Circuits Integrated expands to UK to develop satellite chipsets
The Greek semiconductor design company has joined Space South Central, one of the UK’s largest regional space clusters. Circuits Integrated’s UK expansion centres on Kythrion, its flagship chipset platform.
Nexperia navigates China challenges, supply chain tested
Nexperia has provided an update on its ongoing operational and governance challenges following the Dutch government’s decision to temporarily suspend a control order under the Goods Availability Act.
Alter launches US semiconductor testing facility in Minnesota
Alter, a provider of assembly, testing, qualification, and radiation services for high-reliability semiconductors and microelectronics, has officially opened a new semiconductor testing facility in Plymouth, Minnesota.
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PowerSafe: High-Power Connectors for Harsh Environments Amphenol Socapex’s PowerSafe series stems from the MIL-DTL-38999 Series III architecture and is purpose-built for high-power supply applications up to 500 V in demanding conditions. These connectors integrate highest levels of user safety, shielding effectiveness and environmental performance to meet the European standard for power equipment, DIN EN 61984 (formerly VDE 0627).
Netherlands lifts control of Nexperia after talks with China
The Netherlands has suspended its extraordinary ministerial order under the Goods Availability Act concerning semiconductor manufacturer Nexperia, following constructive discussions with Chinese authorities, Economic Affairs Minister Vincent Karremans announced today.
X-Fab and Fraunhofer ENAS join forces to speed microtechnology to market
X-Fab and the Fraunhofer Institute for Electronic Nano Systems (ENAS) have launched a strategic collaboration aimed at accelerating the transition of microtechnology innovations from research to industrial production. The partnership uses a so-called “Lab-in-Fab” model that integrates research, development, and manufacturing processes under one framework.
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DeepX: the future of Edge AI is low-power, on-device and closer to Europe than ever
At this year’s Evertiq Expo in Warsaw, the conversation around AI hardware took a decidedly practical turn. While much of the global industry continues to debate cloud capacity and data-centre expansion, Korean AI chipmaker DeepX argues that the next wave of innovation will not come from hyperscale infrastructure — but from devices, robots and systems that run their intelligence locally.
Zuppa partners with Eighth Dimension to advance swarm drone tech
The collaboration aims to develop next-generation AI-based teaming algorithms for swarm drones, along with real-time, context-based object recognition and identification capabilities across Zuppa’s existing UAV offerings.
Dutch delegation heads to China as Nexperia exports resume
Dutch Minister of Economic Affairs Vincent Karremans has welcomed China’s decision to ease licensing requirements on Nexperia’s legacy semiconductor exports, calling it an important step toward restoring predictable supply of essential chips to Europe and global markets.
POET, QCi to co-develop 3.2 Tbps optical engines
Quantum Computing Inc. (QCi) will leverage its expertise with TFLN to integrate the high-performance 400G/Lane modulators with the POET Optical Interposer platform technology.
Zooming in on the machine that prints microchips
To build today’s most advanced processors and memories, manufacturers rely on Extreme Ultraviolet (EUV) lithography systems — machines so complex that each one costs more than USD 150 million and contains thousands of precision-engineered components. And at the heart of this market is ASML, the sole producer of EUV lithography tools.
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