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Gen3_MRDIMM

August 05, 2026
Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.

PCB-India_2

August 04, 2026
The 30-acre facility in Andhra Pradesh will have an annual production capacity of 96 million chips and serve high-growth sectors such as AI, high-performance computing, data centres and high-speed communications.

August 04, 2026
Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.

MMO2024-Ronny-Nietzsche

August 04, 2026
The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another issue may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.

Estonia-2025

August 03, 2026
In the January–June 2026 period, Incap reported revenue of EUR 130.2 million, an increase of 21.1% from last year. It reported revenue of EUR 74.2 million for the April–June 2026 quarter, a year-on-year increase of 34.1%.

glass_substrate

August 03, 2026
Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

nvidia_agenticAI

July 31, 2026
The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.

skeeze-supercomputer

July 31, 2026
The latest edition of the TOP500 ranking of the world's most powerful supercomputers has brought a change at the top. China's LineShine has overtaken the United States' El Capitan, while the number of exascale systems has increased to five. Europe has maintained its position among the world's leading high-performance computing regions.

July 31, 2026
The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications

quantum-computer_geralt

July 31, 2026
Following the close of the transaction, SkyWater will continue to serve a full range of customers as a US-based semiconductor foundry, operating as a wholly owned subsidiary of IonQ under the SkyWater name.

fab-P12

July 30, 2026
Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

Indie

July 30, 2026
The collaboration brings together Eros Innovation’s expertise in sovereign AI, multimodal foundation models, cultural intelligence, healthcare AI and digital platforms with Thakers’ expertise in chip design, embedded systems, aerospace and space technologies.

Systems_Openchip_partnership

July 30, 2026
Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.

new-technologies_2

July 29, 2026
The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.

sign

July 29, 2026
Together, Silvaco’s physics-based simulation portfolio and Nvidia accelerated computing and AI will help customers design, simulate and optimize increasingly complex semiconductor technologies.

signing-the-contract_2

July 29, 2026
The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.

PCB-world_2

July 28, 2026
Companies are reassessing where they build, how much flexibility they need, which suppliers they depend on and where financial decisions are made.

Didrik-PCB

July 28, 2026
In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

sign-on-building

July 24, 2026
Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.

SCL_chip_innovation

July 24, 2026
As part of this collaboration, the 1.2 µm Process Design Kit will be made available through eChipHub, and provide students, researchers, faculty members, startups, MSMEs and industry professionals with access to an indigenous semiconductor process technology for IC design and prototyping.

of_Arizona

July 24, 2026
The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.

Products_Taiwan

July 23, 2026
Air Products will supply a range of industrial gases, including nitrogen, oxygen, argon and helium, to support the customer’s semiconductor operations in Taiwan.

Indie

July 22, 2026
Paras Semiconductors, a subsidiary of Indian company Paras Defence and Space Technologies, has signed an MOU with the Madhya Pradesh government’s department of science and technology to jointly set up an OSAT facility in the state’s Indore-Ujjain region.

geralt_AI

July 21, 2026
Joining the AWS Partner Network will help ChipAgents continue scaling its platform as it supports semiconductor companies looking to improve engineering productivity and accelerate development cycles.

team

July 21, 2026
The financing will support the US company’s continued development of scalable superconducting quantum computing technologies, expansion of semiconductor collaborations, and acceleration of its target toward fault-tolerant quantum computing.

Semiconductor_building

July 20, 2026
Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.

Best-Supply-Jacek-Malecki-Krakow-2026

July 20, 2026
Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.

Penang-plant1

July 17, 2026
The digitalised facility is set to boost the company’s back-end operations and support customers’ growing product complexity and capacity demands using AI-enabled capabilities to streamline inventory management, enhance traceability and tracking and deploy autonomous robots.

office

July 17, 2026
The Taiwanese chip giant’s announcement comes after it posted a 77% hike in second-quarter profit to a record high of USD 22 billion, beating market forecasts.

PCB-India_2

July 16, 2026
Companies involved in the manufacturing and R&D of the machines and manufacturing of materials, chemicals and gases that are essential for manufacturing semiconductors will be incentivized.

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