Evertiq - First In Electronics News & Expo

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new-technologies_5

January 12, 2026
Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR and radar fusion.

ZF_acquisition

December 26, 2025
By integrating ZF’s Advanced Driver Assistance Systems (ADAS) capabilities with Harman’s flagship Digital Cockpit offerings within a centralized compute design, the acquisition bolsters Harman’s roadmap for next-generation vehicle architectures.

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PCB-India_3

December 01, 2025
Under the agreement, the Indian automotive supplier will deliver comprehensive High Voltage Electronics for a range of high-performance e-powertrain components, including power electronics unit, inverters, onboard chargers, BMS, and DC-DC converters.

sign-contract

October 29, 2025
Automotive solutions provider indie has entered into an asset purchase agreement with United Faith Auto-Engineering, a publicly-listed Chinese company, to sell its entire 34.38% outstanding equity interest in Wuxi indie Microelectronics Technology to United Faith.

New-Braunfels-Texas-manufacturing-facility-render

October 28, 2025
Aumovio, formerly the automotive group sector of Continental, today announced a USD 110 million investment to significantly expand its New Braunfels, Texas manufacturing facility.

Technologies_Synopsys

October 20, 2025
The collaboration aims to empower automotive manufacturers to tackle the complexities of next-generation mobility by combining Tata Technologies’ domain expertise in vehicle engineering with Synopsys’ virtualization solutions, enabling the deployment of electronics digital twins (eDTs).

axonite_chip

October 09, 2025
The new funds would be used to build and test the company’s first chip, expand its engineering team and launch pilot projects with data center clients. Commercial deployments are planned in India, Europe and the US.

chip

September 12, 2025
Samsung Foundry will fabricate Valens Semiconductor’s MIPI A-PHY chipsets using its advanced automotive process node. This process is supported by Samsung’s expertise in automotive foundry processes, IP and service package development.

hq-600

August 13, 2025
indie Semiconductor has agreed to acquire emotion3D GmbH, an Austrian developer of perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS), and automated driving, the companies announced.

Navigation

August 04, 2025
Traditional Global Navigation Satellite Systems (GNSS), such as GPS, provide positioning with an accuracy range of 3 to 10 meters. Swift’s Skylark Precise Positioning Service is a cloud-based service that corrects errors in GNSS signals, improving accuracy by 100x—to centimeter level.

Polish-facility-2025

July 01, 2025
Taiwanese electronics manufacturer Compal Electronics has completed the first phase of its new automotive electronics facility in Czeladź, Silesian Voivodeship, Poland, marking a key step in the company's expansion into the European market.

depth_sensor

June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.

KAUST_partnership

May 13, 2025
Lucid will have access to KAUST’s supercomputing capabilities. Joint efforts will also focus on the design and prototyping of next-generation components and systems, integrating disciplines such as mechanical, electrical, thermal and chemical engineering.

Intel_partnership

April 28, 2025
Powered by BOS’s automotive AI chiplet SoC, Eagle-N and other products, Intel’s AI-enhanced software-defined SoCs will provide automakers with higher-performance, higher-compute AI solutions, building a solid foundation for in-vehicle AI applications.

Mobileye

April 07, 2025
Mobileye selected the VA7000 for this application following extensive testing of the chipset, where the Valens chip was found superior across a variety of parameters, with significant performance benefits.

chip

March 24, 2025
The testing is a key step towards broad adoption of A-PHY in China, where there is already a particularly robust ecosystem of companies developing products around this technology.

hq-600

March 07, 2025
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.

flags-2019

March 06, 2025
Infineon and the Automotive Research Association of India (ARAI) have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced semiconductor solutions for the Indian automotive sector.

Innotek_Logo

February 21, 2025
The small size of the automotive application processor (AP) module reduces the surface area of the main board, allowing cars to be designed more flexibly, the South Korean company said.

Expo-SAP25-9

February 10, 2025
On February 5, Evertiq Expo Sophia Antipolis reached new heights, setting a visitor record as Evertiq brought its Expo concept to the French Riviera for the second time.

Expo-SAP24-34

February 04, 2025
Evertiq Expo is set to return to Sophia Antipolis on February 6, 2025, at the Mouratoglou Resort & Hotel. Established in 2024, this premier event has quickly become a cornerstone for professionals in the electronics industry, particularly those involved in design and purchasing. Attendees can look forward to a comprehensive program featuring insightful presentations from industry leaders, covering key topics shaping the future of the sector.

CEO-Eric-Aguilar

January 30, 2025
Omnitron Sensors, an inventor of new MEMS fabrication IP, has secured USD 13 million in Series A funding led by Corriente Advisors, LLC, with participation from longtime investor L’ATTITUDE Ventures.

building

January 23, 2025
Aptiv says that it plans to separate its Electrical Distribution Systems business (EDS), creating two independent companies, each positioned to serve their customers and create value for shareholders.

global-automotive-semiconductor-market-share

January 22, 2025
The automotive industry’s impact on the global economy cannot be ignored. And currently, the automotive industry is going through a dramatic transformation – driven by electrification, autonomous driving and new mobility models.

automotive-sensor-market

January 21, 2025
The global automotive sensor market is on track to grow from USD 9.3 billion in 2023 to USD 14.3 billion by 2029, driven by trends such as electrification and advanced driver-assistance systems (ADAS), according to a report by Yole Group.

electric-car_4

January 13, 2025
Yole Group projects a transformative future for the automotive semiconductor market, fueled by advancements in electrification, ADAS, and computing power.

Honda-development-agreement

January 09, 2025
Honda Motor and Renesas have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs).

CEO

December 23, 2024
The Chennai-based company plans to use the investment to expand its workforce and enhance in-house engineering capabilities. The investment will also accelerate production and sales of its first chip.

December 18, 2024
NXP Semiconductors has entered into a definitive agreement to acquire Aviva Links, a provider of Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity solutions in an all-cash transaction valued at USD 242.5 million.

czech-facility-building

December 18, 2024
Denso Corporation and onsemi are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced driver assistance systems (ADAS) technologies.

acquire-Dream-Chip-Technologies

November 12, 2024
Tessolve, a Hero Electronix venture and provider of semiconductor engineering solutions, has signed a definitive agreement to acquire 100% of Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for a consideration of up to EUR 42.5 Million.

chip

November 07, 2024
The acquisition boosts Bangalore-based Tessolve’s presence in the semiconductor space, particularly in custom chip and ASIC design.

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