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iphone18

October 21, 2026
Qnity Electronics will produce films for the variable aperture camera in the iPhone 18 Pro in the US. The deal is part of an expansion of Apple’s American Manufacturing Program, under which nearly 100 components in Apple’s newest iPhones now come from American companies.

Electronics_building

October 19, 2026
Through this agreement, Flip Electronics will distribute Synaptics’ expansive portfolio of embedded compute, wireless connectivity, and sensing solutions, focusing on aged, end-of-life, and obsolete devices that support innovation across automotive and IoT market.

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Longbow-platform

October 14, 2026
Norwegian communications company Comrod has acquired TransOpto in Kristiansand, which develops wireless optical data links. The technology gives defence customers an alternative to radio communication that is harder to detect.

October 13, 2026
Nokia is selling Enterprise Campus Edge, its private wireless and industrial edge business, to investment firm Aurelius. The divestment is another step in Nokia’s strategy to concentrate its resources on fewer areas.

building

October 05, 2026
Under the agreement, Aviat has granted DEAPL, a subsidiary/JV of Indian EMS provider Dixon, a limited license to use specified intellectual property, including technical know-how, solely for the manufacture, use, offer for sale and sale of microwave radios.

Sponsored content by TME Transfer Multisort Elektronik

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Contemporary communication has been dominated by wireless systems. Electronics increasingly rely on data exchange without the use of cables. This applies to household appliances, as well as industrial, medical automation, and Internet of Things solutions. One of the most commonly used short-range communication standards is Bluetooth, particularly its energy-efficient variant, Bluetooth Low Energy (BLE), which allows for the construction of compact battery-powered devices.

Bittium-Headquarters-Oulu-Finland

September 25, 2026
Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.

LG_UWB

September 11, 2026
The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.

opening-Austin-innovation-center

September 08, 2026
Silicon Labs has opened a new research and development laboratory at its headquarters in Austin, Texas, expanding its capabilities for advanced chip design, testing and validation.

axonite_chip

September 04, 2026
GCT Semiconductor and the infrastructure provider for utilities and IoT have a long history of cooperation in the utility sector. The collaboration combines GCT’s cellular and NTN expertise with the provider’s industrial-grade wireless innovation.

August 18, 2026
This validation represents an important step toward realizing predictive network operations, especially as AI-driven network optimization becomes increasingly prevalent in the 6G network.

new_products

July 30, 2026
New supplier additions in Q2 include Neutrik Group, a global manufacturer of professional interconnect solutions; LumenRadio, which specializes in wireless control technology; and AMobile, which delivers industrial mobile computers.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

link_planner

July 24, 2026
The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.

BeRex_agreement

July 21, 2026
South Korean company BeRex leverages over two decades of experience and expertise in developing RF and microwave components in the industry that enable the efficient transmission of voice, video, and data traffic over leading communications networks worldwide.

PCB-USA_1

July 09, 2026
The new agreement will lead to the production of more than 15 billion US-made chips and enable Broadcom to expand and modernize its manufacturing facilities in Fort Collins, Colorado, with a USD 1.5 billion capital expenditure investment.

cooperation-2

July 06, 2026
Through this collaboration, the Fujitsu Group aims to enhance its global customer offerings by combining 1Finity’s expertise in developing, manufacturing, and selling optical transmission and wireless base station equipment with Accton’s advanced network technologies.

building_logo

July 03, 2026
Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.

June 26, 2026
Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.

IIT_Hyderabad_MOU

June 25, 2026
As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.

MIMCAP_silicon_interposer

June 18, 2026
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.

LG_Uplus_MoU

June 18, 2026
Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.

fiber_network_thedigitalartist

June 08, 2026
The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.

Nanopower_agreement

June 08, 2026
Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.

headoffice

June 05, 2026
The companies will explore the potential to provide optimal products and solutions by combining Murata’s expertise in high-frequency and wireless communications, sensors, timing devices and module design with Xona’s LEO-based positioning and timing synchronization technologies.

new-technologies_5

June 01, 2026
As a provider of high-performance semiconductors powering AI data center networking, IoT connectivity, and intelligent connected devices worldwide, Semtech brings silicon expertise and a unique perspective to the Alliance.

May 27, 2026
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

building_logo

May 18, 2026
During the lab test, the application of PC1 technology achieved up to 10 times higher uplink throughput at the cell-edge compared to PC1.5 standard. For users, this means smoother video calls and faster file upload in areas where signals are weak.

partnership_Franz26

May 11, 2026
The expanded USD 1.5 million development partnership addresses growing demand for higher-capacity, short-range mmWave links in dense urban and enterprise FWA deployments and will enable faster, broader network deployment of 28GHz and 60GHz transceivers.

Sponsored content by Würth Elektronik eisos

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The WE MXGI series was developed for use in compact, high-power-density DC/DC applications in which high currents, low losses, and stable performance are required even at high switching frequencies.

Massive_MIMO

May 08, 2026
Huawei’s sub-1 GHz Massive MIMO is the first solution in the industry to combine extremely large antenna arrays with wideband technology in the low-band spectrum.

semiconductor-revenue-growth-2026

April 28, 2026
Omdia has significantly raised its 2026 semiconductor revenue forecast, now projecting growth of 62.7%, citing sustained AI-driven demand and tightening supply conditions in memory markets.

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