Cyient Semiconductors raises $30M in equity and debt funds May 26, 2026 The fresh funding will be deployed to advance the company’s product R&D roadmap across custom power semiconductors and custom ASSPs, build in-house chip validation and testing infrastructure, and support working capital requirements.
Commission approves €288M German state aid for chip value chain May 25, 2026 Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.
Sungrow, Masdar sign 7.5GWh ESS deal for UAE project May 25, 2026 Under the agreement, Chinese company Sungrow will supply 7.5GWh of PowerTitan 3.0 ESS, alongside 2.6GW of PV inverter solutions to supporting the gigascale renewable energy project’s operational reliability and efficiency.
EPC and Mouser Electronics announce global distribution deal May 22, 2026 This agreement will give Mouser’s customers the opportunity to use the latest EPC GaN technology devices in their designs, enabling the development of smaller, faster, and more efficient power conversion systems across a broad range of applications.
Analog Devices to buy Empower Semiconductor for $1.5 billion May 21, 2026 Empower’s silicon capacitors are already in production, and IVR programs are advancing in close collaboration with leading hyperscalers and AI silicon providers — capabilities ADI will accelerate through its scale, manufacturing and customer reach.
UK firm Quantum Motion raises $160 million in Series C May 20, 2026 The financing positions Quantum Motion to deliver utility-scale and commercially viable quantum computers that fit inside existing standard data centres and racks.
Meta partners with AWS on Graviton chips to power agentic AI May 20, 2026 This agreement builds on Meta’s long-standing relationship with AWS, and expanding to include Amazon’s custom silicon, supports Meta’s broader goal of diversifying compute to meet the demands of the AI systems it’s building.
TetraMem announces 22nm RRAM analog IMC SoC milestone May 19, 2026 The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.
Siemens, Vulcan partner to scale Europe’s sustainable lithium supply May 19, 2026 The Lionheart project in Germany’s Upper Rhine Valley involves the construction of an integrated lithium and renewable energy project targeting production capacity of 24,000 tons of lithium hydroxide monohydrate (LHM).
TSMC joins Applied Materials' EPIC Center as founding partner May 14, 2026 Applied Materials has announced a new innovation partnership with TSMC at its EPIC Center in Silicon Valley, where the two companies will co-develop materials, equipment and process technologies for next-generation semiconductor devices. TSMC becomes the latest company to join the platform.
Molex completes its acquisition of Teramount May 14, 2026 Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
GF accelerates adoption of co-packaged optics for AI data centers May 13, 2026 GlobalFoundries’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes.
Indian startup BigEndian Semiconductors raises $6 million May 11, 2026 The fresh funds will be used to commercialise the Bengaluru-based fabless startup’s first system on chip SoC, scale product engineering, and boost partnerships across foundries, IP ecosystems and OEMs.
Kvantify and Equal1 announce strategic quantum alliance May 08, 2026 Under the terms of the agreement, Equal1 recognizes Kvantify as a preferred partner for quantum simulations, and the collaboration enables molecular modeling and biochemical calculations which are currently beyond the reach of classical systems.
NEO partners with South Korean Army to advance battery solutions May 08, 2026 The agreement builds on NEO’s momentum in its Korean Defense Integration Strategy and serves as a milestone due to the Capital Defense Command’s ability to advocate for the prompt implementation of non-Chinese battery solutions.
Lattice Semiconductor to buy software firm AMI in $1.65B deal May 08, 2026 The acquisition brings together Lattice’s low power FPGAs with AMI’s platform firmware and infrastructure manageability solutions for cloud and AI to create a complete portfolio of secure management and control solutions.
Global silicon wafer shipments grew 13% YoY in 1Q26 April 30, 2026 Worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025, reports SEMI.
Omdia lifts 2026 semiconductor outlook as AI-driven memory constraints intensify April 28, 2026 Omdia has significantly raised its 2026 semiconductor revenue forecast, now projecting growth of 62.7%, citing sustained AI-driven demand and tightening supply conditions in memory markets.
Siemens accelerates AI chip verification with Nvidia technology April 24, 2026 Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.
Bull teams up with Equal1 to advance hybrid quantum tech April 23, 2026 By enabling seamless hybridization between classical HPC and quantum computing, the partnership aims to lower the barrier for industrial and scientific adoption of quantum-accelerated workloads.
LTSCT signs agreement with Newen on SiC-based power modules April 23, 2026 The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.
Tim Cook to step down as Apple CEO, John Ternus to take over April 21, 2026 Apple CEO Tim Cook will step down from his role on September 1, 2026, with John Ternus appointed as his successor.
Advantest opens innovation centres in Silicon Valley April 21, 2026 Advantest Corporation has opened a new innovation center in San Jose and is preparing a second facility in Sunnyvale, as the company looks to strengthen collaboration across the semiconductor value chain.
3DGS breaks ground on chip packaging unit in India April 20, 2026 The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.
German startup Peak Quantum raises €2.2 million April 17, 2026 This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.
ASE breaks ground on new Renwu facility to expand testing cluster in Kaohsiung April 16, 2026 Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.
Molex to acquire Teramount to accelerate Co-Packaged Optics push April 16, 2026 Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).
How chips competence centres could change semiconductor hiring in Europe April 15, 2026 Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?
SiFive raises $400M to accelerate RISC-V data center solutions April 13, 2026 This financing will enable the California-based semiconductor company to accelerate the development of its next generation data center solutions and expand its global engineering teams to meet the needs of agentic AI workloads.
Kinetic finalizes majority stake agreement with Cyient Semiconductors April 10, 2026 Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.
Quest Global acquires Indian semiconductor firm BITSILICA April 08, 2026 BITSILICA’s diverse service portfolio will complement Quest Global’s existing strengths as an engineering solutions provider by expanding its capabilities in semiconductors and embedded systems.
SUMCO shifts strategy from new fab to equipment upgrades April 07, 2026 SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.