Infineon raises full-year guidance as AI demand drives Q2 growth May 07, 2026 German semiconductor manufacturer Infineon Technologies has raised its full-year guidance for fiscal 2026 after reporting second-quarter revenue of EUR 3.81 billion, up 6% YoY. The upgrade is driven by surging demand for power supply solutions for AI data centres, with automotive order intake also showing signs of recovery.
Aixtron supplied planetary GaN MOCVD systems to Renesas May 07, 2026 Aixtron has supplied Renesas with multiple Planetary G5+C systems to expand its Gallium Nitride (GaN) production in high-volume manufacturing (HVM) environments.
India approves semiconductor projects worth $400 million May 07, 2026 Crystal Matrix will establish an integrated facility for compound semiconductor fabrication and ATMP while Suchi Semicon will set up an OSAT facility for manufacturing discrete semiconductors, in Gujarat.
Applied Materials acquires NEXX business from ASMPT May 06, 2026 US semiconductor equipment maker Applied Materials has entered into a definitive agreement to acquire the NEXX business from ASMPT, adding panel-level electrochemical deposition technology to its advanced packaging lineup.
Mosaic SoC raises $3.8M to advance spatial intelligence May 06, 2026 The Swiss semiconductor startup builds integrated circuits that process visual and positional sensor data to give devices a real-time understanding of where they are and what’s around them.
Denso withdraws bid for ROHM stake after board fails to secure support May 05, 2026 Less than a year after announcing a strategic semiconductor partnership, Denso has pulled its proposal to acquire shares in ROHM — after failing to secure support from ROHM's board of directors and special committee.
Global semi sales grow 25% from 4Q25 to 1Q26 May 05, 2026 Global semiconductor sales reached USD 298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025, reports SIA.
Evertiq Expo Kraków 2026: from design decisions to market tensions May 04, 2026 What happens at the design stage is increasingly resolved later – in production and on the market. Decisions related to system architecture, material selection or operating parameters often return in the form of integration challenges, manufacturing constraints or supply chain risks. In electronics for demanding applications, these dependencies are particularly visible. Design, system performance and market conditions form a connected system in which changes in one area affect the others.
Advantest partners with Applied Materials, joins EPIC platform May 04, 2026 As the first automated test equipment (ATE) company to join the platform, Advantest will partner with Applied Materials to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages.
Air Products to supply industrial gas for Samsung’s Korea fab May 01, 2026 Under the agreement, the US company will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon and hydrogen for Samsung’s new semiconductor fab.
Global silicon wafer shipments grew 13% YoY in 1Q26 April 30, 2026 Worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025, reports SEMI.
Incap grows revenue but margins tightens in Q1 April 30, 2026 Finnish EMS provider Incap reported revenue growth of 7.3% in the first quarter of 2026, but profitability fell sharply as component availability issues, foreign exchange headwinds, and acquisition-related costs weighed on the result.
Growth surge masks structural strain in semiconductor market April 30, 2026 During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.
Aspocomp reports record-high order book as revenue dips in Q1 April 29, 2026 Finnish PCB manufacturer Aspocomp closed the first quarter of 2026 with its highest-ever order book, even as revenue and profitability declined against a strong comparison period.
Evertiq Expo Zürich 2026 – highlights in pictures April 29, 2026 Evertiq Expo made its debut in Zürich on April 23, bringing together the Swiss electronics industry for a day of networking, insights, and focused discussions.
MELSS, Valtech form JV to boost semiconductor supply chain April 29, 2026 By combining Indian company MELSS’s manufacturing expertise with Valtech’s global strengths, the joint venture is positioned to deliver high-performance solutions that meet the evolving needs of next-generation electronics.
SiPearl appoints Guillaume Etorre as COO ahead of Rhea1 launch April 28, 2026 European processor developer SiPearl has appointed Guillaume Etorre as Chief Operating Officer, strengthening its executive team as the company prepares to bring its first-generation Rhea1 CPU to market in the coming weeks.
Omdia lifts 2026 semiconductor outlook as AI-driven memory constraints intensify April 28, 2026 Omdia has significantly raised its 2026 semiconductor revenue forecast, now projecting growth of 62.7%, citing sustained AI-driven demand and tightening supply conditions in memory markets.
Microchip expands hydrogen maser production with new Alabama facility April 28, 2026 US semiconductor company Microchip Technology has opened a new manufacturing facility in Tuscaloosa, Alabama, to increase production capacity for its hydrogen masers and reduce lead times.
Flex expands Teradyne Robotics partnership to scale factory automation April 28, 2026 US-based EMS provider Flex is expanding its partnership with Teradyne Robotics to accelerate the deployment of automation technologies across its global production footprint.
IndieSemiC, Nordic to develop wireless modules for connected devices April 27, 2026 Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.
Siemens accelerates AI chip verification with Nvidia technology April 24, 2026 Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.
Siemens collaborates with TSMC to advance AI for chip design April 23, 2026 TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.
LTSCT signs agreement with Newen on SiC-based power modules April 23, 2026 The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.
Canada’s Spark Microsystems raises $12 million Series B April 23, 2026 This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.
Lattice Semiconductor collaborates with TI to advance Edge AI April 22, 2026 The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.
ASML reports €8.8 billion in Q1 sales, raises full-year outlook April 22, 2026 ASML reported total net sales of EUR 8.8 billion and net income of EUR 2.8 billion for the first quarter of 2026.
Onto expands partnership with Rigaku through 27% equity investment April 22, 2026 By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.
Wooptix breaks ground on cleanroom facility in Spain April 22, 2026 Designed as a central hub for innovation, the semiconductor cleanroom facility will support the assembly of new equipment, along with testing, validation and customer demonstration activities.
Japan quake triggers alert; semiconductor operations unaffected April 21, 2026 A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.
Advantest opens innovation centres in Silicon Valley April 21, 2026 Advantest Corporation has opened a new innovation center in San Jose and is preparing a second facility in Sunnyvale, as the company looks to strengthen collaboration across the semiconductor value chain.
Molex completes acquisition of Smiths Interconnect April 21, 2026 Molex has completed its acquisition of Smiths Interconnect, a subsidiary of Smiths Group plc, marking the largest acquisition in the company’s history.