Huawei proposes Tau Scaling Law as successor to Moore's Law
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.
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Micron starts 1α DRAM production at Virginia fab in $2 billion expansion
US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.
Okmetic Vantaa fab expansion enters volume production
Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.
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Cold Start & Vibration in Auto Water Pumps: YMIN Hybrid Caps Enable Pin-to-Pin Replacement
YMIN VHT/VHU/VHR solid-liquid hybrid capacitors for automotive electronic water pumps solve cold-start noise and high-vibration challenges. They enable pin-to-pin replacement of Japanese brands with equivalent performance and stable supply.
The invisible workhorse of technology: Inside the CPU
CPUs are at the heart of the devices we use every day – from desktop computers and laptops to smartphones and gaming consoles. But have you ever wondered how CPUs actually work?
Zooming in further: How transistors build a CPU
Branch Education’s previous videos have taken viewers through the process of how microchips are made and the machines that print them. Now, it’s time to go even smaller – down to the level of transistors, the fundamental building blocks of every CPU.
EU member states push for stronger Chips Act 2.0
All 27 EU Member States have called for a reinforced “Chips Act 2.0” to secure Europe’s position in the global semiconductor industry, issuing a joint declaration urging stronger action to reduce vulnerabilities and strengthen technological leadership.
Extending component lifecycles crucial for greener electronics
The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.
Siemens and Intel expand collaboration on IC and packaging solutions
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Magnachip to drop display business, goes all-in on power
Magnachip Semiconductor plans to transition into a pure-play power semiconductor company, a move aimed at boosting revenue growth, improving profitability, and increasing shareholder value. The company is now exploring strategic options for its display business, which could include a sale, merger, joint venture, licensing agreement, or even a complete wind-down.
Nordic Semi partners with Skylo
Nordic Semiconductor and Skylo, a specialist in Non-Terrestrial Network (NTN) communications, have entered into a strategic partnership to certify Nordic’s nRF9151 low-power cellular module on Skylo’s satellite network service.
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