OpenAI and Broadcom team up to develop 10 GW of AI accelerators October 14, 2025 OpenAI and Broadcom have announced a strategic, multi-year collaboration to develop and deploy 10 gigawatts of custom AI accelerators.
ShunYun Technology & NewPhotonics enter volume PIC manufacturing deal October 07, 2025 ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, and NewPhotonics, a designer of photonic integrated circuit (PIC) chips for data centre optical interconnect, have entered into a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.
UNIVITY wins €31M CNES contract to accelerate space-based 5G October 06, 2025 French startup UNIVITY and TDF will carry out a demonstration of satellite-based 5G connectivity. This experiment will validate the relevance of a fully integrated 5G NTN solution combining VLEO satellites with terrestrial infrastructure.
Scania boosts electrification push following Northvolt carve-out September 23, 2025 Scania is launching Scania Industrial Batteries, a new division headquartered in Sweden and focused on electrification solutions for off-road and industrial sectors such as mining, construction and material handling.
Ericsson wins major 5G contract in the UK September 22, 2025 Ericsson has secured an SEK 12.5 billion (approximately GBP 1 billion) contract to supply the majority of VodafoneThree’s next-generation UK mobile network, including the operator’s entire core network. The eight-year partnership marks one of Europe’s largest network consolidation projects.
Valens partners with Samsung to enhance MIPI A-PHY ecosystem September 12, 2025 Samsung Foundry will fabricate Valens Semiconductor’s MIPI A-PHY chipsets using its advanced automotive process node. This process is supported by Samsung’s expertise in automotive foundry processes, IP and service package development.
GlobalLogic, Ericsson deploy private 5G network at Hitachi Rail factory September 12, 2025 The new infrastructure is the digital backbone of the Hagerstown plant in Maryland, US, enhancing efficiency, safety and innovation capabilities in rail manufacturing.
Nokia opens new R&D and manufacturing campus in Oulu September 08, 2025 Nokia has inaugurated a new research and manufacturing campus in Oulu, Finland, dedicated to developing next-generation networks designed for artificial intelligence.
Poland in the race for the Baltic AI GigaFactory August 29, 2025 Poland, together with Estonia, Lithuania and Latvia, has submitted an Expression of Interest to the European Commission for the creation of the Baltic AI GigaFactory – a project valued at around 3 billion euros and designed to become the region’s largest high-performance computing infrastructure for artificial intelligence. According to Poland’s Ministry of Digital Affairs, the proposal was formally lodged in June 2025 as part of the EU’s InvestAI initiative. Now these countries must wait for a decision.
GF expands partnership with Apple August 14, 2025 GlobalFoundries has entered into an agreement with Apple for a deeper collaboration aiming to advance semiconductor technologies and strengthen US manufacturing.
Eutelsat, Tata’s Nelco to offer LEO connectivity across India August 14, 2025 Under the agreement, OneWeb India Communications, Eutelsat’s local operating entity, will partner with Nelco to deliver secure, low-latency Low Earth Orbit (LEO) connectivity for customers on land, at sea, and in the air.
Amphenol to acquire CCS business from CommScope August 06, 2025 Amphenol Corporation has entered into a definitive agreement to acquire CommScope’s Connectivity and Cable Solutions (CCS) business for USD 10.5 billion in cash, subject to customary post-closing adjustments.
Teramount raises $50M to advance optical connectivity solutions for AI July 31, 2025 Israeli company Teramount’s TeraVerse solution is a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.
Sharp teams up with Mitsubishi, NICT, TECHLAB to advance LEO satcom July 30, 2025 By enabling deployment on mobility platforms such as drones and vehicles, applications of Low Earth Orbit (LEO) satellite communication (satcom) will be significantly expanded, ensuring communication lines in mountainous areas and disaster zones.
KISTI secures funding for National Quantum Center of Excellence July 21, 2025 Korea Institute of Science and Technology Information (KISTI) has identified US company IonQ as the primary quantum technology provider for the project, alongside South Korean cloud service and infrastructure provider Megazone Cloud.
Valens’s chipsets enable MIPI A-PHY platform for Embedded Vision by D3 July 17, 2025 The A-PHY platform offers D3 Embedded customers a series of unique benefits, including unparalleled EMI resilience, longer link distances, and the ability to operate over simple, low-cost cabling.
