Toshiba introduces 2-channel automotive high-speed digital isolators
July 02, 2025
The devices ensure the safety and reliability of the on-board charger (OBC) and battery management system (BMS) used in hybrid electric vehicles (HEVs) and electric vehicles (EVs).
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SEALSQ partners with ColibriTD, Xdigit to develop solution for wafer yields
June 30, 2025
The solution aims to significantly improve wafer yield for advanced semiconductor designs at nodes below 7nm by addressing IR Drop issues. It features an advanced mathematical modeling of IR Drop and leverages quantum computing’s ability to solve the resulting complex Partial Differential Equations.
Blue Whale teams up with UNIGRID to deploy urban BESS solutions
June 26, 2025
Urban areas lack open spaces for large containerized battery systems. Blue Whale Energy is addressing this with a novel strategy: installing compact, modular battery packs directly beneath solar panels.
Xanadu opens advanced photonic packaging facility in Ontario
June 25, 2025
Canadian quantum computing company Xanadu has opened a CAD 10 million advanced photonic packaging facility at its headquarters in Toronto. The new site, described as the first of its kind in Canada, aims to strengthen the country’s domestic quantum supply chain and manufacturing capabilities.
IBM, RIKEN unveil first IBM Quantum System Two outside of US
June 25, 2025
IBM Quantum System Two at RIKEN is powered by IBM Quantum Heron, the company’s best-performing quantum processor to-date. Its connection to Fugaku will enable RIKEN teams to use quantum-centric supercomputing approaches to push forward research on advanced algorithms.
IPC becomes Global Electronics Association
June 24, 2025
The organization known as IPC – originally the Institute of Printed Circuits – is changing its name to the Global Electronics Association, and unveils a new study on the electronics industry.
Continental launches semiconductor unit, partners with GlobalFoundries
June 24, 2025
Continental's Automotive Group Sector has established a new internal unit — Advanced Electronics & Semiconductor Solutions (AESS) — to design and verify application-specific semiconductor circuits, as the company prepares for its planned spin-off into the standalone entity Aumovio.
Nuvve launches BaaS to help electric cooperatives slash energy costs
June 23, 2025
Nuvve’s BaaS model enables utilities to deploy scalable battery energy storage systems — including at the substation level — without requiring significant upfront capital investment and delivered through 10 to 12-year service agreements.
Tata Elxsi, Infineon partner to accelerate EV innovation in India
June 20, 2025
Tata Elxsi brings its design, system integration and validation capabilities, while Infineon will provide early access to its latest semiconductor technologies—such as SiC-based components, microcontrollers and ICs.
Anduril teams up with Rheinmetall to produce military drones for Europe
June 20, 2025
The companies will jointly develop European variants of Anduril's Barracuda and Fury aerial drones, and explore opportunities to build solid rocket motors, which are used to propel missiles and rockets.
Northrop integrates spacecraft for space robotic servicing system
June 19, 2025
Integrating the US Naval Research Laboratory’s robotics payload onto MRV brings SpaceLogistics closer to delivering the first commercial spacecraft with robotic servicing capabilities for commercial and government satellites in geosynchronous earth orbit.
Sparc Foundry secures €17.2M public funding for photonic chip plant
June 18, 2025
Sparc Foundry, a Spanish startup focused on photonic semiconductors, has received a EUR 17.2 million capital injection from the Spanish Society for Technological Transformation (SETT). The funding has been approved by the Council of Ministers under the national PERTE Chip initiative and represents 43.9% of the company's capital expansion.
FlexGen partners with Rosendin to deliver BESS solution for data centers
June 16, 2025
The project will integrate proprietary technology and innovations from both Rosendin and FlexGen, including Rosendin’s BESSUPS design and method patent and FlexGen’s Soft Grid Interconnection and Island Grid Transient Frequency Stabilization patents.
Sony to release stacked SPAD depth sensor for automotive LiDAR applications
June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.
Scanfil strengthens US presence with majority stake in ADCO Circuits
June 11, 2025
Finnish EMS provider Scanfil is expanding its footprint in the US and entering the aerospace and defence market through the acquisition of a majority stake in ADCO Circuits Inc., an EMS provider based in the Greater Detroit area.
