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partnership_Franz26

May 25, 2026
This combination of Parker Hannifin and Circor Aerospace brings together complementary capabilities, product portfolios, and platform exposures to create a stronger, more diversified aerospace and defense supplier with enhanced scale.

cosmos-1

May 22, 2026
The California-based company is developing a constellation of Low Earth Orbit satellites that harness solar energy, a purpose-built launch vehicle to deliver them and compute payloads designed specifically for the space environment.

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CCL

May 20, 2026
The South Korean company’s new subsidiary and Copper Clad Laminate (CCL) production plant will be located at Araya Industrial Park in Bang Bo, Samut Prakan, Thailand. Approximately USD 120 million is being invested in the project.

BG8_SSD

May 18, 2026
Compared to the previous generation, the KIOXIA BG8 Series achieves up to 47 % higher sequential read, 67 % higher sequential write, 44 % higher random read, and 30 % higher random write performance.

May 15, 2026
Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

BESS_Ontario

May 11, 2026
Now that the project is operational, it will have 4.74 MW of daily contract capacity available (at a capacity payment to ProjectCo of USD 1,221/MW per business day) for 251 business days in a year.

UMC

May 04, 2026
Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.

EPIC-center

May 04, 2026
As the first automated test equipment (ATE) company to join the platform, Advantest will partner with Applied Materials to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages.

30-04-2026

April 30, 2026
Worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025, reports SEMI.

Mitsubishi-Electric-MOU

April 30, 2026
Hon Hai Precision Industry, otherwise known as Foxconn, and Mitsubishi Electric have signed a memorandum of understanding to explore a strategic alliance centred on Mitsubishi Electric's automotive equipment business.

NTPC

April 30, 2026
The scope of the project includes end-to-end BESS installation and integration with existing thermal power station infrastructure; advanced systems, remote monitoring and control infrastructure; and Operations & Maintenance (O&M) services.

Australia

April 30, 2026
Under this contract, Japan’s NEC Corporation will provide equipment including underwater-related equipment such as surface ship sonars as well as communications and navigation-related equipment.

Valtech_agreement

April 29, 2026
By combining Indian company MELSS’s manufacturing expertise with Valtech’s global strengths, the joint venture is positioned to deliver high-performance solutions that meet the evolving needs of next-generation electronics.

li-battery_1

April 27, 2026
The Australian startup is developing a locally deployable solution to recover critical minerals within domestic or regional supply chains, reducing reliance on exporting battery waste and offshore refining.

April 23, 2026
With this acquisition, US-based startup Skild AI aims to accelerate the deployment of robotics automation solutions alongside its general-purpose Skild Brain.

X-raymetrology_Onto

April 22, 2026
By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.

PCB-Japan_2

April 21, 2026
A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.

office-render

April 21, 2026
Advantest Corporation has opened a new innovation center in San Jose and is preparing a second facility in Sunnyvale, as the company looks to strengthen collaboration across the semiconductor value chain.

fiber_network_thedigitalartist

April 20, 2026
Through this acquisition, Vero will extend its footprint from the Western United States into the Southeast via TEC’s 4,500-mile fiber network. The combined company will reach approximately 444,000 households.

April 20, 2026
The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.

AB-Electronic

April 15, 2026
Assmy & Böttger Electronic GmbH has completed a comprehensive modernisation of its SMD production, adding a second placement line from Fuji Europe Corporation GmbH to increase capacity and introduce redundancy.

April 15, 2026
The transaction will be executed through a company split whereby the business will be transferred to the successor company, followed by the transfer of all issued shares of the successor company to the acquirer.

Opens-Analysis-Center-and-Rapidus-Chiplet-Solutions

April 14, 2026
Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.

April 14, 2026
Nanya Technology Corporation has received strategic participation in its private placement from Kioxia, SK hynix subsidiary Solidigm and SanDisk, as the company accelerates investment in advanced DRAM capacity for AI-driven demand.

M12

April 14, 2026
M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.

April 13, 2026
The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

April 07, 2026
SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.

Fairchild_CEO_SiemensUSA

April 03, 2026
Fairchild has been with Siemens for more than 25 years, most recently serving as general counsel for Siemens USA, overseeing legal, compliance, regulatory and intellectual property functions.

Cellcentric-toyota-deal

April 02, 2026
The Volvo Group, Daimler Truck and Toyota Motor Corporation are planning to jointly operate the fuel cell joint venture cellcentric. The move was outlined in a press release from AB Volvo dated March 31.

sign-on-wall

April 02, 2026
Kioxia Corporation will subscribe to a third-party share allotment by Nanya Technology Corporation and enter into a long-term DRAM supply agreement with the company.

windmills-pexels

April 02, 2026
Following receipt of the final construction approval and financing, the company intends to commence the construction of the project. Once completed, the project in Buffalo, New York, will be operated as a community solar project.

Compass_Swissto12

March 30, 2026
This agreement represents a milestone for Space Compass’s optical data relay service. For Swissto12, the contract represents further validation of the company’s ability to unlock a wide range of space missions with its small GEO satellite platform.

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