Global OSAT market to touch $94 billion by 2031
March 28, 2025
Increasing circuit complexity spurs OSAT market growth, as integrating various functionalities into a single device demands specialized assembly and test capabilities.
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Sivers teams up with WIN to enhance DFB laser production
March 26, 2025
Taiwan’s WIN Semiconductors will serve as an outsourced manufacturing partner for Sivers Semiconductors, enabling the company to scale production and meet the demand for its photonic solutions.
ENC, InductEV team up to enhance electric bus mobility
March 25, 2025
As part of the collaboration in North America, ENC will begin offering wireless inductive charging on its battery-electric buses using InductEV’s high-power hardware.
Taiwan’s Sera Network to invest $35 million in Telangana
March 24, 2025
The new facility in the southern Indian state of Telangana will focus on producing advanced data center switches, 5G technology equipment, and other high-tech electronic components.
Top 10 IC design houses See 49% YoY growth in 2024
March 18, 2025
TrendForce reports that the combined revenue of the world’s top 10 IC design houses reached approximately USD 249.8 billion in 2024, marking a 49% YoY growth. The surge is largely attributed to the booming AI industry, with Nvidia dominating the market.
Omni Design Technologies opens Austin design centre
March 13, 2025
Omni Design Technologies, a provider of high-performance, low-power data acquisition and signal-processing solutions, has opened a new design center in Austin, Texas.
indie partners with GF to boost automotive radar tech
March 07, 2025
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.
Finwave announces global distribution agreement with RFMW
March 07, 2025
This partnership between the two American companies represents a significant step in Finwave’s evolution from a technology-driven company to a product-driven company.
Emtar secures $12.8 million to advance wireless SoC
March 03, 2025
The Canadian company continues to make strong progress in developing high-performance, energy-efficient and low-latency signal acquisition solutions, it said in a media release.
Taiwan semiconductor market to reach $66 billion by 2031
February 28, 2025
It is anticipated that the industry will maintain strong growth to meet rising demand for semiconductor materials in emerging technologies like AI, autonomous driving, the Internet of Things, and 5G.
DigiKey enters global distribution agreement with Qorvo
February 27, 2025
DigiKey and Qorvo, a provider of connectivity and power solutions, have entered into a worldwide distribution agreement.
Silicon Labs secures $23M Texas CHIPS Act grant to boost R&D
February 20, 2025
Silicon Labs has received a USD 23 million grant from the Texas Semiconductor Innovation Fund (TSIF) under the Texas CHIPS Act to enhance research and development in Austin.
Chips from the North – Finland's semiconductor roadmap
February 14, 2025
Finland’s semiconductor industry is poised for significant expansion, driven by its deep-rooted expertise, strong research and development (R&D) ecosystem, and innovative infrastructure – But why is that?
Top 10 largest semiconductors suppliers in 2024
February 06, 2025
It has become a tradition that on the occasion of each Evertiq Expo we publish a Top List dedicated to a different branch of the electronics industry. On February 6, the second edition of our expo was held in Sophia Antipolis, which is recognized as the capital of France's Silicon Valley. So this time we publish the Top 10 global semiconductor suppliers - we based the list on the latest data published by Gartner analysts.
Amphenol completes acquisition of CommScope units
February 04, 2025
Amphenol Corporation has completed the acquisition of CommScope’s Outdoor Wireless Networks (OWN) and Distributed Antenna Systems (DAS) businesses.
Mouser adds over 60 manufacturers in 2024
January 23, 2025
Mouser Electronics says that it added more than 60 new manufacturers to its line card during 2024.
Sponsored content by endrich GmbH
New Bluetooth 5.3 Low Energy (LE) module from Panasonic with LE audio
Panasonic's PAN1783 is a Bluetooth 5.3 Low Energy (LE) module. At its core is the Nordic nRF5340 single-chip controller. The module is available with either an on-board chip antenna or an RF bottom pad. The module uses the functions of Bluetooth 5.3, including isochronous channels and LE audio, and supports a high throughput of 2 Mbps, advertising extensions and long-range communication. It integrates the extensive functions of the nRF52 series and improves performance and memory while maintaining low power consumption.
