Evertiq - First In Electronics News & Expo

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Following the companies’ announcement of Canada’s first commercial virtualized and O-RAN network in February 2024, the RIC implementation will enable TELUS to harness AI throughout network operations and management.

CEO_Kuldeep_Gupta

This collaboration combines ChemVolt Global’s expertise in project development, engineering, procurement, and construction (EPC) and local market execution, with ElevenEs’ experience in LFP cell technology and large-scale European manufacturing.

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Battery_Alexandra_Koch

The partnership brings together Smartports’ scalable carport architecture and integrated charging with Rebaba’s circular storage technology, enabling sites to generate, store and deliver clean power directly where it is used.

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Isuzu is working to commercialize the next-generation fuel cell (FC) route bus as a new technology. Toyota is advancing various initiatives in producing, transporting, storing and using hydrogen in collaboration with a wide range of partners across industries.

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Marco Pieters will take on the role as Executive Vice President and Chief Technology Officer of ASML, reporting to President and Chief Executive Officer, Christophe Fouquet.

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Mercedes-Benz has announced a collaboration with semiconductor company Athos Silicon to accelerate the development of advanced chiplet architectures for autonomous computing.

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Imec has launched a new 300mm gallium nitride (GaN) program aimed at advancing power electronics technology and reducing manufacturing costs.

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VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

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Arduino

Qualcomm Technologies has agreed to acquire open-source hardware and software company Arduino, integrating one of the world’s largest developer ecosystems into its edge computing and AI portfolio.

Fujitsu has an expanded collaboration with Nvidia aimed at developing a full-stack AI infrastructure that integrates AI agents and high-performance computing systems. The companies said the initiative is intended to accelerate industrial transformation and AI adoption across sectors such as healthcare, manufacturing, and robotics.

ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, and NewPhotonics, a designer of photonic integrated circuit (PIC) chips for data centre optical interconnect, have entered into a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.

Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its planned investment to USD 7 billion.

Through this alliance, LTTS will utilize the digital technology portfolio of Siemens to deliver simulation-driven automation and IIoT-enabled solutions for diverse sectors including automotive & transportation, industrial products, and process & plant engineering.

AMD and OpenAI have announced a strategic multi-year agreement to deploy up to 6 gigawatts of AMD GPUs to support OpenAI’s next-generation AI infrastructure.

ARX

The partnership is European in scope. Both companies can tap into battle-proven systems and experience from Ukraine, where networked technologies in the land domain are already a crucial factor in combat.

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While Tata Power will leverage its EV charging infrastructure and expertise in providing customized charging solutions, VECV will contribute its domain expertise in energy efficiency to optimize energy usage in electric trucks.

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Building on Rigetti and QphoX’s successful demonstration of qubit-transducer systems working together to perform optical single-shot qubit readout, the team plans to combine superconducting microwave qubits developed by Rigetti with single-photon microwave-optical transducers developed by QphoX.

The project will explore the viability of zinc-air flow batteries as a safe, sustainable alternative to lithium-based systems, offering longer storage durations, lower costs, and enhanced compatibility with renewable energy sources.

Expo-BER25-Chipsconnect-interview

Chipsconnect founder Fahir Veladzic used the Evertiq Expo Berlin stage to showcase how peer-to-peer trading and shared digital tools can help OEM and EMS companies cut inefficiencies and unlock new opportunities.

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This collaboration secures reliable access to the feedstock required for producing graphite active anode material, a core component in lithium-ion batteries for Electric Vehicles (EVs) and Energy Storage Systems (ESS).

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Before entering service, the new battery-powered electric trains will undergo a series of tests to comply with the guidelines set out by Italy’s National Agency for the Safety of Railways and Road and Motorway Infrastructure (ANSFISA).

Forge_chip

The partnership establishes a collaborative foundation for developing commercially viable in-space semiconductor manufacturing capabilities, combining Space Forge Inc.’s microgravity-enabled materials deposition processes with United Semiconductors’ expertise in ternary III-V semiconductor crystal growth and wafer processing.

This collaboration will bring together the collective strengths of Samsung companies across semiconductors, data centers, shipbuilding, cloud services and maritime technologies.

Muse-semiconductor-acqusition

GS Microelectronics US, Inc. (GSME), a supplier of IC design and manufacturing solutions, has acquired Muse Semiconductor, a provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology.

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Kioxia and Sandisk have started operations at a new semiconductor fabrication facility in Kitakami, Japan, aimed at producing advanced flash memory for applications including artificial intelligence.

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Qualcomm has secured what it calls a “complete victory” in a licensing battle with British chip designer Arm, after a US District Court dismissed the final claim in Arm’s lawsuit.

Handshake

According to a report from Semafor, later cited by Reuters, Intel has entered preliminary talks with AMD regarding a potential foundry partnership. Sources familiar with the matter emphasise that the discussions are still at an early stage and no outcome has been decided.

Drones

Warsaw-based Orbotix Industries, a Polish-Romanian DefenseTech startup, has raised EUR 6.5 million to accelerate the development of autonomous drone systems supported by artificial intelligence. The funding round was led by U.S. fund Bravo Victor Venture Capital (BVVC), with participation from European investors Gustav Söhne Verwaltung and Leryon Global Holdings.

Castrol_MOU

This collaboration will give VinFast customers access to Castrol’s well-established expertise, advanced service protocols and digitally integrated workshop ecosystem.

equipment

Axcelis Technologies and Veeco Instruments have entered into a definitive agreement to merge in an all-stock transaction that values the combined company at approximately USD 4.4 billion. The deal will create one of the largest US suppliers of semiconductor manufacturing equipment.

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SEALSQ Corp and Kaynes SemiCon have signed a term sheet to form a joint venture, SEALKAYNESQ Ltd, which will establish India’s first Outsourced Semiconductor Test and Personalisation (OSTP) facility.

Electric_ISRO

Over the past 15 years, Schneider has supported Indian Space Research Organisation’s launch operations, contributing to missions such as Chandrayaan-3, GSLV-F16, and several others.

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