Volektra partners with Jendamark to boost magnet-free electric motor tech
July 02, 2025
This collaboration designates Jendamark as the partner for industrializing and deploying production lines based on Volektra’s patented Virtual Magnet Motor (VMM) platform.
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Toyota Tsusho, LG Energy establish battery reclamation JV in US
June 27, 2025
Going forward, Green Metals Battery Innovations (GMBI) plans to build a facility with an objective to achieve annual processing capacity of up to 13,500 tons of scrap, equivalent to more than 40,000 automotive battery units.
HCLTech partners with AMD to develop solutions across AI, digital and cloud
June 25, 2025
By co-investing in innovation labs and training programs, HCLTech and AMD aim to provide enterprises with innovative tools that unlock new business opportunities and enhance operational efficiency.
Applied Materials and CEA-Leti expand joint lab
June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.
FlexGen partners with Rosendin to deliver BESS solution for data centers
June 16, 2025
The project will integrate proprietary technology and innovations from both Rosendin and FlexGen, including Rosendin’s BESSUPS design and method patent and FlexGen’s Soft Grid Interconnection and Island Grid Transient Frequency Stabilization patents.
GENESIS project launches to steer Europe towards sustainable chipmaking
June 09, 2025
With a budget of close to €55 million, GENESIS will drive innovative solutions in emission control, eco-friendly materials such as alternatives to PFAS-based ones, waste minimization, and raw material reuse.
Sponsored content by Hanwha
Status with Hanwha Semitech / Cynergy placement solution at GP Electronics after 18 months
The recently increasing trend within the electronics assembly industry has been to return to local manufacturing due to geopolitics, time to market, cost to market and the increasing need for flexibility at the same time as demanding higher volumes. These are well known and widely reported factors, but which specific demands does this place on manufacturers across Europe, the Nordics and Baltics?
Samsung acquires German HVAC firm FläktGroup for €1.5 billion
June 05, 2025
FläktGroup supplies high-reliability and high-efficiency HVAC systems to a wide range of buildings and facilities, including data centers that require stable cooling.
Nvidia selects Navitas to collaborate on 800 V HVDC architecture
June 04, 2025
Navitas’ high-power GaNSafe power ICs integrate control, drive, sensing and critical protection features, enabling reliability and robustness.
Standard Bots expands production facility, unveils 30kg payload robot
June 03, 2025
Standard Bots’ AI tech, designed specifically for its robots and powered by the NVIDIA Isaac platform, enables users to teach robots tasks through demonstration, eliminating the need for traditional coding or programming.
ViTrox Americas launches training center in Texas
June 02, 2025
Training takes place at ViTrox’s Demo Center, which now features cutting-edge systems such as the V510i 3D MicroAOI, V510i DST Dual-Side AOI, V9i XL for large-format ARV inspection, and the V97i with flipper conveyor for post-solder and final assembly inspection.
Reduce, reuse and recycle at Evertiq Expo: the green electronics shift
May 29, 2025
Sustainability is no longer just a buzzword in the electronics industry — it's fast becoming a core strategy that shapes how companies design, produce, and manage their business to minimise environmental impact. At its core, the solution is something most already know: the three R's — reduce, reuse, recycle. The concept may seem simple, but applying it in the world of electronics manufacturing is far more complex than it appears.
IBM and Deca to launch advanced chip packaging in Quebec
May 22, 2025
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
Essemtec expands US presence with larger demo lab in Massachusetts
May 20, 2025
Essemtec, the Swiss technology company specialising in high-tech solutions for electronics assembly, has opened a new demonstration and training centre in Burlington, Massachusetts.
Europe’s patent landscape: stable, but no breakthrough
April 25, 2025
In 2023, the European Patent Office (EPO) received a record number of patent applications from companies, research institutions, and individual inventors alike — a total of 199,275. So, did 2024 break that record? Not quite. Still, the data shows that innovation activity in Europe remains at a consistently high level.
Certus Semiconductor joins TSMC IP alliance program
April 25, 2025
Certus, a US-based provider of custom I/O and ESD solutions, delivers production-proven IP that ensures seamless integration with TSMC process nodes, ranging from 180nm to 12nm.
Lam Research etch system to accelerate nanofabrication R&D at UC Berkeley
April 24, 2025
Lam Research has donated its multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance R&D for next-generation chip technologies.
Omron opens new automation centre in Stuttgart
April 24, 2025
Omron has officially opened its new Automation Centre in Stuttgart. Strategically located near key customers and partners, the new facility will serve as a hub for advanced automation solutions.
A national initiative to strengthen Sweden's semiconductor sector
April 23, 2025
Sweden is taking a major step to boost its position in the semiconductor industry with the launch of a new national coordination initiative. Led by the Swedish electronics industry association, Svensk Elektronik, the project – Semicon Sweden – has received funding from the Swedish Agency for Economic and Regional Growth (Tillväxtverket) to run over the next four years.
UL Solutions enhances BESS safety test methods
April 23, 2025
The new testing methods address industry innovations, including test methods for non-lithium-ion battery chemistries that reflect the evolution of battery technology while continuing to address fire risk mitigation.
Qualcomm acquires Gen AI unit of Vietnamese firm VinAI
April 21, 2025
Combining VinAI’s advanced generative AI research and development (R&D) capabilities with Qualcomm’s decades of extensive R&D will expand Qualcomm’s ability to drive inventions.
ST's response to the global race for AI
April 17, 2025
In recent years, the electronics industry has been marked by tension caused by economic, defence, and technological turmoil. Many countries and companies view artificial intelligence as both a major opportunity and a potential game changer in the ongoing race. The challenges surrounding AI were a key focus at the recent Evertiq Expo in Sophia Antipolis — a topic that drew strong interest, as reflected in the high attendance at the presentation by Edwin Hilkens of STMicroelectronics.
SOTI partners with Urovo to boost battery monitoring
April 14, 2025
SOTI XSight now supports Urovo’s advanced smart batteries, giving organisations real-time insights into battery health, performance and location, thereby reducing mobile-device-related downtime, in the transportation and logistics (T&L) industry.
Cyient to invest $100 million in new semiconductor subsidiary
April 09, 2025
Cyient Semiconductors, the new subsidiary of Indian company Cyient, will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers.
Q5D integrates its largest wire harness automation robot
April 08, 2025
British developer of tools for the robotic wiring harness manufacturing industry has announced that it has obtained the key components for its largest automated wire harness automation bot.
India’s Goat Robotics raises $311K in latest funding round
April 04, 2025
With this funding, the Coimbatore-based robotics and automation start-up aims to accelerate product development, refine AI capabilities, enhance R&D and expand market outreach.
Tokyo Electron, IBM renew partnership for advanced chip tech
April 03, 2025
The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
UMC opens new fab expansion in Singapore
April 01, 2025
Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
Compound semiconductor materials market to cross $91B by 2035
March 31, 2025
EVs are emerging as a critical application area in the compound semiconductor industry, as many EV makers are resorting to MOSFETs or SiC Schottky barrier diodes (SBD) in DC-DC converters.
Global OSAT market to touch $94 billion by 2031
March 28, 2025
Increasing circuit complexity spurs OSAT market growth, as integrating various functionalities into a single device demands specialized assembly and test capabilities.
Inlyte, HORIEN partner to scale up iron-sodium battery production
March 28, 2025
A key outcome of the collaboration is Inlyte Factory 1, scheduled to come online by 2027, which will mirror HORIEN’s existing operations while incorporating Inlyte’s next-gen cell design and cost innovations.
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