Kokoon-IA: transforming senior care with ethical AI
January 16, 2025
Nodeus Solutions, a startup rooted in the innovation hub of Sophia Antipolis, is setting a new standard in e-health with Kokoon-IA. The system empowers seniors living independently by providing non-intrusive health monitoring while prioriting dignity and privacy.
Sivers Semiconductors secures important deal to revolutionize telecom chips
January 10, 2025
Sivers Semiconductors has entered into a new chip development agreement with a leading Tier-1 telecom infrastructure provider. The collaboration, announced in a recent press release, will see Sivers develop advanced semiconductor solutions designed to meet the growing needs of 5G networks and future telecom technologies.
Inventec laboratory for developing UWB solutions is powered by NXP
January 08, 2025
Investec has launched a lab at its facility in Taoyuan, Taiwan. The laboratory aims to design and develop Ultra-Wideband (UWB) based systems for the automotive industry by leveraging NXP’s solution offering including the NXP Trimension UWB portfolio.
Infineon, Eve Energy sign battery management solutions pact
December 16, 2024
Infineon will supply a complete chipset, including microcontroller units, balancing and monitoring ICs, power management ICs, drivers, MOSFETs, controller area networks and sensor products.
Micron secures $6.1 billion CHIPS incentives for US expansion
December 11, 2024
The US Department of Commerce is awarding Micron Technology up to USD 6.165 billion in CHIPS Act incentives to expand its DRAM production facilities in Idaho and New York.
Bittium inks partnership agreement with Finnish Defence Forces
November 26, 2024
Bittium Wireless, a subsidiary of Bittium Corporation, and the Finnish Defence Forces have signed a Partnership Agreement for the years 2025–2036.
Nordic Semi cancels Novelda acquisition
November 21, 2024
Back in mid-October, Nordic Semiconductor announced that it had signed a Letter of Intent (LOI) to acquire the Norwegian ultra-wideband wireless technology company Novelda AS for an undisclosed sum. Now, Nordic Semi says it wont proceed with the potential acquisition.
US to boosts chip packaging with $300M in funding
November 21, 2024
US government announces up to USD 300 million in funding to boost advanced semiconductor packaging.
ST opens new design and industrialisation centre
November 20, 2024
STMicroelectronics has opened its new design and industrialisation centre, equipped with a test lab, in Pisa Montacchiello, Italy.
Microelectronics hubs get $160 million in fresh DoD funding
November 15, 2024
Most of the new funding will go to the eight established Microelectronics Commons Hubs that focus on building infrastructure, supporting operations and accelerating workforce developments.
India’s semiconductor market set to cross $100 billion by 2030
October 18, 2024
Mobile handset, IT and telecom segments are leading the semiconductor industry, contributing over 75% of its revenues, according to a new report.
Nordic Semiconductor wants to acquire Novelda
October 16, 2024
Nordic Semiconductor has signed a Letter of Intent (LOI) to acquire the Norwegian ultra-wideband wireless technology company Novelda AS for an undisclosed sum.
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GigaDevice GD32VW553 – MCU series with large capacity and numerous interfaces
GigaDevice's MCU series GD32VW553 offers developers a flexible and powerful platform The integration of Wi-Fi 6 and Bluetooth LE 5.2 enables fast and secure wireless connections. The extensive security features also ensure the protection of sensitive data and communication channels. The MCUs offer a large memory capacity with up to 4 MB flash and 320 KB SRAM, combined with a diverse range of general-purpose interfaces
VIAVI opens Open RAN lab-as-a-service test facility
October 09, 2024
VIAVI Solutions has opened its VIAVI Automated Lab-as-a-Service (VALOR) Open RAN testing facility in Chandler, Arizona.
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