Wise, Powernet, KEC to co-develop advanced SMPS solutions
Wise will supply its GaN power devices, digital-control expertise and technical support; Powernet will lead the development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC will manage backend manufacturing.
Kongsberg teams up with Helsing to boost European space capability
The companies aim to deploy a sovereign, space-based intelligence, surveillance, and targeting (IST) constellation with an interconnected comms layer for Europe by 2029.
Samsung, KT Corporation validate AI-RAN on commercial networks
The AI-RAN optimization technology verified by the two companies automatically applies optimal configurations for each user — rather than for the network as a whole — based on real-time wireless conditions.
Sponsored content by NORDES EMS
What competencies are really important when choosing an EMS partner?
Modern electronics manufacturing is developing faster than ever. Shorter product life cycles, ever-increasing quality requirements, advancing miniaturization and the need for rapid prototyping means, that companies require partners who can work in highly variable and precise conditions. Against this backdrop, the EMS (electronics manufacturing services) model has become one of the key elements of the modern supply chain.
Qolab secures strategic investment from Western Digital
Together, the companies aim to advance next-generation nanofabrication processes that improve qubit performance, reliability and scalability, paving the way for practical quantum systems that bridge scientific research and real-world application.
Empower Semiconductor opens US HQ and Munich R&D centre
Empower Semiconductor, a provider of power solutions for AI-class processors, opened a new headquarters in Milpitas, California, and established a research and development center in Munich, Germany.
Nvidia pilots chip-tracking software amid rising smuggling concerns
Nvidia is piloting a new software feature that can verify the physical location of its AI chips, aiming to make illicit GPU diversion and smuggling significantly harder. The initiative, described in detail by Reuters, uses telemetry already present in data-centre deployments to estimate where a device is operating — without modifying the chip itself or embedding direct GPS-style hardware tracking.
HCLTech partners with Dolphin to develop energy-efficient chips
Leveraging its engineering expertise in system-on-chip (SoC) architecture, design and development, India’s HCLTech will embed French company Dolphin Semiconductor’s specialized low-power IP into its silicon design workflows.
Trump approves limited Nvidia H200 AI chip exports to China
In a post on Truth Social, US President Donald Trump announced that the United States will allow exports of Nvidia’s H200 AI chips to China under a 25% government fee.
Semiconductor equipment billings increased 11% YoY in 3Q25
Global semiconductor equipment billings rose 11% year-on-year to 33.66 billion US dollars in the third quarter of 2025, according to the latest Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report from SEMI. Compared with the previous quarter, billings increased by 2%.
First 28Si FD-SOI wafers begin cycling in ST’s Crolles facility
Quobly says that it has reached a key milestone in its roadmap toward industrial-scale quantum processors, with the first custom 28Si FD-SOI wafers from Soitec now cycling in STMicroelectronics’ 300 mm manufacturing facility in Crolles.
Sponsored content by PEDC
Join the 2nd PEDC – Pan-European Electronics Design Conference on 21–22 January 2026 in Prague!
The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.
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