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AI chip firm Rebellions raises $400 million ahead of IPO April 06, 2026 With USD 650 million raised in the past six months, the South Korean AI chip startup is entering a new phase of growth focused on US market expansion, scaled production of its Rebel100 platform, and preparation for a future IPO.
India approves electronic manufacturing projects worth $750M April 01, 2026 India’s electronics manufacturing sector produced goods worth USD 125 billion in the year to March 2025. The government hopes to increase this to USD 500 billion by fiscal 2031.
Chimney Rock acquires United Electronics Company March 26, 2026 Headquartered South Carolina, United Electronics Company (UEC) manufactures a suite of RF, circuit card assembly, and power and connectivity solutions that generate, amplify, transmit and receive power and signals for a diverse set of systems.
Delta Electronics strengthens presence in Southeast Asia March 20, 2026 The key leadership appointments across Southeast Asia and Oceania include Jason Yuan, President, SEA & ANZ; David Leal, Vice-President of Solution Business (Infrastructure), SEA & ANZ; and Lili Mow, Vice-President of Solution Business (Automation), SEA & ANZ.
Henkel launches electronics innovation hub in Bengaluru March 19, 2026 The new facility is built to replicate actual electronics manufacturing conditions, allowing customers to evaluate and optimize materials and processes before committing to production scale.
Exicom inaugurates $23M facility to advance EV charging March 18, 2026 The Indian company’s new manufacturing plant in Hyderabad will support the growing demand for EV charging infrastructure, lithium-ion battery systems and critical power solutions across Indian and export markets.
Indian startup Agnit Semiconductors raises $2.6 million March 17, 2026 The Bengaluru-based company plans to use the fresh capital to scale production of GaN components to 100,000 units over the next 24 months. Agnit will also expand into telecom infrastructure and power semiconductor devices.
NEC, Nokia to expand Eletronet’s optical fiber network in Brazil March 04, 2026 The project adds 8,000 km of new fiber routes. This expansion is expected to reach a total of 26,000 km across 23 Brazilian states by the end of 2026. Eletronet is investing USD 30.4 million in this initiative.
Microboard invests $1.3 million in Mycronic inventory towers February 26, 2026 Microboard has made a USD 1.3 million capital investment in MYTower 7+ and MYTower 6X inventory towers from Mycronic, upgrading its component storage capacity at its facility in Seymour, Connecticut.
Ericsson announces major layoff plan in Sweden – 1,600 jobs at risk January 15, 2026 Swedish telecom group Ericsson has notified the Swedish Public Employment Service of a proposed headcount reduction that could affect approximately 1,600 positions in Sweden. The measure is described as part of the company’s efforts to strengthen its competitive position.
Photonic raises $130M to advance quantum computing January 12, 2026 The Canadian company is accelerating the path to fault‑tolerant quantum systems with their Entanglement First Architecture that combines silicon‑based qubits and native photonic connectivity, enabling seamless scaling across existing global telecom infrastructure.
India approves electronic component projects worth $4.6 billion January 05, 2026 These approvals are expected to generate 33,791 direct employment opportunities and include manufacturing of 11 target segment products with cross-sectoral applications such as mobile manufacturing, telecom, consumer electronics, strategic electronics, automotive and IT hardware products.
Sivers Semiconductors partners with DigiKey December 09, 2025 Swedish Sivers Semiconductors has entered into a strategic partnership with distributor DigiKey aimed at broadening global access to Sivers’ millimetre-wave wireless products and evaluation kits.
onsemi, Innoscience to accelerate rollout of GaN power devices December 05, 2025 The collaboration brings together onsemi’s expertise in integrated systems and packaging with Innoscience’s GaN technology and high-volume manufacturing to enable delivery of GaN products for industrial, automotive, telecom infrastructure, consumer and AI data center markets.
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The European duo driving a greener electronics industry November 25, 2025 Stephan Theil, CEO of the German company Factronix, presented technologies and processes at Evertiq Expo Warsaw 2025 that can drastically reduce electronics manufacturing costs, carbon footprint and dependence on unstable supply chains.
