Evertiq - First In Electronics News & Expo

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cloud_server

March 16, 2026
The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.

EPIC-Semiconductor-Centre

March 11, 2026
Applied Materials and SK hynix have signed a long-term research and development agreement aimed at accelerating the development of next-generation memory technologies for artificial intelligence systems.

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EPIC-Semiconductor-Centre

March 10, 2026
Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.

PCB-India_1

March 06, 2026
C2i Semiconductors is redesigning how electricity flows inside a server from the incoming power source to the processor chip using a grid-to-core approach.

sign-on-building

March 04, 2026
Nvidia has entered a multiyear strategic partnership with Lumentum to accelerate the development of advanced optics technologies for next-generation AI infrastructure.

PCB-India_3

March 04, 2026
The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.

sign

March 03, 2026
Nvidia has entered a multiyear strategic agreement with Coherent to develop advanced optics technologies for next-generation AI infrastructure. The agreement includes a USD 2 billion investment by Nvidia in Coherent, alongside a multibillion-dollar purchase commitment for optical networking and laser products.

PCB-Japan_2

March 02, 2026
Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.

Kevin-OBuckley-EVP-Global-Operations-Supply-Chain

February 27, 2026
Qualcomm Incorporated has appointed Kevin O’Buckley as executive vice president of Global Operations and Supply Chain, effective 2 March 2026.

advanced-semiconductor-manufacturing-facility

February 27, 2026
Hitachi Energy and Pakal Technologies have announced a collaboration to develop next-generation high-voltage silicon power semiconductor modules rated at ≥3.3 kV.

northvolt-labs-vasteras

February 27, 2026
Battery company Lyten has completed its acquisition of Northvolt’s Swedish assets, valued at nearly USD 5 billion. The deal includes the Northvolt Ett and Ett Expansion sites in Skellefteå and Northvolt Labs in Västerås.

AMD-Logos-AI

February 25, 2026
AMD and Meta have entered a definitive multi-year agreement under which Meta will deploy up to 6 gigawatts of AMD Instinct GPUs to power its next generation AI infrastructure.

Houston-production

February 25, 2026
Apple will start producing its Mac mini in the US for the first time, with manufacturing slated to start later this year at a new facility in Houston.

EUV-system

February 24, 2026
ASML has developed an upgraded extreme ultraviolet (EUV) light source for its lithography machines, which the company says could increase chip production by up to 50% by the end of the decade, Reuters reports.

chip

February 20, 2026
SemiFive has secured a design win from US‑based Niobium for a fully homomorphic encryption (FHE) hardware accelerator.

agentic-AI-chip-design

February 19, 2026
US-based ChipAgents has raised USD 50 million in an oversubscribed Series A1 funding round, bringing its total capital raised to USD 74 million.

building

February 16, 2026
Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.

groudbreaking-RD-center-Hsinchu-Taiwan

February 15, 2026
Industrial Technology Research Institute (ITRI) has broken ground on a new Advanced Semiconductor R&D Centre at its headquarters campus in Hsinchu, Taiwan.

global-wafer-shipments-msi-february-2026

February 12, 2026
Global silicon wafer shipments increased in 2025, while total wafer revenue declined slightly, according to year-end data from SEMI.

EPIC-Semiconductor-Centre

February 12, 2026
Samsung Electronics will join Applied Materials’ EPIC (Equipment and Process Innovation and Commercialisation) Centre in Silicon Valley, a semiconductor research and development facility backed by a USD 5 billion investment.

building_logo

February 11, 2026
Marvell Technology has completed its previously announced acquisition of XConn Technologies, a provider of advanced PCIe and CXL switching silicon.

Vantaa-expansion-2026

February 11, 2026
Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.

building_logo

February 11, 2026
Mobility supplier Denso has announced a USD 69 million investment to build a new advanced logistics facility in Lebanon, Tennessee, as part of efforts to optimise its North American operations and distribution network.

Haviv-Ilan

February 04, 2026
Texas Instruments has signed a definitive agreement to acquire Silicon Labs in an all-cash transaction valuing the wireless connectivity specialist at approximately USD 7.5 billion.

new-technologies_8

February 03, 2026
In a recent analysis, Evertiq explored which countries dominate global R&D spending. Viewed through the lens of absolute investment volumes, the picture is largely shaped by the United States and China, followed by established industrial powerhouses such as Germany, Japan and France. Shifting that lens away from global heavyweights and toward a smaller, highly R&D-intensive economy reveals a different dynamic — one where the relationship between research investment and industrial capability becomes more clearly defined. Finland provides a useful case for understanding how research investment translates into industrial capability.

February 02, 2026
Vanguard International Semiconductor Corporation (VIS) has signed a technology licensing agreement with TSMC covering both low-voltage (80V) and high-voltage (650V) gallium nitride (GaN) process technologies.

PCB-India_3

January 30, 2026
The proceeds will be used to scale engineering efforts and advance product development as Agrani Labs works towards building globally competitive AI compute solutions.

PCB-India_1

January 29, 2026
Indian company Raana Semiconductors Pvt. Ltd. (RSPL) plans to initially focus on producing 10–12 inch solar-grade silicon ingots, with a longer-term roadmap towards semiconductor-grade wafer manufacturing.

supercomputer_Athena

January 29, 2026
Housed in the Modular Supercomputing Facility at NASA’s Ames Research Center in California, Athena delivers more computing power than any other NASA system, surpassing the capabilities of its predecessors, Aitken and Pleiades, in power and efficiency.

SDI_KGM

January 19, 2026
As part of the agreement, the companies will focus on battery pack technologies using Samsung SDI’s 46-series cylindrical battery cells, while expanding collaboration on technologies to advance next-generation battery pack development.

quantum-technologies-1

January 19, 2026
Current quantum computers demand huge investment: custom fabrication, exotic cooling, specialist teams. Equal1 delivers a different model: quantum servers where cost, ease of deployment, power efficiency, and integration are first-order requirements.

PCB-USA_1

January 16, 2026
The investment will allow SRC Technologies to build a low-volume, high-mix circuit board assembly line — expanding its capacity to produce and remanufacture advanced electronics in-house, in Missouri.

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