Tata Electronics partners with BEL to bolster India’s chip ambitions
June 09, 2025
Tata Electronics and Bharat Electronics Limited (BEL) will explore collaboration opportunities to identify fab, OSAT and design services solutions from Tata Electronics based on the current and future requirements of BEL.
SparkCharge raises $30.5 million to expand mobile EV charging
June 09, 2025
SparkCharge will use the funding to accelerate EV adoption by expanding its mobile, off-grid and scalable EV charging services throughout the United States, Mexico and Canada.
BlueFors LD250 cryostat at Cornell boosts quantum research
June 06, 2025
A cryostat is an instrument that can maintain samples at incredibly low temperatures. When operating, the temperature inside the cryostat hovers just above 0 degrees Kelvin, which is equivalent to absolute zero, or minus 273 degrees centigrade.
NTR selects Fluence for 55 MW battery storage project in Finland
June 06, 2025
Fluence Energy, a provider of intelligent energy storage and optimization software for renewables and storage, has been selected to provide their advanced battery technology solution, Gridstack Pro 5000.
Europe's PCB landscape: 2024’s top 30 manufacturers revealed
June 05, 2025
Evertiq has previously reported on the long-term decline of the European PCB industry. Back in the 1990s, the EU accounted for around 20–30% of global production. Today, that figure stands at just 2%. But who are the champions still holding strong in the storm?
Why PCB raw materials matter: performance, reliability, and cost
June 04, 2025
ICAPE offers an overview of the key factors in PCB raw material selection and the considerations that guide their use.
Dutch HQ/2 project releases open-architecture quantum computer
June 03, 2025
The “open-architecture” approach to building Tuna-5 system, as opposed to the vertically integrated quantum computers available via some leading commercial players, is a distinctive feature of the Delft quantum ecosystem.
Keysight wins NATO FORACS contract to enhance operational readiness
June 02, 2025
Under this agreement, Keysight will deliver Radar Target Generator and Electronic Warfare testing (EW) solutions to be deployed at NATO Navy bases, enabling the calibration and maintenance of NATO radar systems and the assessment of ESM effectiveness.
Sponsored content by PEI-GENESIS
High-Voltage Connections: The Driving Force Behind Electric Vehicles
The IEA’s latest Global EV Outlook report reveals a surge in electric car sales, projected to reach a staggering 17 million units by the end of 2024. This marks a significant milestone in the automotive industry, as EVs are expected to constitute more than one in five cars sold worldwide. As the EV market accelerates, the critical role of advanced connector technology in sustaining this growth becomes increasingly evident. Here, Dawn Rogers, senior product manager at connector specialist PEI-Genesis, explores how connectors are powering the EV development.
Danfoss optimises production with AOI systems from GÖPEL
May 27, 2025
Danfoss has selected automated optical inspection (AOI) systems from GÖPEL electronic to enhance quality control across its SMD and THT production lines. The move aims to improve test coverage, streamline system integration, and reduce manufacturing defects at an early stage.
Incap continues to upgrade its SMT technology in the UK
May 27, 2025
EMS provider Incap Electronics UK says it has completed the second phase of its SMT production lines upgrade at its facility in Newcastle-under-Lyme.
ClassOne, IBM Research team up to develop non-NMP solvent processing
May 26, 2025
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
Aramco launches renewable energy storage system for gas operations
May 26, 2025
Located in Wa’ad Al-Shamal, in western Saudi Arabia, the 1-MW/hour flow battery system is based on Aramco’s patented technology and was developed in collaboration with Rongke Power (RKP).
Sponsored content by TME Transfer Multisort Elektronik
ARDUINO OPTA – SECURE AND EASY-TO-USE MICRO PLC
Designed for security and durability, the robust Arduino Opta micro PLC makes industrial and building automation accessible to everyone.
GCT, G+D partner to launch eSIM solution for IoT devices
May 23, 2025
This collaboration for eSIMs, or SIM cards directly embedded into a device, brings intelligent, location-aware connectivity to headless 4G and 5G IoT devices.
IBM and Deca to launch advanced chip packaging in Quebec
May 22, 2025
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
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