Fingerprint finds its way into another PC
Swedish biometrics company, Fingerprint Cards, says that the company has been awarded a design win by an unnamed, but described as a top tier, PC manufacturer, with a product launch planned for Q1 2021.
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Cicor expands capacity at Wangs facility
Due to the strong demand for the company’s thin-film services, the production capacities at the Wangs (Switzerland) site will be expanded with immediate effect by an additional shift.
MAHLE strengthens global footprint via acqusition
MAHLE is taking over the air conditioning business of the Keihin Corporation (Japan) in Japan, Thailand, and the USA. A corresponding purchase agreement has been signed.
Life returns to the former Nokia plant in Chennai
Its been six years since there were any production going on at Nokia’s former plant in Srioerumbudur. But now the facility is once again in operation, this time under its new owner; Salcomp, a manufacturer of chargers.
Intellitronix invests in SMT system to triple product output
Intellitronix, a subsidiary of the US Lighting Group and a manufacturer of automotive electronics, has purchased a SMT Component Placement System from Europlacer.
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High Quality & efficient fume extraction is not only important to meet workplace regulations
It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
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Rehm expands sales structure in South-East Asia
Andy Wang, Senior Director Sales, is shouldering the responsibilities for Rehm Thermal Systems' sales and marketing activities in the Asia-Pacific region
Cree divest its LED operations as LED supply chain continues its shift to Asia
After global LED giant Cree divested its lighting business in 2019, the company has announced its plan to sell its LED business to SMART Global Holdings (SGH) for USD 300 million. TrendForce indicates that Chinese manufacturers have quickly risen in the LED industry in recent years, benefiting from superior production capacities and cost optimization measures.
Applied Materials and Besi to jointly develop chip integration technology
Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Norautron Suzhou inks new contract with Efore
Norautron Suzhou Co.Ltd announces a new cooperation with Efore Electronics Suzhou Co.Ltd.
Avnet Silica names Gilles Beltran as president
Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
Kitron’s record performance continues amidst the pandemic
The EMS provider reported strong growth and record profit for the third quarter of 2020 – mainly driven by the Medical devices, Defence/Aerospace and Industry sectors.
Huawei opens new R&D centre in Hungary
The Chinese telecom company opened the R&D Center in Budapest as it’s celebrating its 15th anniversary in Hungary.
Hisense Gorenje to start European production of TVs in January
As we move into the next year, Hisense owned Gorenje Group will start production of TV sets for the European market at its plant in Velenje, Slovenia, as part of the new Hisense Europe Electronic company.
SK Hynix holds second highest NAND market share via acquisition of Intel’s NAND capacity
SK Hynix has announced today (Oct. 20) that it will acquire Intel’s NAND Flash business and Dalian-based Fab 68, which is dedicated to 3D NAND Flash production, for USD 9 billion.
Harwin addresses increased demand for Hi-Rel connectors with new facility
The expansion at the manufacturer’s Portsmouth headquarters in the South of England will increase the company’s production output by 30%.
Blackstone has found the location for its battery cell production
The Swiss company, focusing on battery technology and battery metals, says that a decision has been made on the location of its battery cell production facilities for its subsidiary Blackstone Technology GmbH.
Volkswagen invests to up the automation of several plants
The Volkswagen Passenger Cars and Volkswagen Commercial Vehicles brands are working flat out on the transformation to the e-mobility era and the conversion of plants to e-mobility.
AT&S appoints Simone Faath as CFO
With the appointment of Simone Faath as CFO, the AT&S Management Board is now complete again.
SK hynix to acquire Intel NAND memory business
The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers
Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Harman to cut 1’500 jobs globally
Evertiq has learned that the automotive supplier is planning to reduce its headcount to “align with its longer-term goals”. This decision will result in a reduction of 1’500 positions globally.
FREYR and Siemens signs initial battery cell supply agreement
The Norwegian battery company has signed a Memorandum of Understanding (MoU) with Siemens Energy AS for the supply of lithium-ion battery cells (LiB) for marine and Energy Storage System (ESS) applications.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses
Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology
Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs
In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
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