe has long been regarded as a manufacturing powerhouse. Yet in electronics manufacturing services (EMS), the continent faces an increasingly difficult challenge: keeping pace with competitors in Asia.
Börje Ekholm steps down as CEO of Ericsson – Per Narvinger takes over June 16, 2026 Ericsson has announced that Börje Ekholm is stepping down as President and CEO, with Per Narvinger appointed as his successor. Narvinger, currently Executive Vice President and Head of Business Area Networks, takes over on October 1, 2026.
Semiconductor market hits record quarter, driven by memory surge June 16, 2026 Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.