Synopsys completes $35 billion acquisition of Ansys
July 18, 2025
The deal was 18 months in the making. United with Ansys, Synopsys can now deliver holistic system design solutions for customers in industries spanning semiconductors, high-tech, automotive, aerospace, industrial, and more.
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Tata Electronics, Bosch to collaborate in electronics, chipmaking
July 18, 2025
Tata Electronics and Bosch intend to collaborate on chip packaging and manufacturing at Tata Electronics’ upcoming assembly and test unit in Assam and foundry in Gujarat.
Nexceris sells Li-ion Tamer battery monitoring solution to Honeywell
July 18, 2025
Building on its existing partnership with Honeywell, the sale also highlights Nexceris’ strategy to commercialize technology in packaged products that are ultimately licensed or acquired by industrial partners.
Smartkem may team up with Manz Asia for AI chip packaging solutions
July 17, 2025
When finalized, the Joint Development Agreement (JDA) will focus on the co-development of next-generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.
Libra launches in-house high precision underfill capabilities
July 17, 2025
Underfill is typically a thermoset epoxy applied between semiconductor packages and PCBs or substrates. It delivers essential benefits: reinforcing solder-joint reliability, mitigating thermal expansion mismatches, improving thermal management, and enhancing mechanical durability.
Valens’s chipsets enable MIPI A-PHY platform for Embedded Vision by D3
July 17, 2025
The A-PHY platform offers D3 Embedded customers a series of unique benefits, including unparalleled EMI resilience, longer link distances, and the ability to operate over simple, low-cost cabling.
Indian robotics startup Unibose raises $640K to scale up operations
July 17, 2025
Unibose enables industries to access life-saving automation in sectors such as oil and gas, chemicals, fertilisers and heavy industries. The latest capital infusion follows the USD 290,000 raised by the Chennai-based startup earlier.
Hyundai and Kia’s Robotics LAB delivers first ‘X-ble Shoulder’ wearable robot
July 16, 2025
As the first official customer, Korean Air will deploy the wearable robot across its aerospace division, including assembly and maintenance operations for commercial airliners, military aircraft, urban air mobility (UAM) vehicles, drones, stealth aircraft and satellite launch systems.
Kaynes to set up $40M electronics manufacturing facility in Bhopal
July 16, 2025
The upcoming factory in Bhopal’s Badwai IT Park will be built on five acres of land and is expected to create more than 1,000 skilled jobs. Production at Kaynes Electronics’s new plant in Madhya Pradesh is set to begin by mid-2026.
SK keyfoundry, LB Semicon co-develop Direct RDL for chip packaging
July 15, 2025
RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.
RENK, ARX establish software-defined defence mobility partnership
July 15, 2025
German defence startup ARX Robotics will support RENK’s digital transformation as Software-Defined defense partner, while RENK will power the industrial growth and international expansion of ARX.
Mycronic reports 35% increase in net sales in Q2 2025
July 14, 2025
Despite sales growth, order intake fell to SEK 1.3 billion from SEK 2 billion. In the second quarter, order intake saw a decline of 37%. EBIT amounted to SEK 568 million and the EBIT margin was 27%.
Materion completes acquisition to expand semiconductor footprint in Asia
July 14, 2025
This strategic investment expands Materion’s global footprint with a facility in Asia to better support and service global Tier I semiconductor customers and strengthens Materion’s position as a leading supplier of deposition materials.
Comau, Roboze collaborate to expand into new market sectors
July 14, 2025
The two Italian companies have entered into a collaboration aimed at combining digital additive manufacturing and automation to open new customer and market segments.
SHENMAO enhances semiconductor capabilities with acquisition of PMTC
July 11, 2025
PMTC is recognized for its high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance and drop performance. The company brings in-house alloy development, application expertise and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.
Cetec ERP expands into larger office in Austin to boost growth
July 11, 2025
The new location, situated within a prominent Austin business complex, provides ample room for current operations and offers flexible space for future expansion as the company continues to scale.
