Samji selects MaxLinear’s Sierra single-chip radio for Macro O-RU March 02, 2026 By reducing radio power consumption and thermal management requirements while meeting spectral emissions targets with margin, Sierra enables a smaller and lighter radio design that simplifies installation and lowers total cost of ownership.
Qualcomm to invest up to $150 million in AI startups in India February 20, 2026 US semiconductor company Qualcomm says it plans to invest up to USD 150 million in India’s technology and AI startup ecosystem through a new strategic venture fund.
Texas Instruments to acquire Silicon Labs for $7.5B February 04, 2026 Texas Instruments has signed a definitive agreement to acquire Silicon Labs in an all-cash transaction valuing the wireless connectivity specialist at approximately USD 7.5 billion.
Demcon acquires electronics company Leap Development February 02, 2026 Dutch company Leap Development, which will henceforth be known as Demcon electronics, specializes in RF technology, wireless communication, embedded systems and integrated electronics development.
Lego unveils platform with embedded electronics January 22, 2026 Denmark's Lego Group has unveiled LEGO SMART Play, a new interactive play platform based on electronically enabled bricks that respond to physical interaction. The platform was presented at CES 2026 in Las Vegas earlier this month.
Origin AI, NXP team up to accelerate embedded WiFi sensing January 15, 2026 This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.
India’s CoreEL Technologies raises $30 million in Series B December 26, 2025 The capital will be deployed across multiple initiatives, including scaling manufacturing capacity, strengthening research and development, advancing product engineering and supporting participation in large and complex aerospace and defence programmes.
Mouser signs global distribution agreement with Telit Cinterion December 23, 2025 Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.
Samsung, KT Corporation validate AI-RAN on commercial networks December 12, 2025 The AI-RAN optimization technology verified by the two companies automatically applies optimal configurations for each user — rather than for the network as a whole — based on real-time wireless conditions.
Sivers Semiconductors partners with DigiKey December 09, 2025 Swedish Sivers Semiconductors has entered into a strategic partnership with distributor DigiKey aimed at broadening global access to Sivers’ millimetre-wave wireless products and evaluation kits.
Sivers partners with Doosan to develop Ka-band ESA panels December 04, 2025 The contract, valued at USD 1.5 million, will fund the design and development of these advanced antenna systems, powered by Sivers’ upcoming broad-market Ka-band SATCOM beamforming integrated circuits (BFICs).
Sivers enters into production partnership with Tachyon November 24, 2025 Sivers Semiconductors’ antenna modules are central to Tachyon’s approach, enabling an affordable, disruptive solution that leverages Tachyon’s extensive mmWave experience to extend high-speed connectivity.
Fabric8Labs secures $50M to expand US manufacturing capacity November 18, 2025 Fabric8Labs, a developer of Electrochemical Additive Manufacturing (ECAM) technology, has secured USD 50 million in funding to expand its US-based production facilities, enabling the company to produce up to 22 million components annually.
BTRY raises $5.7M to industrialize ultra-thin solid-state cells November 14, 2025 The Swiss battery start-up will use the funds to scale production to industrial roll-to-roll manufacturing, transforming its thin-film batteries into market-ready products.
How Bluetooth 6.0 channel sounding redefines distance measurement November 13, 2025 During Evertiq Expo in Warsaw on October 23, Evertiq spoke with Dariusz Jaworowski from Arrow Electronics about Bluetooth Channel Sounding — a feature introduced with the Bluetooth 6.0 specification that is already reshaping how short-range wireless devices can determine distance.
Wireless Mobility Automotive becomes 100% German-owned November 13, 2025 Wireless Mobility Automotive has become a wholly owned subsidiary of Wireless Mobility Holding GmbH, making the company a 100% German-owned enterprise.
Nokia, Rohde & Schwarz collaborate on AI-powered 6G receiver November 07, 2025 Nokia Bell Labs developed the receiver and validated it using 6G test equipment and methodologies from Munich-based test and measurement company Rohde & Schwarz.
