TSMC, University of Tokyo open joint lab to boost chip research
June 16, 2025
Together, TSMC and UTokyo aim to promote cutting-edge research and development in semiconductor technologies, generate innovative solutions, and cultivate semiconductor talent.
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International consortium rolls out EV battery swapping initiative in Tokyo
June 10, 2025
Japanese shipping and logistics group Yamato will be the initiative’s first major customer and focus on last mile applications. US company Ample will provide battery swapping tech for the participating EV platforms.
WIN announces linearity optimized 0.12µm GaN power process
June 06, 2025
Engineered for demanding high-power applications across K-Band to V-Band frequencies, NP12-1B delivers industry leading high power front end solutions with exceptional linearity, ruggedness, and reliability for next-generation RF and microwave systems.
EdgeCortix secures $21M to develop energy-efficient AI chiplet
June 02, 2025
This funding will drive the development of NovaEdge — a next-generation, energy-efficient edge AI chiplet designed for high-performance generative AI inference and on-device learning.
HANMI Semiconductor launches TC BONDER 4 for HBM4
May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.
Renesas advances India partnership, enhances R&D teams
May 14, 2025
These MOUs focus on supporting local startups by enabling them to drive technological advancement and promote local manufacturing in alignment with the Make in India initiative; and enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students.
NEC achieves Japan’s longest free-space optical communication
April 28, 2025
NEC achieved Japan’s longest terrestrial wireless optical communication over a distance of over 10 km. It also conducted FSO communications between an observation deck at the tallest structure in Japan and a location on the ground 3 km away.
Czech semiconductor centre launches in Brno
April 16, 2025
Another step toward Europe's semiconductor independence has been taken with the launch of the Czech Semiconductor Centre (CSC) in Brno. The centre will focus on supporting innovation, prototyping, and the growth of European fabless companies.
Tokyo Electron, IBM renew partnership for advanced chip tech
April 03, 2025
The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
Thermo Fisher launches solution to boost chip manufacturing
March 26, 2025
The seamlessly integrated system is designed to enhance productivity, increase yield and reduce operating costs for semiconductor manufacturers.
TRENDE’s renewable energy initiatives get $7.2M boost
March 21, 2025
This capital infusion will accelerate TRENDE's growth initiatives, including the expansion of its solar and battery leasing service “Teraris,” and its peer-to-peer (P2P) energy trading platform.
TEL expands with new production building in Miyagi
February 26, 2025
Tokyo Electron is expanding its Miyagi plant in Japan by adding a new production building to meet the rapidly growing demand for semiconductors in recent years.
KASFAB opens India’s first semiconductor equipment manufacturing facility
January 28, 2025
KASFAB Tools Private Limited, a subsidiary of KAS Group, has inaugurated India’s first dedicated facility for manufacturing semiconductor equipment, aiming to serve global customers.
Eaton wins contract to support NY CREATES’ new facility
January 15, 2025
Eaton has signed a contract valued at approximately USD 20 million to help support the construction of NY CREATES' new NanoFab Reflection semiconductor R&D facility at its Albany NanoTech Complex.
Graphene – the sense of a new world
January 10, 2025
Graphene has been described as a “wonder material” ever since its discovery 20 years ago. While at times the hype has been over-egged, its properties are already changing more than just the semiconductor industry.
WMG, Binghamton to collaborate on battery capabilities
December 16, 2024
The five-year MoU sets the foundation for sharing of academic, scientific and cultural experiences between the WMG, at The University of Warwick in the UK, and Binghamton University.
Rohm, TSMC launch GaN partnership for EV sector
December 13, 2024
The partnership will integrate Japanese semiconductor company Rohm’s device development technology with TSMC’s GaN-on-silicon process technology.
Kioxia plans December IPO as Samsung widens lead
November 08, 2024
Bain Capital-backed Kioxia may use a new method for listing at the Tokyo Stock Exchange to speed up its IPO, which has been delayed in the past.
Battery analytics provider Liminal raises $10 million
October 21, 2024
The investment round was catalyzed by LG Technology Ventures, the venture capital arm of the LG Group, and included new support from Chailease Holdings as well as participation by current investors.
Russia to spend $2.5 billion on domestic chipmaking tool tech
October 14, 2024
The initiative includes launching 110 R&D projects to reduce dependence on imported wafer fab tools and make chips on a 28nm-class process technology.
Zeiss opens semiconductor applications lab in Dresden
October 10, 2024
Zeiss has recently opened the Zeiss Microscopy semiconductor applications lab in Dresden, a new facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the Zeiss Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).
Rapidus unveils plans for new R&D facility and clean room
October 03, 2024
Rapidus Corporation will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open an R&D center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
Memory chipmaker Kioxia scraps October IPO plan
September 27, 2024
Bain Capital, which holds a 56% stake in Kioxia along with SK hynix, had been targeting a market value of 1.5 trillion yen (USD 10.39 billion) for Kioxia.
Analog Devices, Tata sign pact to boost chip manufacturing in India
September 19, 2024
Tata Electronics and ADI will explore opportunities to manufacture ADI’s products in Tata's Gujarat fab and OSAT in Assam.
US, Japan near deal to restrict chip tech exports to China
September 18, 2024
But Japanese companies fear China could hit back with a blockade on key minerals like gallium and graphite that would impact the country’s chip and EV industries.
Bosch invests €270 million in Japan
September 17, 2024
Bosch has reaffirmed its commitment to Japan with a total investment of EUR 270 million in a new headquarters in Yokohama.
Tata enters partnership with Tokyo Electron Limited
September 12, 2024
Tata Electronics and Tokyo Electron Limited (TEL) have signed a memorandum of understanding to speed up the development of semiconductor equipment in India. This partnership will support Tata Electronics’ new semiconductor fab in Dholera, Gujarat, and its assembly and test facility in Jagiroad, Assam.
Nvidia suffers $279 bn loss in market value as shares tumble by 9.5%
September 04, 2024
Tuesday’s decline in chip stocks was reflected in the overall performance of Wall Street, with the Nasdaq down 3.3% and the S&P 500 dropping 2.1%.
AGC opens technical service hub in Taiwan, with eye on semiconductor market
September 02, 2024
The centre will actively propose chemical products that align with customers’ technology roadmaps and contribute to research and development of new products, the company said.
Samsung, SK hynix’s China sales double
August 23, 2024
Samsung’s sales in China doubled to USD 24.2 billion in the first half of 2024 compared to the same period last year.
Shipments to China limit revenue decline of top 5 WFE makers
August 15, 2024
The world’s top-five wafer fab equipment (WFE) manufacturers' revenue decreased 9% YoY in Q1 2024 due to delayed customer investments in leading-edge semiconductors, which were offset to some extent by strong DRAM demand.
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