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Ukraine-Kvertus

April 14, 2026
For years, defence electronics followed a relatively stable logic. Systems were designed against defined threat models, tested in controlled environments, certified, and then deployed with the expectation that they would remain valid over time.

3D-Nand

April 14, 2026
Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

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M12

April 14, 2026
M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.

quantum-computer_geralt

April 13, 2026
The funding will accelerate production of the US company’s Quantum Light Engines, photonic control systems for quantum computing, sensing and networking, while supporting scale-up, supply chain expansion and global partnerships.

Russia_Tunguska_Missile

April 13, 2026
The USD 47 million contract for the procurement of Tunguska Air Defence Missile Systems for the Indian Army was signed with JSC Rosoboronexport, Russia’s state intermediary agency for the export/import of defense and dual-use products, technologies and services.

April 13, 2026
The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

video-still

April 10, 2026
How often do we really think about the scale of the technologies we use? How small are the elements that make up a single device — and how far does that scale extend beyond what we can see?

quantum_computer_Poland

April 10, 2026
The system, which will be installed at Galaxy Systemy Informatyczne’s headquarters in Zielona Góra later this year, will enable Galaxy to execute quantum algorithms across various application areas.

PCB-India_1

April 10, 2026
Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.

ESA_partnership

April 10, 2026
Siemens will provide industrial-grade, comprehensive digital twin capabilities and a fully digital engineering and simulation backbone for the European space industry along with access to mentors and experts in the field.

EUV-system

April 09, 2026
Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.

Ukraine-Kvertus-2

April 09, 2026
Cities and critical infrastructure are no longer exposed only to direct, conventional threats. Increasingly, they are tested through disruptions to energy systems, communications, logistics, and command layers – often without a clearly defined frontline.

Fabrica

April 08, 2026
Nano Dimension Ltd. has agreed to sell its additively manufactured electronics (AME) product line and its previously discontinued Fabrica product line to Inspira Technologies as part of an ongoing strategic review.

corporate-building

April 08, 2026
ZEISS has opened a new Quality Excellence Center in Huntersville, North Carolina, expanding its metrology and quality assurance footprint in the US.

April 08, 2026
OKI has introduced a new electronics manufacturing services (EMS) offering targeting AI server equipment.

Lip-Bu-Tan-elon-musk

April 07, 2026
Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.

PCB-Spain_2

April 07, 2026
The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.

groundbreaking_Cable-Manufacturing-Expansion-North-Carolina

April 07, 2026
Corning Incorporated and Meta Platforms, Inc. have started construction on an expansion of optical cable manufacturing capacity in Hickory, North Carolina, aimed at supporting the growing buildout of AI-driven data centres in the United States.

fab-equipment-spending-2026

April 07, 2026
Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.

geralt_AI

April 07, 2026
The investment from TA will support iBase-t’s product innovation and expansion as aerospace and defense manufacturers scale production, modernize sustainment operations, and accelerate adoption of AI-enabled digital manufacturing technologies.

HBM4

April 06, 2026
HBM4 36GB 12H in high-volume production is designed for Nvidia Vera Rubin — with greater than 2.8 TB/s and 20% better power efficiency.

funds_PabitraKaity

April 03, 2026
Headquartered in San Diego, GALT Aerospace is a provider of C3 solutions with core capabilities across airborne networking, multi-domain communications, radio/waveform integration, rapid prototyping, and systems engineering.

Cellcentric-toyota-deal

April 02, 2026
The Volvo Group, Daimler Truck and Toyota Motor Corporation are planning to jointly operate the fuel cell joint venture cellcentric. The move was outlined in a press release from AB Volvo dated March 31.

AI_Data_Center

April 02, 2026
Singapore has charged an additional individual in an ongoing fraud investigation linked to the handling of AI server equipment, according to Reuters.

April 02, 2026
US semiconductor manufacturer Intel has reached a definitive agreement with Apollo Global Management to repurchase the 49% equity interest it does not own in the joint venture tied to its Fab 34 semiconductor facility in Ireland. The transaction is valued at USD 14.2 billion.

Aerospace_team

April 02, 2026
The Bengaluru-based company said the funds would be used to ⁠expand manufacturing capacity to meet rising demand from satellite constellations in India and abroad.

sign

April 01, 2026
TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.

PCB-India_2

April 01, 2026
India’s electronics manufacturing sector produced goods worth USD 125 billion in the year to March 2025. The government hopes to increase this to USD 500 billion by fiscal 2031.

Shipyard_HBL_MOU

March 31, 2026
The collaboration will focus on the development of advanced marine batteries, battery management systems, electric motors, power electronics and charging infrastructure. The JV aims to cater to both Indian and international markets.

University_QpiAI

March 30, 2026
The centre is expected to serve startups, multinational technology companies, academic researchers, and members of the defence and aerospace sectors located in and around Bengaluru.

Inova_PhysicalAI

March 30, 2026
The advanced robotic arm reference platform combines the expertise of Inova, MIPS and GlobalFoundries to build an advanced Physical AI building block that aggregates data interfaces and enables multiple network topologies.

AMD_MOU

March 30, 2026
The companies will collaborate on HBM4 supply for AMD Instinct MI455X GPUs and next-generation DDR5 solutions for AMD EPYC processors and the AMD Helios platform.

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