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Guadalajara-mexico-plant

May 14, 2026
Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

PCB-India_2

May 14, 2026
HrdWyr develops chips for sectors such as consumer electronics, EVs, industrial systems and data centres. The funding will accelerate the development of the company’s AISoC products and expand customer engagements across key global markets.

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acquires-Indesmatech

May 12, 2026
Semiconductor distributor Macnica ATD Europe has acquired Indesmatech, a pan-European technology advisory company specialising in semiconductor representation, design-in support and consulting.

Open-German-RD-Centre

May 12, 2026
Taiwanese power electronics manufacturer Delta has officially opened a new R&D centre in Soest, Germany, expanding its European innovation capacity with a focus on high-efficiency power solutions for AI data centres and electric mobility.

PCB-India_3

May 11, 2026
The fresh funds will be used to commercialise the Bengaluru-based fabless startup’s first system on chip SoC, scale product engineering, and boost partnerships across foundries, IP ecosystems and OEMs.

Arizona-2025

May 08, 2026
TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.

May 08, 2026
The acquisition brings together Lattice’s low power FPGAs with AMI’s platform firmware and infrastructure manageability solutions for cloud and AI to create a complete portfolio of secure management and control solutions.

employees-in-cleanroom

May 06, 2026
US semiconductor equipment maker Applied Materials has entered into a definitive agreement to acquire the NEXX business from ASMPT, adding panel-level electrochemical deposition technology to its advanced packaging lineup.

racks

May 06, 2026
This alliance aims to address the surging demand in the inference market and set standards for high-performance, energy-efficient sovereign AI infrastructure.

soc_founders

May 06, 2026
The Swiss semiconductor startup builds integrated circuits that process visual and positional sensor data to give devices a real-time understanding of where they are and what’s around them.

March-2026

May 05, 2026
Global semiconductor sales reached USD 298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025, reports SIA.

Rhea1

April 28, 2026
European processor developer SiPearl has appointed Guillaume Etorre as Chief Operating Officer, strengthening its executive team as the company prepares to bring its first-generation Rhea1 CPU to market in the coming weeks.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

Veloce_proFPGA

April 24, 2026
Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.

TSMC

April 23, 2026
TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.

April 22, 2026
The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

chip_packaging_Odisha

April 20, 2026
The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.

Liquide_Japan

April 20, 2026
Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.

April 20, 2026
The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.

3090-ti

April 17, 2026
We often speak about the performance of modern GPUs in abstract terms — trillions of operations, ever-increasing compute power. What remains less visible is the structure that makes it possible.

quantum-technologies-1

April 17, 2026
This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

server-hall

April 15, 2026
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.

PCB-Japan_1

April 13, 2026
Established in 2022, Rapidus has secured funding from both the public and private sectors. It is aiming to mass-produce cutting-edge chips using 2-nanometer technology by 2027.

data_centers

April 13, 2026
This financing will enable the California-based semiconductor company to accelerate the development of its next generation data center solutions and expand its global engineering teams to meet the needs of agentic AI workloads.

April 10, 2026
Samsung Electronics is considering an investment in chip testing and packaging operations in Vietnam, Reuters reports, citing a source familiar with the matter.

February-2026

April 09, 2026
Global semiconductor sales were $88.8 billion during the month of February 2026, an increase of 7.6% compared to the January 2026 total of $82.5 billion and 61.8% more than the February 2025 total of $54.9 billion, reports the Semiconductor Industry Association (SIA).

Lip-Bu-Tan-elon-musk

April 07, 2026
Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.

PCB-Spain_2

April 07, 2026
The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.

fab-equipment-spending-2026

April 07, 2026
Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.

AI_infrastructure

April 06, 2026
With USD 650 million raised in the past six months, the South Korean AI chip startup is entering a new phase of growth focused on US market expansion, scaled production of its Rebel100 platform, and preparation for a future IPO.

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