Nokia to cut 427 jobs in France amid shift toward AI November 24, 2025 Finnish telecom giant Nokia plans to reduce its workforce in France by 427 positions, representing roughly one-fifth of its nearly 2,300 employees in the country, a union source told Les Echos.
GlobalFoundries acquires Singapore-based photonics foundry AMF November 19, 2025 GlobalFoundries has acquired Advanced Micro Foundry (AMF), a Singapore-based silicon photonics specialist, in a move that significantly expands the company’s manufacturing footprint and its technology portfolio for optical communications and AI-driven data infrastructure.
POET, QCi to co-develop 3.2 Tbps optical engines November 17, 2025 Quantum Computing Inc. (QCi) will leverage its expertise with TFLN to integrate the high-performance 400G/Lane modulators with the POET Optical Interposer platform technology.
NCAB acquires Multi-Teknik in Sweden November 14, 2025 NCAB has signed an agreement to acquire 100% of the shares in Multi-Teknik Mönsterkort AB with offices in Gothenburg, Lithuania and China.
Indian semiconductor startup Morphing Machines raises $4.3M October 09, 2025 The new funds would be used to build and test the company’s first chip, expand its engineering team and launch pilot projects with data center clients. Commercial deployments are planned in India, Europe and the US.
US quantum computing firm Rigetti secures $5.8M AFRL contract October 06, 2025 Building on Rigetti and QphoX’s successful demonstration of qubit-transducer systems working together to perform optical single-shot qubit readout, the team plans to combine superconducting microwave qubits developed by Rigetti with single-photon microwave-optical transducers developed by QphoX.
UNIVITY wins €31M CNES contract to accelerate space-based 5G October 06, 2025 French startup UNIVITY and TDF will carry out a demonstration of satellite-based 5G connectivity. This experiment will validate the relevance of a fully integrated 5G NTN solution combining VLEO satellites with terrestrial infrastructure.
Aegiq commissions photonic quantum computer at UK’s NQCC September 29, 2025 Aegiq’s on-premises system at NQCC enables exploration and validation of photonic quantum computing use cases through co-development with UK partners, de-risking key technical milestones, and reducing time to commercial impact.
VVDN expands manufacturing footprint into the UAE August 20, 2025 VVDN Technologies, a provider of software, product engineering and electronics manufacturing services, is setting up a new manufacturing facility in the UAE as part of its global expansion strategy. The new facility is slated to be operational in four weeks.
Aspocomp increases revenue and order book – returns to profit August 05, 2025 Finnish PCB manufacturer Aspocomp reported strong growth in both revenue and its order book for the first half of the year, turning to profit in the process.
India’s Amber Group acquires ‘controlling stake’ in Unitronics August 04, 2025 Amber Group's subsidiary ILJIN Electronics India has entered into a definitive agreement to acquire approximately 40.24% of the issued and outstanding share capital of Unitronics.
GovSat orders defence telecom satellite from Thales Alenia Space August 01, 2025 Operating in X, Ka and UHF frequency bands, the satellite will provide secure and jam-resistant telecommunications services for the Luxembourg defence as well as for its partners. The satellite will be built on Thales Alenia Space’s Spacebus 4000B2 platform.
Libra launches in-house high precision underfill capabilities July 17, 2025 Underfill is typically a thermoset epoxy applied between semiconductor packages and PCBs or substrates. It delivers essential benefits: reinforcing solder-joint reliability, mitigating thermal expansion mismatches, improving thermal management, and enhancing mechanical durability.
DIPA, Vi team up to boost sustainable growth in India’s telecom sector July 01, 2025 The objectives of this alliance include implementing green energy solutions, promoting the Green Energy Open Access (GEOA) policy, and boosting adoption of clean energy technologies throughout the country’s telecom infrastructure.
Vi partners with AST SpaceMobile to boost mobile connectivity in India June 23, 2025 This partnership will bring together Vi’s national network with AST SpaceMobile’s space-based cellular technology, which connects directly to everyday smartphones without the need of any specialized software or device support or updates.