Evertiq - First In Electronics News & Expo

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PCB-India_1

September 15, 2025
As part of the deal, Bangalore-based L&T Semiconductor Technologies Ltd (LTSCT) has acquired Fujitsu General Electronics Limited’s R&D equipment, design patents and various intellectual properties related to power module technologies.

Photonics_LEAFLight

September 10, 2025
The funding enables France’s Scintil Photonics to expand hiring, accelerate production and deepen its international presence as it delivers the industry’s first single-chip DWDM light engine, integrating multi-wavelength lasers with silicon photonics, aligned with next-generation CPO.

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August 08, 2025
As a channel partner, India’s Cyient Semiconductors will provide companies with fabrication access, technical consultation, design enablement, assembly, testing, and other value-added services to accelerate innovation and reduce time-to-market.

Claus-Aasholm

July 07, 2025
In this first article of Evertiq’s new expert column series, Claus Aasholm – seasoned technology executive and strategist – shares his perspective on the trends, challenges, and breakthroughs shaping the global electronics industry. Drawing on decades of hands-on experience, Claus offers sharp, thought-provoking insights that go beyond headlines and buzzwords. Expect analysis that connects the dots – and challenges the status quo.

Bosch

June 26, 2025
Indian fabless firm Mindgrove will provide Bosch with chips and boards for field deployment and testing, supported with engineering and logistics assistance. Data generated from these deployments will be used for improvements.

June 24, 2025
Continental's Automotive Group Sector has established a new internal unit — Advanced Electronics & Semiconductor Solutions (AESS) — to design and verify application-specific semiconductor circuits, as the company prepares for its planned spin-off into the standalone entity Aumovio.

Semiconductors

June 17, 2025
At the heart of this innovation is Indian fabless semiconductor startup InCore’s SoC Generator, a powerful automation platform built to radically simplify and accelerate SoC development.

chip_design

June 13, 2025
The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial and data center markets.

Microsystems

June 06, 2025
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.

Sakura

June 02, 2025
This funding will drive the development of NovaEdge — a next-generation, energy-efficient edge AI chiplet designed for high-performance generative AI inference and on-device learning.

Sakura

May 13, 2025
The agreement empowers the US Defense Innovation Unit to rapidly evaluate and eventually deploy EdgeCortix’s hardware and software solutions across diverse US Department of Defense edge applications.

NX450

May 05, 2025
NEXT’s latest APU, the NX450, is the world’s first 200 GS/s antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively.

pile-of-wafers

April 22, 2025
The challenge for the Taiwanese tech giant is that the semiconductors TSMC customizes for many fabless firms and chip designers often end up being used in gadgets made by third parties, which is perfectly legitimate.

PCB-EU_1

April 16, 2025
Another step toward Europe's semiconductor independence has been taken with the launch of the Czech Semiconductor Centre (CSC) in Brno. The centre will focus on supporting innovation, prototyping, and the growth of European fabless companies.

PCB-India_3

April 16, 2025
The new chip design centre aims to serve the global 5G and 6G markets, defence and satellite communication, IOT among others.

technician-holding-epiwafer

April 10, 2025
IQE plc, a supplier of compound semiconductor wafer products and advanced material solutions, and X-FAB Silicon Foundries have entered into a Joint Development Agreement (JDA) to create a European-based GaN Power device platform solution.

PCB-EU_2

March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.

TOP-10

March 18, 2025
TrendForce reports that the combined revenue of the world’s top 10 IC design houses reached approximately USD 249.8 billion in 2024, marking a 49% YoY growth. The surge is largely attributed to the booming AI industry, with Nvidia dominating the market.

PCB-India_1

March 06, 2025
Tata Electronics signed an MoU with Taiwan’s Himax Technologies and PSMC to boost India’s display and ultralow power AI sensing product and technology ecosystem.

geralt-computer-chip

March 03, 2025
The Canadian company continues to make strong progress in developing high-performance, energy-efficient and low-latency signal acquisition solutions, it said in a media release.

chiplet

February 24, 2025
In India, Arm’s team of computer engineers work on architecture development, CPU and system design and verification, software enablement, compute solutions, and physical implementation.

PCB-India_2

February 19, 2025
While IIT Bombay and IIT Bhubaneswar will contribute their research prowess and academic knowhow, iVP Semi brings its industry-leading experience and insights.

chip-image

February 05, 2025
Already equipped with OSAT packaging facilities and Fab prototyping, RRP Semiconductor is now positioning itself as an end-to-end semiconductor solutions provider.

handshake

January 29, 2025
KD, a fabless semiconductor company, has signed an agreement with Keysight Technologies to partner on optical parameters measurement, including TDFOM based on the IEEE Std 802.3cz physical layer test standard.

January 13, 2025
Fresh reports say Japanese foundry Rapidus will begin trial production of 2nm chips in April 2025, and has Broadcom lined up as its first major customer.

January 07, 2025
Dortmund-based Elmos Semiconductor, which completed its fabless transformation following the sale of its wafer fab over the New Year holiday, has expanded its collaboration with its foundry partner Samsung Foundry.

January 06, 2025
The sale of the Dortmund wafer fab to the US technology company Littelfuse, completed the fabless transformation of Elmos Semiconductor. The transaction closed with the arrival of the New Year. With this, US-based Littelfuse became the new owner of Dortmund Semiconductor GmbH, the separate entity of the Elmos wafer factory.

CEO

December 23, 2024
The Chennai-based company plans to use the investment to expand its workforce and enhance in-house engineering capabilities. The investment will also accelerate production and sales of its first chip.

headquarters

December 12, 2024
DigiKey has expanded its product portfolio through a global distribution partnership with MediaTek, one of the world’s largest fabless semiconductor companies.

geralt-computer-chip

December 02, 2024
The merged entity, expected to have an estimated corporate value of USD 928 million, has been named Rebellions. The original Rebellions CEO is set to lead the new company.

WiseGan

November 20, 2024
Wise-integration is expanding with the opening of its new North American Design & Development Centre in Ottawa, Ontario, Canada.

geralt-computer-chip

November 15, 2024
Yali’s strategy is centered on deep tech innovation in India, with key interests spanning chip design, robotics, smart manufacturing, genomics, aerospace, surveillance and AI.

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