Fuji enables SMT placement of large, heavy components for AI servers

Japan’s Fuji Corporation said it is committed to enhancing its solutions, which combine SMT pick and place machines, solder paste printers, and automation technologies, to meet the growing demand for AI server-related equipment driven by the widespread adoption of generative AI. 

The company has the capability to handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines, it said.

AI semiconductor packages integrating devices such as GPUs, ASICs and HBM are becoming larger. Moreover, there is greater adoption of new cutting-edge co-packaged optics (CPO) technologies that significantly reduce power consumption. These trends require support for panels and components that are larger and heavier.

Fuji is driving the development of technologies that eliminate restrictions in the placement process one by one under the concept of Zero Placement Limits, which aims to reduce the placements that cannot be performed to zero, the company said.

“To this end, Fuji has established placement technology for large, heavy components measuring 200 x 200 mm and weighing 2.0 kg and has successfully demonstrated the ability to place such components under our evaluation conditions, enabling us to meet emerging placement requirements for next-generation electronics, including AI server-related equipment,” Fuji said.

Looking ahead, the company said it will continue to expand its capabilities in anticipation of components becoming even larger and heavier.