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Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.

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Under the Long-Term Agreement, Jeh Aerospace will manufacture and supply high-precision components for landing gear systems from its facility in Hyderabad, thus becoming part of Liebherr-Aerospace’s global industrial network.

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The contract covers mid-range X-wing and delta-wing unmanned aerial systems manufactured in Germany for the Armed Forces of Ukraine. This is the largest German production order for heavy autonomous strike drones to date.

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Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

Sponsored content by TME Transfer Multisort Elektronik

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XT series connectors with Push-X technology from Phoenix Contact set a new standard for quick and convenient wiring in industrial installations. The solution available at TME significantly reduces assembly time, increases the reliability of connections, and simplifies work during both installation and subsequent service.

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Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

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Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.

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The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.

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Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.

Nanya Technology Corporation has received strategic participation in its private placement from Kioxia, SK hynix subsidiary Solidigm and SanDisk, as the company accelerates investment in advanced DRAM capacity for AI-driven demand.

Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

The USD 47 million contract for the procurement of Tunguska Air Defence Missile Systems for the Indian Army was signed with JSC Rosoboronexport, Russia’s state intermediary agency for the export/import of defense and dual-use products, technologies and services.

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The Joint Development Agreement (JDA) aims to fast-track lithium metal-based battery technology for Pre-A Sample EV requirements.

The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

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This approval allows Linde customers to integrate UgoWork’s UL-listed energy solutions alongside KION’s existing battery offering, giving its customers flexibility in choosing the forklift power system.

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By bringing together Agile Robots’ hardware and other AI robotic solutions developed with Google DeepMind’s Gemini Robotics foundation models, the two teams will improve performance via robot deployment, data collection, model training and iteration.

Samsung Electronics is considering an investment in chip testing and packaging operations in Vietnam, Reuters reports, citing a source familiar with the matter.

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Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.

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Siemens will provide industrial-grade, comprehensive digital twin capabilities and a fully digital engineering and simulation backbone for the European space industry along with access to mentors and experts in the field.

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The two companies will explore potential applications of Sevnce’s robotic and intelligent inspection solutions at BASF sites, and advance materials innovation for key robotic components.

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Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.

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Japanese component manufacturer Murata has completed a new production building at its subsidiary Izumo Murata Manufacturing Co., Ltd. in Izumo, strengthening its capacity for multilayer ceramic capacitors (MLCCs).

SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.

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By embedding Iontra’s intelligence at the edge, Indian electric mobility company Matter enables faster and safer charging without hardware changes, improves reliability under demanding Indian conditions, and reduces lifetime ownership costs.

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Skoda Auto has announced it will end car sales in China by mid-2026. The decision follows declining sales and increasing pressure from local electric vehicle manufacturers, according to Reuters.

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Kioxia Corporation will subscribe to a third-party share allotment by Nanya Technology Corporation and enter into a long-term DRAM supply agreement with the company.

US semiconductor manufacturer Intel has reached a definitive agreement with Apollo Global Management to repurchase the 49% equity interest it does not own in the joint venture tied to its Fab 34 semiconductor facility in Ireland. The transaction is valued at USD 14.2 billion.

Optical and photonic solutions provider Lumentum plans to establish a new US manufacturing facility in Greensboro, North Carolina.

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Camtek has received a multi-system order totalling USD 31 million from an unnamed OSAT, mainly for CoWoS-like packaging supporting AI applications.

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TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.

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The collaboration will focus on the development of advanced marine batteries, battery management systems, electric motors, power electronics and charging infrastructure. The JV aims to cater to both Indian and international markets.

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Under the arrangement, Molten will produce graphite via methane pyrolysis, which Posco Future M will then process into spherical graphite through its subsidiary FutureGraph before producing natural graphite anode material at its Sejong plant.

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