Orange completes successful trial of Fujitsu 1FINITY T900 transponder
June 09, 2025
Orange found that power consumption of the 1FINITY T900 transponder remained low and constant across all transmission rates, achieving a transport distance of at least 1600 km at 800Gbps with power consumption below 150 Watts.
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Siemens expands OSAT Alliance to boost US chip supply chains
June 06, 2025
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
ClassOne, IBM Research team up to develop non-NMP solvent processing
May 26, 2025
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
KLA opens $138M R&D and manufacturing facility in Wales
May 26, 2025
KLA Corporation has inaugurated a new USD 138 million R&D and manufacturing facility in Newport, Wales, expanding its footprint in the UK. It will serve as the new home for KLA's SPTS division, which specialises in advanced wafer processing technologies.
Sivers joins DIFI to advance satellite network interoperability
May 19, 2025
Digital Intermediate Frequency Interoperability (DIFI) Consortium is a global collective of industry leaders collaborating to develop and promote open, standards-based interoperability for digital IF/RF systems.
Smart Photonics speed up production set up with Aixtron
May 07, 2025
Aixtron supplies the Netherlands-based Indium Phosphide (InP) foundry Smart Photonics with its new G10-AsP system. The MOCVD solution for high-volume production of GaAs/InP materials will enable the foundry to increase its capacity and capabilities.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
Lam Research etch system to accelerate nanofabrication R&D at UC Berkeley
April 24, 2025
Lam Research has donated its multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance R&D for next-generation chip technologies.
Lightmatter’s photonic superchip advances interconnect innovation
April 18, 2025
With fully integrated fiber attachment supporting 256 fibers, Passage M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to existing CPO solutions.
Networking solutions provider Nexthop AI launches with $110M funding
April 18, 2025
Nexthop AI specializes in building custom networking solutions for the hyperscalers, which integrate seamlessly into their optimized cloud-stack. The funding was led by Lightspeed Venture Partners.
ST to cut up to 2,800 jobs in major manufacturing overhaul
April 10, 2025
Semiconductor manufacturer STMicroelectronics will see up to 2,800 employees leave the company globally over the next three years as part of an overhaul of its manufacturing operations and cost structure.
Sivers teams up with WIN to enhance DFB laser production
March 26, 2025
Taiwan’s WIN Semiconductors will serve as an outsourced manufacturing partner for Sivers Semiconductors, enabling the company to scale production and meet the demand for its photonic solutions.
Quantum computing startup PsiQuantum ‘is raising $750M’
March 25, 2025
PsiQuantum uses existing photonics technology at a facility run by GlobalFoundries in New York. In February, PsiQuantum said it had figured out how to manufacture quantum chips in large quantities.
Teradyne to acquire Quantifi Photonics
March 12, 2025
Teradyne has entered into a definitive agreement to acquire Quantifi Photonics, a privately held company specialising in photonic integrated circuit (PIC) testing. The acquisition is expected to be finalised in the second quarter of 2025.
ASML and imec team up to advance European research and sustainability
March 11, 2025
ASML and imec have entered into a new five-year strategic partnership aimed at advancing semiconductor research and sustainability in Europe. The agreement will leverage both companies' expertise to drive technological innovation and sustainable initiatives in the semiconductor industry.
Jabil expands with new factory in India
March 05, 2025
EMS provider Jabil says that it will open a new factory in Gujarat, its second factory in India.
GF and MIT to advance research on essential chips for AI
March 04, 2025
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a new master research agreement aimed at advancing semiconductor technologies.
Finland's path to strengthen its semiconductor industry
February 25, 2025
Finland has a solid plan to increase the country’s importance on the European semiconductor stage – and globally. But there are still hurdles ahead. According to Joonas Mikkilä, Senior Advisor at Technology Industries of Finland, the country must address its talent shortage to secure a leading role in the industry.
EU funding strengthens semiconductor innovation in Finland
February 19, 2025
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.
Chips from the North – Finland's semiconductor roadmap
February 14, 2025
Finland’s semiconductor industry is poised for significant expansion, driven by its deep-rooted expertise, strong research and development (R&D) ecosystem, and innovative infrastructure – But why is that?
Omnitron Sensors secures $13M+ series A funding
January 30, 2025
Omnitron Sensors, an inventor of new MEMS fabrication IP, has secured USD 13 million in Series A funding led by Corriente Advisors, LLC, with participation from longtime investor L’ATTITUDE Ventures.
Ortel transfer wafer fabrication to CPFC
January 29, 2025
Ortel, a Photonics Foundries company, has transferred wafer fabrication for its C-Band, High-Power, Continuous Wave Laser Module platform to the Canadian Photonics Fabrication Centre (CPFC), a pure-play III-V semiconductor wafer foundry.
GF to set up New York advanced packaging and photonics centre
January 21, 2025
Semiconductor manufacturer GlobalFoundries says it plans to create a new centre for advanced packaging and testing of US-made essential chips within its New York manufacturing facility.
EU greenlights Synopsys' $35bn acquisition of Ansys
January 13, 2025
The European Commission (EC) has officially approved Synopsys' move to buy Ansys – subject to Synopsys selling off some competitive assets.
Graphene – the sense of a new world
January 10, 2025
Graphene has been described as a “wonder material” ever since its discovery 20 years ago. While at times the hype has been over-egged, its properties are already changing more than just the semiconductor industry.
Imec’s breakthrough in nano-ridge lasers on 300 mm wafers
January 10, 2025
Belgium-based research institute Imec has achieved a significant milestone in semiconductor technology by fabricating electrically pumped GaAs-based nano-ridge lasers on 300 mm silicon wafers. This breakthrough, announced in a recent press release, represents a crucial step towards integrating photonic and electronic components on a single chip, paving the way for next-generation silicon photonics.
Laser Photonics advances PCB marking technology R&D
December 11, 2024
Industrial laser systems developer Laser Photonics Corporation, and its recently acquired subsidiary Control Micro Systems (CMS), are expanding their PCB Marking technology development program targeting the semiconductor and electronics market.
ULVAC, SAL partner to develop tech for making TFLN
December 09, 2024
SAL, an Austrian research center for Electronics and Software Based Systems, is implementing ULVAC’s plasma etching system Model “NLD-5700” to advance R&D of thin-film lithium niobate (TFLN).
UP approves $1 billion in incentives for 2 semiconductor units
December 02, 2024
The projects proposed by Tarq Semiconductors and Vama Sundari Investments are expected to attract a combined investment of USD 3.8 billion, but both await approval by the central government.
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