RIR expands manufacturing of 1200V SiC diodes in collaboration with PASC
June 11, 2025
Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.
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OKI establishes R&D center in Berlin to advance photonics technology
June 10, 2025
OKI has established the OKI Berlin Lab, a new R&D centre focused on photonics technology, in Berlin, Germany. The centre opened on June 1, 2025, to strengthen core capabilities and promote global deployment through open innovation.
Qualcomm to acquire Alphawave Semi in $2.4 billion deal
June 10, 2025
Qualcomm Incorporated has signed a definitive agreement to acquire UK-based Alphawave IP Group plc (Alphawave Semi) in a transaction valued at approximately USD 2.4 billion. The acquisition, executed through Qualcomm’s indirect subsidiary Aqua Acquisition Sub LLC, marks a strategic move aimed at accelerating Qualcomm’s expansion into data centre markets.
WIN announces linearity optimized 0.12µm GaN power process
June 06, 2025
Engineered for demanding high-power applications across K-Band to V-Band frequencies, NP12-1B delivers industry leading high power front end solutions with exceptional linearity, ruggedness, and reliability for next-generation RF and microwave systems.
Siemens expands OSAT Alliance to boost US chip supply chains
June 06, 2025
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
Cygni commissions 4.8 GWh BESS gigafactory in Hyderabad
June 03, 2025
Set up with an investment of over USD 11.5 million, the Phase-I facility is located on a five-acre campus in Hyderabad, Telangana. The company plans to double the capacity by 2027.
SCI raises $3.3M to develop security-enhanced microcontroller
May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.
AT&S to open Europe's first advanced IC substrate facility in June
May 28, 2025
AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
When chip repair means microsurgery inside the IC
May 23, 2025
While replacing a faulty component is usually the go-to solution in electronics repair, things get more complex when the integrated circuit in question stores critical data – for example, encryption keys. In such cases, replacement is not an option, and the only viable path may be physical repair inside the chip itself.
IBM and Deca to launch advanced chip packaging in Quebec
May 22, 2025
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
GlobalWafers opens Texas wafer plant, announces major expansion
May 21, 2025
Taiwanese semiconductor company GlobalWafers has officially inaugurated its new, USD 3.5 billion, silicon wafer facility in Sherman, Texas, marking a significant step in efforts to boost US semiconductor manufacturing capacity. The company also announced plans to further expand the site, increasing its total investment in the region to USD 7.5 billion.
Zeon partners with SiAT to advance next-gen battery manufacturing
May 20, 2025
Zeon will lead SiAT's USD 20 million USD Series C fundraising round to support the expansion of its production capacity for single-walled carbon nanotube (SWCNT) conductive paste, a critical nanomaterial for next-generation battery technologies.
HANMI Semiconductor launches TC BONDER 4 for HBM4
May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.
Arteris joins Intel Foundry Accelerator Ecosystem Alliance
May 15, 2025
This collaboration will help mutual customers design electronics using Intel Foundry’s advanced process technologies. It will also support increased interoperability and the advancements beyond traditional node scaling by growing the chiplet ecosystem.
Report: Apple is developing specialized chips for smart glasses
May 13, 2025
The effort is being spearheaded by Apple’s silicon design team. Other chips are also being developed to enable future Macs and AI servers to power the Apple Intelligence platform, Bloomberg reports.
Germany greenlights €1B in support for Infineon's massive Dresden fab
May 08, 2025
Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
Siemens and Intel expand collaboration on IC and packaging solutions
May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Sustio completes €68.5M expansion, doubling HDI capacity in Penang
May 06, 2025
Sustio Sdn. Bhd., a subsidiary of South Korea's Simmtech Group, has completed its second manufacturing facility in Batu Kawan, Penang, following an investment of MYR 326 million (EUR 68.5 million). The expansion effectively doubles Sustio’s high-density interconnect (HDI) manufacturing capacity.
IBM, TCS team up to deploy India’s largest quantum computer
May 06, 2025
IBM and the Andhra Pradesh government have entered into discussions that aim for the Quantum Valley Tech Park to be anchored by an IBM Quantum System Two installation, with a 156-qubit Heron quantum processor.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
VSORA raises $46M to bring powerful AI inference chip to market
May 05, 2025
The investment was led by Otium and a French family office with additional participation from Omnes Capital, Adélie Capital and co-financing from the European Innovation Council (EIC) Fund.
Global silicon wafer shipments rise 2.2% YoY in Q1 2025
April 30, 2025
Global silicon wafer shipments grew modestly in the first quarter of 2025, rising 2.2% year-on-year to 2,896 million square inches (MSI), up from 2,834 MSI in Q1 2024, according to the latest quarterly report from the SEMI. The report highlights ongoing demand for advanced semiconductor manufacturing, though short-term pressures continue to weigh on the industry.
Global semiconductor materials market posts $67.5B in 2024 revenue
April 29, 2025
Global semiconductor materials market revenue increased 3.8% to USD 67.5 billion in 2024, reports SEMI.
Sophia Antipolis: Half a century of innovation and future ambitions
April 24, 2025
Sophia Antipolis, Europe’s first science and technology park, marks more than 50 years of growth and innovation. During the Evertiq Expo 2025, Sylvain Rouget and Valérie Gooris from the Sophia Antipolis Foundation reflected on the park’s past achievements and its outlook for the future.
Polar to onshore fabrication of advanced devices on 200mm wafers
April 23, 2025
Polar Semiconductor, a US-owned merchant foundry specialising in sensor, power, and high-voltage semiconductors, has signed a strategic agreement with Renesas to license their Gallium Nitride on Silicon D-Mode (GaN-on-Si) technology.
Valens, ESWIN team up to bring MIPI A-PHY offering to China market
April 23, 2025
By leveraging Valens’ A-PHY expertise and technology as a key contributor to the MIPI A-PHY standard and ESWIN Computing’s technological capabilities and deep market understanding, the two companies are uniquely positioned to support the growing demand for MIPI A-PHY products in China.
Cadence advances Cloud AI with DDR5 12.8Gbps MRDIMM Gen2 IP
April 22, 2025
The Cadence DDR5 MRDIMM IP boasts a new high-performance, scalable and adaptable architecture based on Cadence’s proven and highly successful DDR5 and GDDR6 product lines.
Lightmatter’s photonic superchip advances interconnect innovation
April 18, 2025
With fully integrated fiber attachment supporting 256 fibers, Passage M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to existing CPO solutions.
Silicon Mountain expands US manufacturing capabilities in response to tariff pressures
April 17, 2025
EMS provider Silicon Mountain Contract Services is strengthening its domestic production capabilities amid rising complexities of global tariffs and supply chain disruptions.
NEO to leverage Elementium’s advanced electrolyte tech
April 11, 2025
Under the terms of the Agreement, NEO will apply Elementium’s advanced electrolytes to its silicon battery platform for use in specialty commercial applications.
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