Renesas acquires Pictorus to accelerate embedded system development June 19, 2026 With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.
Tech Mahindra partners with Viam to scale advanced robotics June 19, 2026 As a core partner in physical AI, Viam will work with Tech Mahindra to provide their global enterprise clients with direct access to the Viam platform for managing and maintaining robotic fleets at scale.
Siemens, HighByte partner on industrial data operations June 18, 2026 Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.
Samsung, LG Uplus collaborate on ISAC technology for 6G June 18, 2026 Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.
Principal Mineral acquires Isola, raises $280M for next growth phase June 17, 2026 Principal Mineral has acquired Isola Group, a century-old manufacturer of copper-clad laminates and dielectric prepregs, and raised approximately USD 280 million to fund its next phase of growth. The deal closed on June 16, 2026.
Hitachi, Google Cloud expand alliance to advance physical AI June 15, 2026 Through the strategic alliance, Hitachi will establish and globally deploy Hitachi’s Forward Deployed Engineers (FDEs) model that leverages its strengths in IT, OT, and products cultivated through Lumada, together with Google Cloud’s advanced AI.
Neura Robotics secures $1.4 billion to advance physical AI platform June 12, 2026 German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.
Hitachi, Intel to accelerate AI transformation across industries June 12, 2026 The companies plan to combine Hitachi’s IT expertise, operational technology and product manufacturing knowledge with Intel’s computing capabilities and silicon-based platforms to develop next-gen compute capabilities and industry solutions.
ICEYE raises over €1 billion, valuation surpasses €10 billion June 11, 2026 ICEYE has completed its Series F financing round, raising more than EUR 1 billion in total. The company secured EUR 450 million in new capital, while the overall transaction value – including share sales by existing shareholders – exceeded EUR 1 billion. Following the round, ICEYE's valuation has risen to more than EUR 10 billion.
UK quantum computing company OQC raises $350 million June 10, 2026 The funding will be used to expand OQC’s operational presence in priority markets and accelerate its roadmap toward commercially useful, fault-tolerant quantum computing.
Siemens partners with Samsung Foundry to advance silicon design June 09, 2026 Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.
Dutch firm Nebius breaks ground on AI factory in Missouri June 08, 2026 Creating 1,200 construction jobs and 130 permanent high-tech positions at full operation, Nebius’s Independence (Missouri) investment is also expected to generate USD 650 million in tax payments to local school districts and taxing jurisdictions.
Murata partners with Xona to advance satellite PNT technologies June 05, 2026 The companies will explore the potential to provide optimal products and solutions by combining Murata’s expertise in high-frequency and wireless communications, sensors, timing devices and module design with Xona’s LEO-based positioning and timing synchronization technologies.
Fujitsu signs strategic partnership with Anthropic May 29, 2026 Through this collaboration, Fujitsu will gain early access to Anthropic’s latest AI models and, by developing and delivering solutions that utilize these models, will provide customers with more advanced and practical AI applications.
Zirconn launches SMT division in China May 28, 2026 Zirconn is expanding its manufacturing capabilities in China. The company has launched a new SMT assembly division aimed at increasing its capacity to deliver advanced electronic projects for customers in Europe and international markets.
Global PCB material supply tightening: What the market is experiencing today May 27, 2026 The global raw material supply continues to pressure the electronic industry and not least the PCB manufacturing sector. What initially affected a narrow range of high-frequency materials has now evolved into a broader scope, impacting both advanced laminates and standard FR-4 materials.
Quectel expands EMEA reach with Future Electronics deal May 27, 2026 Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.
Micron starts 1α DRAM production at Virginia fab in $2 billion expansion May 26, 2026 US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.
Sungrow, Masdar sign 7.5GWh ESS deal for UAE project May 25, 2026 Under the agreement, Chinese company Sungrow will supply 7.5GWh of PowerTitan 3.0 ESS, alongside 2.6GW of PV inverter solutions to supporting the gigascale renewable energy project’s operational reliability and efficiency.
EMS in Sweden – Ten factories, half the market May 21, 2026 57.5%. That is the share of the entire Swedish EMS market held by just ten individual production sites. Not ten companies – ten factories.
India, EU launch €15.2M initiative to boost battery recycling May 21, 2026 The call, jointly funded by the EU’s Horizon Europe program and India’s Ministry of Heavy Industries, will support the development of recycling technologies, including high-efficiency material recovery, safe and digitalised collection systems, and pilot-scale demonstration of innovative processes.
Intuitive Machines to acquire Goonhilly Earth Station and COMSAT May 21, 2026 The acquisition, which will include the Goonhilly Lunar and Deep Space Communications, Commercial Satcom, and Defense and Security divisions, significantly expands global ground station resources and capacity on Intuitive Machines’ integrated space-to-ground network.
Hyundai partners with KAI to develop future air mobility May 15, 2026 The two parties will leverage Hyundai Motor Group’s expertise in electrified aviation powertrain development and Korea Aerospace Industries’s aircraft airframe development capabilities to jointly develop and mass produce competitive future air mobility aircraft.
Shrinking semiconductor lifespans put obsolescence management to the test May 12, 2026 As semiconductor lifecycles increasingly mirror consumer electronics timelines, the pressure on manufacturers in long-life industries to manage component obsolescence is intensifying. Gunter Mößinger of HTV ALTER TECHNOLOGY addressed the issue head-on at Evertiq Expo Tampere – and the picture he painted is one the industry can no longer afford to ignore.
Heart of the electronics industry beats again in Kraków May 08, 2026 Evertiq Expo Kraków 2026 brought the electronics industry back to Kraków on May 7. The industrial atmosphere of CFK13, with its distinctive 1930s character, set the stage for discussions about where the Polish and European electronics industries are heading next.
Flex to spin off cloud and power infrastructure business May 06, 2026 US electronics manufacturer Flex will split into two independent publicly traded companies, separating its fast-growing cloud and power infrastructure segment from its core contract manufacturing operations. The transaction is targeted to close in the first quarter of 2027.
Digitalisation increases risk. Companies are not ready May 05, 2026 Just a year ago, during the panel “Cybersecurity in the era of integrated electronic systems” at Evertiq Expo Kraków, uncertainty dominated the discussion. Companies knew new regulations were coming, but lacked clarity – both in terms of scope and implementation. Today, that situation is beginning to shift. Regulations are coming into force, and with them, pressure is mounting – particularly in the industrial and electronics sectors – to treat cybersecurity as an operational concern, not merely a formal requirement.
Accenture, Vodafone Procure & Connect, SAP advance humanoid robotics May 01, 2026 SAP led the integration of the robots into the warehouse management system, while Accenture designed and deployed the robot intelligence and operational framework, drawing on its expertise in physical AI, advanced robotics and digital twin environments.
Growth surge masks structural strain in semiconductor market April 30, 2026 During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.
Ventec evaluates US manufacturing expansion April 29, 2026 Ventec International Group is evaluating the potential establishment of a manufacturing facility in the United States as part of efforts to support its growing North American customer base.
Flex expands Teradyne Robotics partnership to scale factory automation April 28, 2026 US-based EMS provider Flex is expanding its partnership with Teradyne Robotics to accelerate the deployment of automation technologies across its global production footprint.
Siemens accelerates AI chip verification with Nvidia technology April 24, 2026 Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.