Nexperia China questions dismissal of sales executive
Nexperia China has stated in an official announcement that the decision by the company’s Dutch headquarters to dismiss John Chang from his position as Vice President of Global Sales and Marketing is not legally valid in China.
AMD completes sale of ZT Systems manufacturing unit to Sanmina
AMD has completed its divestiture of the ZT Systems US-headquartered data center infrastructure manufacturing business to Sanmina.
Applied Materials to cut 4% of global workforce
Applied Materials has approved a workforce reduction plan affecting about 4% of its global workforce, according to a SEC filing.
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Cinch ModICE Connector Solutions for Heavy Equipment
What commonalities do hydraulic shovels, bulldozers, and threshing machines share? Each example of the above equipment operates in challenging environments where establishing reliable connections is highly difficult. The likelihood of disrupted operations from a single loose connection can be greatly minimized by selecting the appropriate connectivity solution.
LTSCT teams up with HYS to develop 650V to 3300V wafers
India’s L&T Semiconductor Technologies Ltd (LTSCT) will utilize HYS’s facilities in Taiwan to engineer and produce wafers to meet specifications tailored for automotive and industrial applications.
Inova, TactoTek collaborate to boost intelligent lighting solutions
The collaboration combines Inova’s expertise in smart LEDs with integrated drivers and TactoTek’s patented IMSE technology, which enables electronics and lighting to be molded directly into 3D surfaces.
QS, Corning announce agreement for ceramic separator development
The two US companies will work together toward the goal of high-volume production of QS’s ceramic separators for commercial applications.
Sharp partners with ARAV for remote control solutions using satellite
Leveraging the design and communication technologies nurtured through smartphone development, Sharp is advancing the development of satellite communication user terminals that can establish high-quality, high-speed, and large-capacity networks.
ASE to acquire Analog Devices' Penang facility
ASE Technology Holding and Analog Devices (ADI) have announced a strategic collaboration that includes ASE’s planned acquisition of ADI's manufacturing facility in Penang, Malaysia.
VDA warns of potential automotive production disruptions amid Nexperia crisis
The German Association of the Automotive Industry (VDA) has issued a stark warning about potential production disruptions linked to semiconductor manufacturer Nexperia.
Astera Labs to acquire aiXscale Photonics
Astera Labs has signed a definitive agreement to acquire German photonics company aiXscale Photonics GmbH.
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Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
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Amphenol Socapex D38999 Style Connectors & Derivatives
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