Microchip expands hydrogen maser production with new Alabama facility April 28, 2026 US semiconductor company Microchip Technology has opened a new manufacturing facility in Tuscaloosa, Alabama, to increase production capacity for its hydrogen masers and reduce lead times.
Toshiba starts sample shipments of new SmartMCD series product April 28, 2026 TB9M030FG is suitable for sensorless control of the three‑phase brushless DC motors used in automotive applications, such as electric water pumps, electric oil pumps, electric fans and electric blowers.
IndieSemiC, Nordic to develop wireless modules for connected devices April 27, 2026 Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.
Renewable Metals raises $12 million in Series A April 27, 2026 The Australian startup is developing a locally deployable solution to recover critical minerals within domestic or regional supply chains, reducing reliance on exporting battery waste and offshore refining.
BEL partners with BMIT to boost Indian defence tech April 24, 2026 This strategic partnership aims to strengthen efforts towards fostering indigenous design and production capabilities in advanced technology domains critical to national defence.
Indra signs new contract with Kongsberg Defence & Aerospace April 24, 2026 This is the second series of submarines to be equipped by Indra with its latest generation fully digital electronic warfare systems and state-of-the-art navigation radar, bringing the total number of platforms fitted with these capabilities to 12.
Altilium secures $25 million to scale EV battery recycling April 24, 2026 The funding will support the construction of Altilium’s new ACT3 recycling facility, the UK’s first commercial refinery for recovery of critical battery materials from end-of-life EV batteries.
SK hynix begins mass production of 192GB SOCAMM2 April 24, 2026 SOCAMM2 is a module that adapts low-power memory — which was previously used mainly in mobile products like smartphones — for server environments. It is designed to be a primary memory solution for next-generation AI servers.
Siemens accelerates AI chip verification with Nvidia technology April 24, 2026 Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.
Only one European company in global EMS Top 30 April 23, 2026 The global EMS/ODM industry continues to expand, but scale and growth remain unevenly distributed, with Asian players flexing their dominance while Europe lags behind, according to new research from in4ma and EMSNOW.
Siemens collaborates with TSMC to advance AI for chip design April 23, 2026 TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.
Leonardo DRS awarded contracts for MDA SHIELD IDIQ April 23, 2026 These Missile Defense Agency (MDA) Scalable Homeland Innovative Enterprise Layered Defense (SHIELD) indefinite-delivery/indefinite-quantity (IDIQ) contracts encompass a broad range of work areas that allow for rapid delivery of innovative capabilities.
Samsung SDI signs EV battery supply deal with Mercedes-Benz April 23, 2026 Under the agreement, Samsung SDI will supply high-performance batteries for Mercedes-Benz’s next-generation electric vehicles. Mercedes-Benz plans to use the batteries in future compact and mid-size electric SUVs and coupe models.
Canada’s Spark Microsystems raises $12 million Series B April 23, 2026 This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.
Rheinmetall, Destinus to form joint venture for missiles April 22, 2026 The joint venture to be set up during the second half of 2026 will manufacture, market and deliver advanced missile systems, including cruise missiles and ballistic rocket artillery.
Lattice Semiconductor collaborates with TI to advance Edge AI April 22, 2026 The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.
Sygaldry raises $139M to build quantum computers for AI April 22, 2026 Sygaldry servers are designed to address constraints in AI training and inference by operating alongside classical infrastructure within the data center. The company is also developing quantum algorithms that plug into the tools AI researchers already use.
Unisystem and SoMLabs expand cooperation in embedded and display technologies April 22, 2026 As global supply chains remain under pressure and geopolitical uncertainty continues to reshape sourcing strategies, partnerships built on local capabilities are gaining importance. In this context, two Polish companies — Unisystem and SoMLabs — have announced a closer collaboration aimed at jointly delivering technology projects based on complementary products and expertise.
Onto expands partnership with Rigaku through 27% equity investment April 22, 2026 By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.
Electreon completes acquisition of US firm InductEV April 22, 2026 The acquisition secures a robust supply chain that balances Israeli company Electreon’s offshore manufacturing efficiencies with InductEV’s Build America Buy America (BABA) compliant offerings.
Japan quake triggers alert; semiconductor operations unaffected April 21, 2026 A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.
Aumovio to sell Mechelen plant to Dumarey Group April 21, 2026 Aumovio plans to divest its manufacturing site in Mechelen, Belgium, to Dumarey Group, as part of efforts to optimise its production footprint.
Arrow, Infineon introduce 240W USB-C PD 3.2 reference design April 21, 2026 REF_ARIF240GaN is specifically designed to support the launch of EZ-PD PMG1-B2, Infineon’s newest USB PD 3.2 controller, featuring up to 240W USB sink capability and integrated buck-boost functionality in a compact single package.
GE Aerospace partners with IAF to establish engine depot April 21, 2026 The depot facility for F404 -IN20 engines will be owned, operated and maintained by Indian Air Force (IAF) with GE Aerospace providing technical inputs, training, support staff and supply of necessary spares and specialized equipment.
3DGS breaks ground on chip packaging unit in India April 20, 2026 The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.
Italy’s Wearable Robotics raises €5 million in Series A April 20, 2026 The capital will be used to enhance the product portfolio and boost commercial development. Over 50 units of ALEX RS, a device for neuromotor rehabilitation of the upper limb, have already been installed internationally.
Air Liquide invests €200M in Japan to support chip manufacturer April 20, 2026 Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.
Ionna partners with Circle K to expand EV charging in US April 20, 2026 The collaboration is centered around a strategic ambition to expand to more than 350 sites featuring Rechargeries @ Circle K, combining Ionna’s charging technology and driver-first experience with Circle K’s nationwide footprint.
Battery tech firm Basquevolt brings Axon on board as investor April 20, 2026 The resources secured through the entry of Axon Partners Group and the support of CDTI-Innvierte will enable Spanish company Basquevolt to advance its industrial roadmap, including the scale-up of electrolyte production.
BorgWarner to supply VTG turbocharger for OEM’s HEV platform April 17, 2026 BorgWarner’s VTG turbocharger technology enables precise control of engine operation, optimizing performance across a broad range of engine speeds and integrating advanced combustion strategies to boost efficiency, enhance fuel economy and lower emissions.
Fujitsu, Chugoku Electric Power T&D sign IP licensing agreement April 17, 2026 Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.
Gander raises $1.1 million to build search and rescue robots April 17, 2026 Current rescue protocols depend on human reaction time, visual searches and manual deployment of rescue swimmers, a process measured in minutes or hours when every second counts. Gander Robotics’ Autonomous Rescue Swimmer (ARS) is designed to change that equation.