Evertiq - First In Electronics News & Expo

Ad

Ad

Ad

Ad

Sponsored content by TME Transfer Multisort Elektronik

700x300-2

Contemporary communication has been dominated by wireless systems. Electronics increasingly rely on data exchange without the use of cables. This applies to household appliances, as well as industrial, medical automation, and Internet of Things solutions. One of the most commonly used short-range communication standards is Bluetooth, particularly its energy-efficient variant, Bluetooth Low Energy (BLE), which allows for the construction of compact battery-powered devices.

Liquide_gases

October 02, 2026
Air Liquide will build, own and operate several production units to deliver large volumes of ultra-pure nitrogen, oxygen, argon and hydrogen, including significant backup storage capacity.

Ad

signing-the-contract_2

October 02, 2026
Founded in Shanghai in 2016, Puya Semiconductor supplies NOR Flash and EEPROM memories spanning a wide range of densities, voltage options, temperature grades, and package configurations for industrial, consumer, wearable, PC, mobile, automotive and IoT applications

opens-backend-manufacturing-hub-Thailand

October 01, 2026
Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.

PCB-India_3

October 01, 2026
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

opening-singapore-2026

September 30, 2026
Palo Alto-based robotics company Tacta Systems has opened an office and production facility in Woodlands, Singapore. The site will initially produce the Tacta Glove, which captures the movements of skilled workers to teach robotic hands new tasks, ahead of the company's first customer deployments in early 2027.

Substrates

September 30, 2026
LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.

Group_ISM_MOU

September 30, 2026
Under the MOU, Japan’s Nippon Express (NX) Holdings and India Semiconductor Mission (ISM) will work closely to address logistics-related challenges and help in developing infrastructure to strengthen India’s semiconductor ecosystem.

Sejong_site

September 29, 2026
About USD 3.1 billion will be invested to expand FCBGA (Flip Chip-Ball Grid Array) production capacity at the Sejong site in South Korea and USD 1.9 billion will be invested in facilities to expand the FCBGA plant at the Vietnam subsidiary.

Electronics_Besi_MOU

September 29, 2026
Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

headquarters

September 25, 2026
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.

Electronics_Kelington

September 25, 2026
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.

building

September 25, 2026
Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter facility offers packaging, final assembly, pack-on-site services and in-lane logistics for customers in Thailand and throughout Southeast Asia.

TSMC_design

September 24, 2026
As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.

Claus-Aasholm

September 24, 2026
The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.

Enomoto_MoU

September 24, 2026
As part of the collaboration, Japanese precision semiconductor component manufacturer Enomoto will leverage its R&D capabilities, technical know-how and next-gen solutions to accelerate semiconductor packaging readiness for the Jagiroad facility.

campus-veldhoven

September 24, 2026
While High NA EUV will be adopted for production using the current 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.

Expo-GOT-2026-01

September 24, 2026
Early autumn is here again, which means Evertiq has once again taken over Svenska Mässan for Evertiq Expo Gothenburg. For those who couldn't make it, here's a recap of the day in pictures.

Kulim-site-2026

September 24, 2026
Austrian IC substrate and PCB manufacturer AT&S has signed an expanded long-term agreement with semiconductor company Marvell Technology to supply advanced IC substrates for next-generation AI and cloud infrastructure.

Nexstrom

September 24, 2026
The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.

September 23, 2026
Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies.

PCB-Taiwan_2

September 23, 2026
TSMC, the world’s largest contract chipmaker, will ‌build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.

Nexperia-deal

September 23, 2026
Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.

quantum-technologies-1

September 23, 2026
The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.

Electronics_Sumitomo_Chemical

September 23, 2026
Under the MoU, both companies have agreed to explore a collaboration whereby Sumitomo will supply semiconductor materials, including photoresists, functional chemicals, and high-purity chemicals to Tata Electronics’ upcoming Fab in Dholera, Gujarat.

quantum-computer_geralt

September 22, 2026
The Jura Center represents an investment of CHF 40-60 million (USD 49-73 million) over a period of 6 years. At the heart of the project will be SEALSQ’s QS7001 Quantum Shield, a secure semiconductor designed to implement post-quantum cryptographic algorithms.

GeneSiC

September 22, 2026
Navitas Semiconductor is making a USD 5 million strategic equity investment in Magnachip Semiconductor, deepening a partnership the two companies announced in July 2026.

Neue_Klasse

September 21, 2026
The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions.

PCB-India_2

September 21, 2026
The two Indian companies will jointly explore chip fabrication and packaging opportunities for L&T Semiconductor’s current and future products across Tata Electronics’ range of fab process technologies and packaging solutions.

Load more news

© 2026 Evertiq AB

Ad