Extending component lifecycles crucial for greener electronics
The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.
Siemens and Intel expand collaboration on IC and packaging solutions
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Magnachip to drop display business, goes all-in on power
Magnachip Semiconductor plans to transition into a pure-play power semiconductor company, a move aimed at boosting revenue growth, improving profitability, and increasing shareholder value. The company is now exploring strategic options for its display business, which could include a sale, merger, joint venture, licensing agreement, or even a complete wind-down.
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Nordic Semi partners with Skylo
Nordic Semiconductor and Skylo, a specialist in Non-Terrestrial Network (NTN) communications, have entered into a strategic partnership to certify Nordic’s nRF9151 low-power cellular module on Skylo’s satellite network service.
Obsolescence: a question of when, not if
“It’s inevitable; you just have to accept it. The first step is to be aware that it will happen, whether you want it to or not.” That’s what Ronny Nietzsche, regional sales manager Nordic-Baltic region at Rochester Electronics, says about component obsolescence.
U-M awarded up to $7.5M to develop heat-tolerant chips
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Innoscience launches lawsuits against Infineon
Innoscience filed lawsuits against Infineon Technologies in China and two affiliates in the Suzhou Intermediate People's Court of Jiangsu Province, alleging patent infringement.
Canon delivers NIL system to Texas Institute for Electronics
Canon says that it has shipped its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium.
Vishay launches global restructuring – closes three plants
Vishay Intertechnology, one of the world's largest manufacturers of discrete semiconductors and passive components, has announced a major restructuring program which will result in the company closing three plants.
Rohm and UAES ink a long-term supply deal for SiC power devices
Rohm Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, have entered into a long-term supply agreement for SiC power devices.
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