Smartkem may team up with Manz Asia for AI chip packaging solutions
July 17, 2025
When finalized, the Joint Development Agreement (JDA) will focus on the co-development of next-generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.
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Libra launches in-house high precision underfill capabilities
July 17, 2025
Underfill is typically a thermoset epoxy applied between semiconductor packages and PCBs or substrates. It delivers essential benefits: reinforcing solder-joint reliability, mitigating thermal expansion mismatches, improving thermal management, and enhancing mechanical durability.
Valens’s chipsets enable MIPI A-PHY platform for Embedded Vision by D3
July 17, 2025
The A-PHY platform offers D3 Embedded customers a series of unique benefits, including unparalleled EMI resilience, longer link distances, and the ability to operate over simple, low-cost cabling.
ESD industry posts $5.1 billion in revenue in Q1 2025
July 16, 2025
All geographic regions reported growth, with Americas, EMEA and Japan registering double digit increases.
Kaynes to set up $40M electronics manufacturing facility in Bhopal
July 16, 2025
The upcoming factory in Bhopal’s Badwai IT Park will be built on five acres of land and is expected to create more than 1,000 skilled jobs. Production at Kaynes Electronics’s new plant in Madhya Pradesh is set to begin by mid-2026.
Cambridge chooses Aixtron tool for next-gen 2D-based photonic devices
July 16, 2025
Aixtron’s Close Coupled Showerhead (CCS) system is set in a 200mm configuration and is currently being installed at the Cambridge Graphene Centre to be used for the UK’s Layered Materials Research Foundry (LMRF).
Report: Broadcom scraps $1 billion chip investment in Spain
July 15, 2025
The investment had been announced by Broadcom in 2023. Sources told Europa Press that talks with Spain’s government had broken down but the report did not give any reason for the collapse in negotiations.
SK keyfoundry, LB Semicon co-develop Direct RDL for chip packaging
July 15, 2025
RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.
EUV Accelerator opens at Albany NanoTech Complex in New York
July 15, 2025
The EUV Accelerator enables researchers from Natcast, NSTC Member organizations, and NY CREATES to work collaboratively to conduct research and development activities essential to driving faster commercialization of advanced semiconductor technology.
Mycronic reports 35% increase in net sales in Q2 2025
July 14, 2025
Despite sales growth, order intake fell to SEK 1.3 billion from SEK 2 billion. In the second quarter, order intake saw a decline of 37%. EBIT amounted to SEK 568 million and the EBIT margin was 27%.
Materion completes acquisition to expand semiconductor footprint in Asia
July 14, 2025
This strategic investment expands Materion’s global footprint with a facility in Asia to better support and service global Tier I semiconductor customers and strengthens Materion’s position as a leading supplier of deposition materials.
SHENMAO enhances semiconductor capabilities with acquisition of PMTC
July 11, 2025
PMTC is recognized for its high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance and drop performance. The company brings in-house alloy development, application expertise and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.
Nordic, Future Electronics enter global distribution partnership
July 11, 2025
The agreement sees Future added to Norwegian company Nordic’s group of global distribution partners, and involves Future bringing Nordic’s entire current product line to market. Future will also stock modules from Nordic module partners.
ROHM releases level 3 SPICE models with enhanced simulation speed
July 10, 2025
ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.
Guys, can we please stop inflating orders?
July 10, 2025
We are all aware that the semiconductor industry is highly volatile. But that’s not just because of the market itself; in fact, a substantial part is self-inflicted. Because, in times of shortages, companies panic and place inflated orders with multiple manufacturers or suppliers. We see the same thing happening again now with DDR4. Samsung, which captures about half of the DRAM market, has announced that it will wind down its DDR4 production by the end of 2025. This is causing a ripple effect that we have seen time and again.
GlobalFoundries to acquire MIPS to accelerate AI and compute capabilities
July 09, 2025
This strategic acquisition will expand GF’s portfolio of customizable IP offerings, allowing it to further differentiate its process technologies with IP and software capabilities.
