Evertiq - First In Electronics News & Expo

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chip

September 12, 2025
Samsung Foundry will fabricate Valens Semiconductor’s MIPI A-PHY chipsets using its advanced automotive process node. This process is supported by Samsung’s expertise in automotive foundry processes, IP and service package development.

HitachiRail

September 12, 2025
The new infrastructure is the digital backbone of the Hagerstown plant in Maryland, US, enhancing efficiency, safety and innovation capabilities in rail manufacturing.

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R-D-manufacturing-campus-networks-built-for-AI

September 08, 2025
Nokia has inaugurated a new research and manufacturing campus in Oulu, Finland, dedicated to developing next-generation networks designed for artificial intelligence.

PCB-Poland_3

August 29, 2025
Poland, together with Estonia, Lithuania and Latvia, has submitted an Expression of Interest to the European Commission for the creation of the Baltic AI GigaFactory – a project valued at around 3 billion euros and designed to become the region’s largest high-performance computing infrastructure for artificial intelligence. According to Poland’s Ministry of Digital Affairs, the proposal was formally lodged in June 2025 as part of the EU’s InvestAI initiative. Now these countries must wait for a decision.

August 14, 2025
GlobalFoundries has entered into an agreement with Apple for a deeper collaboration aiming to advance semiconductor technologies and strengthen US manufacturing.

Earth_orbit_GustavoAckles

August 14, 2025
Under the agreement, OneWeb India Communications, Eutelsat’s local operating entity, will partner with Nelco to deliver secure, low-latency Low Earth Orbit (LEO) connectivity for customers on land, at sea, and in the air.

businessman-hand-touching-virtual-screen

August 06, 2025
Amphenol Corporation has entered into a definitive agreement to acquire CommScope’s Connectivity and Cable Solutions (CCS) business for USD 10.5 billion in cash, subject to customary post-closing adjustments.

leadership

July 31, 2025
Israeli company Teramount’s TeraVerse solution is a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.

logo_building

July 30, 2025
By enabling deployment on mobility platforms such as drones and vehicles, applications of Low Earth Orbit (LEO) satellite communication (satcom) will be significantly expanded, ensuring communication lines in mountainous areas and disaster zones.

KISTI

July 21, 2025
Korea Institute of Science and Technology Information (KISTI) has identified US company IonQ as the primary quantum technology provider for the project, alongside South Korean cloud service and infrastructure provider Megazone Cloud.

chip

July 17, 2025
The A-PHY platform offers D3 Embedded customers a series of unique benefits, including unparalleled EMI resilience, longer link distances, and the ability to operate over simple, low-cost cabling.

keyfoundry

July 15, 2025
RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.

chip

July 11, 2025
The agreement sees Future added to Norwegian company Nordic’s group of global distribution partners, and involves Future bringing Nordic’s entire current product line to market. Future will also stock modules from Nordic module partners.

ESS-satellite

July 10, 2025
The ESS space vehicles will provide increased capacity, flexibility, reliability and resilience compared to the strategic communications satellites currently on orbit. Since 2020, Boeing has been executing technical maturation and risk reduction under a rapid prototyping contract for the US Space Force.

Netherlands

July 10, 2025
Located in the Park 20|20 business campus, the state-of-the-art 9300-sqm facility in Hoofddorp is expected to be completed by the end of 2026 and will house over 350 employees in R&D, business development, management and more.

India

July 09, 2025
The newly established India ESC is designed to help innovators and technology manufacturers adopt advanced technologies such as edge computing, energy management, automation and e-mobility.

Meter

June 30, 2025
Meter delivers reliable, secure and scalable internet, Wi-Fi, and cellular connectivity for the enterprise. The company built networking infrastructure from the ground up: enterprise hardware, firmware, software, deployment operations and support

cyber_security_ChristophMeinersmann

June 27, 2025
Fueled by AI technology, the hardware root of trust has now become vulnerable to attack, making it critical to harden SoC designs against such sophisticated attacks. The collaboration responds directly to this threat by adding Caspia’s industry leading GenAI security technology to the Questa One smart verification solution.

acquires-Memfault

June 25, 2025
Nordic Semiconductor acquires its long-term partner, Memfault Inc., a cloud platform provider for large-scale deployments of connected products. Through the acquisition Nordic Semi takes the step from a hardware supplier to a complete solution partner.

SpaceMobile_building

June 23, 2025
This partnership will bring together Vi’s national network with AST SpaceMobile’s space-based cellular technology, which connects directly to everyday smartphones without the need of any specialized software or device support or updates.

Semiconductor

June 20, 2025
GCT and Iridium will work together to expedite the development of a new Iridium network-enabled Narrowband Internet of Things (NB-IoT) chipset based on requirements for 3GPP Release 19.

June 17, 2025
Nordic Semiconductor has acquired the intellectual property and core technology assets of Neuton.AI, a developer of fully automated TinyML solutions. The move is aimed at advancing Nordic's capabilities in edge AI, particularly in combination with the company’s nRF54 Series of ultra-low-power wireless SoCs.

June 10, 2025
Qualcomm Incorporated has signed a definitive agreement to acquire UK-based Alphawave IP Group plc (Alphawave Semi) in a transaction valued at approximately USD 2.4 billion. The acquisition, executed through Qualcomm’s indirect subsidiary Aqua Acquisition Sub LLC, marks a strategic move aimed at accelerating Qualcomm’s expansion into data centre markets.

Echostar

June 09, 2025
EchoStar XXVI will deliver robust coverage to DISH TV customers across all 50 US states, including Puerto Rico, and is engineered for dual orbital slot performance, giving EchoStar enhanced operational flexibility to meet evolving customer and network demands.

Singapore_headquarters

June 05, 2025
This strategic move marks a major milestone in GigaDevice’s international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.

team

June 02, 2025
As the project lead, Celtonn will develop a high-linearity, low-noise amplifier (LNA) for V-band feeder uplink — a key enabler for next-generation satellite communication payloads.

charger

May 30, 2025
By eliminating manual configuration steps, QuickLynk streamlines the setup of Lynkwell’s XLynk Level 2 charger, enabling installers to be more efficient and empowering site hosts to control their new charger settings.

cooperation-3

May 27, 2025
The Internet of Things (IoT) is no longer the domain of futuristic visions — it has become a tangible, widespread element of everyday life, from smart homes and modern cities to industrial and logistics applications. At the core of this ecosystem are communication technologies that enable data exchange between devices. Dr Łukasz Krzak from the AGH University of Science and Technology in Kraków spoke to Evertiq about the trends and challenges shaping the selection of these technologies.

Sponsored content by TME Transfer Multisort Elektronik

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Designed for security and durability, the robust Arduino Opta micro PLC makes industrial and building automation accessible to everyone.

Semiconductor

May 23, 2025
This collaboration for eSIMs, or SIM cards directly embedded into a device, brings intelligent, location-aware connectivity to headless 4G and 5G IoT devices.

satcom-2024

May 19, 2025
Digital Intermediate Frequency Interoperability (DIFI) Consortium is a global collective of industry leaders collaborating to develop and promote open, standards-based interoperability for digital IF/RF systems.

India_MOU

May 14, 2025
These MOUs focus on supporting local startups by enabling them to drive technological advancement and promote local manufacturing in alignment with the Make in India initiative; and enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students.

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