NXP breaks ground on assembly and test factory in Malaysia
Adding approximately 500,000 square feet of production space, the facility will expand NXP’s current operations in Malaysia, which are dedicated to supporting the assembly and testing of NXP’s broad product portfolio.
NXP Semiconductors has broken ground on its new assembly and test (A&T) factory in Petaling Jaya, Malaysia, an expansion of the company’s existing A&T site.
Adding approximately 500,000 square feet of production space, the facility will expand NXP’s current operations in Malaysia, which are dedicated to supporting the assembly and testing of NXP’s broad product portfolio. Upon completion of the new factory, the total site will encompass around 900,000 square feet of production space, NXP said in a press release.
The factory is expected to begin ramping production in the first quarter of 2028, with the site’s overall output projected to more than double once fully operational. The added A&T capacity will help support future growth across NXP’s manufacturing ecosystem, including expected output from the VSMC joint venture in Singapore and the ESMC joint venture in Dresden, Germany, the company said.
“Malaysia has been an important part of NXP’s global manufacturing footprint for decades, with a strong semiconductor ecosystem and skilled talent base,” said Andy Micallef, Executive Vice President and Chief Operations and Manufacturing Officer, NXP Semiconductors. “This expansion builds on that foundation, increasing our assembly and test capacity while diversifying operations to strengthen supply chain resilience and flexibility for customers worldwide.”
Designed as a highly automated smart factory, the facility will feature Automated Material Handling Systems (AMHS) and advanced quality management technologies to optimize manufacturing operations, improve efficiency and support high-quality production, NXP said.
