Mastering Heat, Securing Performance Würth Elektronik eisos Mastering Heat, Securing Performance Various cooling concepts are available to efficiently dissipate heat from electronic components. However, if power losses are not removed reliably, performance degradation, premature aging, or even component failure may result. Selecting the appropriate heat sink and thermal interface material is therefore essential.
Sponsored content by Elemaster Group Open Innovation Meets the Factory: Industrialization Support’s Missing Link in Electronics Component shortages, AI-driven demand and a shifting industrial base are testing Europe’s electronics supply chain.
Murata to invest €5.7 billion to double MLCC sales October 30, 2026 Japanese component maker Murata plans to invest about JPY 1 trillion (about EUR 5.7 billion) over five years to expand its global production capacity for multilayer ceramic capacitors (MLCCs). The company expects MLCC sales in fiscal 2030 to be at least double those of fiscal 2025.
Poland to become Europe’s Patriot missile maintenance hub October 28, 2026 The United States has decided to establish a European maintenance centre in Poland for PAC-3 MSE missiles used by Patriot air defence systems. The investment is expected to shorten missile maintenance times and reduce costs. Poland, however, aims to go further and eventually launch missile production on its territory, as these interceptors are in short supply among both European allies and Ukraine.
Malaysia seizes AI servers in suspected chip smuggling network October 28, 2026 Malaysian customs has seized AI servers worth around MYR 49.5 million (USD 12.1 million) at Kuala Lumpur International Airport. The authorities believe the shipment is linked to a syndicate that has been smuggling high-performance chips through the country.
A2 Global Electronics gains AS9100 certification October 27, 2026 US component distributor A2 Global Electronics + Solutions has achieved AS9100 certification. The certification expands the quality management framework supporting the company's value-added services, including BGA reballing, for customers in aviation, space and defence.
Memory shortage pushes engineers to design around availability, survey finds October 27, 2026 Engineers are increasingly choosing memory components based on what they can actually get, rather than on performance or price. In a survey by Memphis Electronic, 95% of respondents said they had changed their sourcing strategy, their product designs, or both, over the past year.
Sponsored content by TME Transfer Multisort Elektronik Power Control and Circuit Protection – Solutions from Littelfuse and IXYS Power electronics systems must not only efficiently control the flow of energy but also handle phenomena that may threaten their components. In converters, inverters, power supplies, or drive systems, semiconductors frequently switch large currents and operate at high voltages. At the same time, they may be exposed to overvoltages originating both from the power grid and generated within the device itself.
Sponsored content by Arrow Electronics Arrow Electronics brings AI, robotics and edge applications to electronica 2026 Arrow Electronics will bring several application-led technology demonstrations to electronica 2026, showing how AI, robotics, edge computing and electronic components are being applied across different vertical market segments.
Sponsored content by StarPower Europe AG StarPower and the New Discipline of Power Electronics Power electronics has entered a new phase—one defined not by incremental improvements, but by the ability to turn semiconductor performance into real, scalable system value. Efficiency, power density, and reliability are no longer isolated metrics; they are interconnected outcomes shaped by device physics, packaging, thermal design, and manufacturing execution. In this evolving landscape, StarPower is positioning itself as more than a component supplier—it is becoming an engineering partner in electrification.
Semtech secures dedicated SiGe capacity at Tower October 22, 2026 Semtech will invest in dedicated silicon germanium (SiGe) capacity at Tower Semiconductor under an expanded multi-year agreement. The capacity spans Tower’s fabs in the US, Israel and Japan and will support Semtech’s growing business in optical and copper interconnect components for AI data centres.
Nvidia and Samsung Electro-Mechanics co-invest in ABF substrate capacity October 22, 2026 Nvidia and Samsung Electro-Mechanics will jointly invest in dedicated ABF substrate production lines in South Korea, under a multi-year agreement that makes the Korean company a supplier of package substrates for Nvidia's AI processors and networking switches.
Apple brings more iPhone component production to the US October 21, 2026 Qnity Electronics will produce films for the variable aperture camera in the iPhone 18 Pro in the US. The deal is part of an expansion of Apple’s American Manufacturing Program, under which nearly 100 components in Apple’s newest iPhones now come from American companies.
TTM continues acquisition streak with $650 million deal for Ophir Optics October 21, 2026 TTM Technologies has agreed to acquire the Ophir Optics business from MKS for around USD 650 million in cash. Ophir Optics makes infrared thermal imaging and laser optics, and the deal adds optical components to TTM’s defence and industrial offering.
Europe’s electronics industry has forgotten how to win October 20, 2026 We have become very good at defending what little we have left. That instinct must be balanced with the winning spirit.
