Agile Analog builds footprint in Asia-Pacific
The UK-based analog IP supplier is responding to demand from chip manufacturers in the Asia-Pacific region by establishing its first regional sales and engineering support operation, based in Taipei, Taiwan.
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'20% of global chip production should be in Europe by 2030'
In a ‘State of the World' special address by President of the European Commission, Ursula von der Leyen, at the World Economic Forum on January 20, the president brought up the fact that the European need for chips will double in the next decade – and that we don’t have the means to supply this.
Renesas reboots equipment after Japanese quake
Toshiba wasn't the only electronics company affected by the earthquake that struck the coast of southwestern Japan on January 22. Semiconductor manufacturer Renesas confirms that some equipment halted operation but are being restarted.
Toshiba halts production at chip plant after earthquake
Following the major earthquakes that occurred off the coast of Kyushu, Japan on January 22, Toshiba Electronic Devices & Storage Corporation has suspended operations at its semiconductor plant in Oita, southern Japan.
TSMC earmarks $40+ billion for manufacturing expansion
The worlds biggest semiconductor foundry says that it will increase capital spending to between USD 40 billion and USD 44 billion this year – after having spend USD 30 billion last year.
Swedish biometrics company team up with Infineon
Precise Biometrics has teamed up with Infineon to jointly provide fingerprint technology to allow various applications, including automated adjustments of driver settings in vehicles.
A*STAR and Soitec to develop next-gen SiC semiconductors
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec have entered into a research collaboration with the aim of developing next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles.
From Micron to Intel – David Zinsner joins as CFO
Intel has appointed David Zinsner as the company’s executive vice president and chief financial officer (CFO), effective Jan. 17, 2022.
SICK takes over MOBILISIS
SICK announces that it is taking over Croatian IT company MOBILISIS in its entirety. The acquisition expands SICK AG’s expertise in the wireless networking of industrial IoT devices.
USound raises USD 30 million to ramp product manufacturing
USound, a developer and manufacturer of MEMS loudspeakers for personal devices and wearable technology, has raised USD 30 million to move into mass production of its second generation MEMS loudspeakers for several global companies.
Rochester receives IATF-16949 letter of conformance
Rochester Electronics has earned a letter of conformance, confirming its Quality Management System (QMS) complies with the requirements of the standard IATF 16949:2016 for the Design and Manufacture of semiconductor components.
Sensata acquires e-mobility component maker Sendyne
Industrial technology company Sensata Technologies has acquired US-based Sendyne Corp, a developer of sensing and simulation technologies for next generation e-mobility.
Navitas opens new GaN focused design centre
Navitas Semiconductor is opening a new design centre dedicated to bringing next-gen GaN power ICs to enable data centers around the world to upgrade from silicon to GaN.
Bosch gives go-ahead for volume production of SiC chips
They are small, powerful, and extremely efficient: semiconductors made of silicon carbide (SiC). After several years of development, Bosch is now starting volume production of SiC power semiconductors.
BMW is looking to secure its chip supply - inks several deals
The German auto group has signed a trilateral agreement with microchip developer INOVA Semiconductors and semiconductor foundry GlobalFoundries with the goal of securing several million semiconductors per year.
Micron plans new memory design centre
Micron Technology says it's planning to open a new memory design centre in Midtown Atlanta, expanding the company’s reach into the Southeast of the U.S.
Taiyo Yuden to construct a new factory in China
The new factory, which will function as a production base for multilayer ceramic capacitors, will launch production in 2023.
TouchNetix gains automotive qualification for family of touchscreen controller ICs
UK manufacturer of high-performance touchscreen controller ICs, TouchNetix, announces that its aXiom AX112 user interface chip has gained qualification to the Automotive Electronics Council’s AEC-Q100-6 standard, validating the device’s use in applications such as the central information display in passenger cars and other types of vehicles.
Intel’s EU investment: Details to be expected soon
Earlier this year US chip manufacturer Intel launched a USD 20 billion expansion plan which would see the construction of two new chip plants in Arizona – as well as an expansion in Europe.
AKM provides an update on its fire damaged fab
In late October last year a fire broke out at Asahi Kasei Microsystem’s (AKM) semiconductor factory in Nobeoka, Miyazaki prefecture. The fire completely ravished the fab and took a total of three days to completely extinguish. But how does the company fare today?
TTI to acquire SMD Inc.
Specialty distributor of electronic components, TTI, Inc.,has entered into a purchase agreement to acquire SMD Inc., a privately held electronic component distributor headquartered in Irvine, California.
Ian Wallace to shoulder new business development role at Digi-Key
Electronic component distributor, Digi-Key Electronics, has promoted Ian Wallace has been to vice president, Americas and EMEA business development.
btv technologies expands production capacities in Romania
Following a planning phase of almost two months, implementation has the company's complete focus. On November 01, 2021, three additional programming machines form the manufacturer Data I/O PSV7000 were put into operation in Timisoara, Romania.
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