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AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
1Q/20 Graphics DRAM price sees sharp upturn Server DRAM prices are expected to lead the uptrend in 1Q20 DRAM prices because the supply has been constrained by unstable yield rates of 1Xnm processes.
Chinese telecom equipment company takes on controlling stake of Nexperia Wingtech Technology – a Chinese computer and telecom equipment manufacturer – has officially obtained a controlling stake in Nexperia from Beijing Jianguang Asset Management Co. Ltd (JAC Capital).
Synaptics divests Mobile LCD TDDI business to Hua Capital Synaptics has signed a definitive agreement to divest its Asia-based, mobile LCD TDDI business to Hua Capital, through a special purpose entity backed by Hua-Capital Cayman, L.P., for USD 120 million in cash.
NAND Flash leads as IC market growth returns in 2020 Topping the chart of fastest-growing products for 2020 is NAND flash with DRAM in third place. The strong anticipated market growth for the two memory segments is not a big surprise given the complete market collapse that these two segments experienced in 2019.
Baidu and Samsung Electronics collaborate on production of AI chip Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced by Samsung Electronics early next year.
Innodisk strengthens AIoT Vision with Sysinno acquisition Innodisk has acquired Sysinno Technology. The acquisition strengthens "Innodisk Group’s ambition to bring the future of Artificial Intelligence and the Internet of Things (AIoT) to customers around the world".
Technic expands manufacturing to Amiens, France Technic has purchased a new chemical production facility located in Amiens, France. The acquisition is aimed at expanding production of its semiconductor products for a growing customer base in Europe and globally.
Elmos and Audi strengthen partnership for LED rear light control Elmos Semiconductor and Audi extend their long standing partnership for LED rear light control and announced sample availability of the new Elmos IC E522.95.
Spot prices see sharp upturn DRAM spot prices have begun to rebound, in turn improving the overall DRAM market sentiment, and memory component buyers in the contract market will be induced to raise their inventories as well. Contract prices are expected to rally as early as 1Q20.
Abracon inks distribution agreement with Symmetry Electronics Abracon, a manufacturer of frequency control, timing, synchronization, RF, connectivity, and power component solutions, has entered into a franchise agreement with Symmetry Electronics.
Digi-Key extends partnership with Precogs Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
First Sensor extends collaboration with Canadian expert for machine vision First Sensor is producing image sensors for a new camera family for a Canadian technology leader for industrial visual inspection in the field of machine vision. The project has a term of seven years.
Cree, STMicroelectronics fortify SiC agreement Cree Inc. and STMicroelectronics have expanded their existing multi-year, long-term silicon carbide wafer supply agreement to more than USD 500 million.
IDEX begins deliveries of its dual-interface sensor
Sivers IMA and NXP collaborate on 5G NXP Semiconductors and Sivers IMA Holding AB announces a collaboration to deliver a state-of-the-art solution for 5G-NR (New Radio), such as gigabit Fixed Wireless Access applications.
LEMO opens new facility in the Netherlands To support the unprecedented growth of its Benelux business, LEMO has invested in a new, purpose-built, hi-tech and eco-friendly facility near Amsterdam.
Wafer capacity by feature size shows rapid growth at <10nm Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49 percent of the IC industry’s total capacity.
Elatec USA appoints Paul Massey as CEO Elatec USA Inc., developer and manufacturer of RFID products, has named Paul K. Massey as Chief Executive Officer. In this newly created position, Massey will report to the Elatec Board of Directors and Managing Director Stefan Haertel.
EC imposes interim measures on Broadcom The European Commission has ordered Broadcom to stop applying certain provisions contained in agreements with six of its main customers. This will "prevent serious and irreparable harm to competition likely to be caused by Broadcom's conduct, which prima facie (at first sight) infringes EU competition rules".
2Q/2019: Memory business is approaching bottom “Combined DRAM and NAND revenue was USD 25.4 billion in 2Q/2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, says Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement.
Tridonic supplies new Beijing airport with light-on-demand Tridonic supplies the new mega airport Beijing Daxing International Airport with drivers, intelligent lighting control and light-on-demand with daylight tracking.
Infineon-radar technology in Google Pixel 4 Smartphone Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion people worldwide 1 will be using smart devices to sense their environment next year.
NVIDIA leads way but competition is intensifying Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors.
Nidec continues Polish investment Nidec Motors & Actuators continues to expand in Poland and decided to invest a further PLN 165.2 million (EUR 3.8 million) in Kraków's special economic zone in Niepołomic.
Phoenix Contact builds R&D centre in Skolkovo German electronics company Phoenix Contact is building a regional development and competence centre in Moscow's high-tech cluster Skolkovo.
Murata develops Millimeter-Wave RF Module for Terragraph Murata Manufacturing is working to develop an RF module solution for Terragraph, a gigabit wireless technology developed by Facebook. The module solution aims at meeting the growing demand for reliable, high-speed internet access in urban and suburban environments.
Spirit Electronics adds VPT Components
Dialog Semiconductor to acquire Creative Chips Dialog Semiconductor has signed a definitive agreement to acquire Creative Chips GmbH, a supplier of Integrated Circuits (ICs) to the Industrial Internet of Things (IIoT) market.
u-blox expands partnership with Kudelski Group u-blox expands its partnership with Kudelski Group to cover IoT security design and evaluation services.
Murata develops and starts volume production of SAW duplexers and filters Passive component manufacturer Murata accelerates production to contribute to denser circuit design and enhanced smartphone functionality.
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January 23 2020 4:22 pm V15.4.2-2