Panelling and depanelling of printed circuit boards (PCBs)

Properly conducted panelling of electronic packages, although often underestimated, allows to optimize all production processes – from assembly, through tests, to subsequent depanelling. In addition, it helps to maximize the efficiency of the use of laminate surfaces, and thus – to manage production costs more wisely. How is the connection of PCBs in the array and their separation made? How to properly perform these processes to avoid damage to circuits? We talk about all this on the example of Comarch IoT Plant work.