Arago raises $26M to slash AI energy consumption with new photonic chip
July 09, 2025
The heart of Arago's processor, codenamed “JEF,” is a proprietary photonic technology: instead of transistors, it uses lasers to process data with photons. The chip is designed to deliver 10× lower energy consumption than today’s leading GPUs at equivalent performance and cost.
Singapore launches innovation hub for gallium nitride semiconductors
July 08, 2025
The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.
Avnet announces Gilles Beltran as new President
July 08, 2025
Gilles Beltran joined Avnet Silica in 2002, bringing more than two decades of company-specific experience and know-how to this new role, including four years as President of Avnet Silica.
Anglia signs franchise agreement with Winslow Adaptics
July 08, 2025
Anglia Components adds IC sockets, adapters and semiconductor hardware from Winslow Adaptics, a UK-based designer and component manufacturer.
One in a Million. People used to be our greatest strength
July 07, 2025
In this first article of Evertiq’s new expert column series, Claus Aasholm – seasoned technology executive and strategist – shares his perspective on the trends, challenges, and breakthroughs shaping the global electronics industry. Drawing on decades of hands-on experience, Claus offers sharp, thought-provoking insights that go beyond headlines and buzzwords. Expect analysis that connects the dots – and challenges the status quo.
Xanadu, Mitsubishi Chemical to develop quantum algorithms for EUV lithography
July 07, 2025
In this partnership, researchers from Mitsubishi Chemical's Materials Design Laboratory will provide deep expertise on EUV photoresist materials, including their molecular structures, compositions, and reactivity.
Kaga Toshiba and Himeji Semiconductor introduce off-site PPA model
July 04, 2025
Toshiba Devices & Storage Group is promoting measures to advance the achievement of carbon neutrality. It aims to achieve net-zero greenhouse gas emissions from all its manufacturing sites by fiscal year 2030.
ViTrox partners with Maxim SMT to strengthen presence in India
July 04, 2025
Malaysian inspection systems specialist ViTrox has appointed Maxim SMT as its new sales channel partner for the Indian market, effective 1 June 2025.
SkyWater Technology completes acquisition of Fab 25
July 04, 2025
By adding approximately 400,000 wafer starts per year in capacity, Fab 25 brings meaningful scale to SkyWater’s exclusively US-based, pure-play foundry operation and enables SkyWater to enhance its advanced technology services (ATS) offering by incorporating the site’s current capabilities.
Indian startup Maieutic raises $4.15 million in seed funding
July 03, 2025
Maieutic’s platform addresses a traditionally slow and manual domain of semiconductor design by applying generative AI to automate early-stage development, detect bugs and optimize design trade-offs.
Accenture acquires SYSTEMA to bolster manufacturing automation
July 02, 2025
SYSTEMA’s long-standing experience in working for semiconductor manufacturers and other high tech companies will bolster Accenture’s capabilities to comprehensively support clients in these industries.
Ericsson expands R&D team in Bengaluru, increases focus on ASIC
July 02, 2025
This strategic move underscores Ericsson’s commitment to enable India to be at the forefront of future communication technology. The decision also demonstrates Ericsson’s dedication to fostering innovation in the highly competitive field of ASIC development.
Navitas partners with Powerchip for 200mm GaN production in Taiwan
July 02, 2025
Navitas Semiconductor has announced plans to start 200mm GaN-on-silicon production in collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC), marking a new phase in the company's supply chain and technology strategy.
Claus Aasholm: “The semiconductor cycle is broken”
July 02, 2025
During Evertiq Expo Malmö 2025, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a sobering reassessment of the global semiconductor market. In his keynote and follow-up interview, Aasholm argued that the industry’s historical four-year cycle has broken down – replaced by a fragmented, profit-driven upswing felt by only a select few.
Pattern Generators expands through acquisition in South Korea
July 01, 2025
Mycronic’s Pattern Generators division has signed an agreement to acquire Cowin DST, a company based in South Korea primarily providing systems for display panel repair, as well as display and semiconductor photomask repair.
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