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Guadalajara-mexico-plant

May 14, 2026
Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

SCALE

May 13, 2026
GlobalFoundries’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes.

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Massive_MIMO

May 08, 2026
Huawei’s sub-1 GHz Massive MIMO is the first solution in the industry to combine extremely large antenna arrays with wideband technology in the low-band spectrum.

UMC

May 04, 2026
Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.

semiconductor-revenue-growth-2026

April 28, 2026
Omdia has significantly raised its 2026 semiconductor revenue forecast, now projecting growth of 62.7%, citing sustained AI-driven demand and tightening supply conditions in memory markets.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

cosmos-3

April 27, 2026
The three partners will combine their respective expertise in military communications payloads, mission control, efficient satellite platform design and industrialisation, as well as secure ground infrastructure and cybersecurity.

Microsystems

April 23, 2026
This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.

April 21, 2026
Molex has completed its acquisition of Smiths Interconnect, a subsidiary of Smiths Group plc, marking the largest acquisition in the company’s history.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

groundbreaking_Cable-Manufacturing-Expansion-North-Carolina

April 07, 2026
Corning Incorporated and Meta Platforms, Inc. have started construction on an expansion of optical cable manufacturing capacity in Hickory, North Carolina, aimed at supporting the growing buildout of AI-driven data centres in the United States.

Inova_PhysicalAI

March 30, 2026
The advanced robotic arm reference platform combines the expertise of Inova, MIPS and GlobalFoundries to build an advanced Physical AI building block that aggregates data interfaces and enables multiple network topologies.

axonite_chip

March 26, 2026
Headquartered South Carolina, United Electronics Company (UEC) manufactures a suite of RF, circuit card assembly, and power and connectivity solutions that generate, amplify, transmit and receive power and signals for a diverse set of systems.

Headquarters-MRS-Electronic-in-Rottweil

March 24, 2026
Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS Holding GmbH, the parent company of MRS Electronic, in a move aimed at strengthening its position in vehicle electronics.

sign-on-building

March 24, 2026
Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.

building_logo

March 20, 2026
Under the agreement, Soitec will provide POI wafers for Skyworks’ Sky5 platform to address RF requirements of today’s 5G smartphones. Soitec POI provides the performance necessary for seamless advanced coexistence in dense signal environments.

groundbreaking-Dresden-expansion-2026

March 18, 2026
GlobalFoundries has started construction of its planned semiconductor fab expansion in Dresden, Germany, marking the next phase of its EUR 1.1 billion investment under Project SPRINT, according to a company update on LinkedIn.

cloud_server

March 16, 2026
The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.

newark-delaware-opening

March 12, 2026
US semiconductor materials supplier Qnity Electronics has opened a new manufacturing facility in Newark, Delaware, aimed at expanding production capacity for chemical mechanical planarization (CMP) materials used in chip fabrication.

March 09, 2026
Qualcomm Technologies will manufacture Qualcomm Automotive Module products in India at Tata Electronics’ upcoming semiconductor assembly and test (OSAT) facility in Jagiroad, Assam.

businessman-hand-touching-virtual-screen

March 05, 2026
Semtech Corporation, a provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions, has acquired HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data centre interconnects (DCI) and intra-data centre interconnects.

new-technologies_1

March 05, 2026
A significant portion of the investment will focus on new businesses based on these technologies, contributing to the development of South Korea’s future industrial competitiveness.

logo_on_building

March 04, 2026
The project adds 8,000 km of new fiber routes. This expansion is expected to reach a total of 26,000 km across 23 Brazilian states by the end of 2026. Eletronet is investing USD 30.4 million in this initiative.

sign

March 03, 2026
Nvidia has entered a multiyear strategic agreement with Coherent to develop advanced optics technologies for next-generation AI infrastructure. The agreement includes a USD 2 billion investment by Nvidia in Coherent, alongside a multibillion-dollar purchase commitment for optical networking and laser products.

Kevin-OBuckley-EVP-Global-Operations-Supply-Chain

February 27, 2026
Qualcomm Incorporated has appointed Kevin O’Buckley as executive vice president of Global Operations and Supply Chain, effective 2 March 2026.

Globalfoundries-deal-2026

February 17, 2026
US semiconductor foundry GlobalFoundries and Japanese Renesas Electronics have expanded their manufacturing partnership in a multi-billion-dollar deal aimed at increasing semiconductor production in the United States.

Dresden-location

February 16, 2026
Infineon Technologies supplies microcontrollers, Ethernet connectivity solutions, power management ICs, and smart power switches for BMW Group’s Neue Klasse platform. The architecture separates software from hardware, enabling over-the-air updates without physical modifications.

building_logo

February 11, 2026
Marvell Technology has completed its previously announced acquisition of XConn Technologies, a provider of advanced PCIe and CXL switching silicon.

Breaks-Ground-Dunkirk-Gigafactory

February 11, 2026
Taiwanese battery developer ProLogium has officially started construction of its first European gigafactory, marking a significant step in the company’s expansion outside Asia.

Haviv-Ilan

February 04, 2026
Texas Instruments has signed a definitive agreement to acquire Silicon Labs in an all-cash transaction valuing the wireless connectivity specialist at approximately USD 7.5 billion.

campus

February 03, 2026
Marvell Technology has completed its previously announced acquisition of Celestial AI. The transaction was finalised following an earlier agreement and brings Celestial AI’s optical interconnect technology into Marvell’s portfolio.

axonite_chip

January 30, 2026
The agreement enables the integration of GCT’s 5G and 4G chipsets into the satellite provider’s user equipment, unlocking new capabilities for global, resilient, and high-bandwidth connectivity, both via satellite and terrestrial networks.

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