Keenfinity EMS secures ISO 13485 certification in Portugal March 03, 2026 Keenfinity EMS has obtained ISO 13485:2016 certification for its electronics manufacturing plant in Ovar, Portugal. The certification, announced on 2 March 2026, covers the design and manufacture of electronic systems for medical devices, including control units, power supply units and human–machine interfaces.
BMW to deploy humanoid robots in production in Germany March 03, 2026 In collaboration with Hexagon, a long‑standing, established partner of the BMW Group in the field of sensor technology and software, the first pilot project in Europe is now underway.
Rohm partners with Suchi to boost chip manufacturing in India March 03, 2026 Rohm is considering the outsourcing of back-end processes for power devices and IC products to Suchi Semicon and has begun technical evaluations toward potential mass production shipments starting in 2026.
Welinq partners with Pasqal to boost networked quantum computing March 02, 2026 This collaboration has reached a milestone with InterQo, an EUR 4 million project that includes a bilateral industrial partnership between Pasqal and Welinq, alongside a dedicated research collaboration.
Samsung, AMD to advance AI-powered network innovations March 02, 2026 Following last year’s validation milestone, both companies will introduce the successful results of multi-cell testing conducted at Samsung’s R&D Lab, enabling scalable deployments and greater processor flexibility within software-based network environments.
Siemens to deliver cloud-based SCADA system for green energy March 02, 2026 Siemens’ platform-independent and AI-enabled Simatic WinCC Open Architecture SCADA will connect eight renewable energy generation and storage assets in New South Wales, Victoria, Western Australia, and the Australian Capital Territory.
DNP invests in Rapidus to advance mass production of 2nm chips March 02, 2026 Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.
Micron opens semiconductor assembly and test facility in India March 01, 2026 US memory manufacturer Micron Technology has officially opened its semiconductor assembly and test facility in Sanand, Gujarat, India.
Qualcomm appoints Intel Foundry Services head as EVP February 27, 2026 Qualcomm Incorporated has appointed Kevin O’Buckley as executive vice president of Global Operations and Supply Chain, effective 2 March 2026.
Hitachi Energy integrates Pakal’s IGTO into ≥3.3 kV power modules February 27, 2026 Hitachi Energy and Pakal Technologies have announced a collaboration to develop next-generation high-voltage silicon power semiconductor modules rated at ≥3.3 kV.
Lyten completes acquisition of Northvolt Sweden February 27, 2026 Battery company Lyten has completed its acquisition of Northvolt’s Swedish assets, valued at nearly USD 5 billion. The deal includes the Northvolt Ett and Ett Expansion sites in Skellefteå and Northvolt Labs in Västerås.
Intervala invests over $6 million in manufacturing expansion February 27, 2026 Intervala has invested more than USD 6 million in new manufacturing technology, automation and facility expansion to strengthen its high-reliability electronics manufacturing capabilities.
SK hynix and Sandisk looks to standardise next-gen HBF memory February 26, 2026 SK hynix and Sandisk have announced the start of a global standardisation initiative for next-generation memory solution, High Bandwidth Flash (HBF) aimed at the AI inference era.
Price rally lifts 4Q25 DRAM revenue 29.4% QoQ February 26, 2026 A sharp upswing in DRAM contract prices drove global industry revenue to USD 53.58 billion in the fourth quarter of 2025, up 29.4% sequentially, according to the latest analysis from TrendForce.
Apple to begin Mac mini production in Houston, expand AI server manufacturing February 25, 2026 Apple will start producing its Mac mini in the US for the first time, with manufacturing slated to start later this year at a new facility in Houston.
TSMC board approves $45 billion for capacity expansion February 25, 2026 The world’s largest semiconductor foundry, TSMC, has approved a capital injection of USD 44.96 billion to expand production capacity. The decision was made during a board meeting on 10 February 2026 in Hsinchu, Taiwan.
ElevenEs secures Caterpillar backing, plans battery factory in Serbia February 24, 2026 ElevenEs has completed the first closing of its Series B financing round, with proceeds earmarked for the construction of a 1GWh lithium iron phosphate (LFP) battery cell factory in Subotica, Serbia. Construction is scheduled to begin in February 2026, with first cell deliveries expected in 2027.
