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June 26, 2026
Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.

2026-expansion-Poland

June 25, 2026
Chinese automotive electronics manufacturer Joynext opened a new 13,300 square-metre production hall at its site in Oborniki Śląskie near Wrocław in Poland in April, bringing the site's total production area to approximately 26,000 square metres.

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DACPOL-Dominik-Kowalczyk-Krakow-2026

June 25, 2026
The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.

June 24, 2026
Nokia and Lenovo have signed a multi-year, multi-technology patent cross-license agreement. The terms are confidential. The two companies previously signed a similar agreement in 2021.

satellite

June 23, 2026
Under this multi-year development award, Viasat’s Space and Mission Systems (SMS) team will produce and deliver a dual-band X/Ka-band mini-GEO, maneuverable satellite, and provide ground stations and operations support.

Dallas_office

June 22, 2026
The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.

Vidros_Planos_Siemens

June 18, 2026
Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.

Borje-Ekholm-CEO

June 16, 2026
Ericsson has announced that Börje Ekholm is stepping down as President and CEO, with Per Narvinger appointed as his successor. Narvinger, currently Executive Vice President and Head of Business Area Networks, takes over on October 1, 2026.

Robotics

June 12, 2026
German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.

Samueli_semiconductor_hub

June 08, 2026
The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.

Moritz-Floder

June 03, 2026
Electronics manufacturers have more access to production data than ever before. Yet despite growing investments in digitalisation, many companies still struggle to achieve complete visibility across their production environments.

Headquarters-Durham

June 02, 2026
Silicon carbide specialist Wolfspeed has established a dedicated data centre solutions team and regional office in the San Francisco Bay Area, targeting the growing market for high-voltage power solutions in AI infrastructure. The company has hired two industry veterans to lead the effort.

new-technologies_5

June 01, 2026
As a provider of high-performance semiconductors powering AI data center networking, IoT connectivity, and intelligent connected devices worldwide, Semtech brings silicon expertise and a unique perspective to the Alliance.

Catcher_Power_Node

May 29, 2026
The US startup is developing a space-based energy infrastructure layer that delivers electricity on demand to satellites and other spacecraft using optical power beaming. The Series A positions Star Catcher to move from validated technology to scalable infrastructure.

Laboratory

May 22, 2026
A Tokyo university is planning a futuristic district where humanoid robots, autonomous vehicles and drone deliveries will operate as part of everyday urban life — turning an entire neighbourhood into a live test environment for next-generation technologies.

Innotek_communication_module

May 22, 2026
LG Innotek’s Automotive Wi-Fi 7 Communication Module will be integrated into Audio, Video, and Navigation(AVN) systems, which will then be delivered to the European automotive parts company.

solar_mrganso

May 19, 2026
The initiative in Pakistan’s communications sector has a total installed capacity of 13 MW. The project leverages Huawei’s integrated green site solutions, combining solar power, battery storage, and intelligent energy management.

building_logo

May 18, 2026
During the lab test, the application of PC1 technology achieved up to 10 times higher uplink throughput at the cell-edge compared to PC1.5 standard. For users, this means smoother video calls and faster file upload in areas where signals are weak.

Guadalajara-mexico-plant

May 14, 2026
Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

SCALE

May 13, 2026
GlobalFoundries’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes.

Massive_MIMO

May 08, 2026
Huawei’s sub-1 GHz Massive MIMO is the first solution in the industry to combine extremely large antenna arrays with wideband technology in the low-band spectrum.

UMC

May 04, 2026
Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.

semiconductor-revenue-growth-2026

April 28, 2026
Omdia has significantly raised its 2026 semiconductor revenue forecast, now projecting growth of 62.7%, citing sustained AI-driven demand and tightening supply conditions in memory markets.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

cosmos-3

April 27, 2026
The three partners will combine their respective expertise in military communications payloads, mission control, efficient satellite platform design and industrialisation, as well as secure ground infrastructure and cybersecurity.

Microsystems

April 23, 2026
This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.

April 21, 2026
Molex has completed its acquisition of Smiths Interconnect, a subsidiary of Smiths Group plc, marking the largest acquisition in the company’s history.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

groundbreaking_Cable-Manufacturing-Expansion-North-Carolina

April 07, 2026
Corning Incorporated and Meta Platforms, Inc. have started construction on an expansion of optical cable manufacturing capacity in Hickory, North Carolina, aimed at supporting the growing buildout of AI-driven data centres in the United States.

Inova_PhysicalAI

March 30, 2026
The advanced robotic arm reference platform combines the expertise of Inova, MIPS and GlobalFoundries to build an advanced Physical AI building block that aggregates data interfaces and enables multiple network topologies.

axonite_chip

March 26, 2026
Headquartered South Carolina, United Electronics Company (UEC) manufactures a suite of RF, circuit card assembly, and power and connectivity solutions that generate, amplify, transmit and receive power and signals for a diverse set of systems.

Headquarters-MRS-Electronic-in-Rottweil

March 24, 2026
Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS Holding GmbH, the parent company of MRS Electronic, in a move aimed at strengthening its position in vehicle electronics.

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