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expo-ber25-Dieter-Weiss-pres

February 27, 2026
Unilateral dependence on Asia for PCBs is a strategic risk. For six years, global geopolitics has been showing us more and more clearly that supply chains are fragile. The pandemic caused massive disruptions, semiconductor shortages led to allocations, the war in Ukraine exacerbated raw material uncertainties, and protectionist measures by the US and the deliberate isolation of Asian markets have made free global trade an illusion.

advanced-semiconductor-manufacturing-facility

February 27, 2026
Hitachi Energy and Pakal Technologies have announced a collaboration to develop next-generation high-voltage silicon power semiconductor modules rated at ≥3.3 kV.

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Expansion-2026

February 27, 2026
Intervala has invested more than USD 6 million in new manufacturing technology, automation and facility expansion to strengthen its high-reliability electronics manufacturing capabilities.

February 26, 2026
SK hynix and Sandisk have announced the start of a global standardisation initiative for next-generation memory solution, High Bandwidth Flash (HBF) aimed at the AI inference era.

02-2006

February 25, 2026
European PCB manufacturing increased by 2.4% in 2025, while the global PCB market expanded by more than 11%, according to Data4PCB. At the same time, 11 manufacturers exited the market, reducing the European PCB base to 168 companies operating 182 facilities.

February 25, 2026
The world’s largest semiconductor foundry, TSMC, has approved a capital injection of USD 44.96 billion to expand production capacity. The decision was made during a board meeting on 10 February 2026 in Hsinchu, Taiwan.

product

February 24, 2026
SEALSQ Corp and its parent WISeKey International Holding, are planning to move their Geneva headquarters to the Pont-Rouge district in August 2026. The relocation coincides with the launch of the Geneva Quantum Centre of Excellence, intended to consolidate the group’s research and industrial deployment of quantum computing, post-quantum cybersecurity, and secure semiconductor technologies.

Anirudh-Devgan-president

February 24, 2026
US-based Cadence Design Systems has completed its acquisition of the Design and Engineering (D&E) business from Swedish technology group Hexagon AB, in a deal valued at approximately EUR 2.7 billion.

automotive-lighting-plant-india

February 24, 2026
Motherson has inaugurated a manufacturing facility in Sanand, Gujarat, India, established as a strategic joint venture with Marelli. The plant is dedicated exclusively to producing exterior automotive lighting systems and expands the group’s capabilities in automotive component manufacturing.

production-2026

February 23, 2026
DATA MODUL is expanding its industrial product assembly services, offering end-to-end manufacturing solutions designed to increase flexibility, quality, and planning reliability, the company states in a press release.

February 23, 2026
SoftBank's subsidiary SAIMEMORY has signed a collaboration agreement with Intel Corporation to advance the development and commercialisation of Z‑Angle Memory (ZAM), a next-generation memory technology designed for high capacity, high bandwidth and low power consumption.

February 23, 2026
Japanese electronics manufacturer Sony and TCL Electronics Holdings Limited have signed a memorandum of understanding (MoU) to explore the establishment of a joint venture in the home entertainment segment.

sign-on-building

February 20, 2026
US semiconductor company Qualcomm says it plans to invest up to USD 150 million in India’s technology and AI startup ecosystem through a new strategic venture fund.

Jochen-Hanebeck-portrait

February 20, 2026
German semiconductor manufacturer Infineon Technologies plans to extend the contracts of Chief Executive Officer Jochen Hanebeck and Chief Financial Officer Sven Schneider ahead of schedule.

researchers-working

February 19, 2026
Austria-based AT&S is funding the establishment of a new microelectronics research group at Graz University of Technology (TU Graz), with a focus on IC substrates and advanced packaging technologies.

Switzerland_1

February 19, 2026
Switzerland is regularly described as one of the world’s most innovative economies. In the Global Innovation Index, the country has repeatedly ranked first, ahead of much larger industrial nations. This position reflects a combination of high R&D intensity, strong patent activity and a dense network of research-performing companies. Yet these aggregate indicators say relatively little about how innovation is structured in practice, and even less about the position of electronics within the Swiss economy.

flag

February 18, 2026
Swedish network and telecommunications company Ericsson has selected Yokohama as the location for its new research and development centre in Japan, according to a press release issued by the company.

Blackwell

February 18, 2026
US chip designer Nvidia has entered a multiyear, multigenerational strategic partnership with Meta Platforms that will include the deployment of millions of Nvidia GPUs.

GaN-300-millimeter-Technology

February 18, 2026
German semiconductor manufacturer Infineon Technologies expects the gallium nitride (GaN) power semiconductor market to reach nearly USD 3 billion by 2030, according to the 2026 edition of its annual “GaN Insights” report.

nexperia-3

February 18, 2026
Invest International has signed a USD 60 million term loan agreement with Nexperia to support the company’s 2026 global production capacity expansion programme.

suits-products

February 17, 2026
Estonian energy storage and supercapacitor company Skeleton Technologies is accelerating its US expansion as artificial intelligence infrastructure increasingly strains power grids nationwide. The company said it will open a new engineering facility in Houston, Texas, and establish local manufacturing for AI data center solutions during the first half of 2026.

Globalfoundries-deal-2026

February 17, 2026
US semiconductor foundry GlobalFoundries and Japanese Renesas Electronics have expanded their manufacturing partnership in a multi-billion-dollar deal aimed at increasing semiconductor production in the United States.

Dresden-location

February 16, 2026
Infineon Technologies supplies microcontrollers, Ethernet connectivity solutions, power management ICs, and smart power switches for BMW Group’s Neue Klasse platform. The architecture separates software from hardware, enabling over-the-air updates without physical modifications.

Sponsored content by Arrow Electronics

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Arrow Electronics will showcase a broad range of technologies from its global supplier network at embedded world 2026 (Stand 4A-342), demonstrating core embedded capabilities across system design, development and deployment.

groudbreaking-RD-center-Hsinchu-Taiwan

February 15, 2026
Industrial Technology Research Institute (ITRI) has broken ground on a new Advanced Semiconductor R&D Centre at its headquarters campus in Hsinchu, Taiwan.

lab

February 13, 2026
Applied Materials has reached a settlement with the US Department of Commerce’s Bureau of Industry and Security (BIS) over alleged violations of export regulations. The company will pay USD 252.5 million, the second-highest penalty ever imposed by BIS.

inspection

February 13, 2026
Camtek has received an order worth approximately USD 25 million for its Hawk inspection systems from a tier-1 integrated device manufacturer (IDM).

global-wafer-shipments-msi-february-2026

February 12, 2026
Global silicon wafer shipments increased in 2025, while total wafer revenue declined slightly, according to year-end data from SEMI.

EPIC-Semiconductor-Centre

February 12, 2026
Samsung Electronics will join Applied Materials’ EPIC (Equipment and Process Innovation and Commercialisation) Centre in Silicon Valley, a semiconductor research and development facility backed by a USD 5 billion investment.

Headquarters

February 12, 2026
Automotive technology company Aumovio plans to reduce up to 4,000 research and development positions globally as part of measures to improve efficiency in a challenging market environment, the company said.

building_logo

February 11, 2026
Marvell Technology has completed its previously announced acquisition of XConn Technologies, a provider of advanced PCIe and CXL switching silicon.

Chipbond-Technology-opening-Penang-Facility

February 11, 2026
Taiwanese semiconductor packaging and testing company Chipbond Technology has officially opened a new manufacturing facility in Penang, Malaysia, marking a major step in the company’s global expansion.

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