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quantum-technologies-1

September 23, 2026
The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.

workforce

September 11, 2026
Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures.

Ad

September 10, 2026
GlobalFoundries has finalised a definitive agreement with the US Department of Commerce for a USD 375 million research and development award to advance its Quantum Technology Solutions business. The funding is tied to milestone achievements over a five-year period.

Photonics-production

September 03, 2026
Swedish company Sivers Semiconductors is investing USD 30 million to expand its indium phosphide manufacturing facility in Glasgow, Scotland.

Engineer-holding-wafer

September 01, 2026
Semiconductors form the backbone of our digitalised society and are business-critical for everything from AI and defence to next-generation energy systems. Yet despite Sweden being among the global leaders in academic fundamental research, we face a critical challenge: we must strengthen our own manufacturing capacity.

Photonics_team

August 28, 2026
The new capital will accelerate the development of a new generation of image sensors, expanding the Scotland-based startup’s product roadmap. Singular also announced that Dipesh Patel, the former CTO of Arm, has joined the company’s board of directors.

chip

August 14, 2026
The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.

Kawasaki-main-office

August 04, 2026
Through this MOU, Chunghwa Telecom, Fujitsu and 1Finity will further advance their existing All-Photonics Network (APN) initiatives and accelerate their collaboration to expand next-generation communication infrastructure in Taiwan.

August 04, 2026
AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain. The acquisition enhances Micross’ presence in continental Europe and broadens its portfolio of high-reliability microelectronic services and products.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

Playground_Global_MOU

July 28, 2026
The collaboration aims to strengthen the pathway from laboratory innovation to global commercial impact by combining Playground’s expertise in building and scaling frontier technology companies with the CEA’s scientific research and technology-transfer capabilities.

of_Arizona

July 24, 2026
The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.

Semiconductor_building

July 20, 2026
Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.

cooperation-1

July 16, 2026
ELIgnite, a new Horizon Europe project coordinated by the Extreme Light Infrastructure ERIC (ELI), will streamline access to advanced laser facilities, making it easier for researchers to discover, apply for, and use ELI’s capabilities.

Aeponyx_PIC_Centre

July 06, 2026
Supported by the Canadian government, the initiative brings together Aeponyx, HOP Technologies and Phantom Photonics to strengthen Canada’s domestic capabilities in advanced photonics and quantum technologies.

team

July 06, 2026
The proceeds will support the Swiss company’s ambitious technical roadmap towards an industrialized production line, unlocking additional manufacturing capacity to serve key Tier-1 customers.

groundbreaking-sherman-texas-2026

July 03, 2026
Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.

Erfurt-Main-entrance

July 02, 2026
X-FAB MEMS Foundry has received a grant notification of EUR 127.4 million from the German federal government and the Free State of Thuringia for the construction of a new cleanroom at its Erfurt site. The Fab4Micro project will expand capacity for MEMS, microsystems and photonics, with initial production targeted for the end of 2028.

logos-on-buildings

July 02, 2026
ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.

headquarters_Sheffield

June 26, 2026
The UK startup’s goal is to deliver quantum computers at scale based on photonics, leveraging chip manufacturing supply chains, working with industry leaders to deliver real-world impact in advanced manufacturing, defence, clean energy and healthcare.

quantum-technologies-1

June 24, 2026
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.

axonite_chip

June 12, 2026
Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

quantum-technologies-1

June 05, 2026
Rather than relying on a single architecture, SEALSQ is investing into several complementary approaches to fault-tolerant quantum computing and binding them to its own QS7001 secure hardware, QVault TPM and PQC product portfolio.

Nano

May 15, 2026
Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.

Guadalajara-mexico-plant

May 14, 2026
Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

SCALE

May 13, 2026
GlobalFoundries’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes.

flags-HQ

May 11, 2026
Austrian-German semiconductor manufacturer ams Osram has agreed to divest its CMOS image sensor business to US-based indie Semiconductor for EUR 40 million, as part of a strategic refocusing toward AI photonics and augmented reality.

UMC

May 04, 2026
Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.

building

April 22, 2026
Aixtron has raised its financial guidance for 2026, citing stronger-than-expected demand from the optoelectronics segment, while reporting preliminary figures for the first quarter.

chip_packaging_Odisha

April 20, 2026
The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

Data-center

April 15, 2026
Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.

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