Evertiq - First In Electronics News & Expo

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2024

February 18, 2026
Back in December 2025, the City of Taylor, Texas, and the Taylor Economic Development Corporation (TEDC) announced an economic development agreement with Compal Electronics Inc. to establish a new advanced manufacturing facility in Taylor.

Dresden-location

February 16, 2026
Infineon Technologies supplies microcontrollers, Ethernet connectivity solutions, power management ICs, and smart power switches for BMW Group’s Neue Klasse platform. The architecture separates software from hardware, enabling over-the-air updates without physical modifications.

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new-technologies_8

February 03, 2026
In a recent analysis, Evertiq explored which countries dominate global R&D spending. Viewed through the lens of absolute investment volumes, the picture is largely shaped by the United States and China, followed by established industrial powerhouses such as Germany, Japan and France. Shifting that lens away from global heavyweights and toward a smaller, highly R&D-intensive economy reveals a different dynamic — one where the relationship between research investment and industrial capability becomes more clearly defined. Finland provides a useful case for understanding how research investment translates into industrial capability.

cosmos-2

January 30, 2026
Japan LEO Shachu was established in July 2024 as a wholly owned subsidiary of Mitsui with the aim of creating a new economy in Low Earth orbit (LEO) by leveraging Japan's technology and industrial foundation.

charger

January 29, 2026
Under the agreement, Wallbox will supply its commercial AC charger, eM4 Twin, as the primary hardware solution for initial Dutch deployments through Eneco eMobility’s installation network.

smart-brick

January 22, 2026
Denmark's Lego Group has unveiled LEGO SMART Play, a new interactive play platform based on electronically enabled bricks that respond to physical interaction. The platform was presented at CES 2026 in Las Vegas earlier this month.

opens-new-site-in-Malaysia

January 20, 2026
US-based AI semiconductor company Syntiant has opened a new manufacturing and research facility in Penang, Malaysia.

January 15, 2026
This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.

January 13, 2026
Farnell has entered into a new global distribution partnership with Fulham, expanding access to advanced LED drivers, emergency lighting and intelligent control solutions for customers across EMEA.

hynix_DDR5_RDIMM

January 09, 2026
As an Intel Data Center Certified system/platform, 256GB DDR5 RDIMM has completed extensive testing and rigorous validation by Intel’s Advanced Data Center Development Laboratory.

DRAM5-products

January 05, 2026
Global memory prices are set to rise sharply in the first quarter of 2026 as suppliers continue to prioritise server and AI-related applications, according to TrendForce.

PCB-India_2

January 05, 2026
These approvals are expected to generate 33,791 direct employment opportunities and include manufacturing of 11 target segment products with cross-sectoral applications such as mobile manufacturing, telecom, consumer electronics, strategic electronics, automotive and IT hardware products.

ZF_acquisition

December 26, 2025
By integrating ZF’s Advanced Driver Assistance Systems (ADAS) capabilities with Harman’s flagship Digital Cockpit offerings within a centralized compute design, the acquisition bolsters Harman’s roadmap for next-generation vehicle architectures.

Electronics_logo

December 23, 2025
Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.

new-technologies_5

December 19, 2025
IBM and Confluent will enable end-to-end integration of applications, analytics, data systems and AI agents to drive intelligence and resilience in hybrid cloud environments.

Chip

December 18, 2025
Avnet Silica has entered into a new franchise agreement with DeepX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful AI semiconductor technology.

December 17, 2025
Betronic Group, a Dutch provider of electronics solutions and components, has acquired Irish EMS provider Smart Electronics, the companies announced in a press release

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

Ewelina-Bednarz_Column-1

December 17, 2025
During this year’s Evertiq Expo in Kraków, the topic of defense electronics filled the conference room to capacity. The top list of defense companies I presented turned out to be only a starting point for conversations that continued long after the session had ended. Behind each of these manufacturers stand dozens of electronics suppliers: semiconductor producers, PCB and RF module manufacturers, and specialized EMS companies. So I asked myself a simple question: which defense technologies drove electronics demand most strongly in 2025? Let’s look at them from the industry’s point of view rather than from a catalogue of weapon systems.

Powernet_KEC_MOU

December 12, 2025
Wise will supply its GaN power devices, digital-control expertise and technical support; Powernet will lead the development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC will manage backend manufacturing.

Ideenion_MOU

December 08, 2025
Together, the companies will co-develop next-generation electrification solutions for high-performance and commercial vehicles, marine platforms, and energy storage systems, with a strong focus on the European market.

chip

December 08, 2025
In addition, based on this platform, Japanese imaging solutions leader CIS Corporation has announced the first A-PHY camera module for machine vision.

building

December 03, 2025
The company also plans to increase its phone manufacturing capacity by 30 million units to a total of 140 million units annually, and produce charging devices for smart rings.

Materials_campus

November 28, 2025
The new investment by venture studio Ferment and existing investor LIOF, alongside prior investment from Fibrant BV, will accelerate commercial scale-up of Dutch materials company Pegasus’s products for the electronics, data center and aerospace industries.

Partnership

November 27, 2025
Congatec and Kontron have together announced new modular and secure embedded platforms. At the core of this collaboration is the integration of KontronOS, Kontron’s secure, Linux-based operating system, with congatec’s application-ready aReady.COM hardware and software building blocks.

employee-with-chip

November 27, 2025
ASIC specialist Presto Engineering Group has acquired Garfield Microelectronics Ltd. (GFMicro), a UK-based design house established in 1993 – a move that will create Europe’s most comprehensive “design-to-production” one-stop shop for ASIC.

BEL_agreement

November 26, 2025
The Joint Venture Cooperation (JVC) will localise the manufacturing, supply and maintenance of the Highly Agile Modular Munition Extended Range (HAMMER) weapon to meet the operational needs of India’s Air Force and Navy.

group_project_MP

November 25, 2025
In phase I, the Indian renewable energy firm will establish a 3 GW solar cell and 4 GW solar module manufacturing facility in Madhya Pradesh, followed by backward integration into ingot and wafer production in subsequent phases.

Dave-Doherty_2

November 19, 2025
The global components market is entering a new phase — one that is neither the pandemic-driven scramble for inventory nor the more recent period of oversupply. In a conversation with Evertiq, DigiKey CEO Dave Doherty describes an industry standing at a fragile point of transition, shaped by both uncertainty and accelerating structural change.

Cyient_chip

November 19, 2025
Developed collaboratively by Azimuth AI and Cyient Semiconductors, ARKA GKT-1 integrates multi core custom computing, advanced analog sensing, memory and intelligent power management into a single, highly energy-efficient SoC.

Ajeet_Drone

November 18, 2025
The collaboration aims to develop next-generation AI-based teaming algorithms for swarm drones, along with real-time, context-based object recognition and identification capabilities across Zuppa’s existing UAV offerings.

SOCAMM2_DRAM

November 17, 2025
The 192GB SOCAMM2 uses Micron’s most advanced 1-gamma DRAM process technology to deliver greater than 20% improvement in power efficiency, further enabling power design optimization of large data center clusters.

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