Evertiq - First In Electronics News & Expo

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February 23, 2026
SoftBank's subsidiary SAIMEMORY has signed a collaboration agreement with Intel Corporation to advance the development and commercialisation of Z‑Angle Memory (ZAM), a next-generation memory technology designed for high capacity, high bandwidth and low power consumption.

acquires-Lacon-Group

February 20, 2026
In early December last year, Finnish EMS provider Incap Corporation signed an agreement to acquire 100% ownership of Lacon Group, an EMS company with facilities in Germany and Romania.

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2024

February 18, 2026
Back in December 2025, the City of Taylor, Texas, and the Taylor Economic Development Corporation (TEDC) announced an economic development agreement with Compal Electronics Inc. to establish a new advanced manufacturing facility in Taylor.

AITC-groundbreaking-august-2025

February 17, 2026
The joint venture between SVI Public Company Limited and China Circuit Technology (Shantou) Corporation has started recruiting personnel for its new PCB manufacturing facility in Thailand.

Drone

February 16, 2026
German defence technology company Stark has announced the opening of an R&D hub in Ukraine and a regional office in Greece, marking a strategic expansion across Europe.

global-wafer-shipments-msi-february-2026

February 12, 2026
Global silicon wafer shipments increased in 2025, while total wafer revenue declined slightly, according to year-end data from SEMI.

New-Fabrication-Facility-at-Yokkaichi-Plant

February 04, 2026
Kioxia Corporation and Sandisk Corporation have extended their joint venture agreements covering Kioxia’s Yokkaichi flash memory manufacturing plant in Japan by five years, pushing the expiry date to December 31, 2034.

February 02, 2026
Vanguard International Semiconductor Corporation (VIS) has signed a technology licensing agreement with TSMC covering both low-voltage (80V) and high-voltage (650V) gallium nitride (GaN) process technologies.

cosmos-2

January 30, 2026
Japan LEO Shachu was established in July 2024 as a wholly owned subsidiary of Mitsui with the aim of creating a new economy in Low Earth orbit (LEO) by leveraging Japan's technology and industrial foundation.

Space_founders

January 26, 2026
The fresh funds will be used to support continued development and qualification of the Australian company’s Eris orbital launch vehicle, scale rocket and satellite manufacturing, expand test and launch infrastructure, and grow its workforce.

headquarters

January 21, 2026
IPValue Management, Inc. has granted California-based Sandisk Corporation a worldwide, nonexclusive patent license to a patent portfolio held by IPValue’s affiliate Longitude Flash Memory Solutions, Ltd. that originated from Cypress Semiconductor.

New_Building

January 20, 2026
The electronics industry continues to expand, driven by advances in development technologies related to semiconductors. Taiyo Nippon Sanso Corporation (TNSC) will construct the new facility to create innovative and original new products in response to these technological advances.

EEC

January 19, 2026
This acquisition will enhance Leonardo’s capabilities in the meteorological business, led by Leonardo Germany, and strengthen its position as a provider of turnkey environmental system solutions based on remote sensing applications by radar, lidar or satellite.

li-battery_1

January 19, 2026
The Battery Anode Material facility in Yanbu Industrial City, Saudi Arabia, will be built through a joint venture company majority-owned (51%) by Saudi diversified industrial group Obeikan and 49% owned by Canadian company Northern Graphite Corporation.

January 19, 2026
The acquisition includes an existing 300mm fab cleanroom of 300,000 square feet and will further position Micron to address growing global demand for memory solutions.

Corporation_building

January 15, 2026
Under the agreement, Cabot Corporation will supply its advanced conductive carbons and conductive dispersions for use in EV battery electrodes.

SAR_satellite

January 14, 2026
This project uses a Private Finance Initiative to build and operate a satellite constellation through private-sector leadership. The initiative aims to provide persistent imagery intelligence that strengthens Japan’s defense posture through enhanced situational awareness and reconnaissance capabilities.

businessman-hand-touching-virtual-screen

January 14, 2026
Amphenol Corporation has completed its previously announced acquisition of CommScope’s Connectivity and Cable Solutions (CCS) business, the company said on January 12.

PCB-India_3

January 08, 2026
The R&D and innovation centre in Chennai will expand the US company’s regional AI and software development capabilities and boost collaboration and innovation across R&D, engineering and product support functions.

Toshiba_EDA

January 02, 2026
Toshiba’s deployment of Siemens’ EDA tools includes advanced thermal design and analysis for 3D IC architectures; power optimization, integrity and reliability enhancement; and next-generation analog simulation acceleration.

salt-lake-facility

December 18, 2025
Sanmina Corporation will expand its energy business with the construction of a new manufacturing facility in Houston, Texas, aimed at serving the US energy market.

sunderland-gigafactory-2025copy

December 18, 2025
Automotive Energy Supply Corporation (AESC) has launched its new electric vehicle battery gigafactory in Sunderland, UK, with production now underway.

Powernet_KEC_MOU

December 12, 2025
Wise will supply its GaN power devices, digital-control expertise and technical support; Powernet will lead the development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC will manage backend manufacturing.

KT_Corporation_AI_RAN

December 12, 2025
The AI-RAN optimization technology verified by the two companies automatically applies optimal configurations for each user — rather than for the network as a whole — based on real-time wireless conditions.

axonite_chip

December 11, 2025
This acquisition expands US firm Virtusa’s industry portfolio to include the high-growth semiconductor sector and completes its full-stack, end-to-end service capabilities, spanning the entire technology ecosystem from the chip to the network, cloud and application layer.

Intel_MOU

December 09, 2025
As part of the MoU, Intel and India’s Tata Group intend to explore manufacturing and packaging of Intel products for local markets at Tata Electronics’ upcoming Fab and OSAT facilities, as well as a collaboration for advanced packaging in India.

chip

December 08, 2025
In addition, based on this platform, Japanese imaging solutions leader CIS Corporation has announced the first A-PHY camera module for machine vision.

commodore-64-ultimate

December 05, 2025
The legendary computing brand Commodore has returned – with an official new hardware launch marking its first fully new computer in over 30 years. The revived company recently unveiled the Commodore 64 Ultimate, a retro-inspired yet modernised remake of the iconic 1982 home computer Commodore 64.

Pratt_Whitney

December 05, 2025
While the Hyderabad-based Azad Engineering did not disclose the size of the contract, it confirmed that there is no shareholding involved between the parties and that the deal does not fall under related-party transactions.

Corporation

December 05, 2025
The phase 2 contract provides funding to complete manufacturing and deliver the spacecraft to launch for the mission, which leverages the design of Redwire’s SabreSat platform.

Shizuoka_Factory

December 05, 2025
This investment strengthens the company’s capabilities for performance and quality evaluation of development products, accelerating the development of new materials for advanced and next-generation semiconductors and ensuring a stable supply of high-quality products.

Bloomington-Minnesota-manufacturing-facility

December 04, 2025
United Microelectronics Corporation (UMC) and Polar Semiconductor have signed a Memorandum of Understanding to explore a partnership aimed at expanding US-based production of 8-inch semiconductor wafers, the companies announced today.

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