European semiconductors sales up 7.2% QoQ November 06, 2025 European sales of semiconductors grew steadily in the third quarter of 2025 compared to the second quarter, reports the European Semiconductor Industry Association (ESIA).
Sivers Semiconductors partners With POET Technologies November 06, 2025 Swedish photonics and wireless technologies specialist, Sivers Semiconductors, has released additional details on the strategic partnership with POET Technologies Inc., a specialist the design and implementation of highly integrated optical engines and light sources for artificial intelligence networks. The collaboration will combine Sivers’ lasers with POET’s optical interposer to deliver scalable, energy-efficient light sources.
GF and Silicon Labs expand US chip manufacturing November 05, 2025 GlobalFoundries and Silicon Labs are expanding their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale US-based semiconductor manufacturing.
Infineon opens new UWB lab in Austria October 30, 2025 Infineon Technologies has established a dedicated Ultra-Wideband (UWB) Application Lab in Graz, Austria. Developed in collaboration with Silicon Austria Labs (SAL), the lab focuses on advancing UWB technology, exploring use cases, and delivering real-world applications for automotive, industrial, IoT, and consumer markets.
GlobalFoundries to invest €1.1 billion in German expansion October 29, 2025 GlobalFoundries plans to invest EUR 1.1 billion to expand its semiconductor manufacturing facility in Dresden, Germany.
Samsung, TELUS collaborate on Canada’s first AI-powered RIC October 10, 2025 Following the companies’ announcement of Canada’s first commercial virtualized and O-RAN network in February 2024, the RIC implementation will enable TELUS to harness AI throughout network operations and management.
Semiconductor innovation at Penn State gets $7.5M boost October 06, 2025 Funded through the US Defense Advanced Research Projects Agency (DARPA)’s Next-Generation Microelectronics Manufacturing (NGMM) program, the work at Penn State is part of a USD 840 million multi-institutional effort.
Patrick Vandenameele takes the helm at imec September 30, 2025 The Board of Directors of imec has appointed Patrick Vandenameele as the next Chief Executive Officer. Effective April 1, 2026, he will succeed current CEO Luc Van den hove, who will then assume the role of Chair of imec’s Board of Directors.
NTT, MHI achieve milestone in laser wireless power transmission September 22, 2025 By irradiating a laser beam with an optical power of 1 kW, the two Japanese companies succeeded in receiving 152 W of electric power 1 kilometer away.
GlobalLogic, Ericsson deploy private 5G network at Hitachi Rail factory September 12, 2025 The new infrastructure is the digital backbone of the Hagerstown plant in Maryland, US, enhancing efficiency, safety and innovation capabilities in rail manufacturing.
IQE lowers 2025 forecast, explores potential sale September 11, 2025 Compound semiconductor specialist IQE plc says it expects weaker full-year revenue and has expanded its ongoing strategic review to include the potential sale of the company.
Nokia teams up with Kongsberg to advance defence communications September 11, 2025 Nokia and Norwegian defence technology provider, Kongsberg Defence & Aerospace, have signed a memorandum of understanding (MoU) to collaborate on enhancing tactical communications solutions for the defence sector.
GF expands partnership with Apple August 14, 2025 GlobalFoundries has entered into an agreement with Apple for a deeper collaboration aiming to advance semiconductor technologies and strengthen US manufacturing.
Sivers Semiconductors reports 38% increase in Q2 revenue July 21, 2025 Adjusted EBITDA improved by 32% YoY and 45% YTD while wireless BU revenues grew by 71% YoY, the Swedish company announced.
Nordic, Future Electronics enter global distribution partnership July 11, 2025 The agreement sees Future added to Norwegian company Nordic’s group of global distribution partners, and involves Future bringing Nordic’s entire current product line to market. Future will also stock modules from Nordic module partners.