Evertiq - First In Electronics News & Expo

Ad

Ad

Ad

Ad

August 28, 2025
Nikon Corporation announced on August 21, 2025, that it will close its Yokohama Plant in Kanagawa Prefecture on September 30, 2025. The decision is part of a plan to consolidate development and production functions across the company.

robotics

August 25, 2025
NEC’s in-house demonstrations of this technology have confirmed that a robot’s travel time can be reduced by up to 50% when compared to conventional methods.

Ad

Systems

August 19, 2025
The Japan-based startup will use the funds to continue the development of Doppler LiDAR technology to observe wind conditions in real time, and to accelerate commercialization efforts aimed at expanding into defense and civilian sectors.

Tohoku-render

August 11, 2025
The six people arrested on allegations of intellectual property theft at the Taiwanese chipmaker include a person identified by local media reports as a former employee of Tokyo Electron. The leaked information was reportedly related to TSMC’s most advanced 2-nanometer chip technology.

partnership_Franz26

August 06, 2025
Tata and Ichikoh are in talks to finalise an agreement to acquire Valeo Lighting Systems (VLS), a business unit of Valeo India Private Limited.

Leadership_Team

July 28, 2025
This funding further enables Silicon Valley startup xLight to develop the world’s most powerful EUV free electron lasers (FEL), which has the potential to revolutionize advanced semiconductor manufacturing and unlock other critical economic and national security applications.

quantum-technologies-2

July 07, 2025
In this partnership, researchers from Mitsubishi Chemical's Materials Design Laboratory will provide deep expertise on EUV photoresist materials, including their molecular structures, compositions, and reactivity.

eCrea

June 18, 2025
Designed without an onboard diesel generator, the vessel named “e-Crea” will support the docking and undocking of tugboats at the Koyasu Shipyard.

UTokyo_Lab

June 16, 2025
Together, TSMC and UTokyo aim to promote cutting-edge research and development in semiconductor technologies, generate innovative solutions, and cultivate semiconductor talent.

Minicab_EV

June 10, 2025
Japanese shipping and logistics group Yamato will be the initiative’s first major customer and focus on last mile applications. US company Ample will provide battery swapping tech for the participating EV platforms.

Building_Logo

June 06, 2025
Engineered for demanding high-power applications across K-Band to V-Band frequencies, NP12-1B delivers industry leading high power front end solutions with exceptional linearity, ruggedness, and reliability for next-generation RF and microwave systems.

Sakura

June 02, 2025
This funding will drive the development of NovaEdge — a next-generation, energy-efficient edge AI chiplet designed for high-performance generative AI inference and on-device learning.

TC_BONDER4

May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.

India_MOU

May 14, 2025
These MOUs focus on supporting local startups by enabling them to drive technological advancement and promote local manufacturing in alignment with the Make in India initiative; and enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students.

wireless

April 28, 2025
NEC achieved Japan’s longest terrestrial wireless optical communication over a distance of over 10 km. It also conducted FSO communications between an observation deck at the tallest structure in Japan and a location on the ground 3 km away.

PCB-EU_1

April 16, 2025
Another step toward Europe's semiconductor independence has been taken with the launch of the Czech Semiconductor Centre (CSC) in Brno. The centre will focus on supporting innovation, prototyping, and the growth of European fabless companies.

IBM

April 03, 2025
The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.

Fisher

March 26, 2025
The seamlessly integrated system is designed to enhance productivity, increase yield and reduce operating costs for semiconductor manufacturers.

solar-panel-cell

March 21, 2025
This capital infusion will accelerate TRENDE's growth initiatives, including the expansion of its solar and battery leasing service “Teraris,” and its peer-to-peer (P2P) energy trading platform.

Miyagi-render

February 26, 2025
Tokyo Electron is expanding its Miyagi plant in Japan by adding a new production building to meet the rapidly growing demand for semiconductors in recent years.

Manjunath-Jyothinagara-Managing-Director

January 28, 2025
KASFAB Tools Private Limited, a subsidiary of KAS Group, has inaugurated India’s first dedicated facility for manufacturing semiconductor equipment, aiming to serve global customers.

SUNY-Nanotech-NanoFab-Reflection

January 15, 2025
Eaton has signed a contract valued at approximately USD 20 million to help support the construction of NY CREATES' new NanoFab Reflection semiconductor R&D facility at its Albany NanoTech Complex.

graphene

January 10, 2025
Graphene has been described as a “wonder material” ever since its discovery 20 years ago. While at times the hype has been over-egged, its properties are already changing more than just the semiconductor industry.

mou

December 16, 2024
The five-year MoU sets the foundation for sharing of academic, scientific and cultural experiences between the WMG, at The University of Warwick in the UK, and Binghamton University.

TSMC

December 13, 2024
The partnership will integrate Japanese semiconductor company Rohm’s device development technology with TSMC’s GaN-on-silicon process technology.

November 08, 2024
Bain Capital-backed Kioxia may use a new method for listing at the Tokyo Stock Exchange to speed up its IPO, which has been delayed in the past.

October 21, 2024
The investment round was catalyzed by LG Technology Ventures, the venture capital arm of the LG Group, and included new support from Chailease Holdings as well as participation by current investors.

chip-generic-image

October 14, 2024
The initiative includes launching 110 R&D projects to reduce dependence on imported wafer fab tools and make chips on a 28nm-class process technology.

innovation-hub-dresden

October 10, 2024
Zeiss has recently opened the Zeiss Microscopy semiconductor applications lab in Dresden, a new facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the Zeiss Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).

plant

October 03, 2024
Rapidus Corporation will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open an R&D center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).

sign-on-wall

September 27, 2024
Bain Capital, which holds a 56% stake in Kioxia along with SK hynix, had been targeting a market value of 1.5 trillion yen (USD 10.39 billion) for Kioxia.

detail-wafer

September 19, 2024
Tata Electronics and ADI will explore opportunities to manufacture ADI’s products in Tata's Gujarat fab and OSAT in Assam.

Load more news

© 2025 Evertiq AB August 29 2025 12:12 pm V24.4.1-1

Ad