NEC partners with MHI to strengthen Japan’s defense capabilities September 17, 2026 The two Japanese companies will contribute to the strengthening and transformation of defense capabilities by providing high-value-added and highly reliable products and services for the development of new command and control systems.
InoBat partners with PETL to strengthen European BESS solutions September 16, 2026 While InoBat will build on its established European presence and planned expansion into North America, Palmer Energy Technology Ltd (PETL) will leverage its strong position in the UK and Ireland. Both companies will address new markets together.
Thales, India’s KSSL sign agreement for 70-mm rocket systems September 15, 2026 Thales will leverage its partnership with India and contribute its expertise in 70-mm rockets and launchers developed in Belgium, while KSSL will utilise its local manufacturing and testing facilities to support production and integration of components from Thales’ supply chain.
HAL, Safran sign contract with SAFHAL to develop Aravalli engine September 14, 2026 India’s Hindustan Aeronautics Limited (HAL) and Safran Helicopter Engines have signed a contract with SAFHAL Helicopter Engines Pvt. Ltd. (SAFHAL) for the design, development, manufacture, supply and lifecycle support of a new-generation high-power helicopter engine.
Infineon extends collaboration with SolarEdge Technologies September 14, 2026 The collaboration builds directly on SolarEdge's SST platform with Infineon SiC components, first announced in November 2025. The SST is designed to enable direct medium-voltage (13.8-34.5 kV) to 800-1500 VDC conversion at over 99 percent efficiency.
Ceva partners with LG Electronics to accelerate UWB adoption September 11, 2026 The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.
EMA, FlowCAD acquisitions expand Cadence’s PCB design portfolio September 11, 2026 By integrating EMA and FlowCAD technology into the Cadence ecosystem, the company is building on a collaboration that spans over 20 years. Deeper integration with Allegro X and OrCAD X platforms will enable scalable library and data management capabilities.
Novo Nordisk Foundation to establish quantum chip fab in Copenhagen September 08, 2026 Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.
Intel Foundry and ASML report High NA EUV production milestone September 08, 2026 Intel Foundry and ASML have reported continued progress in High NA EUV lithography production, including more than one million wafers processed to date across early tool certification and testing, research and development, and volume production on select layers of Intel's Panther Lake processors — part of the Core Ultra Series 3 family.
Semiconductors, circularity and EMS strategy in focus in Gothenburg September 07, 2026 Evertiq Expo Gothenburg takes place on September 17 and brings together the Swedish and Nordic electronics industry for a full day focused on the semiconductor market, component management, PCB manufacturing and how the global EMS industry is changing.
LGES secures multi-year supply of US-produced lithium carbonate September 02, 2026 Under the contract, Smackover Lithium, a partnership between Standard Lithium Ltd. and Equinor, an international energy company, will supply LG Energy Solution with 8,000 metric tonnes of lithium carbonate annually over a 10-year period.
Nexperia reports 18% revenue growth in Q2 September 01, 2026 Nexperia has reported Q2 2026 revenue of USD 355.6 million, an increase of 18.4% compared to Q1. The company says profitability and cash generation also improved QoQ, with operations outside China achieving positive net income and operating cash flow.
Mahindra wins Airbus contract to manufacture A320 fuselage skins September 01, 2026 Mahindra Aerostructures will manufacture fuselage skins for Sections 18 and 19, covering the rear fuselage and tail sections of the Airbus A320neo and A321XLR aircraft. The components will be manufactured at Mahindra Aerostructures’ facility in Bengaluru.
Indichem inaugurates semiconductor materials plant in Gongju August 31, 2026 The facility makes ultra-high-purity chemicals that go into the semiconductor supply chain. Indichem is a Korean step-down subsidiary of Acutaas Chemicals Limited, an Indian manufacturer of specialty chemicals and pharmaceutical intermediates.
Navitas Semiconductor to acquire Claros for $233 million August 27, 2026 Navitas’ potential acquisition of Claros would extend the company’s AI infrastructure portfolio from the grid all the way to the xPU by bringing industry-leading VPD and IVR capabilities that can directly power the high-current, high-speed processors at the heart of modern AI systems.
Navitas partners with Magnachip to accelerate HV, UHV SiC adoption August 24, 2026 Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.
BEL collaborates with Ananth on advanced electronic systems August 21, 2026 The partnership will focus on indigenous design and development, system engineering, electronics manufacturing, integration, testing and production for current and future programmes of strategic importance.
Jubilant Ingrevia to acquire 40% stake in Zettaone August 20, 2026 Zettaone is an Indian electronics design and manufacturing platform with integrated capabilities in the electronics/semicon industry. It delivers engineering solutions for aerospace, defence, semiconductor, automotive, medical and industrial applications.
PCB material shortage spreads to standard FR-4 as structural shift deepens August 19, 2026 The PCB industry's material shortage is no longer confined to advanced laminates. According to a market update from Norwegian PCB supplier Confidee, the shortage has now spread to standard FR-4 and thicker copper-clad laminates – and conditions are not expected to ease through 2026 or into 2027.
TTM Technologies acquires Epiq Solutions for $1.1 billion August 18, 2026 TTM Technologies has entered into a definitive agreement to acquire Epiq Design Solutions, a provider of software-defined radios, high-performance RF products and space compute solutions for defence and signals intelligence applications. The all-cash purchase price is USD 1.1 billion.
Waaree secures $17 million order for medium voltage skids August 14, 2026 The 8.3 MVA MV skid is a plug-and-play, containerised solution developed by Waaree Transpower specifically for BESS applications. The complete solution is integrated within a 20-foot container, enabling efficient transportation, installation and deployment.
US startup Ravee Optics secures $6 million in seed round August 13, 2026 The company’s initial focus is addressing the limitations of current satellite communication technology by building optical communication systems designed for scale. Its hardware is smaller, lighter, and easier to produce in large volumes.
Liebherr-Aerospace Technology breaks ground on Shanghai facility August 11, 2026 Designed as a single-story steel-structured plant, it features a 30-meter span and a building height of 18.30 meters, providing ample space for the precision manufacturing and assembly of large-scale aircraft components.
Air Liquide invests $150M in Idaho semiconductor gas plant August 06, 2026 Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.
Linde wins semiconductor supply deal, to invest $1 billion in US August 04, 2026 Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.
ESCATEC expands advanced SMT capabilities in UK August 03, 2026 The investment will enhance production efficiency and flexibility while strengthening ESCATEC’s ability to support medical manufacturing programmes in the UK.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.
SK tes, EDB use robotics, AI to boost e-waste processing July 30, 2026 The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.
Mitsubishi Electric, Sony to advance vision sensor solutions July 29, 2026 The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.
EMS provider EC Electronics acquires Fastlink Data Cables July 28, 2026 Fastlink Data Cables is known for manufacturing high-quality cable assemblies and box build solutions, with particular expertise in supporting data centre critical power and cooling applications alongside long-established defence and aerospace programmes.
Gotion Power Morocco secures €100M loan for LFP battery project July 27, 2026 The African Development Bank Group, which approved the loan, also plans to mobilise up to an additional EUR 141 million from financial partners to support the implementation of this strategic project in Morocco.
NIELIT, SCL collaborate to advance chip innovation in India July 24, 2026 As part of this collaboration, the 1.2 µm Process Design Kit will be made available through eChipHub, and provide students, researchers, faculty members, startups, MSMEs and industry professionals with access to an indigenous semiconductor process technology for IC design and prototyping.