Singapore launches innovation hub for gallium nitride semiconductors
July 08, 2025
The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.
Ad
Toshiba introduces 2-channel automotive high-speed digital isolators
July 02, 2025
The devices ensure the safety and reliability of the on-board charger (OBC) and battery management system (BMS) used in hybrid electric vehicles (HEVs) and electric vehicles (EVs).
IPC becomes Global Electronics Association
June 24, 2025
The organization known as IPC – originally the Institute of Printed Circuits – is changing its name to the Global Electronics Association, and unveils a new study on the electronics industry.
Benchmark opens new manufacturing facility in Mexico
June 24, 2025
US-based EMS provider Benchmark has officially opened a new 321,000-square-foot production facility in Guadalajara, expanding its regional footprint in Jalisco by 50%.
GCT partners with Iridium to integrate NTN DirectSM service into chipset
June 20, 2025
GCT and Iridium will work together to expedite the development of a new Iridium network-enabled Narrowband Internet of Things (NB-IoT) chipset based on requirements for 3GPP Release 19.
DRDO, IIT Delhi demonstrate free-space quantum secure communication over 1 km
June 18, 2025
Free-space Quantum Key Distribution (QKD) eliminates the need to lay optical fibers. The experiment attained a secure key rate of nearly 240 bits per second with a quantum bit error rate of less than 7%.
Applied Materials and CEA-Leti expand joint lab
June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.
Fujitsu sells power modules business to India’s L&T for $13.8 M
June 11, 2025
The business will be bought by L&T’s semiconductor arm. Separately, Kaynes Semicon (KS) will acquire the production facilities related to the power modules business from Fujitsu.
Dutch quantum firm Qblox opens North America hub in Boston
June 09, 2025
The new Boston headquarters will focus on propelling the adoption of scalable, high-fidelity quantum control stacks for practical, real-world use in computing and communications.
Maxar wins contract to build high-power EchoStar XXVI satellite
June 09, 2025
EchoStar XXVI will deliver robust coverage to DISH TV customers across all 50 US states, including Puerto Rico, and is engineered for dual orbital slot performance, giving EchoStar enhanced operational flexibility to meet evolving customer and network demands.
Orange completes successful trial of Fujitsu 1FINITY T900 transponder
June 09, 2025
Orange found that power consumption of the 1FINITY T900 transponder remained low and constant across all transmission rates, achieving a transport distance of at least 1600 km at 800Gbps with power consumption below 150 Watts.
Samsung develops next-gen cooling tech with Johns Hopkins
June 06, 2025
By leveraging newly created thin-film Peltier semiconductor devices advanced through cutting-edge nano-engineering technology for the first time, the research team has successfully developed and demonstrated a high-performance Peltier refrigerator.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
Celtonn bags ESA contract to develop chip hardware for satellites
June 02, 2025
As the project lead, Celtonn will develop a high-linearity, low-noise amplifier (LNA) for V-band feeder uplink — a key enabler for next-generation satellite communication payloads.
EnSilica opens new engineering hub in Cambridge
May 29, 2025
British chipmaker EnSilica has established a new engineering centre in Cambridge, strengthening its capabilities in mmWave and RF IC design amid rising customer demand.
IoT and connectivity choices: not just about cost
May 27, 2025
The Internet of Things (IoT) is no longer the domain of futuristic visions — it has become a tangible, widespread element of everyday life, from smart homes and modern cities to industrial and logistics applications. At the core of this ecosystem are communication technologies that enable data exchange between devices. Dr Łukasz Krzak from the AGH University of Science and Technology in Kraków spoke to Evertiq about the trends and challenges shaping the selection of these technologies.
Sponsored content by TME Transfer Multisort Elektronik
ARDUINO OPTA – SECURE AND EASY-TO-USE MICRO PLC
Designed for security and durability, the robust Arduino Opta micro PLC makes industrial and building automation accessible to everyone.
RIT, University of Rochester develop experimental quantum communications network
May 23, 2025
In a new paper published in Optica Quantum, scientists described the Rochester Quantum Network (RoQNET), which uses single photons to transmit information about 11 miles along fiber-optic lines at room temperature using optical wavelengths.