Siemens completes acquisition of ebm-papst’s industrial drive tech business
July 11, 2025
Integrating the new portfolio into the existing automation portfolio and leveraging Siemens' global sales network will open up new markets and significant business potential in the field of intelligent, battery-powered drive and robot solutions.
Nordic, Future Electronics enter global distribution partnership
July 11, 2025
The agreement sees Future added to Norwegian company Nordic’s group of global distribution partners, and involves Future bringing Nordic’s entire current product line to market. Future will also stock modules from Nordic module partners.
NEURA, HD Hyundai to jointly develop and test robots for shipbuilding
July 11, 2025
By combining the expertise of all three partners, quadruped and humanoid robots will be tested under real-world conditions, with a focus on validating their potential to increase efficiency, safety and productivity.
ROHM releases level 3 SPICE models with enhanced simulation speed
July 10, 2025
ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.
Guys, can we please stop inflating orders?
July 10, 2025
We are all aware that the semiconductor industry is highly volatile. But that’s not just because of the market itself; in fact, a substantial part is self-inflicted. Because, in times of shortages, companies panic and place inflated orders with multiple manufacturers or suppliers. We see the same thing happening again now with DDR4. Samsung, which captures about half of the DRAM market, has announced that it will wind down its DDR4 production by the end of 2025. This is causing a ripple effect that we have seen time and again.
Delta to construct new regional headquarters in the Netherlands
July 10, 2025
Located in the Park 20|20 business campus, the state-of-the-art 9300-sqm facility in Hoofddorp is expected to be completed by the end of 2026 and will house over 350 employees in R&D, business development, management and more.
Arrow launches Engineering Solutions Center in Bangalore
July 09, 2025
The newly established India ESC is designed to help innovators and technology manufacturers adopt advanced technologies such as edge computing, energy management, automation and e-mobility.
Jaatinen Guides Manufacturers Through Digital Product Passports
July 09, 2025
During Evertiq Expo Tampere 2025, Juhana Jaatinen, managing director of RoHS Management, gave a presentation on the EU’s digital product passport and provided the audience with insight into what this means for manufacturers in the industry.
China’s INV New Material launches $750M battery plant in Malaysia
July 09, 2025
The newly launched facility will produce wet-processed and coated lithium-ion separators – an essential component in EV battery manufacturing.
iPronics partners with Ansys to bring reliability to AI workloads
July 08, 2025
iPronics integrates Ansys solutions across its core development workflow — from optical layout to packaging and thermal simulations — enabling robust, full-stack design and validation of photonic integrated circuits (PICs) that perform reliably despite fabrication variability.
Singapore launches innovation hub for gallium nitride semiconductors
July 08, 2025
The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.
Sthyr raises $1 million to advance zinc-air battery innovation
July 08, 2025
Indian startup Sthyr Energy is developing a mechanically rechargeable zinc-air battery system tailored for long-duration energy storage applications, including seasonal power supply and clean alternatives to traditional peaker plants.
Avnet announces Gilles Beltran as new President
July 08, 2025
Gilles Beltran joined Avnet Silica in 2002, bringing more than two decades of company-specific experience and know-how to this new role, including four years as President of Avnet Silica.
One in a Million. People used to be our greatest strength
July 07, 2025
In this first article of Evertiq’s new expert column series, Claus Aasholm – seasoned technology executive and strategist – shares his perspective on the trends, challenges, and breakthroughs shaping the global electronics industry. Drawing on decades of hands-on experience, Claus offers sharp, thought-provoking insights that go beyond headlines and buzzwords. Expect analysis that connects the dots – and challenges the status quo.
Safran partners with HAL to produce LEAP engines forged parts
July 07, 2025
This agreement supports the Indian government’s “Make in India” policy and follows the MoU signed by Safran and HAL in October 2023 to develop industrial cooperation in LEAP engine parts manufacturing, as well as the contract signed last February to produce forged parts.
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