Evertiq - First In Electronics News & Expo

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investment_Roseville

July 14, 2026
Bosch is investing up to $2 billion to transform the Roseville, California site into a facility that produces and tests SiC semiconductors with state-of-the-art processes and equipment.

Headquarters-Durham

July 10, 2026
Products accused of infringement encompass major product lines of Navitas, including its GaN-based FETs — such as the GaNFast, GaNSlim, and GaNSafe product families — as well as Navitas's GeneSiC MOSFETs and SiCPAK modules. Navitas has refuted the allegations.

Azuremoto_MOU

July 10, 2026
The MoU establishes a structured framework for cross-border business cooperation across SiC power semiconductor products for the AI data centre market, and rectifiers and MOS-based power semiconductor products targeting LTSCT’s key business verticals.

Headquarters-Durham

June 17, 2026
The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

SiC-Wafer

June 11, 2026
Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

June 09, 2026
US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.

Headquarters-Durham

June 02, 2026
Silicon carbide specialist Wolfspeed has established a dedicated data centre solutions team and regional office in the San Francisco Bay Area, targeting the growing market for high-voltage power solutions in AI infrastructure. The company has hired two industry veterans to lead the effort.

PCB-EU_1

May 25, 2026
Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.

solar_mrganso

May 25, 2026
Under the agreement, Chinese company Sungrow will supply 7.5GWh of PowerTitan 3.0 ESS, alongside 2.6GW of PV inverter solutions to supporting the gigascale renewable energy project’s operational reliability and efficiency.

Newen

April 23, 2026
The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

sign-on-building

March 24, 2026
Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.

25-years-012

March 19, 2026
On May 21, 2026, Evertiq Expo makes its long-awaited return to Lund, reconnecting with the city where it all began. Now in its 15th year, Evertiq Expo will be held at Sparbanken Skåne Arena, bringing together companies, researchers, and professionals from Sweden’s electronics and technology sectors.

Headquarters-Durham

February 04, 2026
Wolfspeed has received clearance from the Committee on Foreign Investment in the United States (CFIUS) for its equity issuance to Renesas Electronics, completing a key element of the company’s court-approved restructuring process.

November 25, 2025
The European Commission has approved a EUR 450 million Czech state aid package to support US chipmaker Onsemi in building an integrated semiconductor manufacturing facility in Rožnov pod Radhoštěm.

November 04, 2025
onsemi has completed the acquisition of rights to Vcore power technologies, including associated IP licenses, from Aura Semiconductor.

PCB-India_2

November 03, 2025
Chennai-based SicSem is partnering with British firm Clas-SiC Wafer Fab Ltd to set up the silicon carbide (SiC) facility in Odisha. The plant is expected to create 5,000 direct and indirect jobs in the region.

chip_wafer_v2killer7603

October 27, 2025
India’s L&T Semiconductor Technologies Ltd (LTSCT) will utilize HYS’s facilities in Taiwan to engineer and produce wafers to meet specifications tailored for automotive and industrial applications.

Expo-WAW25-stage

October 24, 2025
During Evertiq Expo Warsaw on 23 October, the conference halls at PGE Narodowy Stadium were filled with conversations in English, German, Chinese, Italian, Korean, Czech—and, of course, Polish. This confirms Poland’s growing role in the European electronics industry and highlights the significance of Evertiq Expo Warsaw.

Top-5

October 23, 2025
The European technology sector is currently undergoing a profound transformation. Changes in global supply chains, public investments, and the growing role of industrial innovation are making advanced technologies one of the cornerstones of regional economic development strategies.

Expo-WAW24-26

October 17, 2025
Evertiq Expo Warsaw returns on 23 October 2025, bringing together Poland’s vibrant electronics community for a day dedicated to advanced technologies, manufacturing, and innovation.

25-years-012

October 02, 2025
The city of ideas, where it all started, will once again host Evertiq’s southernmost Expo. The first Evertiq Expo, then called TEC, was held in Lund in 2011 – and now, fifteen years later, the event returns to its birthplace.

Robert-Feurle-CEO-2025

September 30, 2025
SiC specialist Wolfspeed has successfully completed its financial restructuring process and emerged from Chapter 11 protection. The plan going forward is to leverage its installed 200mm capacity to drive sustainable growth.

peter-wawer-infineon-kazuhide-ino-rhom

September 25, 2025
Rohm and Infineon Technologies have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centres.

g10-sic

September 23, 2025
Aixtron SE has shipped its 100th G10-SiC epitaxy system, highlighting growing global demand for its SiC deposition technology over the past three years.

axonite_chip

September 17, 2025
The total phased investment for the fully integrated SiC power semiconductor project in Dholera, Gujarat, is estimated to be over USD 1 billion. Work on the project is expected to start by April 2026.

SiC

September 09, 2025
SiC and GaN semiconductors are becoming increasingly critical for the development of modern power electronics systems. As Marcin Mierzejewski (KERAFOL Keramische Folien GmbH & Co. KG) points out in an interview with Evertiq, leveraging these technologies gives engineers new opportunities – enabling component miniaturization, meeting growing demands for higher computing power, and addressing the challenges associated with rising power densities.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

SiC-wafer

August 07, 2025
onsemi plans to invest USD 8 million with Stony Brook University to establish a wide band gap research centre that will advance innovation in power semiconductors and foster the next generation of professionals in this field.

brook_campus

July 28, 2025
As a result of the partnership, onsemi will invest USD 8 million to support the center’s operations, while Stony Brook University will invest USD 10 million in renovations and equipment. Empire State Development will support the new facility through a capital grant of up to USD 2 million.

building_logo

July 10, 2025
ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.

office_logo

July 07, 2025
These advances are expected to greatly improve the reliability and efficiency of devices used in power conversion applications, such as electric vehicles and renewable energy systems.

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