Forge Nano delivers wafer fab equipment to leading firm May 15, 2026 Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.
Molex completes its acquisition of Teramount May 14, 2026 Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
GF accelerates adoption of co-packaged optics for AI data centers May 13, 2026 GlobalFoundries’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes.
ams Osram sells CMOS image sensor business to indie Semiconductor May 11, 2026 Austrian-German semiconductor manufacturer ams Osram has agreed to divest its CMOS image sensor business to US-based indie Semiconductor for EUR 40 million, as part of a strategic refocusing toward AI photonics and augmented reality.
HyperLight, UMC, Wavetek to bolster TFLN production May 04, 2026 Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.
Aixtron raises 2026 outlook on strong optoelectronics demand April 22, 2026 Aixtron has raised its financial guidance for 2026, citing stronger-than-expected demand from the optoelectronics segment, while reporting preliminary figures for the first quarter.
3DGS breaks ground on chip packaging unit in India April 20, 2026 The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.
Molex to acquire Teramount to accelerate Co-Packaged Optics push April 16, 2026 Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).
Sivers and Jabil team up on 1.6T optical transceivers for AI data centres April 15, 2026 Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.
How chips competence centres could change semiconductor hiring in Europe April 15, 2026 Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?
Monarch raises $55M to advance quantum photonics April 13, 2026 The funding will accelerate production of the US company’s Quantum Light Engines, photonic control systems for quantum computing, sensing and networking, while supporting scale-up, supply chain expansion and global partnerships.
Spain allocates €19 million to semiconductor research and quantum chip development April 07, 2026 The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.
Polish player acquires US infrared specialist March 25, 2026 VIGO Photonics has completed the acquisition of assets from US-based InfraRed Associates. The USD 8.4 million transaction is expected to strengthen the Polish company’s position in the infrared detector market and accelerate its international expansion, particularly in the United States.
Sivers, O-Net, Enablence advance ELS module for data centers March 23, 2026 O-Net Technologies will serve as the ODM partner, integrating Sivers’ laser arrays and Enablence’s NxN Star Coupler to deliver a scalable external light source (ELS) module for scale-out and scale-up optical systems.
ST enters high-volume production of PIC100 platform March 16, 2026 The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.
BEL partners with Sasmos to boost India’s defence indigenisation March 10, 2026 This partnership focuses on co-development and co-indigenisation in key technology domains, including fibre optics and photonics; tank electronics; and naval systems and airborne platforms.
QCi completes acquisition of quantum communications firm NuCrypt March 09, 2026 By integrating NuCrypt’s suite of quantum communications systems and products, QCi expects to advance its technology roadmap while extending its portfolio of quantum communications and quantum photonics solutions.
Nvidia to invest $2 billion in Lumentum under new optics partnership March 04, 2026 Nvidia has entered a multiyear strategic partnership with Lumentum to accelerate the development of advanced optics technologies for next-generation AI infrastructure.
Nvidia to invest $2 billion in Coherent March 03, 2026 Nvidia has entered a multiyear strategic agreement with Coherent to develop advanced optics technologies for next-generation AI infrastructure. The agreement includes a USD 2 billion investment by Nvidia in Coherent, alongside a multibillion-dollar purchase commitment for optical networking and laser products.
ams OSRAM completes EUR 114m lamps business sale March 03, 2026 Sensor and photonics company ams OSRAM has completed the sale of its Entertainment and Industry Lamps business to Japan-based Ushio Inc. for EUR 114 million. The transaction was closed on 2 March 2026.
Intel backs away from manufacturing deal with Tower Semiconductor February 16, 2026 Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.
ITRI breaks ground on advanced semiconductor R&D centre in Hsinchu February 15, 2026 Industrial Technology Research Institute (ITRI) has broken ground on a new Advanced Semiconductor R&D Centre at its headquarters campus in Hsinchu, Taiwan.
Startup Island Taiwan partners with City of Phoenix January 16, 2026 As the semiconductor industry becomes increasingly integrated with advanced technology applications, this MOU upgrades previous project-based collaboration by incorporating incubation and acceleration resources from partners such as Tesoro Venture Capital.
Echoes from Evertiq Expo 2025: A year of industry rankings December 30, 2025 Throughout 2025, each Evertiq Expo featured a Top List spotlighting the companies shaping Europe’s electronics, manufacturing, and tech sectors. From global semiconductor leaders to Europe’s top EMS providers, these rankings provide a snapshot of industry trends and market dynamics.
Defence electronics in 2025: Key developments followed by the Evertiq audience December 22, 2025 Defence electronics has become one of the fastest-growing segments of Europe’s technology landscape. Rising military budgets, new procurement cycles, digitalisation of battlefield systems and the need for resilient supply chains are transforming the electronics industry into a strategic pillar of national security. Reading patterns on Evertiq clearly show that the audience is most interested in topics related to industrial collaboration, AI in defence, robotics, component manufacturing, sourcing, and critical materials.
CNRS, l’Institut d’Optique, Pasqal inaugurate AtomIQ-Lab December 01, 2025 This collaboration between academic research and business aims to push back the technical limits of laser-cooled atom manipulation. The goal is to considerably increase the performance of quantum processors based on this technology.
Phix teams up with Taiwanese firms to advance optical engines November 24, 2025 The companies have entered into a collaboration to advance the hybrid integration and packaging of photonic integrated circuits (PICs) for next-generation optical transceiver development.
IBM, University of Dayton to jointly research next-gen chip tech November 21, 2025 To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university’s campus.
Alter launches US semiconductor testing facility in Minnesota November 20, 2025 Alter, a provider of assembly, testing, qualification, and radiation services for high-reliability semiconductors and microelectronics, has officially opened a new semiconductor testing facility in Plymouth, Minnesota.
X-Fab and Fraunhofer ENAS join forces to speed microtechnology to market November 19, 2025 X-Fab and the Fraunhofer Institute for Electronic Nano Systems (ENAS) have launched a strategic collaboration aimed at accelerating the transition of microtechnology innovations from research to industrial production. The partnership uses a so-called “Lab-in-Fab” model that integrates research, development, and manufacturing processes under one framework.
GlobalFoundries acquires Singapore-based photonics foundry AMF November 19, 2025 GlobalFoundries has acquired Advanced Micro Foundry (AMF), a Singapore-based silicon photonics specialist, in a move that significantly expands the company’s manufacturing footprint and its technology portfolio for optical communications and AI-driven data infrastructure.
POET, QCi to co-develop 3.2 Tbps optical engines November 17, 2025 Quantum Computing Inc. (QCi) will leverage its expertise with TFLN to integrate the high-performance 400G/Lane modulators with the POET Optical Interposer platform technology.