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Revolutionising Cable Labelling: A Call to Accelerate Production with Automated Solutions
In the dynamic landscape of manufacturing, where cabling plays a vital role in cable harnesses, assemblies, and systems, the need for efficient labelling is more critical than ever. For engineers grappling with the challenges of cable traceability, the need for automated identification becomes a key requirement. Are you ready to explore the transformative benefits of automated cable label print and apply systems?
PSMC aims to mass-produce MRAM chips from 2029
Taiwan's Powerchip Semiconductor Manufacturing Corp (PSMC) is preparing to manufacture next-gen MRAM memory products before the end of the decade, say reports.
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Europe’s home-grown processor
Europe consumes nearly 30% of the world’s supercomputing resources, only 5% of supercomputers are supplied in Europe and exactly 0% of the microprocessors powering them are designed here. That is something that the European Processor Initiative (EPI) is looking to change.
How to inspect chip for counterfeits
Several inspection methods can help to identify counterfeit, or signal that a deeper inspection level is required. Systems design software provider Cadence has taken a deep dive into this subject.
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The Effects of pH: Cleaning Agent Properties and Performance in Production
As cleaning agents evolve to meet customer and supplier environmental challenges, we take a closer look at the effect of pH cleaning agent properties and performance including material compatibility and rinsing behavior all while answering questions with SIR data.
Grand Venture buys surface treatment specialist ACP Metal
Grand Venture Technology, a Singapore-based manufacturer of precision machinery, has bought its compatriot company ACP Metal Finishing for USD 17 million.
BorgWarner completes acquisition of Eldor eMobility division
US-based BorgWarner has formally purchased the Electric Hybrid Systems (EHS) business segment of Italy's Eldor Corporation.
EU makes €1.67bn available for 'innovative pilot lines'
The EU has officially inaugurated its Chips Joint Undertaking (Chips JU) – a fund to 'bridge the gap between research, innovation and production'.
AMD inaugurates design center in India
AMD yesterday inaugurated what the company claim is its largest global design center. Located in Bengaluru, India, the campus plans to host approximately 3,000 AMD engineers in the coming years.
Mercedes-Benz acquires minority stake in btv technologies
Car maker Mercedes-Benz has invested in its logistics partner btv with the aim of securing its semiconductor supply chain.
Resonac plans to establish US semiconductor R&D Center
Resonac Corporation announces that it plans to establish a research and development center for semiconductor packaging technologies and semiconductor materials in Silicon Valley, California.
Sunway opens new massive MLCC investment
Sunway Communication has officially opened and launched MLCC production at the Sunway Yiyang Electronic Technology Industrial Park.
Which embedded antenna choice is right for your design?
When antennas are embedded on the PCB inside the device, performance depends on several factors. Several embedded antenna technologies are available, and while no one will work in all cases, selecting the right antenna type and placing it correctly on the board could massively increase its radiation efficiency and provide several other improvements
Four arrested for supplying Russia with semiconductors
Over USD 7 million worth of semiconductors, ICs, and other electronics have been unlawfully exported from the US to Russian end-users affiliated with the Russian military.
Expedera opens R&D offfice in Singapore
AI silicon IP provider Expedera opens a new Singapore R&D center, the company’s fifth development center, with additional locations in Santa Clara, Bath, Shanghai, and Taipei.
Nexperia partners with Kyocera AVX Salzburg
Semiconductor manufacturer Nexperia has entered into a partnership with Kyocera AVX Components (Salzburg) GmbH, to jointly produce a new 650 V silicon carbide rectifier module for power applications
Kyocera AVX acquires assests of Bliley Technologies
The asset transfer acquisition includes Bliley’s business, equipment, people, and IP.
Microchip’s 28nm SuperFlash memory solution in production at GF
Microchip’s 28nm SuperFlash embedded flash memory solution has entered production at semiconductor manufacturer GlobalFoundries.
Gentex's new tech hub in Grand Rapids officially opened
U.S. supplier of automatic-dimming rearview mirrors and electronics, Gentex has opened a technology hub in downtown Grand Rapids designed to support company activities throughout West Michigan.
Mobase and Ultrasense collaborate on new infotainment system
Mobase Electronics and Ultrasense Systems Partner has announced a partnership to bring solid-surface infotainment touch systems with multi-mode sensing to global automotive OEMs.
Farnell's stocking more than 23,000 products from ADI
Farnell continues to increase its portfolio of products from Analog Devices (ADI), adding over 7,000 new products to its existing stock and bringing the total number of ADI products available to more than 23,300.
Valens Semiconductor announces CFO transition
After more than eight years of serving as Valens Semiconductor's CFO, Dror Heldenberg will be stepping down to pursue other opportunities, effective September 1, 2023.
Japanese lab demos 95% power-saving packaging tech
Researchers at the Electronics and Telecommunications Research Institute in Japan have developed a superior bonding material that achieves dramatic power saving on semiconductor packaging.
Researchers reveal stretchable lithium-ion battery
A team at the University of Houston have developed a prototype of a fabric-based lithium-ion battery. They assert this could accelerate the progress of wearable technology.
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