Evertiq - First In Electronics News & Expo

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Hithium_partnership

April 24, 2026
Under the agreement, Turbo Energy will integrate its proprietary AI-driven software platform with Hithium’s battery storage systems, delivering fully optimized, end-to-end solar energy solutions tailored to complex C&I environments.

BMIT_MoU

April 24, 2026
This strategic partnership aims to strengthen efforts towards fostering indigenous design and production capabilities in advanced technology domains critical to national defence.

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Top-30

April 23, 2026
The global EMS/ODM industry continues to expand, but scale and growth remain unevenly distributed, with Asian players flexing their dominance while Europe lags behind, according to new research from in4ma and EMSNOW.

quantum-technologies-1

April 23, 2026
By enabling seamless hybridization between classical HPC and quantum computing, the partnership aims to lower the barrier for industrial and scientific adoption of quantum-accelerated workloads.

April 23, 2026
With this acquisition, US-based startup Skild AI aims to accelerate the deployment of robotics automation solutions alongside its general-purpose Skild Brain.

TSMC

April 23, 2026
TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.

Newen

April 23, 2026
The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

DRS_logo

April 23, 2026
These Missile Defense Agency (MDA) Scalable Homeland Innovative Enterprise Layered Defense (SHIELD) indefinite-delivery/indefinite-quantity (IDIQ) contracts encompass a broad range of work areas that allow for rapid delivery of innovative capabilities.

conference-map-2026-VIENNA

April 22, 2026
Evertiq will expand its Evertiq Expo format with a first-ever event in Vienna, Austria, scheduled to take place on February 4th, 2027.

April 22, 2026
The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

quantum-technologies-1

April 22, 2026
Sygaldry servers are designed to address constraints in AI training and inference by operating alongside classical infrastructure within the data center. The company is also developing quantum algorithms that plug into the tools AI researchers already use.

TVS_agreement

April 22, 2026
Under the agreement, Hyundai will lead the design of and co-develop the Electric Three-Wheeler (E3W) by leveraging its research and development expertise, advanced mobility technologies and human-centric design approach.

circuit-board

April 22, 2026
As global supply chains remain under pressure and geopolitical uncertainty continues to reshape sourcing strategies, partnerships built on local capabilities are gaining importance. In this context, two Polish companies — Unisystem and SoMLabs — have announced a closer collaboration aimed at jointly delivering technology projects based on complementary products and expertise.

X-raymetrology_Onto

April 22, 2026
By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.

cleanroom

April 22, 2026
Designed as a central hub for innovation, the semiconductor cleanroom facility will support the assembly of new equipment, along with testing, validation and customer demonstration activities.

Dominik-Kowalczyk

April 21, 2026
In many projects, electromagnetic compatibility (EMC) is still treated as a final-stage verification step. In practice, this approach increasingly leads to delays, costly redesigns and errors that are difficult to eliminate — particularly in complex defence systems. As Dominik Kowalczyk, an explosion protection specialist at Dacpol, told Evertiq, EMC analysis should cover the entire lifecycle of a project — from concept to deployment. He also pointed out where signal integrity is most often lost and why the traditional approach to EMC is no longer keeping pace with growing system complexity.

Electronics_REF_ARIF240GaN

April 21, 2026
REF_ARIF240GaN is specifically designed to support the launch of EZ-PD PMG1-B2, Infineon’s newest USB PD 3.2 controller, featuring up to 240W USB sink capability and integrated buck-boost functionality in a compact single package.

Robotics

April 20, 2026
The capital will be used to enhance the product portfolio and boost commercial development. Over 50 units of ALEX RS, a device for neuromotor rehabilitation of the upper limb, have already been installed internationally.

Liquide_Japan

April 20, 2026
Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.

battery_tech

April 20, 2026
The resources secured through the entry of Axon Partners Group and the support of CDTI-Innvierte will enable Spanish company Basquevolt to advance its industrial roadmap, including the scale-up of electrolyte production.

turbocharger

April 17, 2026
BorgWarner’s VTG turbocharger technology enables precise control of engine operation, optimizing performance across a broad range of engine speeds and integrating advanced combustion strategies to boost efficiency, enhance fuel economy and lower emissions.

Kawasaki-main-office

April 17, 2026
Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.

center_NY_Creates

April 17, 2026
Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

top-image-generic

April 16, 2026
The European Commission has unveiled a new EUR 115 million funding instrument aimed at accelerating the development and deployment of disruptive defence technologies, with a strong focus on SMEs, start-ups and scale-ups across the EU.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

Sowa-interview-2025-krk

April 16, 2026
Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.

motherboard-Switzerland

April 15, 2026
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.

MoU_Indra

April 15, 2026
The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.

Ukraine-Kvertus

April 14, 2026
For years, defence electronics followed a relatively stable logic. Systems were designed against defined threat models, tested in controlled environments, certified, and then deployed with the expectation that they would remain valid over time.

3D-Nand

April 14, 2026
Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

M12

April 14, 2026
M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.

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