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Lip-Bu-Tan-elon-musk

April 07, 2026
Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.

PCB-Spain_2

April 07, 2026
The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.

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groundbreaking_Cable-Manufacturing-Expansion-North-Carolina

April 07, 2026
Corning Incorporated and Meta Platforms, Inc. have started construction on an expansion of optical cable manufacturing capacity in Hickory, North Carolina, aimed at supporting the growing buildout of AI-driven data centres in the United States.

fab-equipment-spending-2026

April 07, 2026
Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.

geralt_AI

April 07, 2026
The investment from TA will support iBase-t’s product innovation and expansion as aerospace and defense manufacturers scale production, modernize sustainment operations, and accelerate adoption of AI-enabled digital manufacturing technologies.

HBM4

April 06, 2026
HBM4 36GB 12H in high-volume production is designed for Nvidia Vera Rubin — with greater than 2.8 TB/s and 20% better power efficiency.

funds_PabitraKaity

April 03, 2026
Headquartered in San Diego, GALT Aerospace is a provider of C3 solutions with core capabilities across airborne networking, multi-domain communications, radio/waveform integration, rapid prototyping, and systems engineering.

Cellcentric-toyota-deal

April 02, 2026
The Volvo Group, Daimler Truck and Toyota Motor Corporation are planning to jointly operate the fuel cell joint venture cellcentric. The move was outlined in a press release from AB Volvo dated March 31.

AI_Data_Center

April 02, 2026
Singapore has charged an additional individual in an ongoing fraud investigation linked to the handling of AI server equipment, according to Reuters.

April 02, 2026
US semiconductor manufacturer Intel has reached a definitive agreement with Apollo Global Management to repurchase the 49% equity interest it does not own in the joint venture tied to its Fab 34 semiconductor facility in Ireland. The transaction is valued at USD 14.2 billion.

Aerospace_team

April 02, 2026
The Bengaluru-based company said the funds would be used to ⁠expand manufacturing capacity to meet rising demand from satellite constellations in India and abroad.

sign

April 01, 2026
TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.

PCB-India_2

April 01, 2026
India’s electronics manufacturing sector produced goods worth USD 125 billion in the year to March 2025. The government hopes to increase this to USD 500 billion by fiscal 2031.

Shipyard_HBL_MOU

March 31, 2026
The collaboration will focus on the development of advanced marine batteries, battery management systems, electric motors, power electronics and charging infrastructure. The JV aims to cater to both Indian and international markets.

University_QpiAI

March 30, 2026
The centre is expected to serve startups, multinational technology companies, academic researchers, and members of the defence and aerospace sectors located in and around Bengaluru.

Inova_PhysicalAI

March 30, 2026
The advanced robotic arm reference platform combines the expertise of Inova, MIPS and GlobalFoundries to build an advanced Physical AI building block that aggregates data interfaces and enables multiple network topologies.

AMD_MOU

March 30, 2026
The companies will collaborate on HBM4 supply for AMD Instinct MI455X GPUs and next-generation DDR5 solutions for AMD EPYC processors and the AMD Helios platform.

Micron-factory

March 27, 2026
Taiwan’s semiconductor industry is often discussed in terms of scale, complexity, and technological leadership. Less often, we get a closer look at how these facilities actually operate from the inside.

Saab

March 27, 2026
The MOU establishes a framework for collaboration on AI technologies in support of GlobalEye. The agreement is directly connected to the GlobalEye opportunity in Canada but would also serve existing and future international GlobalEye operators.

axonite_chip

March 27, 2026
The US-based company builds AI for the semiconductor industry and is developing a new class of computing hardware, using its software to design its own hardware IP.

RRP_MOU

March 26, 2026
The MoU brings together BEL’s experience in developing advanced electronics and mission-critical systems for defence applications, RRP Electronics’s semiconductor manufacturing expertise, and RRP Defense’s capabilities in EO systems & UAV platforms.

March 26, 2026
By combining Cisco’s quantum networking hardware, software and expertise in networking protocols with Atom Computing’s neutral-atom quantum hardware, the collaboration aims to accelerate the development of scalable, distributed quantum systems.

building_logo

March 26, 2026
Japanese company NCT’s expertise in materials and processing technologies for iron-based amorphous alloys will help it achieve early realization of motor generators’ product competitiveness using this next-generation material.

graphite

March 26, 2026
Under the strategic pilot and LOI, Vianode will prepare a phased supply of synthetic anode graphite to support Ateios Systems’ electrode production to pair with their PFA-free cathodes of LCO, NMC and LFP.

Arianespace_agreement

March 25, 2026
Slated for launch aboard Ariane 6 in the second half of 2027, the NEXUS-1 will provide in-orbit servicing capabilities, including rendezvous and docking with satellites to deliver hardware upgrades, refueling, and life-extension services.

America_facility

March 25, 2026
This expands Fanuc America’s engineering capacity and advanced manufacturing capabilities to support the growing demand for automation solutions across North America, including physical AI, virtual commissioning and digital-twin technologies.

building_logo

March 25, 2026
The agreement with NSIG subsidiaries Simgui and Simwings extends the existing licensing framework underpinning their longstanding partnership, with no new technology transfer and a joint commitment to strengthen Soitec’s SOI intellectual property rights in China.

Domar-2026

March 24, 2026
Czechoslovak Group (CSG) has reached an agreement to acquire DOMAR MS, one of Poland’s key manufacturers of cabling, wire harnesses and electrical components used in, among others, military systems. The transaction is expected to be finalised in the coming weeks, subject to the required regulatory approvals.

Expo-TMP-2025-003

March 24, 2026
Evertiq Expo Tampere returns on 26 March 2026, bringing together Finland’s electronics community for a day focused on semiconductor reliability, advanced manufacturing, automation strategies, and the evolving business landscape of the European EMS industry.

sign-on-building

March 24, 2026
Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.

Alif_partnership

March 23, 2026
Brilliant Labs’ Halo Glasses will be powered by Alif Semiconductor’s Balletto B1 MCU, an ultra-low-power microcontroller with a dedicated Neural Processing Unit (NPU) that enables on-device AI processing.

chip

March 23, 2026
O-Net Technologies will serve as the ODM partner, integrating Sivers’ laser arrays and Enablence’s NxN Star Coupler to deliver a scalable external light source (ELS) module for scale-out and scale-up optical systems.

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