STMicroelectronics to launch $60M pilot line in France September 17, 2025 Semiconductor manufacturer STMicroelectronics plans to establish a new pilot line for Panel-Level Packaging (PLP) technology at its Tours facility in France, backed by a USD 60 million investment. The pilot line is expected to be operational in the third quarter of 2026.
Stefan Hofschen named as new CEO of Swissbit September 16, 2025 Swissbit AG has appointed Dr. Stefan Hofschen as its new Chief Executive Officer, effective January 1, 2026. He will succeed Silvio Muschter, who will transition to the newly created role of Group Chief Technology Officer.
Smartwatches drive micro LED adoption September 11, 2025 Micro LED penetration in consumer electronics is accelerating. Following Samsung’s launch of its 140-inch Micro LED TV in 2023, Garmin is set to introduce the Fenix 8 Pro smartwatch with Micro LED in 2025, alongside Sony Honda’s planned 30-inch automotive display in its Afeela model at the end of the same year.
Scintil raises €50 million to scale integrated photonics for AI factories September 10, 2025 The funding enables France’s Scintil Photonics to expand hiring, accelerate production and deepen its international presence as it delivers the industry’s first single-chip DWDM light engine, integrating multi-wavelength lasers with silicon photonics, aligned with next-generation CPO.
NXP to relocate German headquarters in Hamburg September 09, 2025 NXP Semiconductors says it plans to relocate its German headquarters from Hamburg-Lokstedt to a new site in Hamburg-Bahrenfeld. The move, scheduled for early 2031, will mark the company’s departure from its current location after more than 100 years.
Tata Electronics partners with Merck to boost India’s chip capabilities September 08, 2025 Merck will offer its full suite of products and services, including high-purity electronic materials, advanced gas and chemical delivery systems, turnkey fab infrastructure services, and its Material Intelligence solutions powered by AI, for Tata Electronics’ fab in Gujarat.
Trump warns ‘fairly substantial’ semiconductor tariffs are coming September 05, 2025 Trump had said last month that he would impose a 100% tariff on semiconductor imports, but would exempt products from companies that shift their manufacturing to the US.
LTSCT, IISc to develop centre for semiconductor research in India September 05, 2025 The national 2D innovation hub, said to be the first of its kind in India, will focus on next-generation semiconductor innovation, beyond silicon chip technologies.
IQM raises €275 million in round led by Ten Eleven Ventures September 04, 2025 The additional capital enables the Finnish quantum computing company to enhance its presence in the US market and further access key global markets to serve the growing demand in IQM’s products.
2Q25 foundry revenue surges 14.6% – TSMC extends market dominance September 02, 2025 Global foundry revenue rose 14.6% quarter-on-quarter (QoQ) in the second quarter of 2025 to a record USD 41.7 billion, according to TrendForce. The increase was driven by China’s consumer subsidy program and early demand for smartphones, notebooks, PCs, and servers ahead of second-half launches, reports TrendForce.
Tessolve raises $150M from TPG to expand global delivery centres September 01, 2025 Bengaluru-based semiconductor engineering services firm Tessolve plans to use the funds to expand global delivery centres, scale advanced test labs and pursue strategic acquisitions to consolidate its position in the domestic and global semiconductor market.
Samsung, SK Hynix lose US waiver on chip gear for China use September 01, 2025 Samsung manufactures about 35-40% of its total NAND flash memory chips at its plant in Shaanxi, while SK Hynix produces about 40% of its DRAM in Jiangsu and 20% of NAND flash chips in Liaoning.
CG Semi unveils one of India’s first end-to-end OSAT facilities August 29, 2025 CG Semi, a subsidiary of CG Power and Industrial Solutions and part of the Murugappa Group, has launched its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.
SK hynix begins mass production of 321-layer QLC NAND flash August 27, 2025 To maximize the cost competitiveness of its new product, SK Hynix developed a 2Tb device with double the capacity of existing solutions. To address potential performance degradation in large-capacity NAND, the number of planes was increased from 4 to 6.
