SEALSQ and IC’ALPS team up to enhance automotive ASIC safety
April 14, 2025
Through this partnership, SEALSQ’s post-quantum secure technology will be integrated into IC’ALPS’ automotive ASIC designs, providing robust cryptographic resistance against quantum-era threats.
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Sponsored content by Comarch S.A.
Prototyping of electronic devices: Major Barriers and Strategies to Overcome Them
Prototyping electronic devices is one of the most important stages of the design process – the point at which an idea begins to take shape. It is not just about testing technical assumptions, but also a strategic exercise requiring precise planning, optimisation and functional analysis. It is at this stage that potential errors are identified, individual components are refined and the readiness of the product for series production is assessed. However, successful prototyping is not without its challenges – from selecting the right components to iterative testing and system integration. At Comarch, with many years of experience in IoT development, we have a deep understanding of the complexity of the electronic device prototyping process and the difficulties that engineers have to face. We also know how to remedy them.
JarnisTech's Chongqing smart factory goes live
April 08, 2025
Against the industrial backdrop of surging demand for 5G-A and AI servers, Chinese PCB manufacturer JarnisTech has officially put its Chongqing smart factory into production – with AOI technology that boosts PCB inspection efficiency by 600%.
Aixtron delivers G10-AsP system to Nokia
April 01, 2025
Aixtron will supply its G10-AsP system to Nokia, facilitating the production of 6-inch Indium Phosphide (InP) wafers for Photonic Integrated Circuits (PICs).
TotalEnergies to invest $173M in battery storage in Germany
March 27, 2025
The six new battery storage projects totalling 221 megawatts will be commissioned next year and supplied by Total’s German subsidiaries SAFT and Kyon Energy.
FAMES Pilot Line launches open-access call for EU chip industry
March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.
CITIC, Sangfor deepen hybrid cloud partnership
March 25, 2025
The new SmartCLOUD C-FUSION hybrid cloud series integrates the full-stack SmartCLOUD dedicated private cloud, virtual private cloud and public cloud services.
Sponsored content by TME Transfer Multisort Elektronik
PANASONIC CAPACITORS FOR USB-PD DEVICES
Panasonic is a supplier of many innovative electronic components. One of the most important product groups in this range are capacitors designed to build power circuits for DC devices - these include components that fit within the parameters of the latest USB standard.
Federal Electronics boosts it cable and wire harness capabilities
March 18, 2025
Electronics manufacturer Federal Electronics has expanded its cable assembly and wire harness capabilities at its Cranston, Rhode Island facility.
CoolCAD, RFMW boost SiC semiconductor devices offerings
March 17, 2025
The agreement strengthens RFMW’s ability to offer customers advanced wide bandgap solutions, enabling superior performance, reliability and efficiency in high-temperature and high-power applications.
GaN semiconductor devices market to reach $19.5B by 2031
March 07, 2025
The expansion of 5G networks globally is significantly contributing to the demand for Gallium Nitride (GaN) semiconductor devices in RF and power electronics applications.
Malaysia partners with Arm to boost semiconductor innovation
March 06, 2025
The Government of Malaysia has entered into a strategic partnership with Arm Limited through a Memorandum of Understanding (MOU) and contract, taking a significant step in the nation’s semiconductor and artificial intelligence (AI) development efforts.
RRP Electronics partners with Deca to boost wafer packaging
March 04, 2025
India’s RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
Supply chain reset – from excess to equilibrium
February 27, 2025
The global electronic component supply chain is expected to transition from excess inventory to a more balanced demand environment in 2025, according to a recent report from independent distributor Fusion Worldwide.
Spirox opens semiconductor verification lab in Taiwan
February 26, 2025
Semiconductor equipment provider, Spirox Corporation, plans to build the first power semiconductor dynamic reliability verification laboratory in the Asia-Pacific region.
LG Innotek launches automotive AP module
February 21, 2025
The small size of the automotive application processor (AP) module reduces the surface area of the main board, allowing cars to be designed more flexibly, the South Korean company said.
NEC develops Near Real-time RIC for high performance 5G vRAN
February 21, 2025
NEC has developed a Near-RT RIC platform that enables flexible and intelligent network control in accordance with O-RAN Alliance specifications for vRAN and runs on general-purpose hardware.
U-M awarded up to $7.5M to develop heat-tolerant chips
February 21, 2025
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Limtronik upgrade production with new SMD line from Fuji
February 20, 2025
The EMS industry experiences high volatility due to shorter product life cycles, increased variations, and ongoing miniaturization of components. To tackle these challenges with enhanced flexibility and scalability, EMS provider Limtronik has actively expanded its production capacity by adding a new SMD line.
ALTER | HTV puts new chip and wafer test tech into operation
February 05, 2025
ALTER | HTV is enhancing its testing capabilities with new technology investments.
Global PCB market set to grow by $26.8 bn by 2029
January 31, 2025
Increased demand for electronic devices will drive uptick, although challenges will persist around environmental concerns, report concludes.
Active-PCB joins ACT Group
January 29, 2025
UK-based contract electronics manufacturer Active-PCB Solutions Ltd has been acquired by Agile Circuit Technologies Group Ltd.
Scanfil expands Malaysia operations amid strong demand
January 29, 2025
It was back in early October last year that EMS provider Scanfil acquired SRX – along with its two factories in Australia and Malaysia – for EUR 23.3 million. Now, the Finnish EMS provider is investing EUR 4.3 million in SRX Malaysia to meet high customer demand.
Top five global robotics trends for 2025
January 28, 2025
The global market value of industrial robot installations has reached an all-time high of USD 16.5 billion. The industry’s growth is set to accelerate, fueled by technology innovations, shifting market dynamics, and emerging business opportunities. Looking ahead to 2025, the International Federation of Robotics highlights five key trends shaping the future of robotics.
Automotive PCB market predicted to reach $25 bn
January 27, 2025
The anticipated boom in demand for electric vehicles is set to provide a significant uptick in the global automotive PCB market, a new report concludes.
Samsung teams up with SoulBrain
January 24, 2025
New semiconductor alliance promising improved supply chain ecosystem
Minimal impact on wafer fabs following Taiwanese earthquake
January 23, 2025
A magnitude 6.4 earthquake struck southern Taiwan near Chiayi in the early hours of January 21, 2025. According to TrendForce, preliminary assessments indicate minimal damage to nearby wafer fabs.
Samsung, LG may shift home appliance production to US
January 23, 2025
South Korean electronics giants Samsung Electronics and LG Electronics are reportedly evaluating plans to relocate some of their home appliance production from Mexico to the United States.
Graphene – the sense of a new world
January 10, 2025
Graphene has been described as a “wonder material” ever since its discovery 20 years ago. While at times the hype has been over-egged, its properties are already changing more than just the semiconductor industry.
Imec’s breakthrough in nano-ridge lasers on 300 mm wafers
January 10, 2025
Belgium-based research institute Imec has achieved a significant milestone in semiconductor technology by fabricating electrically pumped GaAs-based nano-ridge lasers on 300 mm silicon wafers. This breakthrough, announced in a recent press release, represents a crucial step towards integrating photonic and electronic components on a single chip, paving the way for next-generation silicon photonics.
Polish company implements industrial UPD technology in China
January 06, 2025
Polish company XTPL, which specializes in nano-printing for advanced electronics, has made the first industrial deployment of its proprietary Ultra Precise Dispensing (UPD) technology. The company is fulfilling an order for a Chinese display manufacturer listed on the Shenzhen Stock Exchange. The UPD modules will be used to repair defects in ultra-high-resolution displays.
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