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Liquide_gas_plant

August 06, 2026
Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.

Esri_MOU

August 05, 2026
The two companies seek to leverage opportunities in the defence sector by combining BEL’s domain expertise in defence electronics and systems integration with Esri’s geographic information system (GIS), location intelligence and GeoAI capabilities.

Gen3_MRDIMM

August 05, 2026
Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.

Albuquerque-facility-2022

August 04, 2026
US Department of War signs framework agreements with Northrop Grumman to ramp production of PAC-3, THAAD components.

Robotics

August 04, 2026
The company is developing intelligent robots that anyone can train and use. Instead of requiring specialist programmers whenever a task or production process changes, workers can show the robot what to do, watch it attempt the task and correct it on the spot.

August 04, 2026
Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.

MMO2024-Ronny-Nietzsche

August 04, 2026
The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another issue may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.

August 04, 2026
AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain. The acquisition enhances Micross’ presence in continental Europe and broadens its portfolio of high-reliability microelectronic services and products.

sign

August 03, 2026
The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

glass_substrate

August 03, 2026
Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

Kaplan_Waldom

July 31, 2026
Kaplan, former President and CEO of Cornell Dubilier Electronics, brings nearly four decades of leadership experience in the electronic components industry.

nvidia_agenticAI

July 31, 2026
The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.

skeeze-supercomputer

July 31, 2026
The latest edition of the TOP500 ranking of the world's most powerful supercomputers has brought a change at the top. China's LineShine has overtaken the United States' El Capitan, while the number of exascale systems has increased to five. Europe has maintained its position among the world's leading high-performance computing regions.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

new_products

July 30, 2026
New supplier additions in Q2 include Neutrik Group, a global manufacturer of professional interconnect solutions; LumenRadio, which specializes in wireless control technology; and AMobile, which delivers industrial mobile computers.

Facility_expansion

July 30, 2026
The investment will enable Altus to install a complete inline manufacturing solution at the heart of its facility, allowing customers to see first-hand how a full production environment can be configured across SMT assembly, THT assembly, backend production and component management.

tes_logo

July 30, 2026
The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.

new-technologies_2

July 29, 2026
The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.

Technology_building

July 29, 2026
The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.

Jurgen-Braunsteiner-KSG-PCB-FED

July 29, 2026
Why PCB procurement strategies should be reviewed?

PCB-world_2

July 28, 2026
Companies are reassessing where they build, how much flexibility they need, which suppliers they depend on and where financial decisions are made.

Didrik-PCB

July 28, 2026
In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.

Penang_factory

July 28, 2026
The project is aimed at maximising manufacturing efficiency, process consistency and product quality. The new system enables individual process stations to be added, removed or reconfigured as production requirements evolve.

Electronics_team

July 28, 2026
Fastlink Data Cables is known for manufacturing high-quality cable assemblies and box build solutions, with particular expertise in supporting data centre critical power and cooling applications alongside long-established defence and aerospace programmes.

Pascal-Lefarth

July 28, 2026
For Europe's electronics manufacturers, sustainability has become far more than a long-term ambition. Customer questionnaires, ESG platforms and an expanding regulatory framework are rapidly becoming part of everyday business, requiring companies not only to improve their environmental performance but also to demonstrate it through an increasing number of reporting frameworks.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Ersa_Wisconsin

July 27, 2026
The partnership is intended to strengthen local support for electronics manufacturers by combining German company Kurtz Ersa’s equipment portfolio with E-tronix’s applications experience and regional presence.

funds_PabitraKaity

July 27, 2026
The African Development Bank Group, which approved the loan, also plans to mobilise up to an additional EUR 141 million from financial partners to support the implementation of this strategic project in Morocco.

Kineco_partnership

July 27, 2026
The components will be produced in India, comprising several thousand parts per year, with serial production scheduled to start by the end of 2027.

Ford_Valencia_Plant

July 27, 2026
The JV aims to transform Ford’s Valencia, Spain facility into a shared, high-tech manufacturing hub. Under the proposed ownership structure, Chinese firm Geely Auto will own 34% of the new entity and Ford will own 66%.

RSO_KDDI

July 27, 2026
During peak hours, Samsung’s RAN Speed Optimizer (RSO) delivered an average increase of 31% in 5G downlink throughput across the overall trial area, with gains reaching a maximum increase of 52% in dense urban areas, on KDDI’s commercial 5G SA network in Japan.

SCL_chip_innovation

July 24, 2026
As part of this collaboration, the 1.2 µm Process Design Kit will be made available through eChipHub, and provide students, researchers, faculty members, startups, MSMEs and industry professionals with access to an indigenous semiconductor process technology for IC design and prototyping.

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