Evertiq - First In Electronics News & Expo

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Riku-Hynninen

October 01, 2026
EMS companies have been publishing mainly positive headlines related to growth and improving profitability. Even the most struggling companies, Lacroix and TT Electronics, are indicating a comeback after serious restructuring in the Americas region. This is very welcome news for the industry after all the recent crises impacting demand and supply chain.

opens-backend-manufacturing-hub-Thailand

October 01, 2026
Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.

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pcb

October 01, 2026
North American PCB shipments rose 23.5% YoY in August, extending this year's growth. New bookings, however, fell sharply after a strong July.

AB-Electronic-acquisition

October 01, 2026
Dutch electronics group Metis Group has agreed to acquire German EMS provider Assmy & Böttger Electronic (A+B Electronic) from OWG. The deal marks Metis Group's first expansion outside the Netherlands.

PCB-India_3

October 01, 2026
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.

opening-singapore-2026

September 30, 2026
Palo Alto-based robotics company Tacta Systems has opened an office and production facility in Woodlands, Singapore. The site will initially produce the Tacta Glove, which captures the movements of skilled workers to teach robotic hands new tasks, ahead of the company's first customer deployments in early 2027.

Romania-cable-assembly

September 30, 2026
Incap Electronics Romania has invested in a new semi-automatic cable processing system to support a recently awarded multi-year electric bus project. The project has an estimated annual value of EUR 5 million.

Substrates

September 30, 2026
LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.

Group_ISM_MOU

September 30, 2026
Under the MOU, Japan’s Nippon Express (NX) Holdings and India Semiconductor Mission (ISM) will work closely to address logistics-related challenges and help in developing infrastructure to strengthen India’s semiconductor ecosystem.

building_logo

September 30, 2026
Samsung Electronics to invest USD 500 million; five other Samsung affiliates investing the remainder. Samsung commits to Helix’s global AI infrastructure build-out alongside KKR, Kuwait Investment Authority, NVIDIA and Vistra.

budapest-location

September 29, 2026
Panasonic Factory Solutions has opened a significantly expanded Technical Centre in Budapest, centralising customer support, engineering, service and development activities for Central and Eastern Europe. The facility replaces the company's previous training site in Munich.

Discussion-Krakow-2026

September 29, 2026
In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.

MLCCs

September 29, 2026
Japanese and Korean MLCC makers are cutting supply to the consumer market to prioritise capacity for AI applications. The shift is opening doors for Chinese suppliers, several of which are now undergoing qualification with global brands such as Dell, HP, ASUS and Acer, according to market research firm TrendForce.

Christophe-Sut

September 29, 2026
Scanfil is raising its long-term turnover growth target from 10% to 15% on average per year over the business cycle. At the same time, the EMS provider is giving itself more financial room for further acquisitions.

Sejong_site

September 29, 2026
About USD 3.1 billion will be invested to expand FCBGA (Flip Chip-Ball Grid Array) production capacity at the Sejong site in South Korea and USD 1.9 billion will be invested in facilities to expand the FCBGA plant at the Vietnam subsidiary.

Electronics_Besi_MOU

September 29, 2026
Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

CSBC_agreement

September 28, 2026
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.

fuel_cell

September 28, 2026
Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.

Lockheed_Martin

September 28, 2026
Tata Advanced Systems Limited and Javelin Joint Venture (JJV), a partnership between Raytheon and Lockheed Martin, will explore the establishment of a final assembly and integration facility for the Javelin AUR and component production capabilities in India.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

Envision_BESS_Morocco

September 28, 2026
OCP Green Energy, a subsidiary of Morocco’s OCP Group, signed a contract in 2025 with Chinese technology supplier Envision Energy to supply and commission a storage system based on LFP (lithium iron phosphate) technology.

Bittium-Headquarters-Oulu-Finland

September 25, 2026
Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.

Electronics_Kelington

September 25, 2026
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.

building

September 25, 2026
Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter facility offers packaging, final assembly, pack-on-site services and in-lane logistics for customers in Thailand and throughout Southeast Asia.

September 24, 2026
The acquisition is intended to foster an open robotics ecosystem, providing developers with the tools, software and frameworks needed to move more efficiently from research and experimentation to prototyping, deployment and production at scale.

Enomoto_MoU

September 24, 2026
As part of the collaboration, Japanese precision semiconductor component manufacturer Enomoto will leverage its R&D capabilities, technical know-how and next-gen solutions to accelerate semiconductor packaging readiness for the Jagiroad facility.

Expo-GOT-2026-01

September 24, 2026
Early autumn is here again, which means Evertiq has once again taken over Svenska Mässan for Evertiq Expo Gothenburg. For those who couldn't make it, here's a recap of the day in pictures.

Marco-Mezger-2026

September 23, 2026
It is only September, yet Christmas has already arrived in the supermarkets. Gingerbread and holiday decorations are filling shelves, while retailers are preparing for the most important shopping season of the year.

PCB-Taiwan_2

September 23, 2026
TSMC, the world’s largest contract chipmaker, will ‌build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.

Nexperia-deal

September 23, 2026
Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.

quantum-technologies-1

September 23, 2026
The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.

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