Foxconn and Thales eye semiconductor, satellite projects in France
May 20, 2025
Taiwanese electronics manufacturer Foxconn and French defence and aerospace group Thales have entered a strategic partnership aimed at advancing semiconductor and space manufacturing in Europe.
C-DOT teams up with Synergy to develop drone-based QKD tech
May 20, 2025
The MoU aims to formalize cooperation between C-DOT, a telecom R&D institution under the Indian government’s Department of Telecommunications, and Synergy Quantum in the development of drone-based Quantum Key Distribution (QKD) systems.
Sivers joins DIFI to advance satellite network interoperability
May 19, 2025
Digital Intermediate Frequency Interoperability (DIFI) Consortium is a global collective of industry leaders collaborating to develop and promote open, standards-based interoperability for digital IF/RF systems.
Sponsored content by SMT Renting & Panasonic
Automation in Focus: Panasonic Software and SMT Renting Drive Kemptron’s Smart Factory Integration
Kemptron Oy has taken a major step toward full factory automation with a complete solution delivered by SMT Renting and SMT House — covering everything from the turnkey Panasonic SMT line to the fully integrated automated warehouse system from Neotel Technology. Panasonic’s software platform seamlessly connects the production line with the warehouse solution from Neotel, enabling real-time material flow and boosting efficiency and autonomy. The entire setup was financed through SMT Renting’s flexible model, offering Kemptron a low-risk path to state-of-the-art manufacturing.
Sponsored content by SMT Renting & Panasonic
Automation in Focus: Panasonic Software and SMT Renting Drive Kemptron’s Smart Factory Integration
Kemptron Oy has taken a major step toward full factory automation with a complete solution delivered by SMT Renting and SMT House — covering everything from the turnkey Panasonic SMT line to the fully integrated automated warehouse system from Neotel Technology. Panasonic’s software platform seamlessly connects the production line with the warehouse solution from Neotel, enabling real-time material flow and boosting efficiency and autonomy. The entire setup was financed through SMT Renting’s flexible model, offering Kemptron a low-risk path to state-of-the-art manufacturing.
Siemens, O₂ Telefónica partner to enhance 5G network slicing
May 02, 2025
The solution “5G Slice for the Water Industry” allows water utilities in Germany to monitor and control their entire system of automation technology over a virtual 5G network using 5G network slicing technology.
OKI develops 124-layer PCB tech for AI chip testing tools
May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
Europe's electronics erosion threatens strategic autonomy
April 28, 2025
A new report from IPC warns that Europe’s continued decline in electronics manufacturing capacity — particularly in printed circuit boards (PCBs), advanced packaging, and EMS — poses a growing threat to the continent’s defence readiness, industrial resilience, and technological sovereignty.
NEC achieves Japan’s longest free-space optical communication
April 28, 2025
NEC achieved Japan’s longest terrestrial wireless optical communication over a distance of over 10 km. It also conducted FSO communications between an observation deck at the tallest structure in Japan and a location on the ground 3 km away.
Murata establishes US-based venture arm to boost innovation investment
April 17, 2025
Japanese Murata Manufacturing is setting up a new corporate venture capital (CVC) arm, Wonderstone Ventures, in the United States as part of its long-term strategy to expand innovation and competitiveness.
Axiro Semiconductor launches chip design centre in Bengaluru
April 16, 2025
The new chip design centre aims to serve the global 5G and 6G markets, defence and satellite communication, IOT among others.
Trump's policy pushes EU companies to drop ‘diversity’
April 02, 2025
European companies with business in the US are making adjustments to their corporate language following a directive from US President Donald Trump. The directive, which prohibits companies from implementing diversity, equity, and inclusion (DEI) policies if they wish to conduct business with the United States, appears to be influencing corporate communication strategies.
Global OSAT market to touch $94 billion by 2031
March 28, 2025
Increasing circuit complexity spurs OSAT market growth, as integrating various functionalities into a single device demands specialized assembly and test capabilities.
Load more news