Evertiq - First In Electronics News & Expo

EMS provider Dicro Oy has opened a new factory in Narva, the third largest city in Estonia.

Park Systems, a provider of atomic force microscopy (AFM) and nano-metrology solutions, is embarking on a phase of expansion.

The French distributor of electronic components, Alantys Technology, has signed a new EMEA distribution contract with Runic, a Chinese manufacturer of Analog/mixed-signal ICs.

Today, September 21, the European Chips Act – which aims to ensure the EU's security of supply, resilience and technological leadership in semiconductor technologies and applications – enters into force.

Here are four resources for you to find out.

Thales and Hitachi Rail have made significant progress towards the completion of the sale of Thales' Ground Transportation Systems (GTS) business to Hitachi Rail.

Li-Cycle and Glencore has announced plans for a two-phase approach to the Portovesme Hub project in Sardinia, Italy to expedite the production of battery-grade lithium carbonate.

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to USD 38.1 billion, marking a 12.5% quarterly increase.

Electrolux Group has agreed to divest its manufacturing facility in Memphis, Tennessee, USA to a US-based investment company for a cash consideration of USD 61 million

IQE has announced a strategic collaboration with VisIC Technologies to develop "the highest reliability" gallium nitride D-Mode power products for use in electric vehicles inverters.

Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month (wpm), SEMI reports

Infineon Technologies has announced a collaboration with Infypower to improve the efficiency of electric vehicle charging stations.

Ericsson will be granted German funding to establish early technology development of critical microelectronics and communication technologies for energy-efficient Massive MIMO radios.

In today’s high-paced, high-mix, just-in-time production environment, electronics producers have to find the right production setup to handle flexibility, high-reliability, and scalability, all while maintaining a high level of usability for their production staff. Now combining a ground-breaking user-friendliness for program creation with one of the most advanced 3D AOI vision technologies on the market, the MYPro I51 might very well be a game-changer for high-reliability high-mix EMSs and OEMs looking to increase their capacity. Compared with previous generation, the MYPro I51 is up to 30% faster to program, and offers an up to 30% faster cycle time.

NXP teams across Hamburg, Munich and Dresden will focus on automated driving, communication technologies and post-quantum cryptography to accelerate and advance overall development and deployment.

On September 13, VAT broke ground for a new innovation center at its corporate campus in Haag, uniting research, development and application activities under one roof on 12,000 m2 over four floors.

The acquisition is said to provide Redwood with a EU presence to expand operations, increase capacity for battery recycling, and work closely with suppliers, customers and industry partners.

The financing is said to accelerate the construction of Verkor’s gigafactory, in Dunkirk, technological developments, and investments generating thousands of direct and indirect long-term jobs.

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Finnish EMS expands with new factory in Estonia

EMS provider Dicro Oy has opened a new factory in Narva, the third largest city in Estonia.

Park Systems breaks ground on expansion

Park Systems, a provider of atomic force microscopy (AFM) and nano-metrology solutions, is embarking on a phase of expansion.

Alantys inks distribution deal with Runic

The French distributor of electronic components, Alantys Technology, has signed a new EMEA distribution contract with Runic, a Chinese manufacturer of Analog/mixed-signal ICs.

EU Chips Act enters into force

Today, September 21, the European Chips Act – which aims to ensure the EU's security of supply, resilience and technological leadership in semiconductor technologies and applications – enters into force.

Are You Losing Customers Because of Your Traceability Reports?

Here are four resources for you to find out.

"Significant progress" made in Hitachi Thales rail deal

Thales and Hitachi Rail have made significant progress towards the completion of the sale of Thales' Ground Transportation Systems (GTS) business to Hitachi Rail.

Li-Cycle and Glencore ramp up plans for recycling hub

Li-Cycle and Glencore has announced plans for a two-phase approach to the Portovesme Hub project in Sardinia, Italy to expedite the production of battery-grade lithium carbonate.

Q2 revenue for top 10 IC design houses surge 12.5%

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to USD 38.1 billion, marking a 12.5% quarterly increase.

Electrolux has found a buyer for its Memphis factory

Electrolux Group has agreed to divest its manufacturing facility in Memphis, Tennessee, USA to a US-based investment company for a cash consideration of USD 61 million

IQE and VisIC to develop next-gen D-Mode GaN power devices

IQE has announced a strategic collaboration with VisIC Technologies to develop "the highest reliability" gallium nitride D-Mode power products for use in electric vehicles inverters.

12 new 200mm volume fabs to be built by 2026

Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month (wpm), SEMI reports

Infineon and Infypower to advance in new energy vehicle charger market

Infineon Technologies has announced a collaboration with Infypower to improve the efficiency of electric vehicle charging stations.

Ericsson to develop 6G radio microelectronics

Ericsson will be granted German funding to establish early technology development of critical microelectronics and communication technologies for energy-efficient Massive MIMO radios.

MYPro™ I51 3D AOI — when ease of use and high performance go hand in hand

NXP to strengthen R&D in Europe

NXP teams across Hamburg, Munich and Dresden will focus on automated driving, communication technologies and post-quantum cryptography to accelerate and advance overall development and deployment.

VAT breaks ground for innovation center in Haag

On September 13, VAT broke ground for a new innovation center at its corporate campus in Haag, uniting research, development and application activities under one roof on 12,000 m2 over four floors.

Redwood expands in Europe by acquiring Redux Recycling GmbH

The acquisition is said to provide Redwood with a EU presence to expand operations, increase capacity for battery recycling, and work closely with suppliers, customers and industry partners.

Verkor secures over €2 bn to launch gigafactory in France

The financing is said to accelerate the construction of Verkor’s gigafactory, in Dunkirk, technological developments, and investments generating thousands of direct and indirect long-term jobs.

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