TE Connectivity to acquire power solutions provider Astrodyne August 06, 2026 Headquartered in New Jersey, Astrodyne is recognized for its engineering expertise and close collaboration with customers developing next-gen technologies across semiconductor manufacturing equipment, medical, defense and industrial applications.
AccelerComm powers Eclipse’s 5G physical layer for next-gen spacecraft July 31, 2026 Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.
EU, India strengthen strategic partnership with third TTC July 29, 2026 The meeting reviewed progress under the Trade and Technology Council’s (TTC’s) three work strands: digital connectivity and strategic technologies; clean and green technologies; and trade, investment and resilient value chains.
Microchip Technology signs definitive agreement to acquire Hailo July 29, 2026 The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.
Samsung, Broadcom expand collaboration across memory, foundry tech July 28, 2026 On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.
Samsung, KDDI complete AI-powered network optimization trial July 27, 2026 During peak hours, Samsung’s RAN Speed Optimizer (RSO) delivered an average increase of 31% in 5G downlink throughput across the overall trial area, with gains reaching a maximum increase of 52% in dense urban areas, on KDDI’s commercial 5G SA network in Japan.
Taara launches link planner for wireless optical communications July 24, 2026 The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.
Kontron secures European customer for 5G automotive modules July 23, 2026 This contract represents a milestone in Kontron’s strategy to establish a European alternative to non-European suppliers of mobile communications modules, as it marks the first time these modules will be used in a vehicle platform of a European car manufacturer.
SWISSto12 raises €73M to meet growing multi-orbit demand July 20, 2026 With this new round, the company is scaling its capacity to meet accelerating demand from commercial and sovereign government customers, spanning HummingLink — advanced, multi-orbit payload solutions — and HummingSat, SWISSto12’s GEO satellite product line.
Apple to spend $30 billion on US-made chips from Broadcom July 09, 2026 The new agreement will lead to the production of more than 15 billion US-made chips and enable Broadcom to expand and modernize its manufacturing facilities in Fort Collins, Colorado, with a USD 1.5 billion capital expenditure investment.
FOXTRON, MediaTek to advance intelligent vehicle experiences July 07, 2026 The MediaTek Dimensity AX C-X1 platform, which incorporates NVIDIA’s leading-edge GPU and advanced AI technologies, will be integrated into premium automotive solutions across the partners’ ecosystems.
Boeing wins $2 billion contract for communications satellites July 06, 2026 The US Space Force contract award for Mobile User Objective System Service Life Extension (MUOS SLE) includes two narrowband communications satellites that prioritize reliable voice and essential data.
MediaTek, Samsung achieve 3Tx 5-layer uplink breakthrough July 03, 2026 Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.
Rocket Lab to acquire Iridium in $8 billion deal July 01, 2026 The transaction will give Rocket Lab an immediate foothold in space-based applications, including both proprietary and standards-based satellite Internet of Things (IoT) and direct-to-device (D2D), PNT, and critical safety-of-life services.
Indian space-tech startup QOSMIC raises $3.3 million June 29, 2026 The fresh funding will be used to deliver operational optical ground stations and satellite terminals to international customers, scale integration, testing and manufacturing, and expand its engineering teams across optics, mechanical systems and electronics.
onsemi to acquire Synaptics in $7 billion all-stock deal June 26, 2026 Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.
Joynext opens new production hall in Poland June 25, 2026 Chinese automotive electronics manufacturer Joynext opened a new 13,300 square-metre production hall at its site in Oborniki Śląskie near Wrocław in Poland in April, bringing the site's total production area to approximately 26,000 square metres.
Why does signal integrity determine the effectiveness of defence systems? June 25, 2026 The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.
Nokia and Lenovo sign multi-year patent cross-license agreement June 24, 2026 Nokia and Lenovo have signed a multi-year, multi-technology patent cross-license agreement. The terms are confidential. The two companies previously signed a similar agreement in 2021.
Viasat selected by US Space Force to deliver dual-band satellite system June 23, 2026 Under this multi-year development award, Viasat’s Space and Mission Systems (SMS) team will produce and deliver a dual-band X/Ka-band mini-GEO, maneuverable satellite, and provide ground stations and operations support.
Nokia announces $30M semiconductor investment in Pennsylvania June 22, 2026 The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.
Siemens, HighByte partner on industrial data operations June 18, 2026 Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.
Börje Ekholm steps down as CEO of Ericsson – Per Narvinger takes over June 16, 2026 Ericsson has announced that Börje Ekholm is stepping down as President and CEO, with Per Narvinger appointed as his successor. Narvinger, currently Executive Vice President and Head of Business Area Networks, takes over on October 1, 2026.
Neura Robotics secures $1.4 billion to advance physical AI platform June 12, 2026 German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.
UCLA Samueli launches $125 million semiconductor hub June 08, 2026 The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.
The challenge of connecting data across electronics manufacturing June 03, 2026 Electronics manufacturers have more access to production data than ever before. Yet despite growing investments in digitalisation, many companies still struggle to achieve complete visibility across their production environments.
Wolfspeed launches dedicated data centre team in Silicon Valley June 02, 2026 Silicon carbide specialist Wolfspeed has established a dedicated data centre solutions team and regional office in the San Francisco Bay Area, targeting the growing market for high-voltage power solutions in AI infrastructure. The company has hired two industry veterans to lead the effort.
Semtech Corporation Joins Z-Wave Alliance Board of Directors June 01, 2026 As a provider of high-performance semiconductors powering AI data center networking, IoT connectivity, and intelligent connected devices worldwide, Semtech brings silicon expertise and a unique perspective to the Alliance.
Star Catcher raises $65 million to build power grid in space May 29, 2026 The US startup is developing a space-based energy infrastructure layer that delivers electricity on demand to satellites and other spacecraft using optical power beaming. The Series A positions Star Catcher to move from validated technology to scalable infrastructure.
Tokyo wants to build a city-sized testbed for humanoid robots May 22, 2026 A Tokyo university is planning a futuristic district where humanoid robots, autonomous vehicles and drone deliveries will operate as part of everyday urban life — turning an entire neighbourhood into a live test environment for next-generation technologies.
LG Innotek wins $68M order to supply automotive Wi-Fi 7 module May 22, 2026 LG Innotek’s Automotive Wi-Fi 7 Communication Module will be integrated into Audio, Video, and Navigation(AVN) systems, which will then be delivered to the European automotive parts company.
Jazz partners with Huawei to boost green connectivity in Pakistan May 19, 2026 The initiative in Pakistan’s communications sector has a total installed capacity of 13 MW. The project leverages Huawei’s integrated green site solutions, combining solar power, battery storage, and intelligent energy management.