Evertiq - First In Electronics News & Expo

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TOP100

September 18, 2026
When Mareike Haass took to the stage at Evertiq Expo in Gothenburg on September 17, she presented what in4ma describes as the first complete ranking of Europe's 100 largest EMS companies, built on data sourced directly from national company registers and the companies themselves. The full list is now available.

AdamTech

September 15, 2026
Agreement brings US manufacturer Adam Tech's extensive range of connectors, cables and electromechanical products to customers across Europe.

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September 14, 2026
The collaboration brings together Amazon’s comprehensive, secure and price-performant AI infrastructure with Qualcomm Technologies’ expertise in power-efficient processing, silicon design and system-level integration.

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September 11, 2026
The partnership brings together Sure-Seal Connections’ proven sealed connector technology with Wesgarde’s market expertise and established customer relationships.

CEO-vincent-Roche

September 10, 2026
Analog Devices has announced a definitive agreement to acquire Alif Semiconductor in an all-cash transaction valued at USD 1.35 billion, with potential additional contingent consideration of up to USD 200 million. The deal is expected to close before the end of 2026.

building

September 07, 2026
By combining 1Aardvark’s mission software expertise with CesiumAstro’s satellites, communications systems and advanced computing capabilities, the company can now support more capable missions in which spacecraft can respond to changing conditions.

axonite_chip

September 04, 2026
GCT Semiconductor and the infrastructure provider for utilities and IoT have a long history of cooperation in the utility sector. The collaboration combines GCT’s cellular and NTN expertise with the provider’s industrial-grade wireless innovation.

Photonics-production

September 03, 2026
Swedish company Sivers Semiconductors is investing USD 30 million to expand its indium phosphide manufacturing facility in Glasgow, Scotland.

September 01, 2026
Kitron plans to build a new 8,850 square-metre factory for its Danish operations in Horsens, replacing its current site in the same city. Construction is expected to begin in January 2027, with the facility ready for operation in early 2028.

sign-on-building

September 01, 2026
Nvidia and MediaTek have announced an expanded collaboration spanning cloud AI infrastructure, local AI computing and automotive. As part of the deal, Nvidia has invested USD 3.5 billion in convertible bonds issued by MediaTek.

Electronics_smart_telematics

August 25, 2026
The smart telematics solution integrates the communications module and multiple antennas into a single unit. LG Electronics has already commenced deliveries to a European automaker, marking the solution’s first deployment in a production vehicle in Europe.

Skyhop_MOU

August 19, 2026
Under the MoU, SkyHop and Noemi will evaluate the technical, operational, commercial and regulatory requirements for introducing Noemi’s seaplanes into SkyHop’s future fleet. SkyHop plans to introduce up to 10 Noemi amphibious aircraft by FY2030.

640

August 18, 2026
Semtech has entered into a definitive agreement to sell its cellular module business to Compal Electronics for USD 62 million in cash. The transaction is expected to close in Q4 of Semtech's 2027 fiscal year, subject to regulatory approvals.

Earth_orbit_GustavoAckles

August 18, 2026
Under the agreement, Nelco will bring reliable, next-generation connectivity and compute solutions directly from Elveo’s satellites in space to varied sectors, including automotive, maritime, energy and government in India and South Asian markets.

pexels-handshake

August 06, 2026
Headquartered in New Jersey, Astrodyne is recognized for its engineering expertise and close collaboration with customers developing next-gen technologies across semiconductor manufacturing equipment, medical, defense and industrial applications.

cosmos-3

July 31, 2026
Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.

Henna-Virkkunen

July 29, 2026
The meeting reviewed progress under the Trade and Technology Council’s (TTC’s) three work strands: digital connectivity and strategic technologies; clean and green technologies; and trade, investment and resilient value chains.

Technology_building

July 29, 2026
The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.

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July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

RSO_KDDI

July 27, 2026
During peak hours, Samsung’s RAN Speed Optimizer (RSO) delivered an average increase of 31% in 5G downlink throughput across the overall trial area, with gains reaching a maximum increase of 52% in dense urban areas, on KDDI’s commercial 5G SA network in Japan.

link_planner

July 24, 2026
The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.

July 23, 2026
This contract represents a milestone in Kontron’s strategy to establish a European alternative to non-European suppliers of mobile communications modules, as it marks the first time these modules will be used in a vehicle platform of a European car manufacturer.

SWISSto12

July 20, 2026
With this new round, the company is scaling its capacity to meet accelerating demand from commercial and sovereign government customers, spanning HummingLink — advanced, multi-orbit payload solutions — and HummingSat, SWISSto12’s GEO satellite product line.

PCB-USA_1

July 09, 2026
The new agreement will lead to the production of more than 15 billion US-made chips and enable Broadcom to expand and modernize its manufacturing facilities in Fort Collins, Colorado, with a USD 1.5 billion capital expenditure investment.

cooperation-1

July 07, 2026
The MediaTek Dimensity AX C-X1 platform, which incorporates NVIDIA’s leading-edge GPU and advanced AI technologies, will be integrated into premium automotive solutions across the partners’ ecosystems.

satellite

July 06, 2026
The US Space Force contract award for Mobile User Objective System Service Life Extension (MUOS SLE) includes two narrowband communications satellites that prioritize reliable voice and essential data.

building_logo

July 03, 2026
Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.

Lab_Iridium

July 01, 2026
The transaction will give Rocket Lab an immediate foothold in space-based applications, including both proprietary and standards-based satellite Internet of Things (IoT) and direct-to-device (D2D), PNT, and critical safety-of-life services.

cosmos-3

June 29, 2026
The fresh funding will be used to deliver operational optical ground stations and satellite terminals to international customers, scale integration, testing and manufacturing, and expand its engineering teams across optics, mechanical systems and electronics.

June 26, 2026
Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.

2026-expansion-Poland

June 25, 2026
Chinese automotive electronics manufacturer Joynext opened a new 13,300 square-metre production hall at its site in Oborniki Śląskie near Wrocław in Poland in April, bringing the site's total production area to approximately 26,000 square metres.

DACPOL-Dominik-Kowalczyk-Krakow-2026

June 25, 2026
The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.

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