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August 21, 2026
Micron Research Labs will center on a flagship Boise campus designed to support advanced research across critical technology domains. Key research areas include critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.

Semiconductor_Malaysia

August 13, 2026
Adding approximately 500,000 square feet of production space, the facility will expand NXP’s current operations in Malaysia, which are dedicated to supporting the assembly and testing of NXP’s broad product portfolio.

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Indie

August 07, 2026
Rashi will transfer its semiconductor business division into a wholly owned subsidiary headquartered in Bengaluru and step-down subsidiary headquartered in Singapore. Restar Corporation will subsequently acquire a 26% equity stake in the subsidiary.

axonite_chip

August 06, 2026
Under the partnership, the two companies will design, build and industrialise the key fabrication equipment behind the metalens value chain, from research and development through to high-volume manufacturing.

fab-P12

July 30, 2026
Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.

tes_logo

July 30, 2026
The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.

PCB-world_2

July 28, 2026
Companies are reassessing where they build, how much flexibility they need, which suppliers they depend on and where financial decisions are made.

geralt_AI

July 24, 2026
The two parties will draw on their respective strengths in global energy, power optimization, capital deployment, and AI data center technology to pursue in-depth cooperation in global AI infrastructure development.

CostaRica

July 17, 2026
With completion of construction, the focus has now shifted to ramping up the new production and logistics operations. The investment lays the foundation for continued growth while strengthening the German EMS provider’s global manufacturing footprint.

machine

June 24, 2026
Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.

Semiconductor_SinChip

June 17, 2026
This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.

Building-boundry-Switzerland

June 16, 2026
Swiss EMS provider Cicor is divesting its Tunisia production facility and launching an integration and productivity programme expected to deliver recurring EBITDA improvements of more than CHF 10 million annually. The programme affects approximately 220 positions, equivalent to 5% of the company's total headcount.

Singapore_facility

June 12, 2026
The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.

Singapore-facility

June 11, 2026
Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

Robotics

June 08, 2026
The company operates a fleet of all-electric, AI-optimized unmanned surface vessels to solve maritime infrastructure challenges. By utilizing AI for autonomous navigation and data analytics, it ensures operational efficiency without manual intervention.

May 22, 2026
Located within Avnet’s existing Farnell Distribution Center in Singapore, the new integration facility is designed to support system, server, and rack build services, as well as international shipping.

Technologies_logo

May 20, 2026
The acquisition establishes AP Technologies’ first European operation in Ireland’s medtech corridor, and extends its catheter platform into the laser-processed metallic components used in next-generation minimally invasive devices.

partnership_Franz26

April 20, 2026
Seal Dynamics’ presence in Asia and Brazil will connect aerospace OEMs with Greene Tweed’s high-performance solutions, including advanced sealing systems and Xycomp DLF thermoplastic composites, that address their specific challenges.

axonite_chip

April 08, 2026
BITSILICA’s diverse service portfolio will complement Quest Global’s existing strengths as an engineering solutions provider by expanding its capabilities in semiconductors and embedded systems.

AI_Data_Center

April 02, 2026
Singapore has charged an additional individual in an ongoing fraud investigation linked to the handling of AI server equipment, according to Reuters.

groundbreaking-production-Singapore

March 24, 2026
WEVO-CHEMIE GmbH is expanding its footprint in Asia-Pacific with a new production facility in Singapore.

Alif_partnership

March 23, 2026
Brilliant Labs’ Halo Glasses will be powered by Alif Semiconductor’s Balletto B1 MCU, an ultra-low-power microcontroller with a dedicated Neural Processing Unit (NPU) that enables on-device AI processing.

EPIC-Semiconductor-Centre

March 11, 2026
Applied Materials and SK hynix have signed a long-term research and development agreement aimed at accelerating the development of next-generation memory technologies for artificial intelligence systems.

March 05, 2026
Japanese electronics company TDK has established a new Asia-Pacific regional headquarters (APAC RHQ) in Bengaluru, India, effective 1 April 2026. The move marks the company’s fifth regional headquarters, alongside Japan, Europe, the Americas and China.

team

March 05, 2026
The funds will be used for product research and development focused on next-generation electronic warfare and communication payloads across platforms, including drones, ground systems, naval vessels and satellites.

expansion-map-recruitment

February 19, 2026
French aerospace, defence and electronics company Thales says it plans to recruit more than 9,000 employees globally in 2026.

Globalfoundries-deal-2026

February 17, 2026
US semiconductor foundry GlobalFoundries and Japanese Renesas Electronics have expanded their manufacturing partnership in a multi-billion-dollar deal aimed at increasing semiconductor production in the United States.

Headquarters

February 12, 2026
Automotive technology company Aumovio plans to reduce up to 4,000 research and development positions globally as part of measures to improve efficiency in a challenging market environment, the company said.

Groundbreaking-singapore-expansion-2026

January 27, 2026
Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned investment of approximately USD 24 billion over the next ten years.

Siplace-machines-2026

January 27, 2026
ASMPT has initiated a review of strategic options for its SMT Solutions segment. The company said the assessment is intended to support long-term value creation while allowing ASMPT to focus more closely on its Semiconductor Solutions segment.

Quantum_Alice_Bob

January 22, 2026
By integrating A&B’s emulators with Triple Alpha, Horizon Quantum’s development infrastructure, the companies seek to create a full-stack solution for quantum application development that combines best-in-class technologies at both the hardware and software levels.

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

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