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Sponsored content by endrich GmbH
Measuring soil moisture with the endrich IoT ecosystem
The latest development in the endrich IoT ecosystem is the integration of neo.mesh, a wireless ad-hoc network technology from NeoCortec. This design offers a possible solution to collect data from physical networks consisting of many sensors and transfer it to a cloud-based database. This scalable, durable, independent and battery-powered local network of intelligent sensor nodes is ideal for agricultural applications. Instead of direct sensor-cloud communication, which requires multiple internet connections, a secure local sub-gigahertz network with a single connection to the World Wide Web is sufficient.
Which embedded antenna choice is right for your design?
When antennas are embedded on the PCB inside the device, performance depends on several factors. Several embedded antenna technologies are available, and while no one will work in all cases, selecting the right antenna type and placing it correctly on the board could massively increase its radiation efficiency and provide several other improvements
Expedera opens R&D offfice in Singapore
AI silicon IP provider Expedera opens a new Singapore R&D center, the company’s fifth development center, with additional locations in Santa Clara, Bath, Shanghai, and Taipei.
Nexperia partners with Kyocera AVX Salzburg
Semiconductor manufacturer Nexperia has entered into a partnership with Kyocera AVX Components (Salzburg) GmbH, to jointly produce a new 650 V silicon carbide rectifier module for power applications
Sponsored content by STARTEAM Global
Unlocking the Future of PCB: Bridge the Skills Gap and Nurture Next-Gen Talent
In today's highly-digital environment, embracing innovation and technology is no longer a choice but a necessity. The PCB industry is no exception. With a rising skills gap, the PCB industry faces an increasingly ageing workforce and retirement, so the loss of specialised skills and experiences is expected. This shortfall not only pressures the present but the outlook.
Valens Semiconductor announces CFO transition
After more than eight years of serving as Valens Semiconductor's CFO, Dror Heldenberg will be stepping down to pursue other opportunities, effective September 1, 2023.
Japanese lab demos 95% power-saving packaging tech
Researchers at the Electronics and Telecommunications Research Institute in Japan have developed a superior bonding material that achieves dramatic power saving on semiconductor packaging.
Researchers reveal stretchable lithium-ion battery
A team at the University of Houston have developed a prototype of a fabric-based lithium-ion battery. They assert this could accelerate the progress of wearable technology.
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