SK keyfoundry, LB Semicon co-develop Direct RDL for chip packaging July 15, 2025 RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.
Nordic, Future Electronics enter global distribution partnership July 11, 2025 The agreement sees Future added to Norwegian company Nordic’s group of global distribution partners, and involves Future bringing Nordic’s entire current product line to market. Future will also stock modules from Nordic module partners.
Boeing wins $2.8B contract to enhance US strategic SATCOM capabilities July 10, 2025 The ESS space vehicles will provide increased capacity, flexibility, reliability and resilience compared to the strategic communications satellites currently on orbit. Since 2020, Boeing has been executing technical maturation and risk reduction under a rapid prototyping contract for the US Space Force.
Delta to construct new regional headquarters in the Netherlands July 10, 2025 Located in the Park 20|20 business campus, the state-of-the-art 9300-sqm facility in Hoofddorp is expected to be completed by the end of 2026 and will house over 350 employees in R&D, business development, management and more.
Arrow launches Engineering Solutions Center in Bangalore July 09, 2025 The newly established India ESC is designed to help innovators and technology manufacturers adopt advanced technologies such as edge computing, energy management, automation and e-mobility.
Meter raises $170 million in Series C funding June 30, 2025 Meter delivers reliable, secure and scalable internet, Wi-Fi, and cellular connectivity for the enterprise. The company built networking infrastructure from the ground up: enterprise hardware, firmware, software, deployment operations and support
Caspia collaboration to boost security verification in Siemens’ Questa One June 27, 2025 Fueled by AI technology, the hardware root of trust has now become vulnerable to attack, making it critical to harden SoC designs against such sophisticated attacks. The collaboration responds directly to this threat by adding Caspia’s industry leading GenAI security technology to the Questa One smart verification solution.
Nordic Semiconductor acquires Memfault June 25, 2025 Nordic Semiconductor acquires its long-term partner, Memfault Inc., a cloud platform provider for large-scale deployments of connected products. Through the acquisition Nordic Semi takes the step from a hardware supplier to a complete solution partner.
Vi partners with AST SpaceMobile to boost mobile connectivity in India June 23, 2025 This partnership will bring together Vi’s national network with AST SpaceMobile’s space-based cellular technology, which connects directly to everyday smartphones without the need of any specialized software or device support or updates.
GCT partners with Iridium to integrate NTN DirectSM service into chipset June 20, 2025 GCT and Iridium will work together to expedite the development of a new Iridium network-enabled Narrowband Internet of Things (NB-IoT) chipset based on requirements for 3GPP Release 19.
Nordic Semi acquires Neuton.AI June 17, 2025 Nordic Semiconductor has acquired the intellectual property and core technology assets of Neuton.AI, a developer of fully automated TinyML solutions. The move is aimed at advancing Nordic's capabilities in edge AI, particularly in combination with the company’s nRF54 Series of ultra-low-power wireless SoCs.
Qualcomm to acquire Alphawave Semi in $2.4 billion deal June 10, 2025 Qualcomm Incorporated has signed a definitive agreement to acquire UK-based Alphawave IP Group plc (Alphawave Semi) in a transaction valued at approximately USD 2.4 billion. The acquisition, executed through Qualcomm’s indirect subsidiary Aqua Acquisition Sub LLC, marks a strategic move aimed at accelerating Qualcomm’s expansion into data centre markets.
Maxar wins contract to build high-power EchoStar XXVI satellite June 09, 2025 EchoStar XXVI will deliver robust coverage to DISH TV customers across all 50 US states, including Puerto Rico, and is engineered for dual orbital slot performance, giving EchoStar enhanced operational flexibility to meet evolving customer and network demands.
China’s GigaDevice opens global headquarters in Singapore June 05, 2025 This strategic move marks a major milestone in GigaDevice’s international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.
Celtonn bags ESA contract to develop chip hardware for satellites June 02, 2025 As the project lead, Celtonn will develop a high-linearity, low-noise amplifier (LNA) for V-band feeder uplink — a key enabler for next-generation satellite communication payloads.
Lynkwell launches QuickLynk to reduce EV charger connection time May 30, 2025 By eliminating manual configuration steps, QuickLynk streamlines the setup of Lynkwell’s XLynk Level 2 charger, enabling installers to be more efficient and empowering site hosts to control their new charger settings.