Evertiq - First In Electronics News & Expo

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quantum-technologies-1

June 05, 2026
Rather than relying on a single architecture, SEALSQ is investing into several complementary approaches to fault-tolerant quantum computing and binding them to its own QS7001 secure hardware, QVault TPM and PQC product portfolio.

3dIC

June 05, 2026
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.

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axonite_chip

June 05, 2026
The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.

Chips-Act

June 04, 2026
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.

Tessalia

June 04, 2026
Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.

Marco-Mezger-2026

June 03, 2026
For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.

tsmc_chip_design

June 03, 2026
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.

June 02, 2026
AMD says it plans to invest more than USD 10 billion across Taiwan's semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The company also confirmed that its Helios rack-scale platform is on track for deployment in the second half of 2026.

June 02, 2026
French computing company Bull and Foxconn have announced a strategic partnership to manufacture AI and cloud infrastructure in Europe. The collaboration combines Bull's AI systems design and go-to-market capabilities with Foxconn's manufacturing scale, with an initial investment exceeding EUR 120 million.

PCB-India_2

June 01, 2026
The facility in the Indian state of Odisha will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies, with Intel supporting technology know-how and process expertise.

geralt-computer-chip

June 01, 2026
The QUANTIX project involves an estimated investment of EUR 40 million dedicated to the development of a Semiconductor Design and Personalization Center in the Region of Murcia, with advanced capabilities in cybersecurity, post-quantum technology, AI, and RISC-V systems.

Bloomington-Minnesota-manufacturing-facility

May 28, 2026
Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.

May 28, 2026
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.

He-Tingbo

May 27, 2026
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.

May 27, 2026
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

PCB-India_3

May 26, 2026
The fresh funding will be deployed to advance the company’s product R&D roadmap across custom power semiconductors and custom ASSPs, build in-house chip validation and testing infrastructure, and support working capital requirements.

May 25, 2026
Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.

Expo-Zurch-2026-Nikolaos-Florous-memphis-electronic-interview

May 25, 2026
Following his presentation at Evertiq Expo Zürich, Memphis Electronics' Nikolaos Florous had a conversation with Evertiq to go deeper on the market outlook. The short version: conditions will stay difficult, and procurement teams that haven't adapted yet are running out of time.

axonite_chip

May 25, 2026
Moov's platform supports the sourcing and sale of semiconductor fabrication, packaging, test, EMS and SMT equipment, as well as surplus, idle and scrap tools.

PCB-EU_1

May 25, 2026
Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.

Expo-LUN2026-05

May 22, 2026
On 21 May, Evertiq Expo returned to Lund – the city where it all started. After several years at Malmö Arena, the event was back on home turf for its 15th anniversary, this time at Sparbanken Skåne Arena.

axonite_chip

May 21, 2026
Empower’s silicon capacitors are already in production, and IVR programs are advancing in close collaboration with leading hyperscalers and AI silicon providers — capabilities ADI will accelerate through its scale, manufacturing and customer reach.

Motion

May 20, 2026
The financing positions Quantum Motion to deliver utility-scale and commercially viable quantum computers that fit inside existing standard data centres and racks.

MMO2024-Ronny-Nietzsche

May 20, 2026
The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another problem may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.

Expo-MMO25-Claus-Aasholm-presentation

May 19, 2026
Factories are being built, strategies are being written and investments are being made at a pace the electronics industry has not seen in decades. What is actually happening — and what is still missing — is the theme of this year's Expo in Lund.

chip

May 19, 2026
The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.

Expo-KRK2026-01

May 18, 2026
On May 7, the Evertiq Expo Kraków 2026 trade show took place at Fabryczna 13. The event brought together 456 representatives from the European electronics industry and 48 exhibiting companies. Among the 291 registered visitors, the organizers noted a large number of new attendees representing companies that had not previously participated in Evertiq Expo.

PCB-India_1

May 18, 2026
The collaboration between the two companies will focus on deploying ASML’s holistic suite of advanced lithography tools and solutions for Tata Electronics’ upcoming 300 mm (12 inch) semiconductor fab in Dholera, Gujarat.

May 15, 2026
Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

Nano

May 15, 2026
Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.

EPIC-center

May 14, 2026
Applied Materials has announced a new innovation partnership with TSMC at its EPIC Center in Silicon Valley, where the two companies will co-develop materials, equipment and process technologies for next-generation semiconductor devices. TSMC becomes the latest company to join the platform.

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