Czechoslovak Group to acquire DOMAR MS March 24, 2026 Czechoslovak Group (CSG) has reached an agreement to acquire DOMAR MS, one of Poland’s key manufacturers of cabling, wire harnesses and electrical components used in, among others, military systems. The transaction is expected to be finalised in the coming weeks, subject to the required regulatory approvals.
Reliability, automation and EMS strategy take centre stage in Tampere March 24, 2026 Evertiq Expo Tampere returns on 26 March 2026, bringing together Finland’s electronics community for a day focused on semiconductor reliability, advanced manufacturing, automation strategies, and the evolving business landscape of the European EMS industry.
Infineon partners with Indian power electronics firm Zenergize March 24, 2026 Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.
Brilliant Labs, Alif partner on AI-powered smart glasses March 23, 2026 Brilliant Labs’ Halo Glasses will be powered by Alif Semiconductor’s Balletto B1 MCU, an ultra-low-power microcontroller with a dedicated Neural Processing Unit (NPU) that enables on-device AI processing.
Sivers, O-Net, Enablence advance ELS module for data centers March 23, 2026 O-Net Technologies will serve as the ODM partner, integrating Sivers’ laser arrays and Enablence’s NxN Star Coupler to deliver a scalable external light source (ELS) module for scale-out and scale-up optical systems.
Siemens launches Fuse EDA AI Agent for automated workflows March 23, 2026 Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse EDA AI Agent manages workflows across Siemens’ comprehensive EDA portfolio.
IonQ teams up with KISTI to advance quantum HPC tech March 23, 2026 The MOU focuses on seeking to establish a phased approach to integrate IonQ’s quantum hardware with Korea Institute of Science and Technology Information’s (KISTI) high performance computing (HPC) infrastructure using NVIDIA NVQLink.
Ondas completes acquisition of Rotron Aerospace March 23, 2026 Rotron’s portfolio includes vertical take-off and landing (VTOL) platforms, long-range unmanned aircraft, advanced aero-engines, and integrated propulsion systems.
Lyten plans industrial hub in Poland following Northvolt site acquisition March 20, 2026 US-based energy technology company Lyten has announced plans to establish an industrial hub in Gdańsk, centred around a facility acquired from Northvolt in late 2025.
Infineon collaborates with Subaru to enhance next-gen ADAS March 20, 2026 Infineon plays a key role in Subaru’s integrated electronic control unit (ECU) for next‑generation advanced driver assistance systems (ADAS) and vehicle motion control.
US defence firm AV acquires Empirical Systems Aerospace March 20, 2026 California-based Empirical Systems Aerospace (ESAero) is known for its engineering expertise, electric and hybrid propulsion capabilities, aerospace prototyping and AS9100 Certified UAS manufacturing.
SEMI Europe partners with Polish Taiwanese Chamber of Commerce March 20, 2026 The MoU provides a collaborative framework aimed at fostering economic ties, enabling business growth, supporting joint initiatives, and reinforcing existing connections that contribute to the competitiveness and sustainability of the semiconductor ecosystem.
Rhoda raises $450 million to advance robotic intelligence March 20, 2026 Rather than relying primarily on teleoperated robot trajectories, US robotics startup Rhoda AI pre-trains its models on internet-scale video — hundreds of millions of videos — to build a strong prior on motion, physics, and physical interaction.
Boyd completes the sale of its thermal business to Eaton March 19, 2026 Boyd Corporation has completed the sale of its Thermal business to Eaton, an intelligent power management company, for USD 9.5 billion.
GlobalFoundries breaks ground on €1.1bn Dresden expansion March 18, 2026 GlobalFoundries has started construction of its planned semiconductor fab expansion in Dresden, Germany, marking the next phase of its EUR 1.1 billion investment under Project SPRINT, according to a company update on LinkedIn.
