Evertiq - First In Electronics News & Expo

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workforce

September 11, 2026
Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures.

Sponsored content by KOH YOUNG

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026, March 16 to 19 at the Anaheim Convention Center. At Booth 1824, Koh Young will demonstrate how AI-powered inspection and software solutions help electronics manufacturers improve stability and productivity amid tighter tolerances, higher mix production, and rising quality expectations.

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cosmos-2

September 03, 2026
Indian space tech company Kepler Aerospace is focused on enabling reliable, secure and scalable space missions across strategic, defence and commercial applications, with a focus on persistent, low-latency intelligence from space.

Engineer-holding-wafer

September 01, 2026
Semiconductors form the backbone of our digitalised society and are business-critical for everything from AI and defence to next-generation energy systems. Yet despite Sweden being among the global leaders in academic fundamental research, we face a critical challenge: we must strengthen our own manufacturing capacity.

August 27, 2026
Japanese electronics company Renesas has opened a new Physical AI & Robotics Lab in Beijing, China, aimed at supporting the development, demonstration and validation of next-generation robotic systems.

August 24, 2026
Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.

August 21, 2026
Micron Research Labs will center on a flagship Boise campus designed to support advanced research across critical technology domains. Key research areas include critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.

August 12, 2026
The lawsuit comes weeks after Japanese semiconductor company Renesas sued US-based Navitas in the California federal court, claiming the company poached its employees to steal trade ‌secrets for developing next-gen GaN chips.

EDA

August 07, 2026
Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.

Gen3_MRDIMM

August 05, 2026
Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.

chip_technology

June 29, 2026
IBM’s new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM’s 2 nm chip, unveiled in 2021.

quantum-computer_geralt

June 10, 2026
The funding will be used to expand OQC’s operational presence in priority markets and accelerate its roadmap toward commercially useful, fault-tolerant quantum computing.

PCB-USA_1

June 09, 2026
San Francisco-based deep tech startup Itera’s patented technology uses a novel architecture of glass and liquid metal, allowing circuit rewiring in less than a minute.

Energy_building

June 05, 2026
Moment Energy has advanced battery repurposing from experimental use cases to enterprise-grade commercial deployment. The Canadian company has achieved critical safety milestones, including UL 1974 and UL 9540A certifications.

li-battery_2

May 21, 2026
The call, jointly funded by the EU’s Horizon Europe program and India’s Ministry of Heavy Industries, will support the development of recycling technologies, including high-efficiency material recovery, safe and digitalised collection systems, and pilot-scale demonstration of innovative processes.

Aireon

May 20, 2026
The acquisition unites Aireon’s surveillance and data services, including GPS jamming and spoofing detection, with Iridium’s global satcom network and PNT services that help keep GPS-dependent systems working in contested environments.

May 15, 2026
Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

quantum-computer_geralt

April 24, 2026
Cepheus-1-108Q is Rigetti’s highest qubit-count system to date and the industry’s largest modular quantum computing system, based on the US company’s proprietary chiplet-based architecture.

TSMC

April 23, 2026
TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.

quantum_computer_Poland

April 10, 2026
The system, which will be installed at Galaxy Systemy Informatyczne’s headquarters in Zielona Góra later this year, will enable Galaxy to execute quantum algorithms across various application areas.

25-years-012

March 19, 2026
On May 21, 2026, Evertiq Expo makes its long-awaited return to Lund, reconnecting with the city where it all began. Now in its 15th year, Evertiq Expo will be held at Sparbanken Skåne Arena, bringing together companies, researchers, and professionals from Sweden’s electronics and technology sectors.

Sponsored content by KOH YOUNG

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026, March 16 to 19 at the Anaheim Convention Center. At Booth 1824, Koh Young will demonstrate how AI-powered inspection and software solutions help electronics manufacturers improve stability and productivity amid tighter tolerances, higher mix production, and rising quality expectations.

IITD_research

March 12, 2026
The partnership will focus on research areas that support the future of mobility and engineering systems. These include quantum technologies, future materials, neuromorphic engineering and electric mobility.

EPIC-Semiconductor-Centre

March 11, 2026
Applied Materials and SK hynix have signed a long-term research and development agreement aimed at accelerating the development of next-generation memory technologies for artificial intelligence systems.

EPIC-Semiconductor-Centre

March 10, 2026
Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.

March 02, 2026
Following last year’s validation milestone, both companies will introduce the successful results of multi-cell testing conducted at Samsung’s R&D Lab, enabling scalable deployments and greater processor flexibility within software-based network environments.

EPIC-Semiconductor-Centre

February 12, 2026
Samsung Electronics will join Applied Materials’ EPIC (Equipment and Process Innovation and Commercialisation) Centre in Silicon Valley, a semiconductor research and development facility backed by a USD 5 billion investment.

PCB-India_1

January 29, 2026
Indian company Raana Semiconductors Pvt. Ltd. (RSPL) plans to initially focus on producing 10–12 inch solar-grade silicon ingots, with a longer-term roadmap towards semiconductor-grade wafer manufacturing.

Photonic

January 12, 2026
The Canadian company is accelerating the path to fault‑tolerant quantum systems with their Entanglement First Architecture that combines silicon‑based qubits and native photonic connectivity, enabling seamless scaling across existing global telecom infrastructure.

batteries

January 12, 2026
The new company, Argylium, is dedicated to the development and scaling up of materials for solid-state batteries.

Sponsored content by PEDC

12_11_evertiq_pedc_banner

The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.

Manufacturing-Plant-Coahuila-Mexico

December 16, 2025
Littelfuse has completed its previously announced acquisition of Basler Electric Company, strengthening the company’s high-power application capabilities.

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