Evertiq - First In Electronics News & Expo

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signing-the-contract_1

February 05, 2026
SiTime has signed a definitive agreement to acquire assets related to Renesas Electronics’ timing business in a deal valued at USD 1.5 billion in cash and approximately 4.13 million shares of SiTime common stock.

FAMES

February 03, 2026
The FAMES pilot line has been officially inaugurated at CEA-Leti’s site in Grenoble, France, following the delivery of its first validated technical results. The inauguration marks the opening of a new cleanroom facility dedicated to advanced semiconductor technologies and based on 300mm semiconductor equipment.

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Marco-Mezger-interview

January 30, 2026
Ever wanted to pick the brains of someone deep inside the semiconductor industry? Semiconductor industry veteran Marco Mezger sat down in TaiwanPlus’ Now You Know series to answer viewer questions – explaining, quite literally, why things work the way they do.

Marco-Peter-2026

January 29, 2026
When German memory company Neumonda talks about bringing semiconductor memory manufacturing back to Germany, it sparks curiosity — not about the technology itself, but about the scale, the investment needed, and whether it’s actually possible.

experience-centre-veldhoven

January 28, 2026
Dutch semiconductor equipment maker ASML reported much stronger-than-expected bookings for the fourth quarter, as chipmakers step up investments to support booming demand for artificial intelligence hardware, according to a Reuters report.

Minnesota-facility

January 27, 2026
US quantum computing company IonQ has entered into a definitive agreement to acquire US-based semiconductor foundry SkyWater Technology in a cash-and-stock transaction valuing SkyWater at approximately USD 1.8 billion.

Sapien_MOU

January 26, 2026
The two South Korean companies will advance the design and technical evaluation of CMOS backplane technology, which is a core component of micro-displays. This partnership covers both technology and business aspects.

PCB-India_2

January 26, 2026
Under the partnership, Infineon will collaborate with NIELIT — an autonomous body under India’s Ministry of Electronics and Information Technology (MeitY) — to develop training programs in semiconductor assembly, test and packaging.

Tech_Electrical_Engineering

January 23, 2026
Texas Semiconductor Innovation Fund (TSIF) grants are awarded to Texas institutions of higher education for semiconductor research and projects and to state businesses to encourage economic development related to chip manufacturing and design.

smart-brick

January 22, 2026
Denmark's Lego Group has unveiled LEGO SMART Play, a new interactive play platform based on electronically enabled bricks that respond to physical interaction. The platform was presented at CES 2026 in Las Vegas earlier this month.

January 20, 2026
Micron Technology’s planned acquisition of Powerchip Semiconductor Manufacturing Corp.’s (PSMC) Tongluo fab in Taiwan could help strengthen global DRAM supply from 2027, according to market analyst TrendForce.

University_campus

January 20, 2026
The testbed will focus on exploring the manufacturing and testing of ultra-low thermal noise materials for use in quantum sensing, fundamental science and semiconductor manufacturing.

January 19, 2026
The acquisition includes an existing 300mm fab cleanroom of 300,000 square feet and will further position Micron to address growing global demand for memory solutions.

New-Fabrication-Facility-at-Yokkaichi-Plant

January 16, 2026
Flash memory is something most of us only encounter at the very end of the supply chain — as a smartphone in our pocket, a USB stick in a drawer, or an SSD powering our laptop. A new video from Linus Tech Tips flips that perspective and takes viewers straight into the industrial reality behind modern storage.

Trump-Adress-to-congress-04-03-2025

January 16, 2026
The chips include Nvidia’s H200 and AMD’s MI325X. The White House proclamation follows an investigation under ‌Section 232 of the Trade Expansion Act of 1962 and is part of a broader effort to create incentives for chipmakers to produce more semiconductors in the US.

axonite_chip

January 16, 2026
This gives Alif Semiconductor customers access to ModelCat AI’s single step model build process, to generate custom AI models fully optimized for Alif’s Ensemble processors.

Andes_Technology

January 15, 2026
The agreement establishes a scalable framework for long-term intellectual property (IP) collaboration and innovation enabling LTSCT to accelerate the development and commercialization of RISC-V based advanced, customized semiconductor solutions for global markets.

PCB-USA_2

January 12, 2026
The program at the Texas State Technical College (TSTC) will include a wafer processing learning facility with a mock cleanroom replicating industry workflows.

new-technologies_5

January 12, 2026
Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR and radar fusion.

Team

January 05, 2026
The funding has enabled the Swiss-American deeptech startup to develop and demonstrate its multi-color laser technology, which connects computing chips (GPUs, TPUs) in AI clusters faster and more efficiently than copper cables can.

Toshiba_EDA

January 02, 2026
Toshiba’s deployment of Siemens’ EDA tools includes advanced thermal design and analysis for 3D IC architectures; power optimization, integrity and reliability enhancement; and next-generation analog simulation acceleration.

Dennis-Dahlgren_Column-3

December 29, 2025
As 2025 draws to a close, I’ve been looking back at the stories that shaped the year in electronics — stories that reveal an industry caught between ambition and anxiety, progress and hesitation, but also consolidation. It has been a year defined less by dramatic shocks and more by accumulating pressures: delayed investments, geopolitical strain, fragile supply chains.

world-map-l

December 26, 2025
A new analysis of the global semiconductor supply chain highlights how critical stages of chip production remain concentrated among a handful of economies, underscoring the industry’s vulnerability to geopolitical and supply disruptions.

PCB-India_3

December 23, 2025
The collaboration with AOI Electronics positions Kaynes Semicon to deliver turnkey backend semiconductor solutions to global customers. Through the partnership with Mitsui, Kaynes expects to gain access to critical raw materials.

Tata_Electronics

December 22, 2025
As the first step in this collaboration, Tata Electronics will assemble and test Rohm’s India-designed automotive-grade Nch 100V, 300A Si MOSFET in a TOLL package, targeting mass production shipments by next year.

Advanced_Materials_Spokane

December 19, 2025
The expansion and modernization of its electronic materials facility in Spokane Valley, Washington, will play a key role in enabling the next generation of semiconductor fabrication, providing critical materials needed to produce smaller, faster and more energy-efficient chips.

December 18, 2025
ASMPT said it has secured new orders for 19 chip-to-substrate (C2S) thermo-compression bonding (TCB) tools from an unnamed outsourced semiconductor assembly and test (OSAT) provider supplying a leading foundry focused on AI chips.

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

Erfurt-Germany-facility

December 16, 2025
The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,

Claus-Aasholm

December 16, 2025
What can be learned from the Q3-25 results of the Semiconductor Industry?

drone

December 16, 2025
The partnership brings together ideaForge’s FLYGHT platform, a ready-to-deploy, on-demand drone network delivered through a Drone-as-a-Service (DaaS) model, with C-DAC’s Emergency Response Support System (ERSS–Dial 112).

render-Catania-Silicon-Carbide-Campus

December 15, 2025
First €500 million tranche signed to support acceleration of R&D and high-volume chip manufacturing in Italy and France.

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