Kingboard sells stake in subsidiary to ramp up PCB capacity July 01, 2026 Kingboard Holdings has sold a 4.92% stake in its laminates subsidiary, Kingboard Laminates Holdings, raising net proceeds of approximately HKD 11.8 billion – roughly EUR 1.4 billion. The capital is earmarked for PCB capacity expansion and multi-layer and HDI capabilities.
Rocket Lab to acquire Iridium in $8 billion deal July 01, 2026 The transaction will give Rocket Lab an immediate foothold in space-based applications, including both proprietary and standards-based satellite Internet of Things (IoT) and direct-to-device (D2D), PNT, and critical safety-of-life services.
SAEL commissions its 11th agri waste-to-energy plant in India June 30, 2026 The 14.9 MW agri waste-to-energy plant in Bhadra, Rajasthan, will process agricultural residues, including paddy straw, mustard stubble and cotton stalks, for clean power generation.
Voltatron wins contract to supply electronics solutions June 29, 2026 The agreement covers the supply of complex, highly integrated functional modules to the customer for use in peripheral devices deployed in industrial applications within the field of electric mobility. The annual order volume exceeds EUR 10 million.
Bear Robotics to acquire UK firm Kinisi Robotics June 26, 2026 Bristol-based Kinisi Robotics has been building on Bear’s production navigation stack since the company was founded — the same technology that powers Bear’s commercial fleet.
Incap Slovakia adds cleanroom capability in Námestovo June 26, 2026 Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility in Slovakia to support customers with contamination-sensitive assembly requirements, particularly in semiconductor-related applications.
onsemi to acquire Synaptics in $7 billion all-stock deal June 26, 2026 Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.
AMD partners with Rackspace to deploy 30 MW of AMD AI compute June 26, 2026 At full deployment, 30 MW of dedicated AMD compute across Rackspace’s footprint will represent meaningful capacity to serve regulated enterprise workloads, including healthcare providers who have expressed early interest in accelerated compute.
Why does signal integrity determine the effectiveness of defence systems? June 25, 2026 The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.
C-DOT, IIT Hyderabad to advance next-gen communication tech June 25, 2026 As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.
NatPower, Tesla sign agreement for over 25 GWh of BESS in Europe June 25, 2026 Projects under the agreement will be sited in Italy and the UK and will be owned and operated by NatPower. Tesla will provide Megapack, their BESS as well as EPC and bankable trading services, with long-term revenues warranties.
EU clears €76 million German state aid for QuantumDiamonds June 24, 2026 The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.
QCi acquires NHanced in deal valued at up to $145 million June 24, 2026 By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.
TSMC partners with Amkor to accelerate advanced packaging in US June 24, 2026 The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
Infineon wins two more patent cases against Innoscience in Germany June 23, 2026 A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.
OPmobility, ProLogium sign MoU to develop solid‑state battery packs June 23, 2026 France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.
Envision partners with IES to advance green energy transition in Laos June 22, 2026 The collaboration is expected to add significant wind power, solar, and energy storage capacity and help create an AI-powered energy infrastructure that integrates energy systems with intelligent systems.
EuroHPC JU inaugurates new quantum computer in Barcelona June 19, 2026 Hosted and operated by BSC in Barcelona and supplied by Qilimanjaro Quantum Tech, and Do IT Now, EuroQCS Spain is an analogue quantum computer, which allows implementing quantum annealing routines.
Siemens, HighByte partner on industrial data operations June 18, 2026 Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.
Samsung, LG Uplus collaborate on ISAC technology for 6G June 18, 2026 Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.
QBit Semiconductor acquires 60% stake in Singapore’s SinChip June 17, 2026 This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.
Cellula, Metron sign agreement to advance US undersea capability June 16, 2026 The 10-year agreement brings together Cellula Robotics’commercial off-the-shelf (COTS) long-endurance autonomous underwater vehicle (AUV) platforms with Metron’s adaptive mission autonomy and undersea warfare and maritime domain expertise.
India’s Ethereal Machines raises $28.5 million in Series B June 16, 2026 The fresh funds will be used to expand manufacturing infrastructure, develop India’s first indigenous multi-axis CNC controller, strengthen its software stack, support semiconductor manufacturing initiatives, and accelerate international expansion.
Isar secures €270 million to provide sovereign space capabilities June 15, 2026 The capital will drive global scaling and ramp up serial production of the Spectrum launch vehicle. Following its first launch pad in Norway, Isar Aerospace now plans to build a new launch site in Canada.
DHL Supply Chain breaks ground on battery hub in Netherlands June 15, 2026 The batteries handled at the Holtum site are intended for use in electric vehicles as well as in the rapidly growing segment of BESS, including home storage and solar energy applications.
Quobly secures €115M to advance silicon-based quantum computers June 15, 2026 The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.
Forge Nano secures wafer fab equipment order from photonics firm June 12, 2026 Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.
India’s Polymatech establishes manufacturing hub in Singapore June 12, 2026 The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.
OQC, JPMorganChase, AMD partner to develop quantum-AI platform June 12, 2026 The partners will use the platform to conduct research on the application of near-term quantum and hybrid quantum-classical computing including areas such as portfolio optimization and expanding explorations around quantum machine learning.
ICEYE raises over €1 billion, valuation surpasses €10 billion June 11, 2026 ICEYE has completed its Series F financing round, raising more than EUR 1 billion in total. The company secured EUR 450 million in new capital, while the overall transaction value – including share sales by existing shareholders – exceeded EUR 1 billion. Following the round, ICEYE's valuation has risen to more than EUR 10 billion.
Indian supply chain firm TVS SCS forms JV with Italy’s ALA Group June 11, 2026 TVS SCS and ALA will jointly provide integrated supply chain services across production and aftermarket lifecycles, spanning production support, spare parts distribution, inventory optimisation, defence-grade logistics solutions and aftermarket and MRO support services.
Trina Storage completes delivery of BESS project in Romania June 09, 2026 The project integrates 32 units of Trina Storage’s Elementa 2 Pro battery storage system together with four Electra AC units, marking the first deployment in Europe of Trina Storage’s Elementa + Electra integrated DC+AC solution architecture.