Former Marvell COO named NXP’s new EVP, global operations
Andy Micallef has been named NXP’s Executive Vice President, Global Operations, effective May 17. In this role, Micallef will be responsible for executing NXP’s end-to-end manufacturing, quality, and supply chain strategies.
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Sanan IC expands foundry services for the optical market
Wafer foundry, Sanan Integrated Circuit, says it's expanding its optical portfolio. Using advanced materials and foundry supply network, the company says it will provide the global optical market with large-scale foundry services for customised VCSEL and arrays, along with standard products for optical communication applications.
AMD and GlobalFoundries update supply agreement
On May 13, 2021, Advanced Micro Devices (AMD), entered into an amended seventh amendment to the wafer supply agreement with GlobalFoundries (GF) to extend GF’s capacity commitment and wafer pricing to AMD under the backdrop of the current global supply environment.
Siemens expands IC verification portfolio with acquisition
Siemens Digital Industries Software has acquired Fractal Technologies, a provider of production signoff-quality IP validation solutions, based in the U.S. and the Netherlands.
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Arrow Electronics Tech Snacks put engineers’ time first
Arrow Electronics is launching a new learning concept, Tech Snacks, that will provide engineers with the technical information and insight they need in a choice of formats that have been designed to match their demanding schedules. The Tech Snacks concept will be introduced at an EMEA-wide program that will run from 7-18 June covering a wide range of electronic engineering topics. Individual panel discussions will focus on artificial intelligence and machine learning (AI/ML), automotive/electric vehicles, Industry 4.0 and 5G.
Monitor shipment for 2021 expected to reach 150M units
Owing to high demand generated by the proliferation of WFH and distance education, monitor shipment for 2020 reached 140 million units, an 8.6% growth YoY, which represents the highest growth in about 10 years, according market researcher TrendForce.
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ZEISS to acquire Capture 3D
Zeiss plans to expand its national coverage in the US for its Industrial Quality & Research segment by acquiring Santa Ana, California-based Capture 3D, a US partner for GOM 3D non-contact measuring solutions.
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ICAPE Group Service Office in Asia
In a context where traveling can be difficult, finding a good partner for your production of electronics parts can be a real challenge. With its unique organization and a Headquarters in China where all the key services are located close to the factories and fully operational, ICAPE Group provides a global solution.
MKS Instruments to acquire optical sensor specialist
MKS Instruments has entered into a definitive agreement pursuant to which MKS will acquire Photon Control for CAD 3.60 per share, in an all-cash transaction valued at approximately CAD 387 million (EUR 263.85 million).
Diodes sets new revenue record
The company is reporting first quarter revenue growth of 18% sequentially and 47% YoY, resulting in a record USD 413.1 million.
CEVA to acquire chip design specialist
CEVA, a licensor of wireless connectivity and smart sensing technologies, will acquire Massachusetts-based chip design specialist Intrinsix for approximately USD 33 million in cash.
Helios Technologies to acquire the assets of Joyonway
Helios Technologies, a motion control and electronic controls specialist, has entered into a definitive agreement to acquire assets related to the electronic control systems and parts business of Shenzhen Joyonway Electronics & Technology Co., Ltd and its related entities.
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The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Teledyne e2v starts cleanroom upgrade
Teledyne e2v Semiconductors have laid the first stone to what will become the company's new upgraded semiconductor assembly and test cleanroom at the factory near Grenoble, France.
GaN IC company Navitas to go public
GaN Power ICs specialis, Navitas Semiconductor, has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II, a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at $1.4 billion, will result in Navitas becoming a publicly-traded company.
Physik Instrumente continues expansion in Asia
Physik Instrumente (PI) is expanding its precision motion offering in the Asia-Pacific region having invested in a new R&D and manufacturing center in Changzhou, China to specifically focus on the local demands in the APAC region.
Ericsson and Samsung sign global patent license agreement
Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021.
Jenoptik secures automation orders in North America
Photonics company Jenoptik has secured new automation orders in the US and Canada in the first quarter of 2021 totaling more than 40 million USD that will help increase efficiencies in automotive manufacturing.
Infineon looking to increase supply of SiC material
Infineon says that the company has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Sources: TSMC is planning five additional fabs in Arizona
The worlds biggest semiconductor foundry is reportedly planning to build several new manufacturing facilities in the US, more specifically in Arizona.
Foxconn and Yageo team up to form a semiconductor JV
Yageo Group and Foxconn (Hon Hai) Technology Group announces their plans to for a new semiconductor joint venture, XSemi Corporation, for the development and sale of semiconductors.
H. K. Wentworth Group has been acquired
MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in the semiconductor and PCB markets, has acquired H.K. Wentworth Group, the owner of the Electrolube & AF brands.
EMD Electronics opens new centre of excellence
EMD Electronics, a business of Merck KGaA, has inaugurated its new centre of excellence for atomic engineering at Intermolecular's San Jose facility.
Infineon: "The semiconductor market is booming"
"The semiconductor market is booming; electronics that help accelerate the energy transition and make work and home life easier remain in high demand. The push for digitalization continues unabated. Infineon is firmly on course to meet its targets for the current fiscal year," says Dr. Reinhard Ploss, CEO of Infineon in the company's quarterly report.
Intel to invest $3.5 billion to expand New Mexico operations
The US chipmaker is sinking USD 3.5 billion into its Rio Rancho, New Mexico manufacturing operations to increase its capacity of advanced packaging technologies.
Mobix Labs and Richardson RFPD ink distribution agreement
Mobix Labs Inc., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD, an Arrow Electronics company, have entered into a global distribution agreement.
Hprobe receives order for wafer-level magnetic tester
Hprobe, a provider of Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Sony starts operations at new fab expansion
Sony Semiconductor Solutions Corporation has begun operations on the production lines at the new fab built on the premises of Nagasaki Technology Center in Japan, a production center owned by Sony Semiconductor Manufacturing Corporation.
Vanguard to acquire AU Optronics facility
Taiwanese contract chipmaker Vanguard International Semiconductor Corp. has agreed to purchase an 8-inch semiconductor fab (around 48'400sqm) at Hsinchu Science Park for USD 32.5 million.
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