Jenoptik opens the doors to its new fab in Dresden
May 07, 2025
After around two and a half years of construction, Jenoptik has completed its largest single investment in recent history and officially inaugurated its new fab in Dresden, Germany.
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Southampton opens E-beam lithography chip facility
May 05, 2025
University of Southampton’s new E-beam lithography facility, just the second in the world, provides incredible accuracy critical to designing the tiny components that power technologies of the future.
ASML remains confident, but tariffs have increased uncertainty
April 16, 2025
Dutch semiconductor equipment manufacturer ASML reported financial results for the first quarter of 2025, reflecting a sequential decline in net sales and income, though gross margin exceeded expectations.
Japan chip curbs: China warns of adverse impact on supply chain
February 03, 2025
The new export controls, which are scheduled to come into effect at the end of May, include curbs on cutting-edge chips, lithography equipment and cryocoolers needed to make quantum computers.
ASML reports sakes of €28.3 billion in 2024
January 30, 2025
Dutch semiconductor equipment manufacturer ASML closed 2024 on a high note, reporting total net sales of EUR 28.3 billion for the year and a net income of EUR 7.6 billion.
XIVER takes over Philips' MEMS foundry
January 08, 2025
The MEMS foundry at the High Tech Campus Eindhoven, will remain in Dutch hands. The former Philips unit will continue as an independent company and will be named XIVER, following a divestment to a consortium of private investors.
Japan to invest $635M in chipmaker Rapidus in 2025
December 27, 2024
Rapidus is building a plant in the city of Chitose in Hokkaido to start mass production of next-generation semiconductors with a circuit line width of 2 nanometers in 2027.
Rapidus installs Japan's first AMSL EUV lithography machine
December 19, 2024
Japanese semiconductor manufacturer, Rapidus, has reached a milestone by installing Japan's first Extreme Ultraviolet (EUV) lithography machine from ASML. This advanced technology is now part of Rapidus' Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor fab under construction in Chitose, Hokkaido.
ASML assess the impact from updated export restrictions
December 03, 2024
The US authorities published an updated version of the advanced computing and semiconductor manufacturing equipment rule, imposing additional restrictions on suppliers for the export of chip manufacturing technology. ASML is assessing the potential implications of the new regulations.
Ruag's lithography division becomes part of Zeiss SMT
December 03, 2024
It was back in September this year that Zeiss SMT (Semiconductor Manufacturing Technology) announced that it was acquiring Ruag International's Lithography Division – a deal that has now been completed.
ASML reaffirms 2030 revenue targets
November 19, 2024
At its 2024 Investor Day, ASML provided an update on its long-term strategy as well as global market and technology trends, confirming potential 2030 scenarios for annual revenue between approximately USD 44 billion and USD 60 billion.
Samsung's new R&D complex takes shape
November 19, 2024
Samsung says that it will start installing equipment at its new semiconductor research and development complex (NRD-K) at its Giheung campus, located south of Seoul.
US to invest $825 million in New York chip facility
November 01, 2024
The site in Albany, New York, will focus on extreme ultraviolet (EUV) lithography, which is used to make the most advanced nodes for the next generation of chips and processors.
Samsung delays ASML chip gear deliveries for Texas plant
October 21, 2024
The delayed shipments to the Taylor plant involve ASML’s advanced extreme ultraviolet (EUV) lithography tools, according to Reuters.
Russia to spend $2.5 billion on domestic chipmaking tool tech
October 14, 2024
The initiative includes launching 110 R&D projects to reduce dependence on imported wafer fab tools and make chips on a 28nm-class process technology.
Onto Innovation opens new packaging applications center
October 02, 2024
Onto Innovation has officially opened the company’s Packaging Applications Center of Excellence (PACE), a facility dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages.
Canon delivers NIL system to Texas Institute for Electronics
October 02, 2024
Canon says that it has shipped its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium.
Fujifilm to expand its semiconductor materials business
October 01, 2024
Fujifilm Corporation plans to invest JPY 20 billion (EUR 125 million) in its semiconductor materials business. The investment will strengthen the company's facilities for the development, production and quality evaluation of advanced semiconductor materials in Shizuoka and Oita, Japan.
US, Japan near deal to restrict chip tech exports to China
September 18, 2024
But Japanese companies fear China could hit back with a blockade on key minerals like gallium and graphite that would impact the country’s chip and EV industries.
China ‘dissatisfied’ with Dutch controls on ASML chipmaking tools
September 09, 2024
The Netherlands announced it would require export licenses for ASML’s Twinscan NXT:1970i and 1980i systems. These tools are designed for processing wafers with 7nm-class technologies.
Japan’s new R&D base will introduce EUV lithography equipment
September 04, 2024
With its extremely short wavelengths of about 13.5 nanometers, EUV lithography allows for finer etching of smaller features on chips.
ASML’s China business faces more curbs from Dutch government
August 30, 2024
The government is likely to restrict the Netherlands-based company’s ability to repair and provide spare parts for its installed advanced semiconductor equipment in China.
SMIC: making 5nm chips without EUV machines?
June 20, 2024
New reports say China’s largest foundry has found a way to manufacture 5nm chips using deep ultraviolet (DUV) lithography machines purchased before the US imposed export restrictions.
EV Group and Fraunhofer IZM-ASSID expand partnership
June 18, 2024
Wafer bonding and lithography equipment supplier EV Group (EVG) has entered into a strategic partnership with Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), to develop and optimise alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing.
Investment group pays $11bn for stake in Intel's Ireland fab
June 07, 2024
Intel has confirmed that Apollo and its affiliates will acquire a 49% equity interest in a joint venture entity related to the chip firm's Fab 34.
Canon talking to Indian firms about installing litho tech
June 07, 2024
Japanese electronics giant Canon is believed to be in discussions with Indian companies about deals for its proprietary nanoimprint lithography equipment.
ASML and imec open joint lab
June 04, 2024
Imec and ASML are teaming up with the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by both companies.
Micron's DRAM plant in Hiroshima to be operational in 2027
May 30, 2024
US memory manufacturer Micron Technology is reportedly planning to set up a new DRAM plant in Hiroshima, Japan, with production targeted to start by the end of 2027.
Zeiss's chip sales pass EUR 2 billion for the first time
May 23, 2024
Optics giant Zeiss has reported a record-breaking half-yearly performance by its semiconductor division.
TSMC on track to mass produce 3nm chips this year
May 17, 2024
The world's biggest chip maker, TSMC, it set to make 3mn chips in the second half of 2024 following successful testing of its N3E process.
Samsung expands partnership with ZEISS to boost memory tech
April 29, 2024
Samsung Electronics and imaging specialist ZEISS Group have agreed to deepen their collaboration in a move to achieve better yields and performance in next-generation memory chips.
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