Elemaster acquires CR&C, expands RF and lifecycle capabilities March 18, 2026 Italian electronics manufacturer Elemaster Group has acquired 100% of C.R.&C. S.r.l. and a 25% stake in GreenWaves Srl from Gruppo Ollen, the company states in a press release.
Synopsys launches eDT Platform to advance Physical AI March 18, 2026 Initially focused on high-value automotive use cases, the Synopsys Electronics Digital Twin (eDT) Platform enables OEMs to achieve up to 90% of software validation prior to hardware availability.
Micron completes acquisition of PSMC’s Tongluo P5 site March 17, 2026 US memory manufacturer Micron Technology has completed the acquisition of the P5 semiconductor facility in Tongluo, Miaoli County, Taiwan, from Powerchip Semiconductor Manufacturing Corporation (PSMC).
Axonex partners with Synergy to boost digital twins, drone tech March 17, 2026 The joint venture will combine Axonex’s operational resources and international business capabilities with Synergy Technology Group’s digital twins and drone flight control systems technology.
MHI to introduce 10MW class centrifugal chiller for data centers March 16, 2026 The 10MW-class chiller is optimally designed with the objective of aligning with emerging reference architectures for large-scale AI computing facilities, which demand higher cooling capacity, increased redundancy, and standardized deployment models.
GE Aerospace to invest another $1B in US manufacturing March 16, 2026 The 2026 investment — the company’s second consecutive USD 1 billion US investment — is expected to benefit sites across more than 30 communities in 17 states. GE Aerospace also plans to hire 5,000 US workers.
Garuda selects Airbus Flexrotor to expand its UAS portfolio March 16, 2026 Garuda will offer Flexrotor services to its customers through both dry and wet lease options for a broad spectrum of civil and parapublic missions including infrastructure inspection, law enforcement, search, wildfire monitoring and disaster relief.
Xanadu, AMD advance next-gen quantum applications March 16, 2026 By combining Xanadu’s PennyLane quantum software with AMD computing solutions on the AMD DevCloud, Xanadu demonstrated how advanced aerospace simulations can be prepared and run in a hybrid quantum-classical environment.
Cambridge to house UK’s ‘most powerful quantum computer’ March 13, 2026 The partnership between the University of Cambridge and quantum technology company IonQ will support the creation of the IonQ Quantum Innovation Centre, which will house a state-of-the-art IonQ 256-qubit quantum computer.
Nordic EMS companies punch above their weight globally March 13, 2026 The Nordic region may have a relatively small population, but it maintains a surprisingly strong presence in the global electronics manufacturing services industry.
Mirai raises $4.2M to build autonomous maritime systems March 13, 2026 Italian company Mirai Robotics’ systems are designed to enable persistent surveillance, patrolling, monitoring, and control, reducing human exposure to risk and lowering operational costs compared to traditional models.
BEL partners with Bellatrix to develop satellite systems March 13, 2026 This partnership is expected to accelerate innovation and strengthen India’s capabilities in building next-generation satellite systems for Very Low Earth Orbit (VLEO).
Mercedes-Benz, IIT Delhi collaborate on future of mobility March 12, 2026 The partnership will focus on research areas that support the future of mobility and engineering systems. These include quantum technologies, future materials, neuromorphic engineering and electric mobility.
Neways completes its acquisition of Philips Micro Devices March 11, 2026 EMS provider Neways has closed the previously announced acquisition of Philips Micro Devices. The transaction has now been completed following satisfaction of all closing conditions.
Applied Materials and SK hynix to collaborate on AI memory March 11, 2026 Applied Materials and SK hynix have signed a long-term research and development agreement aimed at accelerating the development of next-generation memory technologies for artificial intelligence systems.
ABB to invest $75 million in India to expand manufacturing and R&D March 11, 2026 ABB plans to invest approximately USD 75 million in India during 2026 to expand its manufacturing capacity and research and development activities across several locations in the country.
Applied Materials and Micron to advance AI memory development March 10, 2026 Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.