Digi-Key extends partnership with Precogs
Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
First Sensor extends collaboration with Canadian expert for machine vision
First Sensor is producing image sensors for a new camera family for a Canadian technology leader for industrial visual inspection in the field of machine vision. The project has a term of seven years.
Cree, STMicroelectronics fortify SiC agreement
Cree Inc. and STMicroelectronics have expanded their existing multi-year, long-term silicon carbide wafer supply agreement to more than USD 500 million.
Sivers IMA and NXP collaborate on 5G
NXP Semiconductors and Sivers IMA Holding AB announces a collaboration to deliver a state-of-the-art solution for 5G-NR (New Radio), such as gigabit Fixed Wireless Access applications.
LEMO opens new facility in the Netherlands
To support the unprecedented growth of its Benelux business, LEMO has invested in a new, purpose-built, hi-tech and eco-friendly facility near Amsterdam.
Wafer capacity by feature size shows rapid growth at <10nm
Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49 percent of the IC industry’s total capacity.
Elatec USA appoints Paul Massey as CEO
Elatec USA Inc., developer and manufacturer of RFID products, has named Paul K. Massey as Chief Executive Officer. In this newly created position, Massey will report to the Elatec Board of Directors and Managing Director Stefan Haertel.
EC imposes interim measures on Broadcom
The European Commission has ordered Broadcom to stop applying certain provisions contained in agreements with six of its main customers. This will "prevent serious and irreparable harm to competition likely to be caused by Broadcom's conduct, which prima facie (at first sight) infringes EU competition rules".
2Q/2019: Memory business is approaching bottom
“Combined DRAM and NAND revenue was USD 25.4 billion in 2Q/2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, says Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement.
Tridonic supplies new Beijing airport with light-on-demand
Tridonic supplies the new mega airport Beijing Daxing International Airport with drivers, intelligent lighting control and light-on-demand with daylight tracking.
Infineon-radar technology in Google Pixel 4 Smartphone
Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion people worldwide 1 will be using smart devices to sense their environment next year.
NVIDIA leads way but competition is intensifying
Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors.
Nidec continues Polish investment
Nidec Motors & Actuators continues to expand in Poland and decided to invest a further PLN 165.2 million (EUR 3.8 million) in Kraków's special economic zone in Niepołomic.
Phoenix Contact builds R&D centre in Skolkovo
German electronics company Phoenix Contact is building a regional development and competence centre in Moscow's high-tech cluster Skolkovo.
Murata develops Millimeter-Wave RF Module for Terragraph
Murata Manufacturing is working to develop an RF module solution for Terragraph, a gigabit wireless technology developed by Facebook. The module solution aims at meeting the growing demand for reliable, high-speed internet access in urban and suburban environments.
Dialog Semiconductor to acquire Creative Chips
Dialog Semiconductor has signed a definitive agreement to acquire Creative Chips GmbH, a supplier of Integrated Circuits (ICs) to the Industrial Internet of Things (IIoT) market.
u-blox expands partnership with Kudelski Group
u-blox expands its partnership with Kudelski Group to cover IoT security design and evaluation services.
Murata develops and starts volume production of SAW duplexers and filters
Passive component manufacturer Murata accelerates production to contribute to denser circuit design and enhanced smartphone functionality.
CMOS image sensors stay on stairway to record revenues
Economic slowdown and U.S.-China trade war will not stop CMOS image sensors from continuing their string of record sales and shipments going back to 2011, says report.
Rutronik and AP Memory inks global distribution agreement
Rutronik Elektronische Bauelemente GmbH and Taiwanese memory solutions supplier, AP Memory Technology Corp., have entered into a global distribution agreement.
Mitsubishi Electric tries to solve the issue of corrosion
Mitsubishi Electric Corporation says it has developed what is believed to be the world's first compact metal corrosion sensor small enough to be mounted on printed circuit boards.
One marketplace to rule them all
After two years of development, French startup PRECOGS, is now launching its real-time marketplace platform which directly connects a buyers ERP with component distributors – the company’s addition in making industry 4.0 a reality.
Distrelec appoints Steve Herd as CEO
The European distributor of electronics, automation and measurement technology has appointed Steve Herd as CEO with effect from 2nd September 2019.
Molex opens optical R&D facility in New Jersey
Molex announced this week the opening of a new R&D center in Bridgewater, New Jersey, representing a significant investment in optical wavelength solutions for telecommunications networks.
Smith receives CCAP-101 certification at European distribution center
Electronic components distributor, Smith, says that its recently upgraded warehouse in Amsterdam has earned certification to the CCAP-101 standard.
Smith Relocates Its Austin Office
Electronic components and semiconductor distributor, Smith, is relocating its Austin office.
Osram responds to ams' offer - decides to start negotiations
"In our preliminary assessment, the financing concept presented appears binding and viable," says Osram as it confirms that ams AG has made an offer for a voluntary public takeover offer.
ams makes a u-turn - submits an offer for Osram
ams says that it has submitted a fully financed proposal to Osram Licht AG for an all-cash takeover offer for 100% of the share capital of the company at a price of EUR 38.50 per share.
76% of IC products expected to see flat growth in 2019
After flying high for two years, DRAM sales growth is forecast to rank last in 2019, worst among all IC categories; NAND flash sales decline close behind.
Nidec to form a JV with GAC Components
Nidec Corp. aims to establish a joint venture for the manufacture automotive traction motors with GAC Components Co., Ltd., a member of China-based Guangzhou Automobile Group Co., Ltd.
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