Evertiq - First In Electronics News & Expo

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Expo-WAW24-26

October 17, 2025
Evertiq Expo Warsaw returns on 23 October 2025, bringing together Poland’s vibrant electronics community for a day dedicated to advanced technologies, manufacturing, and innovation.

25-years-012

October 02, 2025
The city of ideas, where it all started, will once again host Evertiq’s southernmost Expo. The first Evertiq Expo, then called TEC, was held in Lund in 2011 – and now, fifteen years later, the event returns to its birthplace.

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Robert-Feurle-CEO-2025

September 30, 2025
SiC specialist Wolfspeed has successfully completed its financial restructuring process and emerged from Chapter 11 protection. The plan going forward is to leverage its installed 200mm capacity to drive sustainable growth.

peter-wawer-infineon-kazuhide-ino-rhom

September 25, 2025
Rohm and Infineon Technologies have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centres.

g10-sic

September 23, 2025
Aixtron SE has shipped its 100th G10-SiC epitaxy system, highlighting growing global demand for its SiC deposition technology over the past three years.

axonite_chip

September 17, 2025
The total phased investment for the fully integrated SiC power semiconductor project in Dholera, Gujarat, is estimated to be over USD 1 billion. Work on the project is expected to start by April 2026.

SiC

September 09, 2025
SiC and GaN semiconductors are becoming increasingly critical for the development of modern power electronics systems. As Marcin Mierzejewski (KERAFOL Keramische Folien GmbH & Co. KG) points out in an interview with Evertiq, leveraging these technologies gives engineers new opportunities – enabling component miniaturization, meeting growing demands for higher computing power, and addressing the challenges associated with rising power densities.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

SiC-wafer

August 07, 2025
onsemi plans to invest USD 8 million with Stony Brook University to establish a wide band gap research centre that will advance innovation in power semiconductors and foster the next generation of professionals in this field.

brook_campus

July 28, 2025
As a result of the partnership, onsemi will invest USD 8 million to support the center’s operations, while Stony Brook University will invest USD 10 million in renovations and equipment. Empire State Development will support the new facility through a capital grant of up to USD 2 million.

building_logo

July 10, 2025
ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.

office_logo

July 07, 2025
These advances are expected to greatly improve the reliability and efficiency of devices used in power conversion applications, such as electric vehicles and renewable energy systems.

gate_driver_IC

June 27, 2025
When combined with GaN devices, this driver, BM6GD11BFJ-LB, enables stable operation under high-frequency, high-speed switching conditions, contributing to greater miniaturization and efficiency in high-current applications.

Infineon_MOU

June 20, 2025
Tata Elxsi brings its design, system integration and validation capabilities, while Infineon will provide early access to its latest semiconductor technologies—such as SiC-based components, microcontrollers and ICs.

Noritake_paste

June 19, 2025
The silver paste co-developed by LG Chem and Noritake is a high-performance paste containing nano-sized silver (Ag) particles, combining LG Chem’s particle engineering technology with Noritake’s particle dispersion expertise.

Power_Electronics

June 11, 2025
Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.

Building_Logo

June 06, 2025
Engineered for demanding high-power applications across K-Band to V-Band frequencies, NP12-1B delivers industry leading high power front end solutions with exceptional linearity, ruggedness, and reliability for next-generation RF and microwave systems.

GAN

June 04, 2025
Navitas’ high-power GaNSafe power ICs integrate control, drive, sensing and critical protection features, enabling reliability and robustness.

Headquarters-Durham

May 21, 2025
Wolfspeed is said to be preparing a Chapter 11 bankruptcy filing within weeks, according to reports from The Wall Street Journal and Reuters. The move comes after failed restructuring talks and growing financial pressure from falling demand and aggressive Chinese competition.

HybridPACKDrive-g2

May 21, 2025
Germany's Infineon Technologies will supply Rivian’s R2 platform with power modules for traction inverters. The R2 platform will use SiC and Si modules from Infineon’s HybridPACK Drive G2 family.

66935

May 09, 2025
The AOTL66935 hot swap MOSFET prevents damage to the system by limiting the high inrush current with low power losses due to the very low on-resistance.

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From chip to casing from one single source – innovative and reliable solutions for every area of application.

April 11, 2025
Farnell has entered into a global distribution agreement with Micro Commercial Components (MCC), expanding its range of discrete semiconductor solutions available to customers in sectors such as automotive, industrial, consumer electronics, and computing.

Robert-Feurle-CEO-2025

April 02, 2025
Wolfspeed, US silicon carbide (SiC) specialist, has appointed Robert Feurle as Chief Executive Officer (CEO), effective May 1, 2025. The appointment follows a comprehensive internal and external search, the company revealed.

semiconductor_materials

March 31, 2025
EVs are emerging as a critical application area in the compound semiconductor industry, as many EV makers are resorting to MOSFETs or SiC Schottky barrier diodes (SBD) in DC-DC converters.

Rohm_agreement

March 28, 2025
The two Japanese firms have started developing automotive components using gallium nitride (GaN) power semiconductors, which reduce power conversion losses and contribute to the miniaturization of components.

chip-image

March 17, 2025
The agreement strengthens RFMW’s ability to offer customers advanced wide bandgap solutions, enabling superior performance, reliability and efficiency in high-temperature and high-power applications.

March 07, 2025
Under the agreement, German firm Infineon will supply bare semiconductor wafers to CDIL, which the Indian company will process and use for assembly and packaging to make power chipsets.

PCB-world_1

March 03, 2025
Silicon carbide (SiC) power semiconductors have gained significant traction in high-power applications due to their superior thermal conductivity, higher breakdown voltage and energy efficiency.

Asia-Pacific

February 26, 2025
Semiconductor equipment provider, Spirox Corporation, plans to build the first power semiconductor dynamic reliability verification laboratory in the Asia-Pacific region.

PCB-world_3

February 24, 2025
In 2024, North America held over 38% of the aerospace semiconductor market, with revenues around USD 2.6 billion. The US market is expected to grow at a CAGR of 6.2%.

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