Report: Beijing E-Town sues Applied Materials over ‘trade secrets leak’ August 25, 2025 The China-based semiconductor equipment firm claims that US firm Applied Materials had illegally obtained and used Beijing E-Town’s core technology secrets related to plasma sources and wafer surface treatment.
Cirrus Logic partners with GF to advance mixed-signal chipmaking August 25, 2025 Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact.
India approves 4 projects in $530 million boost to chip making August 20, 2025 The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.
SoftBank to invest USD 2 billion in Intel August 19, 2025 Japanese SoftBank Group and US chip manufacturer Intel Corporation have entered into a definitive securities purchase agreement under which SoftBank will invest USD 2 billion in Intel common stock.
Oxford Ionics delivers quantum computer to the NQCC August 18, 2025 QUARTET, a full-stack, trapped-ion quantum computer that leverages Oxford Ionics’ proprietary Electronic Qubit Control technology, has now been installed in the National Quantum Computing Centre’s (NQCC) quantum data centre at its Harwell campus.
QCi awarded TFLN photonic chip contract by US’s NIST August 18, 2025 Quantum Computing Inc. (QCi) has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the US Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs).
Report: Trump administration discussing taking a stake in Intel August 15, 2025 According to the Bloomberg report, the two sides were discussing a deal in which the US government would pay for a stake in the company. The White House also wants to shore up Intel’s plans to open a new manufacturing plant in Ohio.
Ecolab to acquire Ovivo’s electronics business for $1.8 billion August 15, 2025 The acquisition will strengthen Ecolab’s high-tech growth engine by bringing together Ovivo’s ultra-pure water technologies with Ecolab’s leading water solutions, digital technologies and global service capabilities.
Xanadu partners with DISCO to develop advanced wafer processing August 15, 2025 This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.
Global semiconductor sales increase 7.8% from Q1 to Q2 August 14, 2025 Global semiconductor sales were $179.7 billion during the second quarter of 2025, an increase of 7.8% compared to Q1, reports the Semiconductor Industry Association (SIA).
Applied Materials to build $200M components plant in Arizona August 14, 2025 Applied Materials says it will invest more than USD 200 million to build an advanced manufacturing facility in Chandler, Arizona, dedicated to producing components for semiconductor equipment.
US uses hidden trackers to monitor AI Chip shipments bound for China August 14, 2025 US authorities have reportedly embedded concealed tracking devices in certain shipments of advanced AI chips to detect possible violations of export restrictions targeting China, according to sources cited by Reuters.
TSMC to phase out 6-inch wafer production August 13, 2025 TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.
indie Semiconductor to acquire emotion3D in $20 million deal August 13, 2025 indie Semiconductor has agreed to acquire emotion3D GmbH, an Austrian developer of perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS), and automated driving, the companies announced.
EnSilica opens mixed-signal design centre in Budapest August 12, 2025 UK-based chipmaker EnSilica has opened a new mixed-signal ASIC design centre in Budapest, Hungary, expanding its presence in the EU.
FuriosaAI closes $125M round to scale production of AI inference chip August 11, 2025 The new funding will be used to accelerate mass production of Furiosa’s RNGD chip to support global enterprise customers and lay the groundwork for development of Furiosa’s next-generation chip.
Tokyo Electron fires employee suspected of stealing TSMC tech August 11, 2025 The six people arrested on allegations of intellectual property theft at the Taiwanese chipmaker include a person identified by local media reports as a former employee of Tokyo Electron. The leaked information was reportedly related to TSMC’s most advanced 2-nanometer chip technology.
SIA: Hope tariff exemptions, trade deals ensure US chip leadership August 08, 2025 President Trump said this week that he plans to impose 100% tariffs on imported semiconductors but indicated he would not charge companies that commit to making chips in the US.