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PCB-India_2

November 10, 2026
The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.

solar_farm

November 10, 2026
The funding comprises USD 42 million in planned investment from Obayashi Corporation, a Tokyo-listed Japanese construction group. Infradebt, an Australian renewables infrastructure lender, is also providing a USD 56 million lending facility.

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building

November 06, 2026
The target business encompasses low-voltage circuit breakers, electromagnetic switches, measurement and control equipment, and UPS for general industrial use of 5kVA or less, and other products.

headquarters

October 27, 2026
The development centers in India will leverage HCLTech’s expertise in core engineering to offer Rapidus a range of semiconductor engineering capabilities, including mask design, design infrastructure, process design kit development, design technology co-optimization and layout design.

October 21, 2026
Micron is investing in an expansion of Indium Corporation’s refining and manufacturing operations in Rome, New York, which will restart US processing of critical minerals used in semiconductor manufacturing. In return, Micron gets a long-term supply agreement for the high-purity materials.

Armscor_MOU

October 20, 2026
The agreement establishes a framework for potential technology cooperation between India and South Africa across defence, aerospace and dual-use technologies.

Digital_Manufacturing

October 19, 2026
The addition of TCS Industries, TCS Electronics, and Precision Grinding & Manufacturing Corporation reinforces Fathom’s ability to address growing demand for precision components, integrated electronics and complex assemblies.

signing-the-contract_2

October 06, 2026
Altera Corporation and Rutronik have signed a strategic distribution agreement to expand access to Altera’s FPGA portfolio across the European market, the companies announced in a press release.

pexels-handshake

October 05, 2026
Investment firm Carlyle has agreed to acquire Nidec Components, a Japanese manufacturer of sensors, switches and encoders, from its parent company Nidec Corporation. The divestment is part of Nidec's planned portfolio rationalisation.

October 05, 2026
The collaboration will combine Sony’s sensing and AI technologies with Aramco’s industrial data, operational experience, established infrastructure and portfolio of real-world industrial use cases.

PCB-India_3

October 01, 2026
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

CSBC_agreement

September 28, 2026
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.

fuel_cell

September 28, 2026
Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.

Bittium-Headquarters-Oulu-Finland

September 25, 2026
Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.

TOP100

September 18, 2026
When Mareike Haass took to the stage at Evertiq Expo in Gothenburg on September 17, she presented what in4ma describes as the first complete ranking of Europe's 100 largest EMS companies, built on data sourced directly from national company registers and the companies themselves. The full list is now available.

MHI_MOU

September 17, 2026
The two Japanese companies will contribute to the strengthening and transformation of defense capabilities by providing high-value-added and highly reliable products and services for the development of new command and control systems.

office

September 16, 2026
Aimtron is increasingly focusing on opportunities where electronics manufacturing is accompanied by deeper engineering involvement, higher product complexity and stringent quality requirements.

September 16, 2026
Through this investment, Mitsubishi Electric expects to gain early insights into the company’s optical quantum computer hardware development technologies, related components, customers and market trends.

August 27, 2026
US automotive supplier Lear Corporation plans to cease production at its facility in Gründau, Germany, relocating manufacturing to Slovakia, Serbia and Tunisia. Around 180 jobs will be lost, with the phase-out expected to begin immediately and complete by mid-2027. Approximately 120 engineering positions will remain at the site, according to IG Metall.

axonite_chip

August 27, 2026
Navitas’ potential acquisition of Claros would extend the company’s AI infrastructure portfolio from the grid all the way to the xPU by bringing industry-leading VPD and IVR capabilities that can directly power the high-current, high-speed processors at the heart of modern AI systems.

GeneSiC

August 24, 2026
Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.

cloeanroom-production

August 20, 2026
Sony Semiconductor Solutions' Kumamoto Technology Center, which was halted following an earthquake in the Kumamoto region on July 28, began staged resumption of operations on August 4. The company expects to return to pre-earthquake operating levels by mid-August, according to updates published by Sony Semiconductor Solutions.

August 17, 2026
Medcom designs, manufactures, sells and maintains electrical equipment for railcars and electric urban transportation, including auxiliary power supply systems, propulsion control systems and industrial power electronics equipment. Its primary business is in Europe.

chip

August 14, 2026
The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.

cosmos-3

August 14, 2026
The investment round was anchored by Mitsubishi Electric Corporation. Array Labs and Mitsubishi Electric have also entered into a partnership to develop and bring to market satellite-based maritime and aircraft tracking services for customers in Asia-Pacific.

geralt-computer-chip

August 12, 2026
Stathera will use the proceeds to fund mass production of its GEN2 silicon timing portfolio while accelerating development of its next-generation platform for AI data centers and growing the company’s engineering and commercial teams.

August 12, 2026
The lawsuit comes weeks after Japanese semiconductor company Renesas sued US-based Navitas in the California federal court, claiming the company poached its employees to steal trade ‌secrets for developing next-gen GaN chips.

solar_mrganso

August 11, 2026
The transaction marks a shift in the composition of Purvah’s portfolio — from a platform built primarily on projects under development to one anchored by assets already generating contracted cash flows.

Indie

August 07, 2026
Rashi will transfer its semiconductor business division into a wholly owned subsidiary headquartered in Bengaluru and step-down subsidiary headquartered in Singapore. Restar Corporation will subsequently acquire a 26% equity stake in the subsidiary.

NXTR

August 06, 2026
The company can handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines.

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