Xanadu opens advanced photonic packaging facility in Ontario
June 25, 2025
Canadian quantum computing company Xanadu has opened a CAD 10 million advanced photonic packaging facility at its headquarters in Toronto. The new site, described as the first of its kind in Canada, aims to strengthen the country’s domestic quantum supply chain and manufacturing capabilities.
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IBM, RIKEN unveil first IBM Quantum System Two outside of US
June 25, 2025
IBM Quantum System Two at RIKEN is powered by IBM Quantum Heron, the company’s best-performing quantum processor to-date. Its connection to Fugaku will enable RIKEN teams to use quantum-centric supercomputing approaches to push forward research on advanced algorithms.
IPC becomes Global Electronics Association
June 24, 2025
The organization known as IPC – originally the Institute of Printed Circuits – is changing its name to the Global Electronics Association, and unveils a new study on the electronics industry.
Continental launches semiconductor unit, partners with GlobalFoundries
June 24, 2025
Continental's Automotive Group Sector has established a new internal unit — Advanced Electronics & Semiconductor Solutions (AESS) — to design and verify application-specific semiconductor circuits, as the company prepares for its planned spin-off into the standalone entity Aumovio.
Tata Elxsi, Infineon partner to accelerate EV innovation in India
June 20, 2025
Tata Elxsi brings its design, system integration and validation capabilities, while Infineon will provide early access to its latest semiconductor technologies—such as SiC-based components, microcontrollers and ICs.
Sparc Foundry secures €17.2M public funding for photonic chip plant
June 18, 2025
Sparc Foundry, a Spanish startup focused on photonic semiconductors, has received a EUR 17.2 million capital injection from the Spanish Society for Technological Transformation (SETT). The funding has been approved by the Council of Ministers under the national PERTE Chip initiative and represents 43.9% of the company's capital expansion.
Sony to release stacked SPAD depth sensor for automotive LiDAR applications
June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.
Scanfil strengthens US presence with majority stake in ADCO Circuits
June 11, 2025
Finnish EMS provider Scanfil is expanding its footprint in the US and entering the aerospace and defence market through the acquisition of a majority stake in ADCO Circuits Inc., an EMS provider based in the Greater Detroit area.
Tata Electronics partners with BEL to bolster India’s chip ambitions
June 09, 2025
Tata Electronics and Bharat Electronics Limited (BEL) will explore collaboration opportunities to identify fab, OSAT and design services solutions from Tata Electronics based on the current and future requirements of BEL.
BlueFors LD250 cryostat at Cornell boosts quantum research
June 06, 2025
A cryostat is an instrument that can maintain samples at incredibly low temperatures. When operating, the temperature inside the cryostat hovers just above 0 degrees Kelvin, which is equivalent to absolute zero, or minus 273 degrees centigrade.
Europe's PCB landscape: 2024’s top 30 manufacturers revealed
June 05, 2025
Evertiq has previously reported on the long-term decline of the European PCB industry. Back in the 1990s, the EU accounted for around 20–30% of global production. Today, that figure stands at just 2%. But who are the champions still holding strong in the storm?
Why PCB raw materials matter: performance, reliability, and cost
June 04, 2025
ICAPE offers an overview of the key factors in PCB raw material selection and the considerations that guide their use.
Dutch HQ/2 project releases open-architecture quantum computer
June 03, 2025
The “open-architecture” approach to building Tuna-5 system, as opposed to the vertically integrated quantum computers available via some leading commercial players, is a distinctive feature of the Delft quantum ecosystem.
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High-Voltage Connections: The Driving Force Behind Electric Vehicles
The IEA’s latest Global EV Outlook report reveals a surge in electric car sales, projected to reach a staggering 17 million units by the end of 2024. This marks a significant milestone in the automotive industry, as EVs are expected to constitute more than one in five cars sold worldwide. As the EV market accelerates, the critical role of advanced connector technology in sustaining this growth becomes increasingly evident. Here, Dawn Rogers, senior product manager at connector specialist PEI-Genesis, explores how connectors are powering the EV development.
Lab Circuits advances expansion with completion of first new facility
May 20, 2025
In May last year, Spanish PCB manufacturer Lab Circuits began a major facility expansion in Barcelona. Now, one year after breaking ground, the company has completed the first phase of the project.
Sivers joins DIFI to advance satellite network interoperability
May 19, 2025
Digital Intermediate Frequency Interoperability (DIFI) Consortium is a global collective of industry leaders collaborating to develop and promote open, standards-based interoperability for digital IF/RF systems.
Chemical mechanical planarization market to reach $10.5B by 2035
May 13, 2025
This upward trajectory is driven by the increased complexity in semiconductor architectures, growing demand for miniaturized electronic components, and the expanding integration of advanced node technology across the microelectronics industry.
Smart Photonics speed up production set up with Aixtron
May 07, 2025
Aixtron supplies the Netherlands-based Indium Phosphide (InP) foundry Smart Photonics with its new G10-AsP system. The MOCVD solution for high-volume production of GaAs/InP materials will enable the foundry to increase its capacity and capabilities.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
Global semiconductor materials market posts $67.5B in 2024 revenue
April 29, 2025
Global semiconductor materials market revenue increased 3.8% to USD 67.5 billion in 2024, reports SEMI.
Apogee partners with Arrow to boost space-grade tech network
April 14, 2025
The partnership will expand the distribution network for Apogee’s high-reliability ICs and radiation-tolerant solutions, bringing their technologies to a broader market across aerospace and defense.
SEALSQ and IC’ALPS team up to enhance automotive ASIC safety
April 14, 2025
Through this partnership, SEALSQ’s post-quantum secure technology will be integrated into IC’ALPS’ automotive ASIC designs, providing robust cryptographic resistance against quantum-era threats.
JarnisTech's Chongqing smart factory goes live
April 08, 2025
Against the industrial backdrop of surging demand for 5G-A and AI servers, Chinese PCB manufacturer JarnisTech has officially put its Chongqing smart factory into production – with AOI technology that boosts PCB inspection efficiency by 600%.
Aixtron delivers G10-AsP system to Nokia
April 01, 2025
Aixtron will supply its G10-AsP system to Nokia, facilitating the production of 6-inch Indium Phosphide (InP) wafers for Photonic Integrated Circuits (PICs).
FAMES Pilot Line launches open-access call for EU chip industry
March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.
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PANASONIC CAPACITORS FOR USB-PD DEVICES
Panasonic is a supplier of many innovative electronic components. One of the most important product groups in this range are capacitors designed to build power circuits for DC devices - these include components that fit within the parameters of the latest USB standard.
CoolCAD, RFMW boost SiC semiconductor devices offerings
March 17, 2025
The agreement strengthens RFMW’s ability to offer customers advanced wide bandgap solutions, enabling superior performance, reliability and efficiency in high-temperature and high-power applications.
GaN semiconductor devices market to reach $19.5B by 2031
March 07, 2025
The expansion of 5G networks globally is significantly contributing to the demand for Gallium Nitride (GaN) semiconductor devices in RF and power electronics applications.
RRP Electronics partners with Deca to boost wafer packaging
March 04, 2025
India’s RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
LG Innotek launches automotive AP module
February 21, 2025
The small size of the automotive application processor (AP) module reduces the surface area of the main board, allowing cars to be designed more flexibly, the South Korean company said.
U-M awarded up to $7.5M to develop heat-tolerant chips
February 21, 2025
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
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