AI chipmaker Hailo collaborates with Renesas
The collaboration is said to result in a powerful and energy-efficient processing solution enabling advanced driver-assistance (ADAS) functions and automated driving (AD) systems in motor vehicles.
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Farnell expands Toshiba portfolio to support design engineers
The global distributor says that it has strengthened its global partnership with Toshiba Electronics Europe GmbH (Toshiba), resulting in a significant product line expansion and increased stock holding.
SK hynix to supply industry's first HBM3 DRAM to Nvidia
South Korean SK hynix says that it ha started mass production of HBM3 DRAM. Nvidia recently completed its performance evaluation of SK hynix's HBM3 samples
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Infineon and pmd develop 3D depth-sensing for Magic Leap 2
Later this year, AR company Magic Leap is expected to introduce its newest AR device, the Magic Leap 2. One of the key features of Magic Leap 2 is the 3D indirect-Time-of-Flight (iToF) depth sensing technology that was co-developed by Infineon Technologies.
Motorola secures chip supply with GlobalFoundries deal
The US semiconductor foundry has entered into a long-term agreement to safeguard the supply of chip solutions for Motorola Solutions' radios, which are widely used by public safety, critical infrastructure and enterprise organisations.
Bell Semiconductor is suing companies left and right
In late April, Bell Semiconductor, a Pennsylvania-based technology and intellectual property licensing company, filed lawsuits against Micron, Infineon, Nvidia and seven other companies alleging infringement of one of its patents.
STMicro supplies SiC tech to Semikron for EV power modules
STMicroelectronics has revealed it is supplying SiC technology for the eMPack electric-vehicle power modules from Semikron.
MaxLinear to acquire Silicon Motion
MaxLinear and Silicon Motion have entered into a definitive agreement under which MaxLinear will acquire Silicon Motion in a cash and stock transaction that values the combined company at USD 8 billion in enterprise value.
Safran combines subsidiaries
Safran Electronics & Defense is grouping two subsidiaries, Safran Colibrys (in Switzerland) and the recently acquired Sensonor (in Norway,) under a single banner, Safran Sensing Technologies.
New Design-win and initial purchase order from Televic
NEXT Biometrics has received an additional Design-win and purchase order from business partner Televic in Belgium. This is the second Televic product using NEXT’s flagship FAP20 product.
Winbond expands DDR3 SDRAM production
Taiwanese semiconductor memory specialist, Winbond Electronics Corporation, says that it is expanding the production capacity at its fab in Kaohsiung, Taiwan.
Tiny Swedish radar sensor included in Japanese robot
The A1 radar sensor from Swedish company Acconeer is used for presence and obstacle detection in a recently announced entertainment robot from a unnamed Japanese consumer electronics company.
SEMIKRON and Danfoss Silicon Power join forces
German manufacturer of power modules, SEMIKRON, is teaming up with Danish power module design and manufacturing company, Danfoss Silicon Power, to create a joint business specialised in power electronics and focusing on power semiconductor modules.
Luminar acquires manufacturer of in high-performance laser chips
Automotive technology company Luminar announces that it is acquiring high-performance laser manufacturer Freedom Photonics.
BrainChip expands its reach with new sales partnerships
The producer of ultra-low power neuromorphic AI chips and IP says that it has established new sales partnerships in Europe and Israel as the company expands the reach of its Akida neuromorphic computing platforms.
Micron's Crucial Ballistix product lines reaches end of life
Micron announces in a press release that the company has decided to adjust its business strategy for Crucial memory.
Digi-Key ink global distribution deal with SPARK Microsystems
Digi-Key Electronics has secured a global distribution agreement with SPARK Microsystems to offer ultra-low power wireless communications for high-performance personal area networks and IoT-connected devices.
Toshiba to increase production with new 300-mm wafer fab
Toshiba Electronic Devices & Storage Corporation says that it will construct a new 300-mm wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture.
Fusion Worldwide expands with two new European offices
The global sourcing specialist is expanding its footprint throughout EMEA with the opening of offices in Paris, France, and Udine, Italy.
Toshiba's 200-mm line in Oita remains suspended
The 200-mm line at Toshiba Electronic Devices & Storage Corp's plant in Oita, southern Japan, remains suspended after the major earthquakes that hit coast of Kyushu on January 22.
Work returns to normal at Samsung's Xi’an operation
Samsung has issued an update stating that its semiconductor manufacturing facilities in Xi’an, China, have returned to normal operation as of January 26th.
Agile Analog builds footprint in Asia-Pacific
The UK-based analog IP supplier is responding to demand from chip manufacturers in the Asia-Pacific region by establishing its first regional sales and engineering support operation, based in Taipei, Taiwan.
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