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eGX

June 26, 2026
Since their introduction in 2021, eGX Series electric power unit models with a maximum output of 1.8 kW, have been adopted by work equipment manufacturers, primarily for small-sized equipment such as rammers and plate compactors.

machine

June 24, 2026
Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.

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June 19, 2026
With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.

building_logo

June 18, 2026
The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.

quantum-technologies-1

June 18, 2026
The agreement creates a foundation for the companies to jointly identify high-impact industrial use cases and explore quantum and hybrid quantum-classical approaches for next-generation engineering workflows.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

Honda_Hanoi_MoU

June 15, 2026
The three parties will work together to build an electric two-wheeler ecosystem that includes Battery Swapping Stations in central Hanoi, battery standards, safety management systems, and new platform-based business models for electric two-wheelers.

quantum-computer_geralt

June 10, 2026
The funding will be used to expand OQC’s operational presence in priority markets and accelerate its roadmap toward commercially useful, fault-tolerant quantum computing.

PCB-Japan_2

June 09, 2026
As a result of this latest capital increase by Japan’s Information-Technology Promotion Agency (IPA), Rapidus’ funding now totals 424.95 billion yen (about USD 2.7 billion).

fiber_network_thedigitalartist

June 08, 2026
The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.

headoffice

June 05, 2026
The companies will explore the potential to provide optimal products and solutions by combining Murata’s expertise in high-frequency and wireless communications, sensors, timing devices and module design with Xona’s LEO-based positioning and timing synchronization technologies.

Yokaichi-and-Tome

June 03, 2026
Japanese component manufacturer Murata has broken ground on two new production buildings in Japan within the space of two weeks, adding to a capacity expansion programme that saw a third building completed in April. The new facilities will produce thermistors, chip inductors and noise suppression filters.

NEXTY

June 01, 2026
NEXTY has been a pivotal partner for Eatron since its early Japan market entry, providing the strategic insight and technical support needed to navigate the automotive and industrial sectors.

May 29, 2026
The investment is part of Indian startup C2i Semiconductors’ USD 16.7 million Series A funding round, which includes participation from Peak XV Partners and other investors

Laboratory

May 22, 2026
A Tokyo university is planning a futuristic district where humanoid robots, autonomous vehicles and drone deliveries will operate as part of everyday urban life — turning an entire neighbourhood into a live test environment for next-generation technologies.

BG8_SSD

May 18, 2026
Compared to the previous generation, the KIOXIA BG8 Series achieves up to 47 % higher sequential read, 67 % higher sequential write, 44 % higher random read, and 30 % higher random write performance.

ww-materials-market

May 13, 2026
Global semiconductor materials market revenue increased 6.8% year-over-year to USD 73.2 billion in 2025, SEMI reports

quantum-computer_geralt

May 07, 2026
With this latest round, the Japanese startup will accelerate R&D and commercialization of a quantum optical interconnect interface based on micro-optical cavities and a distributed ion-trap quantum computing architecture, building on research outcomes from OIST.

March-2026

May 05, 2026
Global semiconductor sales reached USD 298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025, reports SIA.

Expo-ZRH26-claus-speaking

April 30, 2026
During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.

Australia

April 30, 2026
Under this contract, Japan’s NEC Corporation will provide equipment including underwater-related equipment such as surface ship sonars as well as communications and navigation-related equipment.

April 27, 2026
Hitachi Global Life Solutions will spin off its home appliance business into a new company that Nojima will acquire a 80.1 percent stake in for about 100 billion yen (USD 630 million) through a special purpose company.

Top-30

April 23, 2026
The global EMS/ODM industry continues to expand, but scale and growth remain unevenly distributed, with Asian players flexing their dominance while Europe lags behind, according to new research from in4ma and EMSNOW.

X-raymetrology_Onto

April 22, 2026
By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.

PCB-Japan_2

April 21, 2026
A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.

partnership_Franz26

April 20, 2026
Seal Dynamics’ presence in Asia and Brazil will connect aerospace OEMs with Greene Tweed’s high-performance solutions, including advanced sealing systems and Xycomp DLF thermoplastic composites, that address their specific challenges.

Liquide_Japan

April 20, 2026
Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.

April 20, 2026
The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.

Kawasaki-main-office

April 17, 2026
Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.

center_NY_Creates

April 17, 2026
Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

PCB-Japan_1

April 13, 2026
Established in 2022, Rapidus has secured funding from both the public and private sectors. It is aiming to mass-produce cutting-edge chips using 2-nanometer technology by 2027.

April 13, 2026
The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

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