Flip Electronics announces distribution partnership with Synaptics October 19, 2026 Through this agreement, Flip Electronics will distribute Synaptics’ expansive portfolio of embedded compute, wireless connectivity, and sensing solutions, focusing on aged, end-of-life, and obsolete devices that support innovation across automotive and IoT market.
MintNeuro raises $5 million to scale chip platform for neural devices October 19, 2026 The London-based startup will use the investment to grow its engineering and commercial teams, bring its products to market, support customers as they adopt its chips, and strengthen its presence in the US alongside its UK and European base.
Fathom expands aerospace, defense platform with 3 acquisitions October 19, 2026 The addition of TCS Industries, TCS Electronics, and Precision Grinding & Manufacturing Corporation reinforces Fathom’s ability to address growing demand for precision components, integrated electronics and complex assemblies.
XIVER adds ASML DUV lithography to its Eindhoven foundry October 15, 2026 Dutch specialty foundry XIVER has acquired an ASML PAS 5500 DUV lithography tool to make finer structures for photonic and semiconductor devices. The tool is expected to be in operation in 2027.
Vietjet Air expands contract with RTX’s Collins Aerospace October 15, 2026 Under the expanded contract, FlightSense, a full-lifecycle support program powered by Collins’ Ascentia analytics platform, will deliver guaranteed component availability, reduced downtime and cost predictability.
Poland seeks to seize opportunities in Europe’s semiconductor sector October 14, 2026 Poland’s semiconductor market could grow from USD 5.1 billion in 2025 to USD 23.7 billion by 2035. A report by Bank Gospodarstwa Krajowego (BGK), Poland’s state development bank, also identifies opportunities for the domestic sector not in building chip fabrication plants, but in developing integrated circuit design, power electronics, photonics, and semiconductor assembly and testing technologies. The outlook for an industry that is becoming increasingly important to European manufacturing will also be discussed at Evertiq Expo in Warsaw, scheduled for 22 October at PGE Narodowy Stadium.
Kontron moves VPX board production to Huntsville October 14, 2026 Kontron has started US production of its rugged VX307H computing board at subsidiary Nextek in Huntsville, Alabama. At the same time, the product moves from build-to-order to build-to-stock, to shorten delivery times for US defence customers.
Kongsberg to build counter-drone factory in Poland October 13, 2026 Kongsberg will build a factory in Poland to manufacture and maintain systems against unmanned aerial vehicles. The PLN 200 million investment is expected to create more than 100 jobs, with serial production set to start in the first half of 2028.
From inspiration to transformation: How Apator is building the factory of the future October 13, 2026 There is a certain paradox in electronics manufacturing. The more processes become automated, the more important those that still rely on human expertise seem to be. These are often the very stages where the quality of the finished product is determined – at workstations where correct assembly still depends on the operator's experience, concentration and attention to detail.
Aequs signs supply agreements with Safran for aerospace applications October 13, 2026 The awards cover the machining of superalloy parts, along with the supply of complex machining coating and assembly of landing gear components for the Airbus A320, A330, A350 and Boeing 787 programs.
COGD: Obsolescence risks have never been greater October 12, 2026 Obsolescence risks in electronics supply chains have never been as numerous as they are today, according to Axel Wagner, Chairman of the German industry association COGD. He points to shifting semiconductor strategies, geopolitics and trade restrictions, and calls on companies to manage obsolescence across the whole company rather than within purchasing alone.
India’s electronic components market is evolving. Is the supply chain ready? October 09, 2026 As India enters its next phase of electronics manufacturing growth, Waldom highlights an important opportunity: improving access to existing global inventory rather than simply increasing the amount of stock held locally.
GlobalFoundries to make AI chip component for TSMC in $2B deal October 09, 2026 Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.
Rising component costs could push notebook shipments lower in 2027 October 08, 2026 Next year, the biggest challenge for the notebook market is no longer getting hold of components but whether consumers are willing to pay for them, according to TrendForce. Global shipments are projected to decline, and the drop could be considerably steeper if brands pass on the full cost increase.
Green Circuits adds sixth SMT line, with three more in the pipeline October 08, 2026 US EMS provider Green Circuits has installed its sixth SMT production line at its San Jose facility, increasing SMT capacity by around 20%. A seventh line is about to ship, and an eighth and ninth are at the quotation stage.
Bosch to cut 900 jobs at Nuremberg plant October 07, 2026 Bosch plans to cut 900 jobs at its plant in Nuremberg, Germany, by the end of 2029, roughly half of the site's workforce. The plant mainly produces components for combustion engines, and IG Metall warns that a closure after 2029 can no longer be ruled out.
BFL, Pratt & Whitney sign contract for aerospace engine components October 07, 2026 The mission-critical aerospace engine components will be manufactured at Bharat Forge Ltd’s aerospace facility in India.