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BECOM starts operations at its Heyuan location
February 24, 2021
The Austrian headquartered EMS provider opened its new location in China just before the Chinese New Year. In this first step, the company invested a total of EUR 4 million in the new 3'000 square metre, high-tech location in Heyuan in southern China.
NCAB Group acquires Italian PCB supplier
February 23, 2021
NCAB Group announces that it has acquired 100% of the shares in Italian PCB supplier PreventPCB.
Solas OLED settles patent disputes with LG Display
February 22, 2021
Solas OLED, an Irish company that specialises in OLED technologies that it licenses to consumer electronics manufacturers, has entered into a Settlement and License Agreement with LG Display, resolving a number of patent infringement actions brought by Solas against LG Display and a certain number of its customers, including Sony.
Panthronics seals global partnership agreement with AdvanIDe
February 22, 2021
Panthronics AG, a fabless semiconductor company specialising in high performance wireless technology, has signed a global partnership agreement with specialist supplier of NFC, RFID and smart card components, AdvanIDe.
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Logic ICs account for the largest share of China’s IC market
February 19, 2021
China became the largest IC market in the world in 2005 and has continued to grow in size since then. In 2020, the Chinese IC market increased to USD 143.4 billion, a 9% gain from USD 131.3 billion in 2019.
Ventec’s German facility receives AS9100-D certification
February 18, 2021
Ventec International Group's European facility in Kirchheimbolanden, Germany, is now certified according to AS9100 Revision D (DIN EN 9100), the quality-management standard for the aviation, space, and defense (ASD) industries.
Scanfil delivers solid performance during 2020
February 18, 2021
2020 was an exceptional year, but despite the challenges the EMS provider saw customer demand pick up towards the end of the year which ultimately resulted in a solid year.
SMIC unable to keep up with demand amid shortage and sanctions
February 16, 2021
The Chinese semiconductor manufacturer, even with plants running “fully loaded” cannot work fast enough to keep up with customer demand for certain mature technologies.
German components distribution: Downturn stopped
February 15, 2021
German distribution of components, according to the FBDi, increases order intake by 23% in the fourth quarter. Sales down "only" by 8.1%. Full year 2020 shows deep traces of the pandemic.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Apple and Samsung remain the top chip buyers in 2020
February 12, 2021
Gartner says that the top 10 original equipment manufacturers (OEMs) increased their semiconductor spending by 10% in 2020, and accounted for 42% of the total market, up from 40.9% in 2019.
German automation specialist to invest €5.8 million in Hungary
February 11, 2021
Balluff-Elektronika Kft. specialising in the production of electronic components is to launch a new research and development project, targeting the major regeneration of sensors and network devices for industrial automation.
Top 5 wafer capacity leaders raise their global share to 54%
February 10, 2021
Each of the top-five wafer capacity leaders had capacity of at least 1.5 million wafer starts per month. The combined capacity of the top five companies represented 54% of total global wafer capacity in December 2020, up one point from 53% in 2019.
Nexperia plans to grow global production and increase R&D
February 09, 2021
The company is planning new investments to support its strategy to address the growing demand for power semiconductors and boost GaN capabilities.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Richardson ink agreement with Quantum Microwave
February 02, 2021
Richardson Electronics has entered into a new distribution agreement with Quantum Microwave, a US-based manufacturer of microwave and millimeter-wave solutions. This is a global agreement, excluding Japan, China, and Taiwan.
Panel prices to remain high due to the furnace explosion at AGC
February 02, 2021
AGC Fine Techno Korea, which is a glass substrate manufacturing plant owned by AGC and located in the South Korean city of Gumi, suffered a furnace explosion that also led to injuries of plant personnel on January 29.
Global semiconductor sales amounted to $439 billion in 2020
February 01, 2021
Global semiconductor industry sales were USD 439.0 billion in 2020, an increase of 6.5% compared to the 2019 total of USD 412.3 billion, reports the Semiconductor Industry Association (SIA)
Silanna Semiconductor expands its Asian distribution network
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February 01, 2021
Power management specialist, Silanna Semiconductor, expands its Asian distribution network with the appointment of Audix Group, an electronic component distributor, manufacturer and technical services to support customers in Asia.