SEALSQ and WISeKey to relocate Geneva HQ, launch quantum hub February 24, 2026 SEALSQ Corp and its parent WISeKey International Holding, are planning to move their Geneva headquarters to the Pont-Rouge district in August 2026. The relocation coincides with the launch of the Geneva Quantum Centre of Excellence, intended to consolidate the group’s research and industrial deployment of quantum computing, post-quantum cybersecurity, and secure semiconductor technologies.
RECOM Power and Bürklin expand their partnership February 24, 2026 RECOM Power and Bürklin Elektronik are expanding their long-standing distribution partnership, with a focus on product availability, technical expertise and streamlined delivery processes.
Cadence completes acquisition of Hexagon’s D&E business February 24, 2026 US-based Cadence Design Systems has completed its acquisition of the Design and Engineering (D&E) business from Swedish technology group Hexagon AB, in a deal valued at approximately EUR 2.7 billion.
ams OSRAM, Meizhi settle LED patent disputes February 24, 2026 ams OSRAM and Shenzhen Meizhi Optoelectronics Technology have settled LED-related patent disputes in the US and Germany. The agreement resolves proceedings before the US District Court for the District of Massachusetts and the Regional Court of Düsseldorf, Germany.
SoftBank’s SAIMEMORY and Intel collaborate on next-gen Z‑Angle memory February 23, 2026 SoftBank's subsidiary SAIMEMORY has signed a collaboration agreement with Intel Corporation to advance the development and commercialisation of Z‑Angle Memory (ZAM), a next-generation memory technology designed for high capacity, high bandwidth and low power consumption.
From room‑sized to pocket‑sized – the evolution of computers February 20, 2026 What was your first contact with a computer? For some, it might have been a bulky desktop at school, a gaming console in the living room, or even a first smartphone that seemed impossibly small yet powerful.
SemiFive secures design win with Niobium for FHE accelerator February 20, 2026 SemiFive has secured a design win from US‑based Niobium for a fully homomorphic encryption (FHE) hardware accelerator.
Qualcomm to invest up to $150 million in AI startups in India February 20, 2026 US semiconductor company Qualcomm says it plans to invest up to USD 150 million in India’s technology and AI startup ecosystem through a new strategic venture fund.
Kontron expands manufacturing in Hungary with €5 million investment February 20, 2026 IoT and embedded computing technology specialist Kontron is expanding its manufacturing capacity in Hungary through its local subsidiary Kontron Electronics Kft.
AT&S funds new microelectronics research group at TU Graz February 19, 2026 Austria-based AT&S is funding the establishment of a new microelectronics research group at Graz University of Technology (TU Graz), with a focus on IC substrates and advanced packaging technologies.
R&D in Switzerland: structure, scale and the role of electronics February 19, 2026 Switzerland is regularly described as one of the world’s most innovative economies. In the Global Innovation Index, the country has repeatedly ranked first, ahead of much larger industrial nations. This position reflects a combination of high R&D intensity, strong patent activity and a dense network of research-performing companies. Yet these aggregate indicators say relatively little about how innovation is structured in practice, and even less about the position of electronics within the Swiss economy.
Boyd expands liquid cooling production capacity in Mexico February 19, 2026 US-based Boyd has more than doubled the manufacturing footprint of its liquid cooling operations in Juarez, Mexico, to meet growing demand from AI-driven data centers.
Nvidia and Meta enter multiyear deal covering millions of GPUs February 18, 2026 US chip designer Nvidia has entered a multiyear, multigenerational strategic partnership with Meta Platforms that will include the deployment of millions of Nvidia GPUs.
Infineon: GaN market to reach USD 3 billion by 2030 February 18, 2026 German semiconductor manufacturer Infineon Technologies expects the gallium nitride (GaN) power semiconductor market to reach nearly USD 3 billion by 2030, according to the 2026 edition of its annual “GaN Insights” report.
Invest International provides $60M loan to Nexperia for global expansion February 18, 2026 Invest International has signed a USD 60 million term loan agreement with Nexperia to support the company’s 2026 global production capacity expansion programme.