Sponsored content by POLYRACK TECH-GROUP How developers choose the right solution between LCD, OLED and e-paper Today, displays are a central element of electronic systems – far beyond their traditional role as output devices. They directly influence user interaction, power consumption, thermal behavior and ultimately the overall system architecture. Whether in embedded systems, medical devices, test equipment or mobile applications, developers must define the display technology early in the design phase. This decision has a direct impact on hardware, software and mechanical integration – and is difficult and costly to change later.
Why does signal integrity determine the effectiveness of defence systems? June 25, 2026 The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.
TTI Europe stocks and offers VG-qualified connector series June 19, 2026 By maintaining a stock of key VG-qualified connector series and associated components, TTI IP&E – Europe helps defence OEMs and system integrators reduce programme risk, improve supply continuity, and mitigate extended industry lead times.
TTM Technologies expands into the Swiss and German PCB markets June 18, 2026 U.S.-based TTM Technologies has announced plans to acquire Switzerland’s Swiss Technology Group and Germany’s ILFA GmbH. Both transactions are expected to be completed in the third quarter of 2026.
DELTEC acquires Cicor's Tunisia facility – expands into international EMS network June 18, 2026 German EMS provider DELTEC has acquired Cicor Digital Tunisie, the Borj-Cedria facility in Tunisia that Cicor announced it was divesting earlier this month. The acquisition, completed by DELTEC owner Carsten Ellermeier, brings around 100 employees into the DELTEC network.
Imec unlocks system-level III-V chiplet integration on Si-CMOS June 18, 2026 By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.
Semiconductor market hits record quarter, driven by memory surge June 16, 2026 Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.
Evertiq Expo Berlin 2026: a closer look at the conference programme June 12, 2026 From AI-driven production planning and advanced PCB manufacturing to supply chain resilience and Europe's industrial competitiveness, Evertiq Expo Berlin 2026 will bring together experts from across the electronics industry to discuss some of the sector's most pressing challenges. Ahead of the event on 18 June, we take a closer look at this year's conference programme.
The semiconductor industry as it is, not as it is told June 12, 2026 At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.
Xbox: “We are in a hardware component crisis” June 12, 2026 In an internal memo published on June 10, Xbox CEO Asha Sharma outlined five realities facing the gaming company — including a stark assessment of the hardware component situation.
Zollner opens new mechanics building at Zandt headquarters June 10, 2026 German EMS provider Zollner Elektronik AG has commissioned a new mechanics building at its main site in Zandt, Germany, expanding production capacity and adding capabilities in defence and high-precision manufacturing.
Natrion launches battery product lines for uncrewed systems June 10, 2026 Designed specifically for uncrewed, battery-powered systems like drones, surface and underwater vessels, ground vehicles, and humanoids, Natrion’s cells deliver nearly 80% more energy density than available Li-ion cell alternatives.
BEL, DGQA sign MoU for long-term provisioning of electronic fuzes June 10, 2026 The proposed agreement aims at the timely supply of electronic fuzes as per stipulated specifications and quality standards to undertake proof firing and evaluation or trials of weapons and ammunition being procured by the Indian Army.
Itera raises $12M to bring real-time prototyping to electronics June 09, 2026 San Francisco-based deep tech startup Itera’s patented technology uses a novel architecture of glass and liquid metal, allowing circuit rewiring in less than a minute.
Nvidia, LG Group build AI factory to advance physical AI June 09, 2026 The collaboration brings together Nvidia’s full-stack, end-to-end AI factory platform with LG Group’s global expertise in consumer electronics, robotics, mobility components, smart spaces and data center technologies.
GE Aerospace completes ground test of hybrid electric engine system June 09, 2026 The ground test was the company’s first to validate the full integrated system, including GE Aerospace-developed motor/generators, power converters and inverters, controllers, Dowty propellers, Avio Aero gearboxes, and a CT7 engine.
Anglia, Nanopower sign pan-European distribution agreement June 08, 2026 Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.
Seoul Semiconductor’s HV opto-semiconductor powers up automakers June 05, 2026 The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.
Tessalia plans €250M semiconductor packaging site in France June 04, 2026 Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.
Tata AutoComp partners with Jahwa to manufacture EV components June 04, 2026 The partnership brings together Jahwa Electronics’ Korean engineering expertise and Tata AutoComp’s manufacturing ecosystem in India. The companies will manufacture low and high voltage PTC heaters critical for thermal management in electric and hybrid vehicles.
Why stockpiling doesn’t work anymore June 03, 2026 For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.
Bull and Foxconn partner to manufacture AI infrastructure in Europe June 02, 2026 French computing company Bull and Foxconn have announced a strategic partnership to manufacture AI and cloud infrastructure in Europe. The collaboration combines Bull's AI systems design and go-to-market capabilities with Foxconn's manufacturing scale, with an initial investment exceeding EUR 120 million.
Digital twins in the automotive industry: fewer physical tests, more data-driven decisions June 02, 2026 In the automotive industry, the digital twin is no longer just a simulation tool. It is increasingly becoming part of the decision-making process—it influences which components make it to the production line, which tests are performed physically, and which can be bypassed. At the same time, it helps answer questions about when it is safe to implement changes in production.
CSG acquires Polish wiring harness manufacturer DOMAR MS May 28, 2026 Czechoslovak Group (CSG) has signed a preliminary agreement to acquire DOMAR MS, a Warsaw-based manufacturer of cable harnesses, cabling, electrical boxes and specialised connectors for the defence sector. The transaction is CSG's first acquisition in Poland.
Evertiq Expo Berlin – between resilience, AI and manufacturing reality May 26, 2026 The German electronics industry is entering a period defined less by stability and more by adaptation. For years, the sector benefited from a model built on industrial strength, global supply chains and close ties between manufacturing and export-driven growth. Today, many of those assumptions are being re-evaluated.
Sponsored content by TME Transfer Multisort Elektronik COMPACT PHOTOELECTRIC SENSORS OF THE PANASONIC BRAND Panasonic offers a wide range of components designed for industrial automation applications. Among them, miniature photoelectric sensors are particularly popular, valued for their compact dimensions, high precision of operation, and reliability in demanding applications. Let’s check what functions these solutions offer and what distinguishes them in terms of technical parameters.
Lava plans to invest $114M in electronics components unit May 22, 2026 The Indian mobile phone company will manufacture key smartphone components such as display modules, camera modules, multilayer PCBs and enclosures in the country as part of its localisation strategy.
Singapore’s AP Technologies acquires Irish firm Blueacre May 20, 2026 The acquisition establishes AP Technologies’ first European operation in Ireland’s medtech corridor, and extends its catheter platform into the laser-processed metallic components used in next-generation minimally invasive devices.
GE Aerospace to invest $10 million in Pune facility May 20, 2026 This latest investment builds on the USD 42 million announced over the last two years, bringing GE Aerospace’s total investment in the Pune (India) facility to more than USD 52 million over three years.
Are you overthinking semiconductor datecodes? May 20, 2026 The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another problem may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.
sensiBel aligns with Silex for production of MEMS microphone May 18, 2026 Norwegian company sensiBel’s optical MEMS microphone platform features a traditional ASIC and MEMS sensor, combined with a precision optical measurement module that captures the displacement of the MEMS -based diaphragm.
Collins Aerospace invests $26.5M to expand Florida facility May 18, 2026 Collins Aerospace’s Largo, Florida facility plays a critical role in the company’s production of radars, satellite and secure communications components, and testing for commercial and military customers.